CN103891817A - Wafer biscuit composite raising agent - Google Patents

Wafer biscuit composite raising agent Download PDF

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Publication number
CN103891817A
CN103891817A CN201410097028.1A CN201410097028A CN103891817A CN 103891817 A CN103891817 A CN 103891817A CN 201410097028 A CN201410097028 A CN 201410097028A CN 103891817 A CN103891817 A CN 103891817A
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China
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parts
sodium
ammonium
alkyl phosphate
sulfonate
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Pending
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CN201410097028.1A
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Chinese (zh)
Inventor
韦谷林
张爱萍
吴润秀
李安平
严积芳
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Individual
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Individual
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Priority to CN201410097028.1A priority Critical patent/CN103891817A/en
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Abstract

The wafer biscuit composite raising agent is composed of 1 part to 2 parts of ethylenediamine tetraacetic acid disodium, 1 part to 2 parts of sodium salt of polynaphthalene sulphonic acid, 1 part to 2 parts of diammonium hydrogen phosphate, 1 part to 2 parts of alkyl phosphate sodium, 1 part to 2 parts of modified soybean lecithin, 25 parts to 45 parts of baking soda, 25 parts to 45 parts of ammonium bicarbonate, 25 parts to 35 parts of glucono delta-lactone, 12 parts to 35 parts of potassium hydrogen tartrate, 24 parts to 35 parts of monocalcium phosphate, 1 part to 2 parts of octadecane amine acetate, 1 part to 2 parts of self sodium benzylnaphtthalene sulfonate, 1 part to 2 parts of polyethylene wax, 1 part to 2 parts of chlorcosane, 1 part to 2 parts of lecithin, 1 part to 2 parts of calcium chloride, 1 part to 2 parts of sodium polyacrylate, 1 part to 2 parts of ammonium chloride, 1 part to 2 parts of alkyl phosphate sodium, 1 part to 2 parts of phosphate containing halogen, and 1 part to 2 parts of fatty alcohol polyoxyethylene ether. The wafer biscuit composite raising agent has the advantages that raw material can be easily obtained, and the wafer biscuit composite raising agent is low in cost, free of aluminum, green and environmentally friendly, convenient to use, and good in effect.

Description

Wafer duplex baking powder
Technical field
The invention belongs to a kind of food additives, particularly a kind of leavening agent food additives.
Background technology
Food additives are for improving the qualities such as food color, and add chemical combination material or the natural materials in food for anticorrosion with needs processing technology.Leavening agent (Bulking Agents) adds in food processing process, can make face embryo initiate to form dense porous tissue, thereby makes goods have bulk, soft or crisp material.Leavening agent is one of common food additives, is generally divided into biological leavening agent and chemistry leavening agent, and the use principle of different leavening agents is consistent.Conventional leavening agent is the baking powder containing aluminium, and too much can go down man memory power and Immunosuppression function of the content of aluminium in diet, the potential safety hazard of range of application and existence thereof.Fried food is a kind of traditional instant food, utilize grease to make heat exchange medium, make the starch gelatinization in fried food, protein denaturation, hydrone is overflowed with the form of steam, make food there is porous and the crisp special mouthfeel of crust, produce special local flavor because the protein in food, carbohydrate, fat and some micro constitutent change in frying course simultaneously.Therefore, fried food liking of consumer extremely at home and abroad, deep-fried twisted dough sticks are exactly to be deeply subject to one of food that consumers in general like, a kind of inexpensive instant food especially, use usually used as breakfast, occupy an important position in the catering trade, along with Chinese's footprint spreads all over the world.The feature of the food such as bread, cake, steamed bun is to have sponge shape porous organization, therefore mouthfeel softness.On making, for reaching this kind of object, must make to maintain in dough enough gas.Material mixes and stirs in the air of sneaking in process and material institute's water content produced steam that is heated in the time curing, and can make product produce some sponge shape tissues, but will reach the ideal effect of goods, and gas flow is far from being enough.The overwhelming majority of desired gas is provided by leavening agent, and therefore leavening agent has consequence in food manufacturing.Leavening agent is adding in main bakery product taking wheat flour, and in process decomposes, produce gas, the face embryo of making rises to be sent out, and forms dense porous tissue, thereby makes goods have bulk, soft or a crisp salty class material.It can have alkaline leavening agent and duplex baking powder two classes.The former is mainly that sodium acid carbonate produces carbon dioxide, and the face embryo of making rises to be sent out.Acidic materials still can in and producing the basic salt forming in carbon monoxide process, and the speed that produces of regulation of carbon dioxide.Starch etc. have the leavening agent of being conducive to be preserved, and adjustments of gas produces speed, makes bubble distribution evenly wait effect.Leavening agent is adding in main bakery product taking wheat flour, and decomposes produces gas in process, and the face embryo of making rises to be sent out, and forms dense porous tissue, thereby makes goods have bulk, soft or a crisp class material.Leavening agent also claims swelling agent, raising agent or hair powder.It not only can improve the aesthetic quality of food, and is conducive to digesting and assimilating of food, and this has certain importance in the time that greatly develop instant food today and emphasize its trophism.Different leavening agents is consistent in principle, is all in dough, to produce great amount of carbon dioxide gas by leavening, and in digestion process, carbon dioxide expanded by heating, so that dough just becomes is soft, forms loose structure.Leavening agent can not only make food produce soft sponge shape porous organization, makes it that volume expands, the soft pine of mouthfeel is good to eat; And saliva is infiltrated in the tissue of goods very soon can make to chew time, with solable matter in stripping goods, stimulate gustatory nerve, make it to react rapidly the local flavor of this food; After food enters stomach, various digestive ferments can enter in food tissue fast, make food easily, rapidly digested, absorb, avoid nutritive loss.Traditional baking powder, leavening agent; Generally contain the compositions such as alum, potassium hydrogen tartrate, phosphate, aerogenesis speed is difficult to control, and foams inhomogeneous; It is harmless containing aluminium duplex baking powder that past attempts thinks such, but along with people progressively deepen the understanding of aluminium, its bio-toxicity is also familiar with by people gradually.Various scientific researches show, excessive edible aluminium can produce expendable injury to the hemopoietic system of human body, bone and nervous system, causes senile dementia, osteoporosis diseases.There is data to show, use containing aluminium duplex baking powder and be easy to cause aluminium to exceed standard, harm consumer's physical and mental health.Through Chinese publication retrieval, do not find the scheme identical with present patent application.
Summary of the invention:
The object of the invention is to; A kind of wafer duplex baking powder is proposed.
Wafer duplex baking powder of the present invention, it is characterized in that: it is filled a prescription by weight, by 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25~45 parts, sodium bicarbonate, 25~45 parts of ammonium hydrogencarbonates, glucono-δ-lactone 25-35 part, potassium hydrogen tartrate 12-35 part, calcium dihydrogen phosphate 24-35 part, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of composition of AEO.
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25~45 parts, sodium bicarbonate, 25~45 parts of ammonium hydrogencarbonates, glucono-δ-lactone 25-35 part, potassium hydrogen tartrate 12-35 part, calcium dihydrogen phosphate 24-35 part, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
Product of the present invention, as bulk food additives, is added in an amount of 1-2% scope.
The present invention compared with prior art its beneficial effect is: have raw material and be easy to get, cost is low, advantage without aluminium environmental protection, easy to use, effective.
Detailed description of the invention:
Below in conjunction with embodiment, the invention will be further described, but embodiments of the present invention are not limited to this.
The present invention is raw materials used buys acquisition.
Embodiment 1
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25~45 parts, sodium bicarbonate, 25~45 parts of ammonium hydrogencarbonates, glucono-δ-lactone 25-35 part, potassium hydrogen tartrate 12-35 part, calcium dihydrogen phosphate 24-35 part, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
Embodiment 2
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25 parts, sodium bicarbonate, 25 parts of ammonium hydrogencarbonates, 25 parts of glucono-δ-lactones, 12 parts of potassium hydrogen tartrates, 24 parts of calcium dihydrogen phosphates, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
Embodiment 3
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 45 parts, sodium bicarbonate, 45 parts of ammonium hydrogencarbonates, 35 parts of glucono-δ-lactones, 35 parts of potassium hydrogen tartrates, 35 parts of calcium dihydrogen phosphates, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
Embodiment 4
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25 parts, sodium bicarbonate, 45 parts of ammonium hydrogencarbonates, 25 parts of glucono-δ-lactones, 35 parts of potassium hydrogen tartrates, 24 parts of calcium dihydrogen phosphates, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
Embodiment 5
Wafer duplex baking powder preparation method of the present invention, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 45 parts, sodium bicarbonate, 25 parts of ammonium hydrogencarbonates, 35 parts of glucono-δ-lactones, 12 parts of potassium hydrogen tartrates, 35 parts of calcium dihydrogen phosphates, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
The present invention has raw material and is easy to get, and cost is low, advantage without aluminium environmental protection, easy to use, effective.

Claims (2)

1. a wafer duplex baking powder, it is characterized in that: it is filled a prescription by weight, by 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25~45 parts, sodium bicarbonate, 25~45 parts of ammonium hydrogencarbonates, glucono-δ-lactone 25-35 part, potassium hydrogen tartrate 12-35 part, calcium dihydrogen phosphate 24-35 part, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of composition of AEO.
2. a wafer duplex baking powder preparation method, it is characterized in that: formula by weight, press 1~2 part of disodium ethylene diamine tetraacetate, 1~2 part of sodium metnylene bis-naphthalene sulfonate, 1~2 part of phosphoric acid one hydrogen two ammonium, 1~2 part, alkyl phosphate sodium, 1~2 part of modified soybean phosphide, 25~45 parts, sodium bicarbonate, 25~45 parts of ammonium hydrogencarbonates, glucono-δ-lactone 25-35 part, potassium hydrogen tartrate 12-35 part, calcium dihydrogen phosphate 24-35 part, 1~2 part of octadecylamine acetate, from 1~2 part of benzyl naphthalene sodium sulfonate, 1~2 part of Tissuemat E, 1~2 part of chlorinated paraffin wax, 1~2 part of lecithin, 1~2 part, calcium chloride, 1~2 part of Sodium Polyacrylate, 1~2 part of ammonium chloride, 1~2 part, alkyl phosphate sodium, containing 1~2 part of halophosphate, 1~2 part of AEO mixes, obtain product.
CN201410097028.1A 2014-03-17 2014-03-17 Wafer biscuit composite raising agent Pending CN103891817A (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104170917A (en) * 2014-07-22 2014-12-03 东莞万好食品有限公司 Baking powder as well as porous dough and preparation method thereof
CN105341048A (en) * 2015-12-23 2016-02-24 成都汇安捷伦科技有限公司 Cake leavening agent
CN108142500A (en) * 2018-03-05 2018-06-12 威宁县黔鹤农产品有限责任公司 Bitter buckwheat sugar-free biscuit and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104170917A (en) * 2014-07-22 2014-12-03 东莞万好食品有限公司 Baking powder as well as porous dough and preparation method thereof
CN105341048A (en) * 2015-12-23 2016-02-24 成都汇安捷伦科技有限公司 Cake leavening agent
CN108142500A (en) * 2018-03-05 2018-06-12 威宁县黔鹤农产品有限责任公司 Bitter buckwheat sugar-free biscuit and preparation method thereof

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Application publication date: 20140702