CN103887688B - 分布反馈光纤激光器的封装结构 - Google Patents
分布反馈光纤激光器的封装结构 Download PDFInfo
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- CN103887688B CN103887688B CN201410094231.3A CN201410094231A CN103887688B CN 103887688 B CN103887688 B CN 103887688B CN 201410094231 A CN201410094231 A CN 201410094231A CN 103887688 B CN103887688 B CN 103887688B
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 58
- 239000010453 quartz Substances 0.000 claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000835 fiber Substances 0.000 claims abstract description 59
- 239000004519 grease Substances 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 20
- 229920002545 silicone oil Polymers 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 241000931526 Acer campestre Species 0.000 claims description 3
- 230000008602 contraction Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 238000013016 damping Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
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Priority Applications (1)
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CN201410094231.3A CN103887688B (zh) | 2014-03-14 | 2014-03-14 | 分布反馈光纤激光器的封装结构 |
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CN201410094231.3A CN103887688B (zh) | 2014-03-14 | 2014-03-14 | 分布反馈光纤激光器的封装结构 |
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CN103887688A CN103887688A (zh) | 2014-06-25 |
CN103887688B true CN103887688B (zh) | 2016-06-15 |
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CN201410094231.3A Active CN103887688B (zh) | 2014-03-14 | 2014-03-14 | 分布反馈光纤激光器的封装结构 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104201544B (zh) * | 2014-08-14 | 2017-04-12 | 山东省科学院激光研究所 | 一种分布反馈式光纤激光器降噪封装 |
CN106568465A (zh) * | 2016-03-04 | 2017-04-19 | 北京玻璃研究院 | 一种金属涂覆光纤光栅的封装方法 |
CN105823573A (zh) * | 2016-05-20 | 2016-08-03 | 江苏昂德光电科技有限公司 | 一种光纤温度传感器及其点胶方法 |
CN106482863B (zh) * | 2016-10-12 | 2019-02-01 | 山东省科学院激光研究所 | 基于有源相移光栅的温度传感器及温度传感系统 |
CN106525099B (zh) * | 2016-10-28 | 2018-12-07 | 北京信息科技大学 | 一种非接触式光纤光栅角量传感器及测试方法 |
CN107024305A (zh) * | 2017-04-21 | 2017-08-08 | 深圳市威士邦建筑新材料科技有限公司 | 桥梁结构智能加固组件及光纤光栅传感器复合粘结的方法 |
CN109031408A (zh) * | 2018-08-17 | 2018-12-18 | 山东省科学院激光研究所 | 一种光纤光栅检波器的封装装置及方法 |
CN110864844B (zh) * | 2019-11-27 | 2021-08-24 | 中国工程物理研究院流体物理研究所 | 一种应用于爆轰压力测量的光纤探头及其制作方法 |
CN113363796B (zh) * | 2021-06-07 | 2022-07-05 | 武汉安扬激光技术股份有限公司 | 一种棒状掺稀土光纤的封装系统 |
CN115079363B (zh) * | 2022-07-27 | 2022-12-13 | 联纲光电科技股份有限公司 | 一种aoc有源光缆结构 |
CN118031833B (zh) * | 2024-02-02 | 2024-10-01 | 南通理工学院 | 一种路面结构响应动态感知监测系统的埋设方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1393709A (zh) * | 2001-06-22 | 2003-01-29 | 陈祖培 | 光纤器件防湿密封方法 |
CN1548994A (zh) * | 2003-05-09 | 2004-11-24 | 任建华 | 光纤光栅的液体填充隔震封装技术 |
CN200979608Y (zh) * | 2006-10-30 | 2007-11-21 | 深圳朗光科技有限公司 | 小尺寸光纤耦合器模块 |
CN200997006Y (zh) * | 2006-11-29 | 2007-12-26 | 无锡爱沃富光电科技有限公司 | 光纤耦合器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0119033D0 (en) * | 2001-08-03 | 2001-09-26 | Southampton Photonics Ltd | An optical fibre thermal compensation device |
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- 2014-03-14 CN CN201410094231.3A patent/CN103887688B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1393709A (zh) * | 2001-06-22 | 2003-01-29 | 陈祖培 | 光纤器件防湿密封方法 |
CN1548994A (zh) * | 2003-05-09 | 2004-11-24 | 任建华 | 光纤光栅的液体填充隔震封装技术 |
CN200979608Y (zh) * | 2006-10-30 | 2007-11-21 | 深圳朗光科技有限公司 | 小尺寸光纤耦合器模块 |
CN200997006Y (zh) * | 2006-11-29 | 2007-12-26 | 无锡爱沃富光电科技有限公司 | 光纤耦合器 |
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Effective date of registration: 20200417 Address after: 309, building 5, No. 1659-3, Keyuan Road, East District, high tech Zone, Jinan City, Shandong Province 250101 Patentee after: Jinan shankezhiguang optoelectronic technology partnership (L.P.) Address before: 272073 Shandong province Jining Haichuan Road No. 9 high tech Zone Research Base A3 Patentee before: LASER INSTITUTE,SHANDONG ACADEMY OF SCIENCES |
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Effective date of registration: 20200612 Address after: 250101 room 2733, building 3, Aosheng building, 1166 Xinluo street, Jinan area, China (Shandong) pilot Free Trade Zone, Jinan City, Shandong Province Patentee after: Shandong feibosis Photoelectric Technology Co.,Ltd. Address before: 309, building 5, No. 1659-3, Keyuan Road, East District, high tech Zone, Jinan City, Shandong Province 250101 Patentee before: Jinan shankezhiguang optoelectronic technology partnership (L.P.) |
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Denomination of invention: Packaging Structure of Distributed Feedback Fiber Laser Effective date of registration: 20230821 Granted publication date: 20160615 Pledgee: Bank of Beijing Co.,Ltd. Jinan Branch Pledgor: Shandong feibosis Photoelectric Technology Co.,Ltd. Registration number: Y2023980052952 |
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Granted publication date: 20160615 Pledgee: Bank of Beijing Co.,Ltd. Jinan Branch Pledgor: Shandong feibosis Photoelectric Technology Co.,Ltd. Registration number: Y2023980052952 |