CN103887221A - Wafer lifting pin device - Google Patents
Wafer lifting pin device Download PDFInfo
- Publication number
- CN103887221A CN103887221A CN201210557538.3A CN201210557538A CN103887221A CN 103887221 A CN103887221 A CN 103887221A CN 201210557538 A CN201210557538 A CN 201210557538A CN 103887221 A CN103887221 A CN 103887221A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- wafer
- inlet pipe
- lifting pin
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Abstract
The invention discloses a wafer lifting pin device. The wafer lifting pin device comprises a cylinder and a pair of inductors, wherein the pair of inductors are mounted at two sides of the cylinder in a staggered mode, the wafer lifting pin device further comprises a moving shaft, a lifting pin, an inlet pipe, an outlet pipe and adjusting parts, one end of the moving shaft is arranged in the cylinder, the other end of the moving shaft is arranged outside the cylinder through extension, the lifting pin is mounted at a top portion of the moving shaft, the inlet pipe and the outlet pipe are respectively communicated with the cylinder, the adjusting parts are correspondingly arranged on the inlet pipe and the outlet pipe and are used for adjusting air flows of the inlet pipe and the outlet pipe, and the adjusting parts are needle valves. According to the wafer lifting pin device, an external manipulator is guaranteed to accurately grab a wafer to prevent the wafer from dropping through adjusting the inlet pipe and the outlet pipe.
Description
Technical field
The present invention relates to semiconductor wafer etching field, be specifically related to a kind of wafer lift pins device.
Background technology
In prior art, in the time of wafer engraving, as shown in Figure 1, in the wafer lift adopting, there is no gas regulation parts, if it is unstable to enter Compressed Gas in cylinder 1 ', cause lifter pin 4 ' mobile too fast or excessively slow, drop or the wafer aligned serious problem such as unsuccessfully thereby caused as wafer.
Summary of the invention
The invention provides a kind of wafer lift pins device, this device can pass through to regulate air inlet pipe and escape pipe throughput, thereby ensures that exterior mechanical hand can accurately capture wafer, prevents that wafer from dropping.
In order to achieve the above object, the present invention is achieved through the following technical solutions:
A kind of wafer lift pins device, comprises cylinder and a pair of inductor, and a pair of described inductor is staggered installation of respectively the both sides at cylinder up and down, is characterized in, also comprises:
Shifting axle, described shifting axle one end is arranged in cylinder, and its other end extension is arranged on cylinder outside;
Lifter pin, described lifter pin is arranged on the top of shifting axle;
Air inlet pipe, escape pipe, described air inlet pipe, escape pipe are connected with cylinder respectively;
Correspondence is arranged on the adjustment member on air inlet pipe, escape pipe respectively, and described adjustment member is for regulating the throughput of air inlet pipe and escape pipe.
Described adjustment member is needle-valve.
A kind of wafer lift pins device of the present invention compared with prior art has the following advantages:
The present invention, owing to into and out of tracheae, needle-valve being installed respectively, can pass through to regulate air inlet pipe and escape pipe throughput, thereby ensures that exterior mechanical hand can accurately capture wafer, prevents that wafer from dropping.
Brief description of the drawings
Fig. 1 is the structural representation of wafer lift pins cylinder in prior art;
Fig. 2 is the structural representation of a kind of wafer lift pins device of the present invention.
Embodiment
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, the present invention is further elaborated.
As shown in Figure 2, a kind of wafer lift pins device, comprises cylinder 1 and a pair of inductor 2, and a pair of described inductor 2 is staggered installation of respectively the both sides at cylinder 1 up and down, shifting axle 3, described shifting axle 3 one end are arranged in cylinder 1, and its other end extension is arranged on cylinder 1 outside, when shifting axle is made lifting moving, in the time that the inductor 2 of bottom first detects shifting axle 3, represent that shifting axle 3 rises, in the time that the inductor 2 on top first detects shifting axle 3, represent that shifting axle 3 declines; Lifter pin 4, described lifter pin 4 is arranged on the top of shifting axle 3; Air inlet pipe 5, escape pipe 6, described air inlet pipe 5, escape pipe 6 are connected with cylinder 1 respectively; Correspondence is arranged on the adjustment member on air inlet pipe 5, escape pipe 6 respectively, and described adjustment member is for regulating the throughput of air inlet pipe 5 and escape pipe 6, and this adjustment member is needle-valve 7, by metering pin valve 7, control throughput, change lifter pin 4 translational speeds, practice shows, the wafer lift pins cylinder of prior art, in the time occurring that air-flow is unstable, lifter pin 4 rising or falling speeds are too fast, so metering pin valve 7, the throughput of air inlet pipe and escape pipe is reduced, reduce lifter pin 4 translational speeds.
In sum, a kind of wafer lift pins device of the present invention, this device can pass through to regulate air inlet pipe and escape pipe throughput, thereby ensures that exterior mechanical hand can accurately capture wafer, prevents that wafer from dropping.
Although content of the present invention has been done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.Read after foregoing those skilled in the art, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (2)
1. a wafer lift pins device, comprises cylinder (1) and a pair of inductor (2), and a pair of described inductor (2) is staggered installation of up and down in the both sides of cylinder (1) respectively, it is characterized in that, also comprises:
Shifting axle (3), described shifting axle (3) one end is arranged in cylinder (1), and its other end extension is arranged on cylinder (1) outside;
Lifter pin (4), described lifter pin (4) is arranged on the top of shifting axle (3);
Air inlet pipe (5), escape pipe (6), described air inlet pipe (5), escape pipe (6) are connected with cylinder (1) respectively;
Correspondence is arranged on the adjustment member on air inlet pipe (5), escape pipe (6) respectively, and described adjustment member is used for regulating the throughput of air inlet pipe (5) and escape pipe (6).
2. wafer lift pins device as claimed in claim 1, is characterized in that, described adjustment member is needle-valve (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557538.3A CN103887221B (en) | 2012-12-20 | 2012-12-20 | A kind of wafer lift pin assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557538.3A CN103887221B (en) | 2012-12-20 | 2012-12-20 | A kind of wafer lift pin assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103887221A true CN103887221A (en) | 2014-06-25 |
| CN103887221B CN103887221B (en) | 2016-09-28 |
Family
ID=50956054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210557538.3A Active CN103887221B (en) | 2012-12-20 | 2012-12-20 | A kind of wafer lift pin assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103887221B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1635608A (en) * | 2003-12-26 | 2005-07-06 | 清华大学 | Fast semiconductor heat-treating facility with vertical heat treating chamber |
| US20060284357A1 (en) * | 2005-05-24 | 2006-12-21 | Denso Corporation | Workpiece holding method and holding system |
| CN1905152A (en) * | 2005-07-29 | 2007-01-31 | 东京毅力科创株式会社 | Substrate lifting device and substrate processing device |
-
2012
- 2012-12-20 CN CN201210557538.3A patent/CN103887221B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1635608A (en) * | 2003-12-26 | 2005-07-06 | 清华大学 | Fast semiconductor heat-treating facility with vertical heat treating chamber |
| US20060284357A1 (en) * | 2005-05-24 | 2006-12-21 | Denso Corporation | Workpiece holding method and holding system |
| CN1905152A (en) * | 2005-07-29 | 2007-01-31 | 东京毅力科创株式会社 | Substrate lifting device and substrate processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103887221B (en) | 2016-09-28 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |