CN103883939A

CN103883939A - Light guide plate with blunt edges

Info

Publication number: CN103883939A
Application number: CN201310664776.9A
Authority: CN
Inventors: 朱新羽; 邱柏文; 齐军
Original assignee: Apple Computer Inc
Current assignee: Apple Inc
Priority date: 2012-12-20
Filing date: 2013-12-10
Publication date: 2014-06-25
Also published as: KR20140080417A; KR101567155B1

Abstract

The invention relates to a light guide plate with blunt edges. Electronic devices may include displays. A display may include display layers having an array of display pixels and a backlight unit that provides backlight illumination to the display pixels. The backlight unit may include a light guide plate that distributes light across the display layers and a stack of optical films that may be used to enhance backlight performance. The optical films may be interposed between the light guide plate and the display layers. The light guide plate may be provided with one or more rounded edges formed from curved surfaces and/or one or more beveled edges formed from chamfered surfaces. Providing the light guide plate with rounded or beveled edges may minimize abrasive contact between the light guide plate and the adjacent optical films. An injection molding tool may be used to mold a light guide plate with rounded or beveled edges.

Description

There is the LGP of blunt edge

The application advocates the priority of the U.S. Patent application No.14/049114 that on October 8th, 2013 submits to and the U.S. Provisional Patent Application No.61/739931 submitting on December 20th, 2012, and its full content is incorporated herein by reference.

Technical field

Present invention relates in general to electronic equipment, more particularly, relate to the electronic equipment with display.

Background technology

Electronic equipment generally includes display.For example, cell phone and portable computer generally include display for to user's presentation information.Electronic equipment can have shell, such as the shell of plastics or metal formation.The assembly of electronic equipment such as display assembly can be arranged in shell.

Display being incorporated in the shell of electronic equipment may be challenging work.Size, weight, electrical ground, robustness, be convenient to the factor conventionally considered when assembling and light sealing are design of electronic devices.If do not noted, display may be heavy, may show less desirable light reflection, or may be easily impaired during falling event.The shell of electronic equipment is adjustable to hold the heavy display with large limit portion, but this can make the size of shell and weight increase undesirably, causes unappealing equipment appearance.

Therefore, expectation can provide the mode of improvement to be provided for the display of electronic equipment.

Summary of the invention

A kind of electronic equipment can have display.This display can comprise the display unit of the array with display pixel and for the back light unit of back lighting is provided to display pixel.

Back light unit can comprise LGP and blooming stacking, LGP distributes across display layer from the light of light source for making, blooming is stacking for improving performance backlight.Blooming is stacking can be inserted between LGP and display layer.

LGP can have the rectangular shape with four edges.One, two, three or four in these edges can be blunt edge, and it has minimized LGP and adjacent blooming contacts such as the abrasion between adjacent diffusing layer.In a suitable embodiment, blunt edge can be the edge that is greater than the rounding that the curved surface of 50 microns forms by radius of curvature.In another suitable embodiment, blunt edge can be the chamfered edge that is oriented relative to one another to two or more planes formation at the angle that is greater than 90 degree.

Blunt edge can extend to another angle from an angle along the whole side of LGP, or can only form along a part of side of LGP.Except rounding and/or chamfer, LGP can have vertical sidewall surface, its upper surface from LGP extends vertically up to the relative lower surface of LGP, forms thus straight edge.Vertical sidewall surface can be in the contrary side of the curved surface with forming rounded edges of LGP.

Injection-molded instrument can be used for the LGP of molded strip curved surface and rounded edges.Polishing tool such as diamond edge polisher is used in the edge of injection molding process grinding afterwards and polishing LGP.

Other features of the present invention, its essence and various advantages will from accompanying drawing and below detailed description of the preferred embodiment become more obvious.

Accompanying drawing explanation

Fig. 1 is the perspective view according to an embodiment of the invention with exemplary electronic equipment such as the laptop computer of display.

Fig. 2 is the perspective view according to an embodiment of the invention with exemplary electronic equipment such as the hand-held electronic equipment of display.

Fig. 3 is the perspective view according to an embodiment of the invention with exemplary electronic equipment such as the tablet PC of display.

Fig. 4 is the perspective view according to an embodiment of the invention with exemplary electronic equipment such as the computer display of display.

Fig. 5 is the schematic diagram according to an embodiment of the invention with the exemplary electronic equipment of display.

Fig. 6 is the cross-sectional side view of exemplary display layer and backing structure according to an embodiment of the invention.

Fig. 7 is the cross-sectional side view of exemplary display layer and backing structure according to an embodiment of the invention, shows LGP and can how to have the edge of rounding.

Fig. 8 has the edge of rounding and has the perspective view of the exemplary LGP of straight edge at opposite side in a side according to an embodiment of the invention.

Fig. 9 is the perspective view according to an embodiment of the invention with a part for the exemplary LGP of blunt edge such as cutting edge.

Figure 10 has the perspective view of blunt edge such as a part for the exemplary LGP of half outer circular edge according to an embodiment of the invention.

Figure 11 is the perspective view according to an embodiment of the invention with a part for the exemplary LGP of blunt edge such as wedge-shaped edge.

Figure 12 is the perspective view according to an embodiment of the invention with a part for the exemplary LGP of blunt edge such as full outer circular edge.

Figure 13 is the perspective view according to an embodiment of the invention with a part for the exemplary LGP of blunt edge such as chamfered edge.

Figure 14 is the perspective view according to an embodiment of the invention with the exemplary LGP of alignment characteristics and blunt edge.

Figure 15 is the diagram that can be used for according to an embodiment of the invention the exemplary injection-molding-system that forms the LGP with blunt edge.

Figure 16 is the diagram that can be used for according to an embodiment of the invention the exemplary device at the edge of revising LGP.

Figure 17 is the diagram that can be used for according to an embodiment of the invention the exemplary device at the edge of revising LGP.

Figure 18 illustrates how mould and milling tool can be used to form the diagram that has the LGP of blunt edge and the electronic equipment how LGP and other parts of appliance such as shell to assemble to have formed is shown.

The specific embodiment

Electronic equipment can comprise display.Display can be used for showing image to user.The exemplary electronic equipment can with display is shown in Fig. 1,2 and 3.

Fig. 1 illustrates how electronic equipment 10 can have the shape of laptop computer, has upper shell 12A and lower casing 12B, and lower casing 12B has the assembly such as keyboard 16 and touch pad 18.Equipment 10 can have hinge arrangement 20, and it allows upper shell 12A to rotate along direction 22 around rotating shaft 24 with respect to lower casing 12B.Display 14 can be arranged in shell 12A.Upper shell 12A can be described as display casing or lid sometimes, can be by being placed in closing position around rotating shaft 24 shell 12A in lower casing 12B rotation.

Fig. 2 illustrates how electronic equipment 10 can be portable equipment, such as cell phone, music player, game station, navigation elements or other compact devices.In this type of configuration of equipment 10, shell 12 can have relative front surface and rear surface.Display 14 can be arranged on shell 12 before.If necessary, display 14 can have display cover layer or other exterior layers, and it comprises that opening is for the assembly such as button 26.Opening also can be formed in display cover layer or in other display layers to hold speaker port (for example, referring to Fig. 2 speaker port 28).

Fig. 3 illustrates how electronic equipment 10 can be tablet PC.In the electronic equipment 10 of Fig. 3, shell 12 can have relative smooth front surface and rear surface.Display 14 can be arranged on the front surface of shell 12.As shown in Figure 3, display 14 can have cover layer or other exterior layers, and it has opening to hold button 26(as example).

Fig. 4 illustrates the exemplary configuration for electronic equipment 10, and wherein equipment 10 is computer displays or is integrated into the computer in computer display.Arrange for this type of, the shell 12 of equipment 10 is arranged on supporting structure such as support 27.Display 14 be arranged on shell 12 before.

Exemplary configuration for the equipment 10 shown in Fig. 1,2,3 and 4 is only exemplary.Conventionally, electronic equipment 10 can be laptop computer, the computer monitor of the computer that comprises embedding, tablet PC, cell phone, media player or other hand-helds or portable electric appts, less equipment is such as watch equipment, Suspenoing apparatus, earphone or earplug equipment or other can be worn or satellite equipment, television set, do not comprise the computer display of the computer of embedding, game station, navigator, embedded system is arranged on the system in canyon or automobile such as the electronic installation wherein with display, implement the device of the function of two or more equipment in these equipment, or other electronic installations.

The shell 12 of equipment 10 is sometimes referred to as housing, can be formed by the material of for example, combination such as plastics, glass, pottery, carbon fiber composite and other fiber-like compounds, metal (, machined or forging cast aluminium, stainless steel or other metals), other materials or these materials and so on.Equipment 10 can utilize Construction integration to form, its housing 12 most of or all by single structure element (for example, a slice machined metal or a slice molded plastics) form, or can be formed by multiple shell mechanisms (for example, outer enclosure structure is installed to inner frame member or other inner shell structures).

Display 14 can be touch-sensitive display, and it comprises touch sensor, or can be insensitive to touching.Can be formed by the array of capacitive touch sensor electrode, resistive touch array, touch sensor arrangement or other suitable touch sensor assemblies based on acoustic touch, optical touch or the touching technique based on power for the touch sensor of display 14.

Generally can comprise the image pixel being formed by light emitting diode (LED), organic LED, plasma unit, the wetting pixel of electricity, electrophoretic display, liquid crystal display (LCD) assembly or other suitable image pixel structures for the display of equipment 10.In some cases, may expect to form display 14 with LCD assembly, be therefore that the configuration for display 14 of liquid crystal display is described as example here sometimes by display 14 wherein.Also may expect, to providing backing structure such as the display of display 14, therefore sometimes the configuration of the display 14 that comprises back light unit to be described as to example here.If necessary, the Display Technique of other types also can be used in equipment 10.In equipment 10, the use of liquid crystal display device structure and backing structure is only exemplary.

Display cover layer can cover the surface of display 14 or the display layer such as color-filter layer, or other parts of display can be used as outermost in display 14 (or almost outermost) layer.Display cover layer or other outer display layers can be formed by transparent glass sheet, clarity plastic layer or other transparent elements.

Touch sensor assemblies the array of capacitive touch sensor electrode forming such as transparent material (such as indium tin oxide) can be formed on display tectal below, can be formed on independent display layer such as in glass or polymer touch sensor substrate, or can be integrated into (for example, the substrate layer such as tft layer) in other display layers.

Fig. 5 illustrates the schematic diagram of the exemplary configuration that can be used for electronic equipment 10.As shown in Figure 5, electronic equipment 10 can comprise control circuit system 29.Control circuit system 29 can comprise store and treatment circuit system for the operation of control appliance 10.Control circuit system 29 such as hard drive holder, nonvolatile memory (for example for example can comprise, be configured to form flash memory or other EPROMs of solid-state drive), the holder of volatile memory (for example, static state or dynamic random access memory) etc. and so on.Control circuit system 29 can comprise the treatment circuit system based on one or more microprocessors, microcontroller, digital signal processor, BBP, power management block, audio coding decoding chip, special IC etc.

Control circuit system 29 is used in operating software on equipment 10, such as operating system software and application software.Use this software, control circuit system 29 can be on display 14 to user's presentation information of electronic equipment 10.When on display 14 during to user's presentation information, sensor signal and other information can be regulated for the intensity of the back lighting to for display 14 by control circuit system 29.

Imput output circuit system 30 can be used for allowing data to be provided for equipment 10 and allows data to offer external equipment from equipment 10.Imput output circuit system 30 can comprise communication circuitry 32.Communication circuitry 32 can comprise the communication of wired communication circuitry for supporting to utilize the FPDP in equipment 10 to carry out.Communication circuitry 32 also can comprise radio communication circuit (for example,, for utilizing the Circuits System of antenna sending and receiving radio frequency signal).

Imput output circuit system 30 also can comprise input-output equipment 34.User can be by the operation that provides order to carry out control appliance 10 via input-output equipment 34, and can utilize the output resource of input-output equipment 34 from equipment 10 receiving status informations and other outputs.

Input-output equipment 34 can comprise sensor and positioning indicator 36, such as ambient light sensor, proximity sensor, temperature sensor, pressure sensor, Magnetic Sensor, accelerometer, light emitting diode and for collecting about the information of the operating environment of equipment 10 and the information of the state about equipment 10 being offered to other assemblies of the user of equipment 10.

Audio-frequency assembly 38 can comprise that loudspeaker and audio-frequency generator are for presenting sound to the user of equipment 10, also can comprise that microphone is for collecting user's audio frequency input.

Display 14 can be used for presenting image to user, such as text, video and still image.Sensor 36 can comprise touch sensor array, and it is formed as one of layer in display 14.

User's input can utilize button and other in-out boxs 40 to collect, such as touchpad sensor, button, joystick, some striking wheel, roller, touch sensor (such as the sensor 36 in display 14), keyboard, keypad, vibrator, video camera and other in-out boxs.

Fig. 6 illustrate can be used for equipment 10 display 14(for example, for Fig. 1,2,3 or 4 equipment or the display 14 of other suitable electronic equipments) the cross-sectional side view of exemplary configuration.As shown in Figure 6, display 14 can comprise backing structure, such as back light unit 42, for producing backlight 44.During operation, backlight 44 outwards advance (in the orientation of Fig. 6 along Z dimension vertically upward) advance and through the display pixel structure in display layer 46.This has illuminated any image just being produced by display pixel watches for user.For example, backlight 44 images that can illuminate on the display layer 46 of just being watched along direction 50 by spectators 48.

Display layer 46 can be installed to Undercarriage structure, such as plastic bottom shelf structure and/or metal bottom shelf structure, to form the display apparatus module being arranged in shell 12, or display layer 46 can be directly installed on (for example,, by display layer 46 is stacked in the sunk part in shell 12) in shell 12.Display layer 46 can form liquid crystal display or can be used for forming the display of other types.

Be used to form in the configuration of liquid crystal display at display layer 46, display layer 46 can comprise liquid crystal layer, such as liquid crystal layer 52.Liquid crystal layer 52 can be folded between the display layer such as display layer 58 and 56.

Layer

56 and 58 can be plugged between lower polarizer layer 60 and upper polarizer layer 54.If needed, upper polarizer layer 54 can attach to outer cover, such as cover layer 49(Fig. 6).

Layer

58 and 56 can be formed such as glass or plastic, transparent layer by transparency

carrier layer.Layer

56 and 58 can be the layer such as tft layer and/or color-filter layer.Conductive trace, color filter element, transistor and other circuit and structure can be formed on

layer

58 and 56 substrate (for example, thereby form tft layer and/or color-filter layer).Touch sensor electrode also can be incorporated in the layer such as

layer

58 and 56, and/or touch sensor electrode can be formed on other substrates.Here sometimes display layer 46 can be called " display unit " or " display device ".

For an exemplary configuration, layer 58 can be tft layer, it comprise thin film transistor (TFT) and the array of the electrode (display pixel electrode) that is associated for applying electric field to liquid crystal layer 52, on display 14, show image thus.Layer 56 can be color-filter layer, and it comprises the array of color filter element, for the ability of color display is provided for display 14.If needed, layer 58 can be color-filter layer, and layer 56 can be tft layer.

The operating period of the display 14 in equipment 10, control circuit system (for example, one or more integrated circuits, such as the assembly 68 on the printed circuit 66 of Fig. 6) can be used for generating the information (for example, showing data) that will show on display 14.The data that show can utilize the signal path the signal path (as example) that conductive metal trace in flexible print circuit 64 forms to be delivered to display driver integrated circuit 62 from Circuits System 68.

Display driver integrated circuit 62 can be arranged on tft layer driver ledge 82, or can be arranged on the elsewhere in equipment 10.Flexible print circuit cable such as flexible print circuit 64 is used in route signal between printed circuit 66 and tft layer 58.If needed, display driver integrated circuit 62 can be arranged on printed circuit 66 or flexible print circuit 64.

Printed circuit 66 can for example, for example, be formed by printed circuit board (, glass fibre filled epoxy resin layer) or flexible print circuit (, the flexible sheet material of polyimides or other flexible polymer layers).But these examples are only exemplary.If needed, printed

circuit

64 and 66 can (being for example combined to form by rigidity and flexible print circuit layer, printed circuit 66 can be by forming with the printed circuit board of flexible print circuit system layer, and flexible print circuit system layer extends to form the flexible print circuit system 64 that is attached to tft layer 58 from the edge of printed circuit 66).

Backing structure 42 can comprise backlight guide plate, such as LGP 78.LGP 78 can be formed by transparent material, such as clear glass or plastics.In the operating period of backing structure 42, the light source such as light source 72 can produce light 74.Light source 72 can be the array of for example light emitting diode.

Can be coupled to from the light 74 of light source 72 in the edge surface 76 of LGP 78, and can be due to total internal reflection principle laterally spread all over LGP 78 along X and Y dimension and distribute.LGP 78 can comprise light scattering feature, such as pit or projection or other light scattering structures.Light scattering feature can be positioned on upper surface and/or the relative lower surface of LGP 78 on.

From LGP 78 along Z direction upwards the light 74 of scattering can be used as backlight 44 of display 14.The light 74 of scattering downwards can be reflected back along upward direction by reflector 80.Reflector 80 can be formed by reflective material, such as white plastics or other glossiness materials.

In order to strengthen the performance backlight of backing structure 42, backing structure 42 can comprise blooming 70.Blooming 70 can comprise contribute to make 44 homogenising backlight and reduce thus the diffusing layer of hot spot, for strengthening the compensate film watched from axle and for calibrating backlight 44 brightness enhancement film (sometimes also referred to as tuning film).Blooming 70 other structures in can overlapping back light unit 42, such as LGP 78 and reflector 80.For example, if LGP 78 has rectangle floor space in the X-Y plane of Fig. 6, blooming 70 and reflector 80 can have the rectangle floor space of coupling.

If do not noted, the layer in display may be easily impaired such as optical film.For example, conventional LGP has near sharpened edge LGP periphery, and this may abrade optical film, such as adjacent diffusing layer.This type of abrasion contact between the sharpened edge of LGP and adjacent optical film can produce dust granule, and it can damage again other bloomings in display.

In order to minimize the abrasion contact between LGP 78 and blooming 70, LGP 78 can have one or more blunt edges.Fig. 7 illustrates the cross-sectional side view of backing structure 46, and wherein LGP 78 has blunt edge.

As shown in Figure 7, LGP 78 can be plugged between reflector 80 and blooming 70.Light source such as light source 72 can emit light in the edge surface 76 of LGP 78.Light scattering feature 92(for example, pit, projection or other light scattering structures) can contribute to scattered light upwards with the display layer through in display 14.Light scattering feature 92 can be formed on lower surface 78L upper (as shown in Figure 7) and maybe can be formed on contrary upper surface 78U.

Light source 72 can be for example the bar of light emitting diode, and its edge surface 76 along LGP 78 extends.Light emitting diode 72 can be arranged on the substrate such as substrate 84.Substrate 84 can be formed such as the sheet material of polyimides or other flexible polymers by flexible printed circuit substrate material, or can be formed by printed circuit board material (for example, glass fibre filled epoxide resin material, such as FR4).LGP 78 can utilize adhesive such as adhesive 86 to attach to substrate 84.Adhesive 86 can be contact adhesive, Photocurable adhesive, liquid adhesive or other suitable adhesives.

LGP 78 can have upper surface such as upper surface 78U and lower surface such as lower surface 78L.Upper surface 78U can adjacent optical film 70(for example, the diffusing layer in adjacent optical film 70 is such as diffusing layer 70D), and lower surface 78L can near reflection device 80.Upper surface 78U can have sweep, and such as sweep 78S, it engages the planar section of upper surface 78U and smooth lower surface 78L.Curved surface 78S can for example have radius of curvature R, and it is greater than 10 microns, be greater than 50 microns, be greater than 100 microns, be greater than 500 microns or be less than 500 microns.The curved surface 78S of LGP 78 can form blunt edge, and it has minimized the abrasion contact between LGP 78 and blooming 70.

If needed, LGP 78 can have the combination of blunt edge such as blunt edge 78S and straight edge such as straight edge 76.As shown in Figure 8, for example, LGP 78 has the rectangular shape with four edges.In these edges one, two, three or whole four edges can be the blunt edges that bending or beveled surface form.In the example of Fig. 8, edge 78S is the blunt edge that curved surface forms.On the other hand, opposite edges 76 are straight edges.If needed, blunt edge 78S can extend to angle C2 from angle C1 along the whole side of LGP 78, or can only partly extend along the side of LGP 78.

Edge 76 can be formed by flat vertical sidewall surface, and extend its whole side along LGP 78, or edge 76 can be formed with the part with vertical sidewall surface by the part with curved surface.At edge 76 as optically-coupled edge for receiving in the configuration from the light (Fig. 7) of light source 72, edge 76 can have the optically-coupled region that belt surface changes, it has promoted optically-coupled.For example, edge 76 can have such optically-coupled region, and it comprises vertically extending ripple or other superficial makings (for example, combination on curved surface, knuckle-tooth surface, serrated surface, one-tenth angle surface, these surfaces etc.).If needed, edge 76 can have and (is for example plugged on other surf zones, curved edge fragment, chamfered edge fragment, other blunt edge fragments etc.) between vertical sidewall surface (sidewall surfaces for example, being vertically orientated with upper surface 78U and the lower surface 78L of LGP 78).

" blunt " edge for example can refer to the edge for example, being formed by curved surface (, the surface that radius of curvature R is greater than 50 microns), or can refer to the edge that interior angle is greater than 90 degree." directly " edge for example can refer to the edge with approximately 90 degree interior angles.Edge 76 in the example of Fig. 7 is defined by about 90 interior angles of spending, and is sometimes referred to as flat edge or square edge.If needed, LGP 78 can have a blunt edge and three straight edges, two blunt edges and two straight edges, three blunt edges and a straight edge, and the whole periphery of LGP 78 can have blunt edge, etc.The example of Fig. 8 is only exemplary.

Different surface geometry configurations can be used for forming the blunt edge of LGP 78, such as edge 78S.Fig. 9-13 illustrate the demonstrative example that can be used for the different surface geometry configuration that forms the blunt edge such as blunt edge 78S.

In the example of Fig. 9, the blunt edge 78S of LGP 78 is formed by cutting surface (being sometimes referred to as beveled surface).Adopt this type of configuration, a series of flat surfaces 88 of angulation (for example, being greater than the interior angle of 90 degree) can engage upper surface 78U and the lower surface 78L of LGP 78 each other.In the example of Fig. 9, three flat surfaces 88 are for engaging upper surface 78U and the lower surface 78L of LGP 78.But this is only exemplary.If need, can have greater or less than the surface 88 of three and engage upper surface 78U and lower surface 78L.For example, single flat surfaces 88(for example, becomes to be greater than the interior angle of 90 degree with respect to flat surfaces 78U) can be used for forming chamfered edge, it engages upper surface 78U and lower surface 78L.

In the example of Figure 10, the blunt edge 78S of LGP 78 is formed by rounding surface.This type of edge is sometimes referred to as half cylindrical or the edge of releiving.Adopt this type of configuration, broad warp surface can engage the flat upper surfaces 78U of LGP 78 and the flat bottom surface 78L of LGP 78.Curved surface 78S can for example occupy the position of the flat sidewall of the edge of LGP 78.

In the example of Figure 11, the blunt edge 78S of LGP 78 is formed by the curved surface that forms wedge-shaped edge.The middle body of LGP 78 can have the first thickness T 1 between upper surface 78U and lower surface 78L.Can there is the second thickness T 2 that is less than thickness T 1 in 78SChu marginal portion, edge.The curved surface of the wedge-shaped edge 78S of Figure 11 can be transitioned into marginal portion gradually from middle body, makes LGP 78 and adjacent blooming 70(Fig. 7) between abrasion contact minimized.

In the example of Figure 12, the blunt edge 78S of LGP 78 is formed by the curved surface that forms full outer circular edge.For this type of configuration, edge 78S has c shape cross section, and wherein upper surface 78U and lower surface 78L engage by level and smooth c shape curved surface 78S.

In the example of Figure 13, the blunt edge 78S of LGP 78 for example, is formed by chamfered edge (, half chamfered edge, 1/4th chamfered edges etc.).The example class of Figure 13 is similar to the example of Fig. 9, except the example of Figure 13 comprises vertical sidewall part 99.

In some configurations, LGP 78 can have alignment characteristics, and its help is aimed at LGP 78 and be fixed in the shell 12 of equipment 10.For example, as shown in figure 14, LGP 78 can have align structures 78E, and it is laterally outwards outstanding from LGP 78.Align structures 78E(is sometimes referred to as outstanding or contact pin) can be received by the respective aligned structure in the shell of equipment 10 12 or in other structures of display 14.If needed, LGP align structures 78E can have snap feature such as opening 79 for receiving corresponding snap feature such as post or projection, so that LGP 78 is remained on to the appropriate position in equipment 10.

Wherein to have the example of the Figure 14 of two align structures 78E on the single edge that is formed on LGP 78 be only exemplary to LGP 78.If need, can have one, two, three or whole four sides of one or more align structures 78E at LGP 78.

If needed, LGP align structures 78E can have blunt edge 78S to minimize align structures 78E and adjacent blooming 70(Fig. 7) between abrasion contact.The blunt edge of align structures 78E can be taked the form of any blunt edge in the exemplary blunt edge shown in Fig. 9-13.

Figure 15 illustrates the exemplary injection-molding-system that can be used for the molded LGP 78 with one or more blunt edge 78S.As shown in figure 15, injection-molding-system 200 can comprise the mould such as mould 202.Mould 202 can comprise die cavity 202C.The strong 202C of mould can have the negative shape of the LGP with blunt edge 78S, thereby in the time being filled with plastics, resulting part has the shape of the LGP 78 with blunt edge 78S.As shown in figure 15, mold 202C has curved surface 202S, and it contributes to form the blunt edge 78S of LGP 78.

As shown in figure 15, some ball shape thermoplastics (for example, thermoplastic granulates or " resin ") can be added to feed hopper such as feed hopper 282.This material can be by gravity fed to screw type piston such as piston 284.The rotation of the screw rod in the heat that heating unit 286 generates and piston 284 can cause temperature rise and the shear action to thermoplastic ball, and this makes ball be fused into fusibleness plastics.Screw rod rotation in piston 284 can be pushed the plastics of fusing at nozzle 288 and enter die cavity 202C.

In the time that mould 202 has been completely filled, the plastics of fusing can be cooled.In the time that plastics have cured, mould 202 can be removed (for example, can upper part 202U be separated and open mould 202 with lower part 202L by along the line 244).

The plastics that are solidificated in the 202C of chamber can form the LGP 78 with blunt edge 78S.If needed, can carry out additional treatments operation to LGP 78.For example, after forming the injection molding process of LGP 78, the edge of LGP 78 is such as other edges of edge 78S(and LGP 78, can be polished if necessary) and/or polishing.The edge surface that can be used for revising LGP 78 is shown in Figure 16 and 17 such as the demonstration equipment of edge surface 78S.

As shown in figure 16, equipment 234(for example, diamond edge polisher, edge grinding instrument, edge polishing instrument, laser cutting instrument, presses grinder tool, machinery tools such as drill bit, grinder cutter or other cutting tools etc.) can comprise computer-controlled locator 236 and machinery tools head 238A.The surface profile of 238A is configured to grind and/or finished edge surface 78S has the rounding surface (for example, full outer circular edge) of c shape cross section to form.During operation, locator 236 around axle 240 whirler machining tool head 238A(for example, utilizes motor), along the edge 78S Move tool 238A of LGP 78, thus the edge surface 78S of LGP 78 is machined to intended shape simultaneously.If needed, can use the different locators of arranging.As example, computer-controlled locator 235 is used in edge polishing operating period and moves LGP 78, and equipment 234 remains on fixed position simultaneously.

In the demonstrative example of Figure 17, equipment 234 comprises machinery tools head 238B.The surface profile of 238B be configured to grind and/or finished edge surface 78S for example, with the surface (, thering is half outer circular edge that curved surface part and smooth surface element divide) of forming section rounding.

If needed, equipment 234 can be used for revising all four edges of (for example, grind and/or polishing) LGP 78, or equipment 234 can be used for revising one or more in the edge of LGP 78.The machinery tools head that is used for the given edge of revising LGP 78 can have the surface profile corresponding with the expectation surface profile at this edge.For example, have in the layout of combination of rounded edges and straight edge at LGP 78, the combination with the machinery tools head of different surfaces profile can be used for processing LGP four edges (for example, have flat surfaces profile machinery tools head, there is curved surface profile machinery tools first-class).

Figure 18 illustrates the flow chart that utilizes the injection-molded instrument of Fig. 5 and the equipment 234 of Figure 16 and 17 to form the included exemplary steps of LGP 78.

As shown in figure 18, the equipment such as mould 200 for example can receive polymeric material 300(, the transparent resin such as plexiglass or other acrylic resins, polycarbonate resin etc.).Mould 200 can be used for polymer 300 to be molded as the LGP 78 with blunt edge 78S.In some configurations, the resulting part being formed by mould 200 can have afterbody, such as the afterbody 78T at 78S place, edge.LGP 78 can taper to from the first thickness T 1' of the central portion office of LGP 78 the second thickness T 2' of the afterbody 78T of LGP 78.The blunt edge being formed by curved surface 78S can minimize and contact with the abrasion of the adjacent optical film 70 in the display 14 of equipment 10 and scratch to it.

After formation has the LGP 78 of blunt edge 78S, LGP 78 can utilize the milling tool such as milling tool 234 to be polished and polishing.Milling tool 234 can be used for grinding and removing thus the part or all of afterbody 78T at 78S place, edge.Milling tool 234 also can be used for one or more edges of shaping and polishing LGP 78 to form smooth edge.For example, can during the grinding/polishing step at Figure 18, be removed at any plastics in (for example,, at 244 places, interface) seepage between mold 202U and bed die 202L during injection molding process (being sometimes referred to as thorn or burr).If needed, all four edges of LGP 78 can utilize milling tool 234 polished.

After grinding and polishing operation, the miscellaneous part (as shown in the parts 306 in Figure 18) in other layers, shell 12 and the electronic equipment 10 of LGP 78, display 14 can utilize mounting equipment 304 to assemble, the electronic equipment 10 having formed thus.This can comprise the light emitting diode base plate 84 that for example LGP 78 is attached to Fig. 7.

According to an embodiment, a kind of sub-assembly backlight (assembly) that is configured to provide to the display layer in display back lighting is provided, it comprises: LGP, there is the surface that described back lighting is provided from it to described display layer, described surface has planar section and sweep, and described sweep forms rounded edges; And at least one blooming adjacent with the described surface of described LGP.

According to another embodiment, the sweep on described surface has the radius of curvature that is greater than 50 microns.

According to another embodiment, described LGP has the straight edge in a side relative to described rounded edges of described LGP, described LGP has the vertical sidewall that forms described straight edge, described sub-assembly backlight also comprises: multiple light emitting diodes, be arranged on substrate, wherein said light emitting diode is configured to emit light in described straight edge, and described LGP attaches to described substrate.

According to another embodiment, described LGP comprises align structures, and described align structures has rounded edges.

According to another embodiment, described LGP comprises injection-molded LGP.

According to another embodiment, described at least one blooming comprises diffusing layer.

According to another embodiment, described LGP comprises polymethyl methacrylate.

According to an embodiment, a kind of method is provided, comprises: utilize injection-molded instrument, the molded rectangular light guide plate with four neighborings, at least one in described four neighborings is the rounded edges being formed by curved surface, and described curved surface extends along described rounded edges.

According to another embodiment, described curved surface has the radius of curvature that is greater than 50 microns.

According to another embodiment, molded described LGP comprises the molded LGP with at least one vertical sidewall.

According to another embodiment, described method also comprises: at described at least one vertical sidewall place, described LGP is attached to light emitting diode base plate.

According to another embodiment, described method comprises: utilize polishing tool, the described rounded edges of described LGP is carried out to polishing.

According to another embodiment, described polishing tool comprises diamond edge polisher.

According to an embodiment, a kind of electronic equipment is provided, comprising: electronic equipment casing; Display layer, is arranged in described electronic equipment casing; And LGP, there is relative upper surface and lower surface and there are four edges, provide back lighting from described upper surface to described display layer, described upper surface comprises along the curved surface of at least one extension in described four edges.

According to another embodiment, described electronic equipment comprises: multiple bloomings, are plugged between described display layer and described LGP.

According to another embodiment, described multiple bloomings comprise the diffusing layer adjacent with the upper surface of described LGP, and described diffusing layer is left in described curved surface bending.

According to another embodiment, the curved surface of described LGP forms second jiao at least one rounded edges that extends to described LGP from first jiao of described LGP.

According to another embodiment, described LGP comprises multiple align structures, and described curved surface forms at least a portion of described align structures.

According to another embodiment, described display layer comprises: color-filter layer; Tft layer; And be plugged on the liquid crystal layer between described color-filter layer and described tft layer.

According to another embodiment, the lower surface of described LGP comprises light scattering structure.

Be only the demonstration of principle of the present invention above, those skilled in the art can carry out various modifications in the situation that not departing from thought of the present invention and scope.Previous embodiment can be implemented independently or with any combination.

Claims

1. a sub-assembly backlight, being configured to provides back lighting to the display layer in display, and described sub-assembly backlight comprises:

LGP, has the surface that described back lighting is provided from it to described display layer, and wherein said surface has planar section and sweep, and described sweep forms blunt edge; And

At least one blooming adjacent with the described surface of described LGP.

2. sub-assembly backlight as claimed in claim 1, wherein said blunt edge is rounded edges, the sweep on described surface has the radius of curvature that is greater than 50 microns.

3. sub-assembly backlight as claimed in claim 1, wherein said LGP has the straight edge in a side relative to described blunt edge of described LGP, and wherein said LGP has the vertical sidewall that forms described straight edge, and described sub-assembly backlight also comprises:

Multiple light emitting diodes, are arranged on substrate, and wherein said light emitting diode is configured to emit light in described straight edge, and wherein said LGP attaches to described substrate.

4. sub-assembly backlight as claimed in claim 1, wherein said LGP comprises align structures, wherein said align structures has blunt edge.

5. sub-assembly backlight as claimed in claim 1, wherein said LGP comprises injection-molded LGP.

6. sub-assembly backlight as claimed in claim 1, wherein said at least one blooming comprises diffusing layer.

7. sub-assembly backlight as claimed in claim 1, wherein said LGP comprises polymethyl methacrylate.

8. a method, comprising:

Utilize injection-molded instrument, the molded rectangular light guide plate with four neighborings, at least one in wherein said four neighborings is the blunt edge being formed by curved surface, described curved surface extends along described blunt edge.

9. method as claimed in claim 8, wherein said blunt edge is rounded edges, described curved surface has the radius of curvature that is greater than 50 microns.

10. method as claimed in claim 8, wherein molded described LGP comprises the molded LGP with at least one vertical sidewall.

11. methods as claimed in claim 10, also comprise:

At described at least one vertical sidewall place, described LGP is attached to light emitting diode base plate.

12. methods as claimed in claim 8, also comprise:

Utilize polishing tool, the described blunt edge of described LGP is carried out to polishing.

13. methods as claimed in claim 12, wherein said polishing tool comprises diamond edge polisher.

14. 1 kinds of electronic equipments, comprising:

Electronic equipment casing;

Display layer, is arranged in described electronic equipment casing; And

LGP, has relative upper surface and lower surface and has four edges, wherein provide back lighting from described upper surface to described display layer, and wherein said upper surface comprises along the curved surface of at least one extension in described four edges.

15. electronic equipments as claimed in claim 14, wherein said curved surface has the radius of curvature that is greater than 50 microns.

16. electronic equipments as claimed in claim 14, also comprise:

Multiple bloomings, are plugged between described display layer and described LGP.

17. electronic equipments as claimed in claim 16, wherein said multiple bloomings comprise the diffusing layer adjacent with the upper surface of described LGP, described diffusing layer is left in wherein said curved surface bending.

18. electronic equipments as claimed in claim 14, the curved surface of wherein said LGP forms second jiao at least one blunt edge that extends to described LGP from first jiao of described LGP.

19. electronic equipments as claimed in claim 14, wherein said LGP comprises multiple align structures, wherein said curved surface forms at least a portion of described align structures.

20. electronic equipments as claimed in claim 14, wherein said display layer comprises:

Color-filter layer;

Tft layer; And

Be plugged on the liquid crystal layer between described color-filter layer and described tft layer.