CN103881644B - The preparation technology of organic silicon adhesive - Google Patents
The preparation technology of organic silicon adhesive Download PDFInfo
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- CN103881644B CN103881644B CN201410121543.9A CN201410121543A CN103881644B CN 103881644 B CN103881644 B CN 103881644B CN 201410121543 A CN201410121543 A CN 201410121543A CN 103881644 B CN103881644 B CN 103881644B
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- organic silicon
- silicon adhesive
- adhesive
- whipping agent
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Abstract
The present invention discloses a kind of preparation technology of organic silicon adhesive, and described organic silicon adhesive is obtained after reaction by the material of following mass percentage: organic silicon adhesive 30 ~ 35%; α, alpha, omega-dihydroxy polysiloxane 3 ~ 5%; Platinum catalyst 2 ~ 3%; Silane coupling agent KH550 1-2%; Malaysia alcohol 0.5 ~ 1%; MQ resin 30 ~ 50%; Alkane whipping agent 10 ~ 12%; Described reaction comprises said components mixing and stirring is obtained mixture; First described mixture is heated to 50 ~ 80 DEG C of solvent removals making to contain in described mixture; Being warming up to 85 ~ 100 DEG C again makes whipping agent have an effect and foam in described mixture, is finally warming up to 120 ~ 180 DEG C and makes described mixture solidified to obtain Micropore-type organic silicone adhesive.The microvoid structure size of organic silicon adhesive of the present invention can regulate, micropore arranged evenly can tightly can pine, according to final requirement, the structure of micropore and the size of viscosity can be decided.
Description
Original applying number 201210234768.6, on July 9 2012 applying date, denomination of invention is: a kind of preparation method of Micropore-type organic silicone adhesive.
Technical field
The present invention relates to a kind of organic silicon adhesive, particularly a kind of preparation method of organic silicon adhesive, belong to adhesive material technical field.
Background technology
Organic silicon adhesive mainly contains rubber-type and resin type two class.Organic silicon adhesive has the features such as high temperature resistant, clinging power stable, persistence is good, is widely used in the every field such as aviation, navigation, spaceship, rocket-powered missile, nuclear power, electronic apparatus industry.Along with the progressively expansion of the range of application of organic silicon adhesive system adhesive tape, all trades and professions propose new requirement to the quality of organic silicon adhesive system adhesive tape and the application of properties.The adhesive surface of many irregular and different treatment technique, makes the application of organic silicon adhesive system adhesive tape be changed to special use by simple.The preparation technology of general organic silicon adhesive system adhesive tape is surface organic silicon adhesive being coated on adhesive band base (as various film, paper etc.).One large purposes of organic silicon adhesive system adhesive tape makes protective membrane, for the protection of the surface of the material such as glass, sheet metal, plastic plate of transport or use procedure, its surface scratched from contact stain(ing) or polishing scratch.When organic silicon adhesive system adhesive tape protective membrane protection electronic product surface, because these surfaces can apply some water-miscible paints, the chemical substances such as gloss oil, in general technology, there is chemical substance solvent on these surfaces, small molecules etc. remain, with existing organic silicon adhesive system protective membrane be fitted in surface protect time, due to the smooth consolidation of organic silicone adhesive oxidant layer, exhaust-duct is not had between protected surface and organic silicon adhesive, can not discharge when residual small-molecule substance volatilizees, aberration is there will be during long-time use, circle print, the bad phenomenon such as peculiar smell, this is because the super planarization of silica gel, cannot breathe freely and cause.
Summary of the invention
The invention provides a kind of preparation method of Micropore-type organic silicone adhesive, in order to prepare organic silicon adhesive protective membrane, object solves the not smooth problem of existing organic silicon adhesive exhaust.
For achieving the above object, the technical solution used in the present invention is: a kind of preparation technology of organic silicon adhesive, is characterized in that: described organic silicon adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 30%;
α, alpha, omega-dihydroxy polysiloxane 4%;
Platinum catalyst 3%;
Silane coupling agent KH550 2%;
Malaysia alcohol 1%;
MQ resin 50%;
Alkane whipping agent 10%;
Described reaction comprises described organic silicon adhesive, α, and alpha, omega-dihydroxy polysiloxane, platinum catalyst, Silane coupling agent KH550, Malaysia alcohol, MQ resin and alkane whipping agent mixing and stirring obtain mixture; First described mixture is heated to 50 ~ 80 DEG C of solvent removals making to contain in described mixture; Being warming up to 85 ~ 100 DEG C again makes whipping agent have an effect and foam in described mixture, is finally warming up to 120 ~ 180 DEG C and makes described mixture solidified to obtain Micropore-type organic silicone adhesive.
Related content in technique scheme is explained as follows:
1, in such scheme, described alkane whipping agent is at least one in pentamethylene, Skellysolve A, iso-pentane, Trimethylmethane, normal butane alkane and propane.
2, in such scheme, described Silane coupling agent KH550 is by trichlorosilane (HSiCl
3) and with unsaturated olefin addition under the catalysis of platinum chloric acid of reactive group, then obtain through alcoholysis.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The object of the invention is general organic silicon adhesive to be transformed into the Micropore-type organic silicone adhesive with microvoid structure, make organic silicon adhesive have venting quality, adsorptivity, micropore is hollow simultaneously, has the micromolecular function of absorption.The microvoid structure size of organic silicon adhesive can regulate, micropore arranged evenly can tightly can pine, according to final requirement, the structure of micropore and the size of viscosity can be decided.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of preparation technology of organic silicon adhesive, is characterized in that: described organic silicon adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 30%;
α, alpha, omega-dihydroxy polysiloxane 4%;
Platinum catalyst 3%;
Silane coupling agent KH550 2%;
Malaysia alcohol 1%;
MQ resin 50%;
Alkane whipping agent 10%;
Described reaction comprises described organic silicon adhesive, linking agent, catalyzer, coupling agent, inhibitor, tackifying resin and whipping agent mixing and stirring is obtained mixture; First described mixture is heated to 50 ~ 80 DEG C of solvent removals making to contain in described mixture; Being warming up to 85 ~ 100 DEG C again makes whipping agent have an effect and foam in described mixture, is finally warming up to 120 ~ 180 DEG C and makes described mixture solidified to obtain Micropore-type organic silicone adhesive.
Above-mentioned alkane whipping agent is at least one in pentamethylene, Skellysolve A, iso-pentane, Trimethylmethane, normal butane alkane and propane.
Preparation method:
The first step, chooses a kind of organic silicon adhesive, α, and alpha, omega-dihydroxy polysiloxane, platinum catalyst, Silane coupling agent KH550, Malaysia alcohol, MQ resin and alkane whipping agent add in order one by one, stir.
Second step, according to the kind of whipping agent, select suitable temperature, the solidification value >100 degree of general silica gel, select the whipping agent of foaming within 100 degree, oven temperature arranges as follows: 50,80,100,120,140,140,70, is first solvent flashing between 50-80 degree, foam between 85 degree and 100 degree, between 120-180, carry out the solidification of silica gel.The type of foaming can obtain perforate according to the difference of whipping agent, also can be the Micropore-type organic silicone adhesive of closed pore.Thus make Micropore-type organic silicone adhesive have good permeability.
Through measuring: the pore diameter range of micropore is distributed as 1nm ~ 5cm.The pore density of embodiment two, embodiment three is highdensity, is namely more than or equal to 45kg/m
3.The pore density of embodiment four, embodiment five is Midst density, is namely less than 45kg/m
3, and be greater than 18kg/m
3, the pore density of embodiment six is low-density, is namely less than or equal to 18kg/m
3.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (2)
1. a preparation technology for organic silicon adhesive, is characterized in that: described organic silicon adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 30%;
α, alpha, omega-dihydroxy polysiloxane 4%;
Platinum catalyst 3%;
Silane coupling agent KH550 2%;
Malaysia alcohol 1%;
MQ resin 50%;
Alkane whipping agent 10%;
Described reaction comprises described organic silicon adhesive, α, and alpha, omega-dihydroxy polysiloxane, platinum catalyst, Silane coupling agent KH550, Malaysia alcohol, MQ resin and alkane whipping agent mixing and stirring obtain mixture; First described mixture is heated to 50 ~ 80 DEG C of solvent removals making to contain in described mixture; Being warming up to 85 ~ 100 DEG C again makes whipping agent have an effect and foam in described mixture, is finally warming up to 120 ~ 180 DEG C and makes described mixture solidified to obtain Micropore-type organic silicone adhesive.
2. the preparation technology of organic silicon adhesive according to claim 1, is characterized in that: described alkane whipping agent is at least one in pentamethylene, Skellysolve A, iso-pentane, Trimethylmethane, normal butane and propane.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210234768.6A CN102757758B (en) | 2012-07-09 | 2012-07-09 | Preparation method of micropore organic silicone adhesive |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234768.6A Division CN102757758B (en) | 2012-07-09 | 2012-07-09 | Preparation method of micropore organic silicone adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103881644A CN103881644A (en) | 2014-06-25 |
| CN103881644B true CN103881644B (en) | 2016-04-27 |
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ID=47052412
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234768.6A Active CN102757758B (en) | 2012-07-09 | 2012-07-09 | Preparation method of micropore organic silicone adhesive |
| CN201410121554.7A Active CN103881645B (en) | 2012-07-09 | 2012-07-09 | For the protection of the preparation technology of the pressure-sensitive adhesive of film |
| CN201410121701.0A Active CN103881646B (en) | 2012-07-09 | 2012-07-09 | The preparation technology of discharge type pressure-sensitive adhesive |
| CN201410121543.9A Active CN103881644B (en) | 2012-07-09 | 2012-07-09 | The preparation technology of organic silicon adhesive |
| CN201410121632.3A Active CN103897655B (en) | 2012-07-09 | 2012-07-09 | There is the manufacture method of the organic silicon adhesive of microvoid structure |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234768.6A Active CN102757758B (en) | 2012-07-09 | 2012-07-09 | Preparation method of micropore organic silicone adhesive |
| CN201410121554.7A Active CN103881645B (en) | 2012-07-09 | 2012-07-09 | For the protection of the preparation technology of the pressure-sensitive adhesive of film |
| CN201410121701.0A Active CN103881646B (en) | 2012-07-09 | 2012-07-09 | The preparation technology of discharge type pressure-sensitive adhesive |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410121632.3A Active CN103897655B (en) | 2012-07-09 | 2012-07-09 | There is the manufacture method of the organic silicon adhesive of microvoid structure |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104194711A (en) * | 2014-08-15 | 2014-12-10 | 安徽省元琛环保科技有限公司 | Heat-resistant organic silicone adhesive and preparation method thereof |
| CN104877620A (en) * | 2015-05-06 | 2015-09-02 | 无锡市中星工业胶带有限公司 | Modified organic silica gel having color changing function |
| CN104946192A (en) * | 2015-07-20 | 2015-09-30 | 无锡市中星工业胶带有限公司 | Preparation process of modified organic silica gel with color changing function |
| CN106318242A (en) * | 2016-08-23 | 2017-01-11 | 苏州盛达胶粘制品有限公司 | High-heat-conductivity electric-insulation adhesive tape and manufacturing method thereof |
| CN106753197A (en) * | 2017-02-14 | 2017-05-31 | 中卫市创科知识产权投资有限公司 | A kind of organic silicone adhesive agent producing process |
| CN109467717A (en) * | 2018-09-14 | 2019-03-15 | 张家港康得新光电材料有限公司 | A kind of silica gel and its preparation method and application |
| CN110229525A (en) * | 2019-06-18 | 2019-09-13 | 北京化工大学常州先进材料研究院 | A kind of preparation ionizing low deformation organosilicon foam material |
| CN111087969A (en) * | 2019-12-31 | 2020-05-01 | 无锡海特信成高分子科技有限公司 | Light-sensitive color-changing modified organic silica gel |
| CN115491168A (en) * | 2022-08-22 | 2022-12-20 | 振德医疗用品股份有限公司 | Ultramicro porous organic silicon gel and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516929A (en) * | 2011-11-25 | 2012-06-27 | 上海锐朗光电材料有限公司 | Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20100103870A (en) * | 2008-01-11 | 2010-09-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Stretch releasing optically clear pressure sensitive adhesive |
| CN101942201B (en) * | 2010-08-30 | 2012-05-23 | 北京天山新材料技术股份有限公司 | Room-temperature vulcanized antiflaming single-component dealcoholization-type silicone rubber sealant and preparation method thereof |
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2012
- 2012-07-09 CN CN201210234768.6A patent/CN102757758B/en active Active
- 2012-07-09 CN CN201410121554.7A patent/CN103881645B/en active Active
- 2012-07-09 CN CN201410121701.0A patent/CN103881646B/en active Active
- 2012-07-09 CN CN201410121543.9A patent/CN103881644B/en active Active
- 2012-07-09 CN CN201410121632.3A patent/CN103897655B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516929A (en) * | 2011-11-25 | 2012-06-27 | 上海锐朗光电材料有限公司 | Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103897655B (en) | 2016-04-27 |
| CN103881645A (en) | 2014-06-25 |
| CN103881644A (en) | 2014-06-25 |
| CN103881646B (en) | 2016-03-02 |
| CN103881646A (en) | 2014-06-25 |
| CN102757758A (en) | 2012-10-31 |
| CN103897655A (en) | 2014-07-02 |
| CN102757758B (en) | 2014-03-26 |
| CN103881645B (en) | 2016-05-25 |
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Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd. |