CN103881643B - Thermosetting polyimide adhesive - Google Patents
Thermosetting polyimide adhesive Download PDFInfo
- Publication number
- CN103881643B CN103881643B CN201410146885.6A CN201410146885A CN103881643B CN 103881643 B CN103881643 B CN 103881643B CN 201410146885 A CN201410146885 A CN 201410146885A CN 103881643 B CN103881643 B CN 103881643B
- Authority
- CN
- China
- Prior art keywords
- accounts
- agent
- thermosetting polyimide
- polyimide adhesive
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 40
- 239000000853 adhesive Substances 0.000 title claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 27
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 23
- 239000004642 Polyimide Substances 0.000 title claims abstract description 22
- 239000009719 polyimide resin Substances 0.000 claims abstract description 18
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical group OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 claims abstract description 14
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical group COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000008139 complexing agent Substances 0.000 claims abstract description 11
- 239000000080 wetting agent Substances 0.000 claims abstract description 11
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 36
- -1 stopper Substances 0.000 claims description 17
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 12
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 12
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 12
- 239000005642 Oleic acid Substances 0.000 claims description 12
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 12
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 12
- 229940067107 phenylethyl alcohol Drugs 0.000 claims description 12
- 239000013530 defoamer Substances 0.000 claims description 8
- 239000003223 protective agent Substances 0.000 claims description 8
- 229940120146 EDTMP Drugs 0.000 claims 4
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical group OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims 4
- 229910052708 sodium Inorganic materials 0.000 claims 4
- 239000011734 sodium Substances 0.000 claims 4
- 230000003712 anti-aging effect Effects 0.000 abstract description 7
- 239000000654 additive Substances 0.000 abstract description 3
- 239000002518 antifoaming agent Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000003112 inhibitor Substances 0.000 abstract 3
- 238000006116 polymerization reaction Methods 0.000 abstract 3
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical group C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 abstract 1
- BVBIQASDHXEFKW-UHFFFAOYSA-N P1(OCCCCO1)=O.C(CN)N.[Na] Chemical group P1(OCCCCO1)=O.C(CN)N.[Na] BVBIQASDHXEFKW-UHFFFAOYSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 229940049964 oleate Drugs 0.000 abstract 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 abstract 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical group CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 abstract 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 8
- 239000001488 sodium phosphate Substances 0.000 description 8
- 229910000162 sodium phosphate Inorganic materials 0.000 description 8
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 8
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 125000003916 ethylene diamine group Chemical group 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a thermosetting polyimide adhesive. The thermosetting polyimide adhesive comprises polyimide resin, a defoaming agent, a wetting agent, a polymerization inhibitor, a complexing agent and an anti-aging agent, wherein the defoaming agent is phenylethanol oleate, the wetting agent is propanediol, the polymerization inhibitor is p-hydroxyanisole, the complexing agent is sodium ethylenediamine tetramethylene phosphonate and the anti-aging agent is N-phenyl-N'-cyclohexyl-p-phenylenediamine. The product is prepared by adopting the polyimide resin and five additives, namely the defoaming agent, the wetting agent, the polymerization inhibitor, the complexing agent and the anti-aging agent, and the prepared adhesive has the characteristics of high adhesion strength, long storage time, anti-aging effect, good using effects and no residue in use.
Description
Technical field
The present invention relates to Chemicals, be specifically related to a kind of thermosetting polyimide adhesive.
Background technology
At present, the adhesive tape glue paste kind that market uses is different, uses field also different.The raw material types of the glue paste of existing use is various, and the function possessed is also different.Thermoset polyimide resin has use as the one of pressure sensitive adhesive in a lot of field, but there is very large deficiency in existing polyimide resin pressure sensitive adhesive, as adhesive strength, easily aging in carrying and storage process, storage time is short, and owing to easily leaving residue on use thing surface after finishing using after finished product, result of use is poor.
Summary of the invention
The object of the present invention is to provide that a kind of adhesive strength is high, the storage time long, anti-aging, result of use good, use thermosetting polyimide adhesive without residue.
Technical scheme of the present invention is, a kind of thermosetting polyimide adhesive, comprise polyimide resin, defoamer, wetting agent, stopper, complexing agent and protective agent, described defoamer is phenylethyl alcohol oleic acid ester, described wetting agent is propylene glycol, described stopper is MEHQ, described complexing agent is ethylenediamine tetraacetic methene sodium phosphate, described protective agent is N-phenyl-N '-cyclohexyl Ursol D, shared by each composition of described thermosetting polyimide adhesive, weight percent is respectively: described polyimide resin accounts for 87.4%-91.9%, described phenylethyl alcohol oleic acid ester accounts for 1.8%-2.7%, described propylene glycol accounts for 2.4%-3.3%, described MEHQ accounts for 1.4%-2.3%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 0.9%-1.8%, described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.6%-2.5%.
In a preferred embodiment of the present invention, shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 91.3%, described phenylethyl alcohol oleic acid ester accounts for 1.9%, described propylene glycol accounts for 2.5%, described MEHQ accounts for 1.5%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 1.1%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.7%.
In a preferred embodiment of the present invention, shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 87.9%, described phenylethyl alcohol oleic acid ester accounts for 2.6%, described propylene glycol accounts for 3.2%, described MEHQ accounts for 2.2%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 1.7%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 2.4%.
Of the present invention is a kind of thermosetting polyimide adhesive, this product adopts polyimide resin and defoamer, wetting agent, stopper, complexing agent and protective agent five kinds of additives to obtain, and obtained glue paste has that adhesive strength is high, the storage time long, anti-aging, result of use good, use is without the feature of residue.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Of the present invention is a kind of thermosetting polyimide adhesive, comprise polyimide resin, defoamer, wetting agent, stopper, complexing agent and protective agent, described defoamer is phenylethyl alcohol oleic acid ester, described wetting agent is propylene glycol, described stopper is MEHQ, described complexing agent is ethylenediamine tetraacetic methene sodium phosphate, described protective agent is N-phenyl-N '-cyclohexyl Ursol D, shared by each composition of described thermosetting polyimide adhesive, weight percent is respectively: described polyimide resin accounts for 87.4%-91.9%, described phenylethyl alcohol oleic acid ester accounts for 1.8%-2.7%, described propylene glycol accounts for 2.4%-3.3%, described MEHQ accounts for 1.4%-2.3%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 0.9%-1.8%, described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.6%-2.5%.
Further, shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 91.3%, described phenylethyl alcohol oleic acid ester accounts for 1.9%, described propylene glycol accounts for 2.5%, described MEHQ accounts for 1.5%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 1.1%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.7%.
Further, shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 87.9%, described phenylethyl alcohol oleic acid ester accounts for 2.6%, described propylene glycol accounts for 3.2%, described MEHQ accounts for 2.2%, described ethylenediamine tetraacetic methene sodium phosphate accounts for 1.7%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 2.4%.
Carry out proportioning by each composition Different Weight per-cent, the product performance height obtained is differed.
Of the present invention is a kind of thermosetting polyimide adhesive, this product adopts polyimide resin and defoamer, wetting agent, stopper, complexing agent and protective agent five kinds of additives to obtain, and obtained glue paste has that adhesive strength is high, the storage time long, anti-aging, result of use good, use is without the feature of residue.
The foregoing is only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (3)
1. a thermosetting polyimide adhesive, it is characterized in that: by polyimide resin, defoamer, wetting agent, stopper, complexing agent and protective agent composition, described defoamer is phenylethyl alcohol oleic acid ester, described wetting agent is propylene glycol, described stopper is MEHQ, described complexing agent is ethylene diamine tetra methylene phosphonic acid sodium, described protective agent is N-phenyl-N '-cyclohexyl Ursol D, shared by each composition of described thermosetting polyimide adhesive, weight percent is respectively: described polyimide resin accounts for 87.4%-91.9%, described phenylethyl alcohol oleic acid ester accounts for 1.8%-2.7%, described propylene glycol accounts for 2.4%-3.3%, described MEHQ accounts for 1.4%-2.3%, described ethylene diamine tetra methylene phosphonic acid sodium accounts for 0.9%-1.8%, described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.6%-2.5%.
2. thermosetting polyimide adhesive according to claim 1, it is characterized in that: shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 91.3%, described phenylethyl alcohol oleic acid ester accounts for 1.9%, described propylene glycol accounts for 2.5%, described MEHQ accounts for 1.5%, described ethylene diamine tetra methylene phosphonic acid sodium accounts for 1.1%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 1.7%.
3. thermosetting polyimide adhesive according to claim 1, it is characterized in that: shared by each composition of described thermosetting polyimide adhesive, weight percent is specially: described polyimide resin accounts for 87.9%, described phenylethyl alcohol oleic acid ester accounts for 2.6%, described propylene glycol accounts for 3.2%, described MEHQ accounts for 2.2%, described ethylene diamine tetra methylene phosphonic acid sodium accounts for 1.7%, and described N-phenyl-N '-cyclohexyl Ursol D accounts for 2.4%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410146885.6A CN103881643B (en) | 2014-04-14 | 2014-04-14 | Thermosetting polyimide adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410146885.6A CN103881643B (en) | 2014-04-14 | 2014-04-14 | Thermosetting polyimide adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103881643A CN103881643A (en) | 2014-06-25 |
| CN103881643B true CN103881643B (en) | 2015-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410146885.6A Expired - Fee Related CN103881643B (en) | 2014-04-14 | 2014-04-14 | Thermosetting polyimide adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103881643B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106190006A (en) * | 2016-08-23 | 2016-12-07 | 苏州盛达胶粘制品有限公司 | A kind of reinforced polyimides adhesive |
| CN109438702A (en) * | 2018-09-29 | 2019-03-08 | 苏州市新广益电子有限公司 | It is a kind of for the TPI film of FPC industry and its preparation and processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560371A (en) * | 2008-04-18 | 2009-10-21 | 中国科学院化学研究所 | High temperature resistant thermosetting polyimide adhesive and preparation method thereof |
| CN101921482A (en) * | 2010-08-18 | 2010-12-22 | 东华大学 | Thermosetting polyimide resin and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565174B2 (en) * | 2010-07-30 | 2014-08-06 | 大日本印刷株式会社 | Heat-resistant temporary adhesive tape |
| JP5699388B2 (en) * | 2010-11-30 | 2015-04-08 | 大日本印刷株式会社 | Adhesive composition and adhesive tape |
-
2014
- 2014-04-14 CN CN201410146885.6A patent/CN103881643B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560371A (en) * | 2008-04-18 | 2009-10-21 | 中国科学院化学研究所 | High temperature resistant thermosetting polyimide adhesive and preparation method thereof |
| CN101921482A (en) * | 2010-08-18 | 2010-12-22 | 东华大学 | Thermosetting polyimide resin and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN103881643A (en) | 2014-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: YUEYANG SHANYING CHEMICAL INDUSTRY CO., LTD. Free format text: FORMER OWNER: TAICANG HUANYA PACKAGING PRODUCTS CO., LTD. Effective date: 20150414 |
|
| C14 | Grant of patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Zupang Inventor before: Lu Minjie |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215400 SUZHOU, JIANGSU PROVINCE TO: 414000 YUEYANG, HUNAN PROVINCE Free format text: CORRECT: INVENTOR; FROM: LU MINJIE TO: CHEN ZUPANG |
|
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150414 Address after: 414000 Yunxi Industrial Park, Hunan, Yueyang Applicant after: YUEYANG SHANYING CHEMICAL INDUSTRY CO., LTD. Address before: 215400, Jiangsu, Suzhou province Taicang town Chengxiang emerging village Mao roadside Applicant before: Taicang Huanya Packaging Products Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150506 Termination date: 20170414 |
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| CF01 | Termination of patent right due to non-payment of annual fee |