CN103874377A - 电子装置及其芯片模组 - Google Patents

电子装置及其芯片模组 Download PDF

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Publication number
CN103874377A
CN103874377A CN201210551140.9A CN201210551140A CN103874377A CN 103874377 A CN103874377 A CN 103874377A CN 201210551140 A CN201210551140 A CN 201210551140A CN 103874377 A CN103874377 A CN 103874377A
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CN
China
Prior art keywords
mainboard
circuit board
chip module
connector
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210551140.9A
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English (en)
Inventor
张德光
潘芳黎
黄红莲
黄梅
骆健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201210551140.9A priority Critical patent/CN103874377A/zh
Priority to TW101149662A priority patent/TW201427547A/zh
Priority to US13/727,554 priority patent/US20140168911A1/en
Publication of CN103874377A publication Critical patent/CN103874377A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

一种电子装置，包括一设有一第一连接器的主板及设置于该主板上的一芯片模组，该芯片模组包括一电路板、一贴设于该电路板一侧面的芯片、一设于该电路板另一侧面的第二连接器及一锁固件，该芯片模组的第二连接器插接于该主板的第一连接器上，该锁固件穿过该电路板固定于该主板上。所述电子装置的芯片模组的电路板通过锁固件平行地固定于主板上，使该芯片模组与主板连接牢固且能满足主板的限高要求。

Description

电子装置及其芯片模组
技术领域
本发明涉及一种电子装置及其芯片模组。
背景技术
通常在电子装置（如服务器）的主板上插接一芯片模组，请参考图1，现有技术中的芯片模组包括一电路板12、一贴设于该电路板12上的芯片14及一平行于该电路板12设于该电路板12的一端的第一连接器16，该第一连接器16插接于一主板20的一第二连接器22上，使该芯片模组的电路板12垂直于该主板20。由于该芯片模组10仅靠第一连接器16与第二连接器22的连接固定，连接不牢固，且不能满足主板的限高要求。
发明内容
鉴于以上内容，有必要提供一种连接更牢固又能满足主板的限高要求的芯片模组及电子装置。
一种电子装置，包括一设有一第一连接器的主板及设置于该主板上的一芯片模组，该芯片模组包括一电路板、一贴设于该电路板一侧面的芯片、一设于该电路板另一侧面的第二连接器及一锁固件，该芯片模组的第二连接器插接于该主板的第一连接器上，该锁固件穿过该电路板固定于该主板上。
一种芯片模组，设置于一设有一第一连接器的主板上，该芯片模组包括一电路板、一设于该电路板一侧面的芯片及一贴设于该电路板另一侧面的第二连接器，该芯片模组的第二连接插接于该主板的第一连接器上，使该芯片模组的电路板平行于该主板。
相较现有技术，所述电子装置的芯片模组的电路板通过锁固件平行地固定于主板上，使该芯片模组与主板连接牢固且能满足主板的限高要求。
附图说明
图1为现有芯片模组与一主板的立体组装图。
图2为本发明电子装置的较佳实施方式的立体分解图。
图3为图2的立体组装图。
主要元件符号说明
电路板 12、52
芯片 14、522
第一连接器 16、32
主板 20、30
第二连接器 22、524
芯片模组 10、50
卡固孔 34
定位柱 54
锁固件 56
通孔 526
卡扣部 542
勾部 544
螺孔 546
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参考图2，本发明电子装置的较佳实施方式包括一主板30及一芯片模组50。本实施方式中，芯片模组50是一安全芯片模组。
该主板30上贴设有一第一连接器32。该主板30于邻近该第一连接器32处开设一卡固孔34。本实施方式中，该主板30为一服务器主板。
该芯片模组50包括一电路板52、一定位柱54及一锁固件56。
该电路板52的一侧面贴设有芯片522等电子元件，该电路板52的另一侧面贴设一第二连接器524。该电路板52的一端开设一通孔526。
该定位柱54的底部向下延伸一卡扣部542。该卡扣部542包括形状相同且位置相对的两弹性的勾部544，该两勾部544由定位柱54的底部向下并向两侧倾斜延伸形成，且该两个勾部544之间具有一定空隙，两个勾部544可向彼此间适当扳动。该定位柱54的顶部轴向地开设一螺孔546。
本实施方式中，该锁固件56为一螺钉。
请参考图3，组装时，将定位柱54的两勾部544自该主板30的上表面插入该主板30的卡固孔34内，使勾部544卡固于该主板30的下表面。将电路板52的第二连接器524插入该主板30的第一连接器32，使该电路板52的通孔526正对该定位柱54的螺孔546。将锁固件56穿过该电路板52的通孔526锁固于该螺孔546内，使该电路板52牢固地固定于该主板30上，该电路板52大致平行于该主板30。

Claims (6)

1.一种电子装置，包括一设有一第一连接器的主板及设置于该主板上的一芯片模组，该芯片模组包括一电路板、一贴设于该电路板一侧面的芯片、一设于该电路板另一侧面的第二连接器及一锁固件，该芯片模组的第二连接器插接于该主板的第一连接器上，该锁固件穿过该电路板固定于该主板上。
2.如权利要求1所述的电子装置，其特征在于：该芯片模组还包括一设于该电路板与主板之间的定位柱，该主板上开设一卡固孔，该定位柱设有一固定于该卡固孔内的卡扣部。
3.如权利要求2所述的电子装置，其特征在于：该卡扣部包括相对的两弹性的勾部，该两勾部由定位柱的底部向下延伸形成，勾部穿过主板的卡固孔卡固于该主板的下表面。
4.如权利要求2所述的电子装置，其特征在于：该电路板上开设一通孔，该定位柱的顶部开设一定位孔，该锁固件穿过该通孔锁固于该定位孔内。
5.如权利要求1所述的电子装置，其特征在于：该芯片模组的电路板平行于该主板。
6.一种芯片模组，可插接于一设有一第一连接器的主板上，该芯片模组包括一平行该主板的电路板、一设于该电路板一侧面的芯片及一贴设于该电路板另一侧面的第二连接器，该芯片模组的第二连接插接于该主板的第一连接器上。
CN201210551140.9A 2012-12-18 2012-12-18 电子装置及其芯片模组 Pending CN103874377A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201210551140.9A CN103874377A (zh) 2012-12-18 2012-12-18 电子装置及其芯片模组
TW101149662A TW201427547A (zh) 2012-12-18 2012-12-25 電子裝置及其晶片模組
US13/727,554 US20140168911A1 (en) 2012-12-18 2012-12-26 Electronic device with chip module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210551140.9A CN103874377A (zh) 2012-12-18 2012-12-18 电子装置及其芯片模组

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CN103874377A true CN103874377A (zh) 2014-06-18

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US (1) US20140168911A1 (zh)
CN (1) CN103874377A (zh)
TW (1) TW201427547A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109982507A (zh) * 2017-12-28 2019-07-05 鸿富锦精密工业(武汉)有限公司 电路板组件
CN113422222A (zh) * 2021-05-24 2021-09-21 得意精密电子(苏州)有限公司 连接器组件

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CN116614149A (zh) * 2023-04-11 2023-08-18 重庆蓝鲸智联科技有限公司 一种基于模块化可替换的收音功能模块设计方法

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CN113422222A (zh) * 2021-05-24 2021-09-21 得意精密电子(苏州)有限公司 连接器组件
CN113422222B (zh) * 2021-05-24 2023-08-15 得意精密电子(苏州)有限公司 连接器组件

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Publication number Publication date
US20140168911A1 (en) 2014-06-19
TW201427547A (zh) 2014-07-01

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Application publication date: 20140618