CN103874318A - Peripheral circuit structure - Google Patents
Peripheral circuit structure Download PDFInfo
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- CN103874318A CN103874318A CN201210535811.2A CN201210535811A CN103874318A CN 103874318 A CN103874318 A CN 103874318A CN 201210535811 A CN201210535811 A CN 201210535811A CN 103874318 A CN103874318 A CN 103874318A
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- cabling
- connection pad
- connection
- periphery circuit
- ground connection
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- 230000002093 peripheral effect Effects 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 11
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 14
- 230000003068 static effect Effects 0.000 description 11
- 230000006378 damage Effects 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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- Elimination Of Static Electricity (AREA)
Abstract
The invention provides a peripheral circuit structure which is arranged on a substrate. The substrate comprises a component region and a peripheral circuit region. The peripheral circuit structure in the peripheral circuit region comprises multiple first connecting pads, multiple second connecting pads, a first line, a second line and multiple third lines, wherein the multiple third lines are connected to components in the component region, and electrically connected with the second connecting pads. Each first connecting pad comprises a first grounding connection pad and a second grounding connection pad, and the second connecting pads are positioned between the first grounding connection pads and the second grounding connection pads. The two ends of the first line are respectively electrically connected with the first grounding connection pads and the second grounding connection pads. The two ends of the second line are also respectively electrically connected with the first grounding connection pads and the second grounding connection pads Thus, the second line, the first line, the first grounding connection pads and the second grounding connection pads form an enclosed loop.
Description
Technical field
The invention relates to a kind of periphery circuit structure, and particularly contribute to promote the periphery circuit structure of anti-electrostatic discharging (Electrostatic Discharge, ESD) ability about one.
Background technology
Generally speaking, electronic product making, packaging, test, carrying and even when finally assembling and using, have at any time suffer the destruction of static discharge and cause cannot normal operation possibility.Therefore, electronic product must possess electrostatic discharge protective design, can effectively extend its useful life.
In processing procedure, conventionally all can be around electronic component making one ESD protection circuit, so that the electric current that static discharge was produced is exported to earth terminal, and avoid causing periphery circuit structure to be damaged because electric current enters internal circuit.
ESD protection circuit is formed by metal routing and with the metal oxide connection pad of metal routing overlap joint conventionally, and wherein metal routing contributes to promote the conductivity of periphery circuit, and the overlap joint of metal oxide ground connection connection pad helps avoid metal routing oxidation.But, because cabling is different from the resistance of connection pad, once immediate current is exceedingly accumulated in both lap-joints, periphery circuit structure is destroyed by static discharge can.Particularly, more easily suffer the destruction of static discharge in the ground connection connection pad as ESD protection circuit and the lap-joint of corresponding cabling.Therefore, the lap-joint of ground connection connection pad and cabling needs further design, effectively derives the electric current that is accumulated in lap-joint, and promotes the anti-static-discharge capability of periphery circuit structure.
Summary of the invention
The invention provides a kind of periphery circuit structure, it contributes to derive the electric current that is accumulated in cabling and ground connection connection pad lap-joint.
The invention provides a kind of periphery circuit structure, it is configured on substrate.Substrate comprises element region and is positioned at the periphery circuit district of element region periphery, and wherein periphery circuit structure is configured in periphery circuit district, and in element region, disposes multiple elements.Periphery circuit structure comprises multiple the first connection pads, multiple the second connection pad, the first cabling, the second cabling and many articles of the 3rd cablings.The first connection pad comprises the first ground connection connection pad and the second ground connection connection pad.The second connection pad is between the first ground connection connection pad and the second ground connection connection pad.The first cabling is around in element region around, and the two ends of the first cabling are electrically connected with the first ground connection connection pad and the second ground connection connection pad respectively.The second cabling is positioned at a side that is away from element region of the second connection pad, and the two ends of the second cabling are electrically connected with the first ground connection connection pad and the second ground connection connection pad respectively, so that the second cabling, the first cabling, the first ground connection connection pad and the second ground connection connection pad form loop.The 3rd cabling is connected to the element that is arranged in element region, and is electrically connected with the second connection pad, and wherein the 3rd cabling position is in loop.
In one embodiment of this invention, aforesaid the first cabling and the second cabling are connected to the opposite end of the first ground connection connection pad.
In one embodiment of this invention, aforesaid the first cabling and the second cabling are connected to the opposite end of the second ground connection connection pad.
In one embodiment of this invention, aforesaid periphery circuit structure also comprises the 4th cabling.The 4th cabling is connected between the first cabling and the second cabling.
In one embodiment of this invention, aforesaid the first cabling and the second cabling are connected to same one end of the first ground connection connection pad, and described end is away from element region.
In one embodiment of this invention, aforesaid the first cabling and the second cabling are connected to same one end of the second ground connection connection pad, and described end is away from element region.
In one embodiment of this invention, aforesaid the first connection pad also comprises one the 3rd ground connection connection pad, and between the first ground connection connection pad and the second ground connection connection pad, and the second cabling is also connected to this 3rd ground connection connection pad.
In one embodiment of this invention, aforesaid the first cabling and the second cabling are extended on the first connection pad by substrate, and are extended to the sidewall of the first connection pad by the end face of the first connection pad.
In one embodiment of this invention, aforesaid at least one the 3rd cabling is extended on the second connection pad by substrate, and is extended to the sidewall of the second connection pad by the end face of the second connection pad.
In one embodiment of this invention, aforesaid the first cabling and the second cabling extend to respectively between substrate and the first connection pad, and the 3rd cabling extends between substrate and the second connection pad, and the first cabling and the second cabling extend to length between substrate and the first connection pad and are greater than the 3rd cabling and extend to the length between substrate and the second connection pad.
In one embodiment of this invention, aforesaid periphery circuit structure also comprises insulating barrier.Insulating barrier at least covers the first cabling, the second cabling and the 3rd cabling, and insulating barrier has multiple openings, exposes respectively the subregion of the first connection pad and the subregion of the second connection pad.
In one embodiment of this invention, the element of aforementioned arrangements in element region is touch control component or display element.
In one embodiment of this invention, when aforementioned the first cabling is connected to one end away from element region of one first connection pad wherein, periphery circuit structure also comprises peripheral cell, at the first cabling and wherein between one article of the 3rd cabling.
The invention provides a kind of periphery circuit structure, it is configured on substrate.Substrate comprises element region and is positioned at the periphery circuit district of element region periphery, and wherein periphery circuit structure is configured in periphery circuit district, and in element region, disposes multiple elements.Periphery circuit structure comprises multiple the first connection pads, multiple the second connection pad, the first cabling, the second cabling and many articles of the 3rd cablings.The first connection pad comprises the first ground connection connection pad, the second ground connection connection pad and at least one the 3rd ground connection connection pad between the first ground connection connection pad and the second ground connection connection pad.The second connection pad is between the first ground connection connection pad and the second ground connection connection pad.The first cabling is around in element region around.The two ends of the first cabling are electrically connected with the first ground connection connection pad and the second ground connection connection pad respectively.The second cabling is positioned at a side that is away from element region of the second connection pad, and one end of the second cabling is connected at least one of this 3rd ground connection connection pad, and the other end of the second cabling is connected to the wherein one of the first ground connection connection pad and the second ground connection connection pad.The 3rd cabling is connected to the element that is arranged in element region, and is electrically connected with the second connection pad.
Based on above-mentioned, the present invention can be by many cablings (comprising the first cabling and the second cabling) that are electrically connected with ground connection connection pad (comprising the first ground connection connection pad and the second ground connection connection pad) of configuration, increase the circulation path of the electric current of lap-joint, and effectively derive the electric current of the lap-joint that is accumulated in cabling and ground connection connection pad.So, contribute to promote the anti-static-discharge capability of periphery circuit structure, and the reliability that makes to apply integrated circuit, display floater or the contact panel of described periphery circuit structure is raised.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Brief description of the drawings
Fig. 1 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram;
Fig. 2 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram;
Fig. 3 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram;
Fig. 4 A to Fig. 4 B be application the embodiment of the present invention periphery circuit structure different contact panels on look schematic diagram;
Fig. 5 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram;
Fig. 6 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram;
Fig. 7 A to Fig. 7 D illustrates the mode that four kinds of cablings and connection pad are electrically connected;
Fig. 8 looks schematic diagram on the part of periphery circuit structure of one embodiment of the invention;
Fig. 9 A is the local schematic side view of the periphery circuit structure of another embodiment of the present invention;
Fig. 9 B is the local schematic side view of the periphery circuit structure of further embodiment of this invention.
Symbol figure description of symbols:
100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I: periphery circuit structure;
110: the first connection pads;
112: the first ground connection connection pads;
114: the second ground connection connection pads;
116,116a, 116b: the 3rd ground connection connection pad;
120,120a, 120b: the second connection pad;
130A, 130B: the first cabling;
140A, 140B, 140C, 140D, 140E: the second cabling;
142: protuberance;
150: the three cablings;
160: the four cablings;
170: insulating barrier;
10: contact panel;
12: substrate;
14: element;
14a: the first sensing serials;
14b: the second sensing serials;
16: peripheral cell;
18: the three connection pads;
A1: element region;
A2: periphery circuit district;
A 3, B: region;
CL1, CL2: loop;
P1, P2: end;
V1, V2: opening;
L1, L2, L3: length;
T1, T2: end face;
S1, S2: sidewall;
X: first direction;
Y: second direction;
I-I ', II-II ': hatching line.
Embodiment
Fig. 1 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram; Fig. 2 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram; Fig. 3 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram; Fig. 4 A to Fig. 4 B be application the embodiment of the present invention periphery circuit structure different contact panels on look schematic diagram; Fig. 5 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram; Fig. 6 be application the embodiment of the present invention periphery circuit structure contact panel on look schematic diagram.Please refer to Fig. 1, the periphery circuit structure 100A of the present embodiment for example can be applicable in contact panel 10, and wherein contact panel 10 comprises substrate 12, and the periphery circuit structure 100A of the present embodiment is configured on substrate 12.
In detail, substrate 12 comprises element region A1 and is positioned at the periphery circuit district A2 of element region A1 periphery, and wherein periphery circuit structure 100A is configured in periphery circuit district A2, and in element region A1, disposes at least one element 14.
In the present embodiment, element 14 is for example touch control component, and multiple touch control component is arranged in element region A1 in the mode of array, and a decorative layer is arranged on periphery circuit district A2, to cover periphery circuit structure.For example, element 14 can comprise the first sensing serials 14a and the second sensing serials 14b during for touch control component, wherein the first sensing serials 14a extends and arranges along second direction Y along first direction X, and the second sensing serials 14b extends and arranges along first direction X along second direction Y.In the present embodiment, first direction X is for example perpendicular to second direction Y.Certainly, above-mentioned enforcement aspect is only for illustrating, and not in order to limit the present invention.
In other unshowned embodiment, first direction X can be not orthogonal to second direction Y.Or element 14 can be other forms of touch control component, for example, can be and do not need the individual layer of bridging structure sensing electrode.When periphery circuit structure 100A is applied in display floater, element 14 can be an electric crystal array film of driving display medium, or is a display component array, for example organic light emission array.Generally speaking, every member being arranged on substrate 12 so that the functions such as specifically luminous, demonstration, touch-control sensing, light sensing to be provided can be considered as element 14.
The first connection pad 110 and the second connection pad 120 are electrically insulated each other, and these second connection pads 120 are between the first ground connection connection pad 112 and the second ground connection connection pad 114, wherein the first connection pad 110 and the second connection pad 120 are arranged along first direction X, but the present embodiment must not limit the arrangement mode of these connection pads especially.
The first cabling 130A is around in element region A1 around, and the two ends of the first cabling 130A are electrically connected respectively the first ground connection connection pad 112 and the second ground connection connection pad 114.The method of described electric connection can comprise partly to be overlapped the first cabling 130A and contacts at the first connection pad 110.
The second cabling 140A is positioned at a side that is away from element region A1 of these the second connection pads 120, and the two ends of the second cabling 140A are electrically connected respectively the first ground connection connection pad 112 and the second ground connection connection pad 114, this means, the first ground connection connection pad 112 and the second ground connection connection pad 114 are all connected to the first cabling 130A and the second cabling 140A.
One end of the 3rd cabling 150 and the second connection pad 120 are electrically connected, and the other end of the 3rd cabling 150 is connected to the element 14 that is arranged in element region A1.In the time that element 14 is the touch-control sensing element of tandem form, each the first cabling 130A is connected to the end of a first sensing serials 14a wherein or is connected to the wherein end of a second sensing serials 14b.Now, these the 3rd cablings 150 are all between the first cabling 130A and element region A1, that is in the middle of 150 areas that enclose at the first cabling 130A of these the 3rd cablings.
The material of the first cabling 130A, the second cabling 140A and the 3rd cabling 150 is for example the good metal or metal alloy of conduction, and the material of the first connection pad 110 and the second connection pad 120 is for example metal oxide.In one embodiment, in order to make element region A1 have the character of light-permeable and to consider the first connection pad 110 and the second connection pad 120 can be to make with the first sensing serials 14a or the second sensing serials 14b simultaneously, therefore the material of the first connection pad 110 and the second connection pad 120 can be identical with the material of the first sensing serials 14a of touch control component and the second sensing serials 14b.But, the present invention is not as limit.In other embodiments, the first sensing serials 14a or the second sensing serials 14b can be made and do not needed to limit the only electric conducting material with light-permeable by various material and be made.For example, the first sensing serials 14a or the second sensing serials 14b can be made by mesh wire (metal mesh) material, or partly made by metal material and another part is made by the electric conducting material of light-permeable, for example indium tin oxide/silver/indium tin oxide layered structure.
As shown in Figure 1, the second cabling 140A, the first cabling 130A, the first ground connection connection pad 112 and the second ground connection connection pad 114 form loop CL1.Meaning, the first ground connection connection pad 112 and the second ground connection connection pad 114 are electrically connected to each other by the first cabling 130A and/or the second cabling 140A, and the first ground connection connection pad 112, the second ground connection connection pad 114, the first cabling 130A and the second cabling 140A form the annular conductive path of a sealing, i.e. loop CL1.Now, in the second connection pad 120 that loop CL1 is electrically connected by the 3rd cabling 150 and with the 3rd cabling 150 and element 14 rings are located at, using as ESD protection circuit, the destruction of avoiding static discharge phenomenon to cause.
In the present embodiment, the first ground connection connection pad 112 and the second ground connection connection pad 114, except being electrically connected with the first cabling 130A, are also electrically connected with the second cabling 140A.By increasing the quantity of the cabling being electrically connected with the first ground connection connection pad 112 and the second ground connection connection pad 114, the present embodiment can increase the circulation path of the first ground connection connection pad 112 and the second ground connection connection pad 114.The electric current being accumulated on the first ground connection connection pad 112 (or second ground connection connection pad 114) can be derived via the first cabling 130A and the second cabling 140A.Therefore, the present embodiment be designed with the anti-static-discharge capability that helps promote periphery circuit structure 100A, and the reliability of integrated circuit, display floater or the contact panel of applying described periphery circuit structure 100A is raised.
In the present embodiment, the first cabling 130A and the second cabling 140A are connected to the opposite end of the first ground connection connection pad 112 and the second ground connection connection pad 114.But the present invention does not limit the relative configuration relation of the first cabling 130A and the second cabling 140A and the first ground connection connection pad 112 and/or the second ground connection connection pad 114.Below by other enforcement aspects with Fig. 2 to Fig. 4 A explanation periphery circuit structure.Please refer to Fig. 2, the periphery circuit structure 100B of the present embodiment has similar structure to the periphery circuit structure 100A of Fig. 1.Both are by Main Differences, and the first cabling 130B of the periphery circuit structure 100B of the present embodiment and the second cabling 140A are connected to same one end of the first ground connection connection pad 112 and the second ground connection connection pad 114, and described end is away from element region A1.This means, the first cabling 130B and the second cabling 140A are one end P1, the P2 that is connected to the first ground connection connection pad 112 and the second ground connection connection pad 114 adjacent substrates 12 edges.
So; the first cabling 130B, the second cabling 140A, the first ground connection connection pad 112 and the second ground connection connection pad 114 form loop CL2; and in the second connection pad 120 that loop CL2 is electrically connected by the 3rd cabling 150 and with the 3rd cabling 150 and element 14 rings are located at; using as ESD protection circuit, the destruction of avoiding static discharge phenomenon to cause.At this, the first cabling 130B and the second cabling 140A can be two independently conductor lines and be connected to separately the first ground connection connection pad 112 and the second ground connection connection pad 114.But, in other embodiment, the first cabling 130B and the second cabling 140A can first link together and be connected to the first ground connection connection pad 112 and the second ground connection connection pad 114 by same conductor line.That is to say, two conductor lines shown in the B of region can connect into one.
In the present embodiment, the electric current being accumulated on the first ground connection connection pad 112 (or second ground connection connection pad 114) can be derived via the first cabling 130B and the second cabling 140A.In other words, the present embodiment can, by the current flowing path that increases the first ground connection connection pad 112 and the second ground connection connection pad 114, be derived the electric current that is accumulated in ground connection connection pad and cabling lap-joint.So, contribute to promote the anti-static-discharge capability of periphery circuit structure 100B, and the reliability of integrated circuit, display floater or the contact panel of applying described periphery circuit structure 100B is raised.
In addition, in the design of the present embodiment, the first cabling 130B and the second cabling 140A are connected to one end P1, the P2 that are away from element region A1 of the first connection pad 110.Therefore,, in periphery circuit district A2, the region A3 between the first cabling 130B and the 3rd cabling 150 can optionally be provided with a peripheral cell 16.Now, peripheral cell 16 can be show the display element of specific pattern, as the touch control component of shortcut key, or provide the region of specific function.Under such design, peripheral cell 16 is also surrounded by the first cabling 130B, thereby the first cabling 130B can provide to peripheral cell 16 effect of anti-electrostatic discharging.In addition, in the time being provided with peripheral cell 16 in region A 3, periphery circuit structure 100B for example can also include the 3rd connection pad 18 that is connected to peripheral cell 16, and the 3rd connection pad 18 is positioned at a side that is away from the second connection pad 120 of the first connection pad 110.Or, in other unshowned embodiment, the 3rd connection pad 18 can be arranged between the first connection pad 110 and the second connection pad 120.So, the second cabling 140A that is connected to the first ground connection connection pad 112 and the second ground connection connection pad 114 can further improve the anti-static-discharge capability of periphery circuit structure 100B, for example, can avoid the 3rd connection pad 18 to be subject to electrostatic breakdown.
It should be noted that, the embodiment of Fig. 1 and Fig. 2 is two kinds of enforcement aspects for illustrating periphery circuit structure, but the invention is not restricted to this.In other unshowned embodiment, the first cabling and the second cabling can be connected to the opposite end of the first ground connection connection pad, and the first cabling and the second cabling can be connected to same one end of the second ground connection connection pad.Or the first cabling and the second cabling can be connected to same one end of the first ground connection connection pad, and the first cabling and the second cabling can be connected to the opposite end of the second ground connection connection pad.
Please refer to Fig. 3, the periphery circuit structure 100C of the present embodiment has similar structure to the periphery circuit structure 100A of Fig. 1.Both are by Main Differences, and the periphery circuit structure 100C of the present embodiment more comprises that the 4th cabling 160 is connected between the first cabling 130A and the second cabling 140A.In addition, the material of the 4th cabling 160 can be all the good metal or metal alloy of conduction with the material of the first cabling 130A, the second cabling 140A and the 3rd cabling 150.
In the present embodiment, the electric current being accumulated on the first ground connection connection pad 112 (or second ground connection connection pad 114) can be dredged via the first cabling 130A, the second cabling 140A and the 4th cabling 160.In other words, the present embodiment can be by the circulation path that increases the first ground connection connection pad 112 and the second ground connection connection pad 114, effectively to derive the electric current that is accumulated in ground connection connection pad and cabling lap-joint.So, contribute to promote the anti-static-discharge capability of periphery circuit structure 100C, and the reliability of integrated circuit, display floater or the contact panel of applying described periphery circuit structure 100C is raised.
Please refer to Fig. 4 A, the periphery circuit structure 100D of the present embodiment has similar structure to the periphery circuit structure 100A of Fig. 1.Both are by Main Differences, and the first connection pad 110 of the periphery circuit structure 100D of the present embodiment also comprises that the 3rd ground connection connection pad 116 is between the second connection pad 120, and the second cabling 140B is connected to the 3rd ground connection connection pad 116.
In detail, described the 3rd ground connection connection pad 116 be for example and the first sensing serials 14a be electrically connected the second connection pad 120a and and the second sensing serials 14b be electrically connected the second connection pad 120b between ground connection connection pad.In addition, the second cabling 140B also has a protuberance 142, and the second cabling 140B is connected to the 3rd ground connection connection pad 116 by protuberance 142.
In addition, as shown in Figure 4 B, the 3rd ground connection connection pad 116 can be also to intercept to be connected to the 3rd connection pad 18 of peripheral cell 16 and the ground connection connection pad of other the second connection pads 120.
In the embodiment of Fig. 4 A and Fig. 4 B, by the quantity that increases the cabling being electrically connected with ground connection connection pad (comprising the first ground connection connection pad 112, the second ground connection connection pad 114 and the 3rd ground connection connection pad 116), increase the circulation path of the first ground connection connection pad 112, the second ground connection connection pad 114 and the 3rd ground connection connection pad 116, effectively to derive the electric current that is accumulated in ground connection connection pad and cabling lap-joint.So, contribute to promote the anti-static-discharge capability of periphery circuit structure 100D, and the reliability of integrated circuit, display floater or the contact panel of applying described periphery circuit structure 100D is raised.In detail, in the time having a large amount of electric currents to flow through the 3rd ground connection connection pad 116, the second cabling 140B and protuberance 142 thereof can effectively be assisted to derive and be accumulated in the electric current at the 3rd ground connection connection pad 116 places, avoid the 3rd ground connection connection pad 116 and arround connection pad be subject to electrostatic breakdown.For example, in the embodiment of Fig. 4 A, the second cabling 140B and protuberance 142 thereof particularly can avoid the second connection pad 120a, 120b to be subject to electrostatic breakdown effectively.In the embodiment of Fig. 4 B, particularly can effectively avoid the 3rd connection pad 18 to be subject to electrostatic breakdown.Another is carried, and the quantity of the 3rd ground connection connection pad does not limit, and while being multiple, is to be all or part ofly connected to the second cabling as the quantity of the 3rd ground connection connection pad.
Above embodiment is the enforcement kenel of the multiple loop being formed by the second cabling, the first cabling, the first ground connection connection pad and the second ground connection connection pad.But the present invention does not limit the second cabling, the first cabling, the first ground connection connection pad and the second ground connection connection pad must form loop.In other words, above-mentioned member also can form open loop, below will describe with Fig. 5 and Fig. 6.
Please refer to Fig. 5, the periphery circuit structure 100E of the present embodiment has similar structure to the periphery circuit structure 100D of Fig. 4 A.Both are by Main Differences, and one end of the second cabling 140C of the periphery circuit structure 100E of the present embodiment is connected to the 3rd ground connection connection pad 116, and the other end is connected to the first ground connection connection pad 112, but the present embodiment is not limited to this.In other unshowned embodiment, the other end of the second cabling 140C can be to be also connected to the second ground connection connection pad 114.In other words, the other end of the second cabling 140C can be the wherein one that is connected to the first ground connection connection pad 112 and the second ground connection connection pad 114.
Please refer to Fig. 6, the periphery circuit structure 100F of the present embodiment has similar structure to the periphery circuit structure 100E of Fig. 5.Both are by Main Differences, the periphery circuit structure 100F of the present embodiment comprises the 3rd ground connection connection pad 116a, 116b and the second cabling 140D, 140E, wherein one end of the second cabling 140D is connected to the 3rd ground connection connection pad 116a, and the other end is connected to the first ground connection connection pad 112, and one end of the second cabling 140E is connected to the 3rd ground connection connection pad 116b, and the other end is connected to the first ground connection connection pad 114.
In the embodiment of Fig. 5 and Fig. 6, by the circulation path of electric current that increases ground connection connection pad (comprising the first ground connection connection pad 112, the second ground connection connection pad 114 and the 3rd ground connection connection pad 116), effectively to derive the electric current that is accumulated in ground connection connection pad and cabling lap-joint.So, contribute to promote the anti-static-discharge capability of periphery circuit structure 100E, 100F, and the reliability of integrated circuit, display floater or the contact panel of applying described periphery circuit structure 100E, 100F is raised.In detail, in the time having a large amount of electric currents to flow through the 3rd ground connection connection pad 116,116a, 116b, the second cabling 140C, 140D, 140E can effectively assist to derive and be accumulated in the electric current at the 3rd ground connection connection pad 116,116a, 116b place, avoid the 3rd ground connection connection pad 116,116a, 116b and arround connection pad be subject to electrostatic breakdown.
Below by the electric connection mode for the first cabling and the second cabling and the first connection pad with Fig. 7 A to Fig. 7 D, and the electric connection mode of the 3rd cabling and the second connection pad is described further.Fig. 7 A to Fig. 7 D illustrates the mode that four kinds of cablings and connection pad are electrically connected, and wherein Fig. 7 A is the generalized section along Fig. 1 Vertical Centre Line I-I ', II-II '.
Please refer to Fig. 7 A, periphery circuit structure can also comprise insulating barrier 170.In the present embodiment, insulating barrier 170 covers the first cabling 130A, the second cabling 140A, the 3rd cabling 150, the first connection pad 110 and the second connection pad 120, and insulating barrier 170 has multiple opening V1, V2, expose respectively the subregion of the first connection pad 110 and the subregion of the second connection pad 120.Particularly, the opening V1 of the present embodiment is for example the region not overlapping with the first cabling 130A or the second cabling 140A that exposes the first connection pad 110, and opening V2 exposes the region that the second connection pad 120 does not overlap with the 3rd cabling 150.In detail, the first cabling 130A of the present embodiment and the second cabling 140A extend to respectively between the first connection pad 110 and substrate 12, and the 3rd cabling 150 is for example to extend between the second connection pad 120 and substrate 12, but the invention is not restricted to this.
As shown in Figure 7 B, the first cabling 130A and the second cabling 140A extend to respectively between the first connection pad 110 and substrate 12, and the first cabling 130A and the second cabling 140A are connected to each other.In addition, the 3rd cabling 150 is for example to extend between the second connection pad 120 and substrate 12, and the one end at one end of the 3rd cabling 150 and the second connection pad 120 adjacent substrates 12 edges trims.
In addition,, as shown in Fig. 7 C, the material of the first connection pad 110 and the second connection pad 120 can be all metal or metal alloy.So, the first connection pad 110, the second connection pad 120, the first cabling 130A, the second cabling 140A and the 3rd cabling 150 can be made simultaneously.
In addition, as shown in Fig. 7 D, the first cabling 130A and the second cabling 140A are extended on the first connection pad 110 by substrate 12, and the 3rd cabling 150 can also be to be extended on the second connection pad 120 by substrate 12.In addition, insulating barrier 170 at least covers the first cabling 130A, the second cabling 140A and the 3rd cabling 150 to avoid its oxidation.
In addition, the material of the first cabling 130A, the second cabling 140A and the 3rd cabling 150 is not defined as the good metal or metal alloy of conduction, it can be also for example the electrically conducting transparent materials such as metal oxide, and the material of the first connection pad 110 and the second connection pad 120 is not defined as metal oxide, it can be also for example the good metal or metal alloy of conduction.Certainly, if the first connection pad 110, the second connection pad 120, the first cabling 130A, the second cabling 140A and the 3rd cabling 150 are to make simultaneously, its material for example can be all metal or metal alloy, also or can be all the electrically conducting transparent materials such as metal oxide.
It is worth mentioning that, previous embodiment also can promote by increasing the contact area of cabling and connection pad the anti-static-discharge capability of periphery circuit structure.Below will be described further with Fig. 8, Fig. 9 A and Fig. 9 B.For ease of explanation, Fig. 8, Fig. 9 A and Fig. 9 B only illustrate first connection pad 110 and second connection pad 120.
Fig. 8 looks schematic diagram on the part of periphery circuit structure of one embodiment of the invention.Please refer to Fig. 8, the periphery circuit structure of the periphery circuit structure 100G application drawing 7A of the present embodiment.Both are by Main Differences, and the first cabling 130A of the periphery circuit structure 100G of the present embodiment and the second cabling 140A extend to length L 1, L2 between substrate 12 and the first connection pad 110 at second direction Y and be greater than the 3rd cabling 150 and extend to the length L 3 between substrate 12 and the second connection pad 120 at second direction Y.
Extend to length L 1, the L2 between substrate 12 and the first connection pad 110 by increasing the first cabling 130A and the second cabling 140A at second direction Y, the present embodiment can motor current subjecting to the negotiability of lap-joint of destruction of static discharge, and avoids immediate current to be accumulated in lap-joint and make periphery circuit structure 100G suffer the destruction of static discharge.Therefore, the periphery circuit structure 100G of the present embodiment can have good anti-static-discharge capability, and the reliability that makes to apply integrated circuit, display floater or the contact panel of periphery circuit structure 100G is raised.In other unshowned embodiment, extend to the length L 3 between substrate 12 and the second connection pad 120 by increasing by the 3rd cabling 150 at second direction Y, also can motor current in the negotiability of the lap-joint of the 3rd cabling 150 and the second connection pad 120, and avoid immediate current to be accumulated in lap-joint and make periphery circuit structure 100G suffer the destruction of static discharge.
Fig. 9 A is the local schematic side view of the periphery circuit structure of another embodiment of the present invention, and Fig. 9 A is for example one of Fig. 7 B and implements aspect, and wherein Fig. 9 A omits the insulating barrier 170 that Fig. 7 B is shown.Please refer to Fig. 9 A, the first cabling 130A and the second cabling 140A of the periphery circuit structure 100H of the present embodiment are extended on the first connection pad 110 by substrate 12 respectively, and are extended to the sidewall S1 of the first connection pad 110 by the end face T1 of the first connection pad 110.
In the present embodiment, the first cabling 130A and the second cabling 140A, except contact is at the end face T1 of the first connection pad 110, also contact the sidewall S1 at the first connection pad 110.By increasing the contact area of the first connection pad 110 and the first cabling 130A and the second cabling 140A, there is the congested phenomenon of electric current in the lap-joint that can reduce the first connection pad 110 and the first cabling 130A and the second cabling 140A, and motor current is in the negotiability of lap-joint, and then avoids immediate current to be accumulated in lap-joint and make periphery circuit structure 100H suffer the destruction of static discharge.Therefore, the periphery circuit structure 100H of the present embodiment can have good anti-static-discharge capability, and the reliability that makes to apply integrated circuit, display floater or the contact panel of periphery circuit structure 100H is raised.
Fig. 9 B is the local schematic side view of the periphery circuit structure of further embodiment of this invention.Please refer to Fig. 9 B, the periphery circuit structure 100I of the present embodiment has similar structure to the periphery circuit structure 100H of Fig. 9 A.Both are by Main Differences, and the 3rd cabling 150 of the periphery circuit structure 100I of the present embodiment is extended to the sidewall S2 of the second connection pad 120 by the end face T2 of the second connection pad 120.So, also can motor current in the negotiability of lap-joint, and avoid immediate current to be accumulated in lap-joint and make periphery circuit structure 100I suffer the destruction of static discharge.Therefore, the periphery circuit structure 100I of the present embodiment can have good anti-static-discharge capability, and the reliability that makes to apply integrated circuit, display floater or the contact panel of periphery circuit structure 100I is raised.
Certainly,, in the embodiment of Fig. 9 A and Fig. 9 B, concept that also can application drawing 8 embodiment increases the negotiability of electric current in lap-joint.In brief, extend to length L 1, the L2 between substrate 12 and the first connection pad 110 by increasing the first cabling 130A and the second cabling 140A at second direction Y, promote the anti-static-discharge capability of periphery circuit structure 100H, 100I.
In sum, the present invention can, by the quantity that increases the cabling being electrically connected with the first ground connection connection pad and the second ground connection connection pad, increase the circulation path of the electric current of lap-joint, and effectively derives the electric current of the lap-joint that is accumulated in cabling and ground connection connection pad.So, contribute to promote the anti-static-discharge capability of periphery circuit structure, and the reliability that makes to apply integrated circuit, display floater or the contact panel of described periphery circuit structure is raised.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (18)
1. a periphery circuit structure, it is characterized in that, be configured on a substrate, this substrate comprises an element region and is positioned at a periphery circuit district of this element region periphery, wherein this periphery circuit structure is configured in this periphery circuit district, and in this element region, dispose multiple elements, this periphery circuit structure comprises:
Multiple the first connection pads, comprise one first ground connection connection pad and one second ground connection connection pad;
Multiple the second connection pads, between this first ground connection connection pad and this second ground connection connection pad;
One first cabling, is around in this element region around, and the two ends of this first cabling are electrically connected with this first ground connection connection pad and this second ground connection connection pad respectively;
One second cabling, be positioned at a side that is away from this element region of those the second connection pads, the two ends of this second cabling are electrically connected with this first ground connection connection pad and this second ground connection connection pad respectively, so that this second cabling, this first cabling, this first ground connection connection pad and this second ground connection connection pad form a loop; And
Many articles of the 3rd cablings, are connected to those elements that are arranged in this element region, and are electrically connected with those second connection pads, and wherein those the 3rd cablings are positioned at this loop.
2. periphery circuit structure according to claim 1, is characterized in that, this first cabling and this second cabling are connected to the opposite end of this first ground connection connection pad.
3. periphery circuit structure according to claim 1, is characterized in that, this first cabling and this second cabling are connected to the opposite end of this second ground connection connection pad.
4. periphery circuit structure according to claim 1, is characterized in that, also comprises one the 4th cabling, is connected between this first cabling and this second cabling.
5. periphery circuit structure according to claim 1, is characterized in that, this first cabling and this second cabling are connected to same one end of this first ground connection connection pad, and this end is away from this element region.
6. periphery circuit structure according to claim 1, is characterized in that, this first cabling and this second cabling are connected to same one end of this second ground connection connection pad, and this end is away from this element region.
7. periphery circuit structure according to claim 1, is characterized in that, this first connection pad also comprises one the 3rd ground connection connection pad, and between those second connection pads, and this second cabling is also connected to the 3rd ground connection connection pad.
8. periphery circuit structure according to claim 1, is characterized in that, this first cabling and this second cabling are extended on this first connection pad by this substrate, and is extended to the sidewall of this first connection pad by the end face of this first connection pad.
9. periphery circuit structure according to claim 8, is characterized in that, at least one the 3rd cabling is extended on this second connection pad by this substrate, and is extended to the sidewall of this second connection pad by the end face of this second connection pad.
10. periphery circuit structure according to claim 8, is characterized in that, this first cabling and this second cabling extend to length on this first connection pad and be greater than the 3rd cabling and extend to the length on this second connection pad.
11. periphery circuit structures according to claim 1, it is characterized in that, this first cabling and this second cabling extend to respectively between this substrate and this first connection pad, and the 3rd cabling extends between this substrate and this second connection pad, and this first cabling and this second cabling extend to length between this substrate and this first connection pad and are greater than the 3rd cabling and extend to the length between this substrate and this second connection pad.
12. periphery circuit structures according to claim 1, it is characterized in that, this first cabling and this second cabling extend to respectively between this substrate and this first connection pad, and the 3rd cabling extends between this substrate and this second connection pad, and this first cabling is electrically connected at this second cabling by this first connection pad.
13. periphery circuit structures according to claim 1, it is characterized in that, this first cabling and this second cabling extend to respectively between this substrate and this first connection pad, and this first cabling is directly connected to this second cabling, and the 3rd cabling extends between this substrate and this second connection pad, one end of the 3rd cabling also trims with the one end at the edge of contiguous this substrate of this second connection pad.
14. periphery circuit structures according to claim 1, is characterized in that, the material of this first connection pad, this second connection pad, this first cabling, this second cabling and the 3rd cabling is metal or metal alloy.
15. periphery circuit structures according to claim 1, is characterized in that, also comprise:
One insulating barrier, at least covers this first cabling, this second cabling and the 3rd cabling, and this insulating barrier has multiple openings, exposes respectively the subregion of those the first connection pads and the subregion of those the second connection pads.
16. periphery circuit structures according to claim 1, is characterized in that, this element being configured in this element region is touch control component or display element.
17. periphery circuit structures according to claim 1, it is characterized in that, when this first cabling is connected to one end away from this element region of this first connection pad wherein, this periphery circuit structure also comprises a peripheral cell, at this first cabling and wherein between one article of the 3rd cabling.
18. 1 kinds of periphery circuit structures, it is characterized in that, be configured on a substrate, this substrate comprises an element region and is positioned at a periphery circuit district of this element region periphery, wherein this periphery circuit structure is configured in this periphery circuit district, and in this element region, dispose multiple elements, this periphery circuit structure comprises:
Multiple the first connection pads, comprise one first ground connection connection pad, one second ground connection connection pad and at least one the 3rd ground connection connection pad between this first ground connection connection pad and this second ground connection connection pad;
Multiple the second connection pads, between this first ground connection connection pad and this second ground connection connection pad;
One first cabling, is around in this element region around, and the two ends of this first cabling are electrically connected with this first ground connection connection pad and this second ground connection connection pad respectively;
One second cabling, be positioned at a side that is away from this element region of those the second connection pads, one end of this second cabling is connected at least one of the 3rd ground connection connection pad, and the other end of this second cabling is connected to the wherein one of this first ground connection connection pad and this second ground connection connection pad; And
Many articles of the 3rd cablings, are connected to those elements that are arranged in this element region, and are electrically connected with those second connection pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210535811.2A CN103874318B (en) | 2012-12-12 | 2012-12-12 | Periphery circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210535811.2A CN103874318B (en) | 2012-12-12 | 2012-12-12 | Periphery circuit structure |
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| CN103874318A true CN103874318A (en) | 2014-06-18 |
| CN103874318B CN103874318B (en) | 2017-07-21 |
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| CN201210535811.2A Expired - Fee Related CN103874318B (en) | 2012-12-12 | 2012-12-12 | Periphery circuit structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129046A (en) * | 2016-07-25 | 2016-11-16 | 上海中航光电子有限公司 | Array base palte, display floater and display device |
| WO2021093443A1 (en) * | 2019-11-15 | 2021-05-20 | 京东方科技集团股份有限公司 | Touch substrate and manufacturing method therefor, touch display substrate, and touch display device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249047B1 (en) * | 1999-09-02 | 2001-06-19 | Micron Technology, Inc. | Ball array layout |
| CN201303461Y (en) * | 2008-11-25 | 2009-09-02 | 英业达股份有限公司 | Layout structure for preventing electrostatic discharge and electromagnetic interference |
| TW201040615A (en) * | 2009-05-12 | 2010-11-16 | Wintek Corp | An electronic device with high ESD protection |
| TWM434257U (en) * | 2012-01-30 | 2012-07-21 | Chunghwa Picture Tubes Ltd | Touch panel |
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2012
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129046A (en) * | 2016-07-25 | 2016-11-16 | 上海中航光电子有限公司 | Array base palte, display floater and display device |
| CN106129046B (en) * | 2016-07-25 | 2018-08-21 | 上海中航光电子有限公司 | Array substrate, display panel and display device |
| WO2021093443A1 (en) * | 2019-11-15 | 2021-05-20 | 京东方科技集团股份有限公司 | Touch substrate and manufacturing method therefor, touch display substrate, and touch display device |
| US11537253B2 (en) | 2019-11-15 | 2022-12-27 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Touch substrate and manufacturing method therefor, touch display substrate, and touch display device |
| US11853519B2 (en) | 2019-11-15 | 2023-12-26 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Touch substrate and manufacturing method therefor, touch display substrate, and touch display device |
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| CN103874318B (en) | 2017-07-21 |
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