JP2014153791A - Input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device configured to improve invisibility of a bridge section and resistance to ESD which repeatedly occurs.SOLUTION: An input device includes first transparent electrode sections 31 arranged adjacent to each other in a first direction, a bridge section 32 for connecting the first transparent electrode sections 31, second transparent electrode sections 41 arranged adjacent to each other in a second direction, and a narrowed section 42 for connecting the second transparent electrode sections 41. The bridge section 32 is formed across the narrowed section 42 via an insulating layer 37. The bridge section 32 includes a plurality of main bridge wirings 33a, 33b for connecting the first transparent electrode sections 31 in parallel to each other, and a sub bridge wiring 34a for connecting the main bridge wirings 33a, 33b. The sub bridge wiring 34a is formed in a direction crossing a longitudinal direction of the main bridge wirings 33a, 33b.

Description

  The present invention relates to an input device, and more particularly to a configuration of a bridge portion that connects between transparent electrodes.

  In a display unit of an electronic device such as a mobile device or a mobile phone, a translucent input device is used. Such a translucent input device is placed on a display device such as a liquid crystal panel or an OLED (Organic Light Emitting Diode) panel so that an operator can perform an input operation while viewing an image on the display device. it can.

  As such an input device, Patent Document 1 discloses a capacitance-type input device having a configuration in which a plurality of transparent electrodes are connected by a bridge portion (described in Patent Document 1 as an intersection portion and a relay electrode). Is disclosed. FIG. 10 shows an input device of a first conventional example described in Patent Document 1, in which FIG. 10 (a) is a partially enlarged plan view, and FIG. 10 (b) is an X of FIG. 10 (a). The partial expanded sectional view when cut | disconnecting by-X-ray and seeing from the arrow direction is shown.

  As shown in FIG. 10A, the input device 110 of the first conventional example includes a transparent substrate 120, a plurality of first transparent electrode portions 131 and a plurality of second electrodes formed on the transparent substrate 120. And a transparent electrode portion 141. The plurality of second transparent electrode portions 141 are connected in the Y1-Y2 direction by the width details 142, and the plurality of first transparent electrode portions 131 are bridge portions in the X1-X2 direction intersecting the width details 142. 132 is connected. As shown in FIG. 10B, the bridge portion 132 and the width detail 142 are insulated via an insulating layer 127. Moreover, the bridge part 132 is formed in the narrow shape so that it may not be visually recognized from the outside.

  However, in the manufacturing process of the input device 110 of the first conventional example, electrostatic discharge (ESD) is repeatedly generated due to charging of the transparent substrate 120 or charging of an external object such as a human body, and the like. The problem that the device 110 is damaged occurs.

  In particular, in order to realize good invisible characteristics of the input device 110, since the bridge portion 132 is formed narrowly, the bridge portion 132 is compared with the first transparent electrode portion 131 and the second transparent electrode portion 141. When a portion having a high resistance value is formed and ESD occurs, the bridge portion 132 is likely to be disconnected. In addition, as shown in FIG. 10B, in the case where ESD more than the withstand voltage of the insulating layer 127 occurs in the portion where the width detail 142 and the bridge portion 132 are stacked via the insulating layer 127, the insulating layer There is a problem that 127 is subjected to dielectric breakdown and disconnection of the bridge portion 132 or the like occurs. Thus, when the disconnection of the bridge unit 132 occurs due to ESD, the input position detection function of the input device 110 is impaired.

  FIG. 11 is a partial enlarged plan view of the input device 210 of the second conventional example described in Patent Document 2. In particular, the first transparent electrode portion 231 and the second transparent electrode portion 232 are provided. The crossing part is shown. As shown in FIG. 11, an opening 250c is provided in the first transparent electrode portion 231 at a portion where the first transparent electrode portion 231 and the second transparent electrode portion 232 intersect, and the first transparent electrode portion 231 A structure for reducing the capacitance between the electrode portion 231 and the second transparent electrode portion 232 is disclosed. As a result of such a structure, the plurality of first transparent electrode portions 231 adjacent in the Y1-Y2 direction are connected by the bridge portion 250, and the bridge portion 250 and the second transparent electrode portion 232 are insulating layers. 236 to intersect with each other. As shown in FIG. 11, the bridge part 250 is composed of two bridge wires 250a and 250b.

  In the input device 210 of the second conventional example, even when one of the two bridge wirings 250a and 250b is disconnected due to the occurrence of ESD, the connection between the first transparent electrode portions 231 is secured by the other. Is estimated. Therefore, it is possible to improve the ESD durability by preventing both of the bridge wirings 250a and 250b from being damaged by one occurrence of ESD.

JP 2008-310550 A JP 9-51186 A

  However, since many steps are required in the manufacturing process of the input device 210 and ESD may occur repeatedly for each process, it is possible to prevent disconnection of the bridge portion even when ESD occurs repeatedly. It is desired to improve the durability. If the width of the bridge portion 132 in FIG. 10 is increased or the number of bridge wires is increased more than two, it is possible to improve the ESD resistance, but the area of the bridge wire becomes large and is easily visible from the outside. Therefore, good invisible characteristics cannot be obtained. Therefore, it is difficult to improve durability against repeated ESD while securing the invisible characteristics of the bridge portion 250.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide an input device capable of ensuring good invisible characteristics of a bridge portion and improving durability against repeated ESD.

  The input device of the present invention includes a transparent substrate, a plurality of first transparent electrodes and a plurality of second transparent electrodes formed on the transparent substrate, and the first transparent electrode includes a plurality of first transparent electrodes. A plurality of the first transparent electrode portions are arranged at intervals in a first direction in the plane of the transparent base material and are adjacent to each other in the first direction. The first transparent electrode portions are connected to each other by a bridge portion, and the second transparent electrode includes a plurality of second transparent electrode portions arranged in a second direction intersecting the first direction. A width detail connecting the second transparent electrode portions adjacent to each other in the second direction, and the bridge portion is formed across the width detail via an insulating layer. The bridge portion includes a plurality of main bridge wires that connect the first transparent electrode portions in parallel. , And a sub-bridge wiring that connects the plurality of the main bridge wiring, the sub bridge wiring is characterized in that it is formed in a direction intersecting the longitudinal direction of the main bridge wiring.

  According to this, the bridge unit has the sub-bridge wiring that connects the plurality of main bridge wirings. For this reason, even if ESD occurs and the sub-bridge wiring is disconnected, the first transparent electrode portions can be electrically connected to each other by the plurality of main bridge wirings. Therefore, by using the sub-bridge wiring as the sacrificial wiring, durability against multiple occurrences of ESD can be improved. Alternatively, in one main bridge wiring of a plurality of main bridge wirings, even if a disconnection occurs in one main bridge wiring portion from the place where the sub bridge wiring is connected to the one adjacent first transparent electrode portion, Since the connection between the other main bridge wiring portion from the connection location to the other adjacent first transparent electrode portion and the sub-bridge wiring is ensured, it is possible to improve durability against repeated ESD. is there.

  In addition, since the sub-bridge wiring is formed in a direction intersecting with the longitudinal direction of the main bridge wiring, the main bridge wiring and the sub-bridge are compared with the method of forming many main bridge wirings instead of forming the sub-bridge wiring. An increase in the area combined with the wiring can be suppressed. Therefore, it is prevented from being visually recognized from the outside, and good invisible characteristics are ensured.

  Therefore, according to the input device of the present invention, it is possible to ensure good invisible characteristics of the bridge portion and improve durability against repeated ESD.

  In the input device according to the aspect of the invention, it is preferable that the sub-bridge wiring is formed at a position overlapping with the width details in a plan view. According to this, by forming a sub-bridge wiring at a location where disconnection due to ESD is likely to occur, when ESD occurs, the sub-bridge wiring is preferentially disconnected to ensure electrical connection of the main bridge wiring. it can.

  In the input device of the present invention, it is preferable that a plurality of the sub-bridge wirings are formed. According to this, when ESD repeatedly occurs, it is possible to secure electrical connection of the main bridge wiring and improve durability against the repeatedly generated ESD. Further, by providing the sub-bridge wiring, the area of the bridge portion can be reduced as compared with the case where the main bridge wiring is provided, so that the invisible characteristics of the bridge portion can be ensured.

  In the input device according to the present invention, a connection portion that connects the plurality of main bridge wires to each other is formed at an end portion of the plurality of main bridge wires connected to the first transparent electrode. It is preferable to be connected to the first transparent electrode portion. According to this, since the contact resistance between the bridge portion and the first transparent electrode portion can be reduced, the resistance value of the entire bridge portion can be reduced. Therefore, it is not necessary to increase the area and thickness of the main bridge wiring and the sub bridge wiring for the purpose of reducing the resistance, and good invisible characteristics can be ensured.

  In the input device of the present invention, it is preferable that the main bridge wiring and the sub bridge wiring are configured to have a metal layer, and the metal layer is Cu or a Cu alloy. According to this, since the reflectance of Cu or Cu alloy is small compared with the case where Au or Ag is used as the metal layer, the reflection of light from the outside is suppressed, and the main bridge wiring and the sub bridge wiring. Can be visually recognized from the outside.

  The input device of the present invention is an input device installed on the surface of a display device, and the display device is a plurality of subpixels regularly arranged in both the first direction and the second direction. Preferably, the sub-bridge wiring is formed in a direction inclined with respect to the second direction. According to this, since the edge of the subpixel and the sub-bridge wiring are not parallel, the phenomenon of light flickering in the sub-bridge wiring can be prevented, and the invisible characteristics can be improved.

  According to the input device of the present invention, it is possible to secure good invisible characteristics of the bridge portion and improve durability against repeated ESD.

It is a top view of the transparent base material which constitutes the input device of a 1st embodiment of the present invention. FIG. 2 is a partial enlarged cross-sectional view of the input device as viewed from the direction of the arrow cut along the line II-II in FIG. 1. FIG. 4 is a partially enlarged plan view (a) of a region surrounded by a dotted line A in FIG. 1 and a partially enlarged sectional view (b) taken along the line III-III in FIG. FIG. 5 is a partially enlarged plan view (a) showing a first modification of the present embodiment, and a partially enlarged sectional view (b) as viewed from the direction of the arrow cut along the line IV-IV in FIG. 4 (a). . It is the elements on larger scale (a) which show the 2nd modification of this embodiment, and the elements on larger scale (b) when it cuts in the VV line of Drawing 5 (a), and it sees from the direction of an arrow. . It is a partial enlarged plan view which shows the 3rd modification of this embodiment. It is a partial enlarged plan view showing the 4th modification of this embodiment. It is a partial expanded sectional view of the input device of 2nd Embodiment. FIG. 6 is a partially enlarged plan view showing an input device according to a second embodiment and showing a relative positional relationship between an array of sub-pixels and a sub-bridge wiring of the display device. FIG. 11 is a partially enlarged plan view (a) and a partially enlarged cross-sectional view (b) taken along line IX-IX in FIG. 10 (a) in the input device of the first conventional example. It is the elements on larger scale in the input device of the 2nd prior art example.

  Hereinafter, an input device according to a specific embodiment of the present invention will be described with reference to the drawings. In addition, the dimension of each drawing is changed and shown suitably.

<First Embodiment>
FIG. 1 is a plan view of a transparent substrate constituting the input device according to the first embodiment of the present invention. FIG. 2 is a partially enlarged cross-sectional view of the input device as viewed from the direction of the arrow cut along the line II-II in FIG.

  As shown in FIG. 1, the input device 10 of the present embodiment includes a transparent base material 20, a plurality of first transparent electrodes 30 and a plurality of second transparent electrodes 40 formed on the transparent base material 20. Configured. Each of the plurality of first transparent electrodes 30 includes a plurality of first transparent electrode portions 31. The plurality of first transparent electrode portions 31 are arranged at intervals in the X1-X2 direction, and the first transparent electrode portions 31 adjacent to each other in the X1-X2 direction are connected to each other by a bridge portion 32. Each of the plurality of second transparent electrodes 40 includes a plurality of second transparent electrode portions 41 and a width detail 42 that connects the second transparent electrode portions 41 to each other. The plurality of second transparent electrode portions 41 are arranged at intervals in the Y1-Y2 direction, and the second transparent electrode portions 41 adjacent in the Y1-Y2 direction are connected to each other by a width detail 42. As shown in FIG. 1, the first transparent electrode 30 is formed to extend in the X1-X2 direction, the second transparent electrode 40 is formed to extend in the Y1-Y2 direction, The transparent electrode 30 and the second transparent electrode 40 are formed so as to cross each other.

  As shown in FIGS. 1 and 2, the first transparent electrode 30 and the second transparent electrode 40 are formed so that the width detail 42 and the bridge portion 32 intersect each other. As shown in FIG. 2, an insulating layer 27 (not shown in FIG. 1) is formed so as to cover the width detail 42, and the bridge portion 32 is formed on the width detail 42 via the insulating layer 27. The first transparent electrode portions 31 are connected to each other.

  As shown in FIG. 2, the input device 10 according to the present embodiment is configured by bonding a transparent base material 20 to a transparent cover panel 28 via an optical adhesive layer 26. In the input device 10 according to the present embodiment, an operator performs an input operation by bringing a finger or the like into contact with or approaching a cover panel 28 (not shown in FIG. 1), and the first transparent electrode unit 31 and the second electrode at this time This is a capacitance type input device 10 that detects an input position based on a change in capacitance with the transparent electrode portion 41.

  As shown in FIG. 1, the first transparent electrode 30 and the second transparent electrode 40 are formed in an input region 15 (region surrounded by a two-dot chain line) where an input operation is performed. In addition, in the non-input area 16 on the outer periphery of the input area 15, a lead wiring 22 that is led out from the first transparent electrode 30 and the second transparent electrode 40 is formed, and the lead wiring 22 is connected to an external flexible substrate. It is connected to the terminal part 23 for doing. The input area 15 is a light-transmitting area, and a transparent material is used for the first transparent electrode portion 31 and the second transparent electrode portion 41 and the width detail 42 so as not to be visually recognized by the operator. Since the non-input area 16 is a non-light-transmitting area provided with a decorative layer (not shown) or the like, the lead-out wiring 22 and the terminal portion 23 are not visually recognized by the operator.

In the present embodiment, the transparent base material 20 is formed using a film-like resin material, and includes a polycarbonate resin (PC), a polyethylene terephthalate resin (PET), a polyethylene naphthalate resin (PEN), and a cyclic polyolefin (COP). A translucent resin material such as polymethyl methacrylate resin (PMMA) is used. The first transparent electrode portion 31, the second transparent electrode portion 41, and the width detail 42 are formed using a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , ZnO, etc. The thin film method is used. Further, a metal material such as Cu or Ag is used for the lead wiring 22 and the terminal portion 23.

  Next, the configuration of the bridge unit 32 in the input device 10 of the present invention will be described. 3A is a partially enlarged plan view of a region surrounded by a dotted line A in FIG. 1, and FIG. 3B is a cross-sectional view taken along the line III-III in FIG. FIG.

  As shown in FIG. 3B, the insulating layer 27 is formed so as to cover the width detail 42, and the bridge portion 32 is formed over the width detail 42 via the insulating layer 27. Yes. And the 1st transparent electrode parts 31 and 31 arrange | positioned so that the width detail 42 may be pinched | interposed in a X1-X2 direction are connected by the bridge | bridging part 32. FIG. As shown in FIG. 3A, the bridge portion 32 includes two long main bridge wires 33a and 33b extending in the X1-X2 direction and a sub bridge wire 34a connecting the two main bridge wires 33a and 33b. It is comprised. The two main bridge wirings 33a and 33b connect the first transparent electrode portions 31 and 31 adjacent in the X1-X2 direction in parallel, and the sub bridge wiring 34a is connected to the main bridge wirings 33a and 33b. A plurality of main bridge wirings 33a and 33b are connected in the Y1-Y2 direction, which is a direction intersecting the longitudinal direction. As shown in FIG. 3A, the length of the sub-bridge wiring 34a is shorter than the length of the main bridge wirings 33a and 33b.

  As shown in FIGS. 3A and 3B, connection portions 35a and 35b for connecting the plurality of main bridge wirings 33a and 33b to each other at the ends in the X1-X2 direction of the plurality of main bridge wirings 33a and 33b are provided. Each is formed. And as shown in FIG.3 (b), the connection parts 35a and 35b are connected to the 1st transparent electrode parts 31 and 31, respectively.

  In the input device 10 of the present embodiment, an opening 37a is formed by the main bridge wirings 33a and 33b, the sub bridge wiring 34a, and the connection portion 35a, and the main bridge wirings 33a and 33b, the sub bridge wiring 34a and the connection portion 35b. It can be said that the opening 37b is formed.

  In the bridge portion 32 of the input device 10 of the present embodiment, a sub-bridge wiring 34a that connects the two main bridge wirings 33a and 33b is formed. Therefore, even when ESD (Electro-Static Discharge) occurs and the sub-bridge wiring 34a is disconnected, the first transparent electrode portions 31 and 31 are electrically connected to each other by the two main bridge wirings 33a and 33b. Can be connected. That is, by using the sub-bridge wiring 34a as the sacrificial wiring, it is possible to improve durability against ESD repeatedly generated a plurality of times as compared with the input devices 110 and 210 of the conventional example.

  As shown in FIG. 3A, with respect to the main bridge wiring 33a, one of the first transparent electrodes 31 and 31 adjacent to each other from the position where the main bridge wiring 33a and the sub bridge wiring 34a are connected. A portion up to a portion connected to the transparent electrode 31 (the first transparent electrode 31 positioned in the X1 direction) is referred to as a main bridge wiring portion 33a1. The first transparent electrode 31 (the first transparent electrode located in the X2 direction) of the adjacent first transparent electrodes 31 and 31 from the place where the main bridge wiring 33a and the sub bridge wiring 34a are connected. The portion up to the location connected to 31) is defined as a main bridge wiring portion 33a2. Similarly, the main bridge wiring 33b is referred to as a main bridge wiring portion 33b1 and a main bridge wiring portion 33b2.

  In the bridge portion 32 of the input device 10 of the present embodiment, the portion located on the X1 side of the main bridge wires 33a and 33b divided in the longitudinal direction (X1-X2 direction) at the location where the sub-bridge wire 34a is connected. Even if either one of the main bridge wiring portion 33a1 or the main bridge wiring portion 33b1 is disconnected due to the occurrence of ESD, the other of the main bridge wiring portion 33a1 or the main bridge wiring portion 33b1 and the sub bridge wiring 34a The main bridge wiring portion 33a2 or the main bridge wiring portion 33b2 is electrically connected. Therefore, durability against repeatedly generated ESD can be improved.

  Further, in order to improve durability against repeated ESD, it is conceivable to increase the number of main bridge wirings to form three or more instead of forming the sub-bridge wiring 34a. The area increases, and the invisible characteristics of the entire bridge portion 32 deteriorate. In the input device 10 of this embodiment, the sub-bridge wiring 34a shorter than the length of the main bridge wirings 33a and 33b is formed in the direction intersecting with the longitudinal direction of the main bridge wirings 33a and 33b. An increase in the area of is suppressed. Therefore, it is prevented from being visually recognized from the outside, and good invisible characteristics are ensured.

  In addition, it is preferable that the space | interval of the adjacent said main bridge wiring 33a, 33b is 10 micrometers or more and 100 micrometers or less. The line width of each wiring is preferably 10 μm or more and 30 μm or less. If it carries out like this, while the bridge | bridging part 32 can be formed easily, a favorable invisible characteristic is acquired.

  As described above, according to the input device 10 of the present invention, it is possible to ensure good invisible characteristics and improve durability against ESD that is repeatedly generated by the bridge portion 32.

  As shown in FIG. 3A, the sub-bridge wiring 34a is formed at a position overlapping the width detail 42 in plan view. Further, the main bridge wirings 33 a and 33 b are formed so as to intersect the width detail 42, and a part thereof is formed overlapping the width detail 42. As shown in FIG. 3B, the sub-bridge wiring 34 a is electrically insulated from the width detail 42 through the insulating layer 27.

  In the position where the main bridge wirings 33a and 33b and the sub-bridge wiring 34a overlap the width detail 42, if an ESD higher than the withstand voltage of the insulating layer 27 occurs, the insulating layer 27 breaks down and the main bridge wirings 33a and 33b. Etc. are likely to occur. In the present embodiment, by forming the sub-bridge wiring 34a at a location where disconnection due to the occurrence of ESD is likely to occur, when the ESD occurs, the sub-bridge wiring 34a is preferentially disconnected and used as a sacrificial wiring. The conduction of the main bridge wirings 33a and 33b is ensured.

  In the present embodiment, connection portions 35a and 35b are provided at the ends of the main bridge wirings 33a and 33b, and the connection portions 35a and 35b are connected to the first transparent electrode portions 31 and 31, respectively. Thereby, since the connection area of the bridge part 32 and the 1st transparent electrode part 31 can be enlarged and contact resistance can be reduced, the resistance value of the bridge part 32 whole is reduced. Therefore, it is not necessary to increase the area and thickness of the main bridge wires 33a and 33b in order to reduce the resistance of the bridge portion 32, and good invisible characteristics of the bridge portion 32 can be ensured.

  When a transparent conductive material such as ITO is used as the bridge portion 32 as in the case of each transparent electrode, the invisible characteristics are good, but since the resistance value increases, disconnection is likely to occur due to ESD, and both the invisible characteristics and ESD resistance are compatible. It is difficult. Therefore, it is preferable to use a metal material for the bridge portion 32.

  In the input device 10 of the present embodiment, it is preferable to use a metal layer made of Cu or a Cu alloy (for example, CuNi) as the main bridge wirings 33a and 33b and the sub bridge wiring 34a. In this way, the reflectance of Cu or Cu alloy is smaller than when Ag or Au is used as the metal layer, so that reflection of light from the outside and display light from the display device is suppressed, and the main bridge The wirings 33a and 33b and the sub-bridge wiring 34a are suppressed from being visually recognized from the outside.

  FIG. 4 shows a first modification of the input device 10 of the first embodiment, FIG. 4 (a) is a partially enlarged plan view of a bridge portion, and FIG. 4 (b) is a diagram of FIG. 4 (a). The partial expanded sectional view when cut | disconnected by the IV-IV line and seeing from the arrow direction is shown. 5 shows the input device 10 of the second modification, FIG. 5 (a) is a partially enlarged plan view of the bridge portion, and FIG. 5 (b) is a VV line in FIG. 5 (a). The partial expanded sectional view when it cut | disconnects and seen from the arrow direction is shown.

  As shown in FIG. 4, the input device 10 of the first modified example is configured to include two subbridge wirings 34a and 34b. The subbridge wirings 34a and 34b include the width details 42 and the first It is formed at a position that does not overlap with the transparent electrode portion 31. As a result, the main bridge wirings 33a and 33b are connected to the main bridge wiring parts 33a1, 33a2, and 33a3 or the main bridge wiring parts 33b1, 33b2, and 33b3 in the longitudinal direction more at the locations where the sub bridge wirings 34a and 34b are connected. Divided. Therefore, even if a part of the main bridge wiring portion is disconnected due to ESD in one main bridge wiring, the conduction between the first transparent electrodes 31 and 31 can be secured by the remaining main bridge wiring portion and the sub-bridge 34a. For this reason, durability against repeatedly generated ESD is improved. Note that the number of sub-bridge wirings is not limited to this, and three or more sub-bridge wirings may be provided.

  Further, in the input device 10 of the second modification shown in FIG. 5, three main bridge wires 33a, 33b, 33c are formed, and the first transparent electrode portions 31, 31 are connected in parallel, respectively. Even in such an embodiment, durability against repeated ESD can be improved. If the number of long main bridge lines is increased, the invisible characteristics may be deteriorated. Therefore, the line width of each main bridge line 33a, 33b, 33c and the width dimension of the entire bridge portion 32 (dimension in the Y1-Y2 direction). Need to be properly formed.

  In FIG. 6, the 3rd modification of the input device 10 of this embodiment is shown. The main bridge wirings 33a and 33b and the sub bridge wiring 34a shown in FIGS. 3 to 5 are all formed in a straight line shape, but are not limited thereto. Like the input device 10 of the 3rd modification shown in FIG. 6, you may form with a curve. For example, the openings 37a and 37b can be formed in a shape such as a circle or an ellipse. Alternatively, the line width of the long main bridge wirings 33a and 33b may be changed in the X1-X2 direction to partially increase the line width. Even in these embodiments, good invisible characteristics and durability against repeated ESD can be improved.

  In FIG. 7, the 4th modification of the input device 10 of this embodiment is shown. As shown in FIG. 7, in the input device 10 of the fourth modification, at least one of the plurality of main bridge wirings 33a and 33b and the sub bridge wiring 34a is formed to have a different width. . In the input device 10 shown in FIG. 7, the main bridge wiring 33b is formed relatively wide, and the main bridge wiring 33a and the sub bridge wiring 34a are formed narrow.

  According to this, at least one of the plurality of main bridge wirings 33a and 33b and the sub bridge wiring 34a is formed to have a different width in accordance with the ESD size assumed in the manufacturing process of the input device 10 or the like. Can do. For example, when ESD is small, the main bridge wiring 33a or the sub bridge wiring 34a having a small wiring width is preferentially disconnected, and the main bridge wiring 33b is not disconnected. Therefore, it is possible to improve durability against ESD that is effectively repeatedly generated.

  In addition, in the input device 10 of this embodiment shown in FIGS. 1-7, although the 1st transparent electrode part 31 and the 2nd transparent electrode part 41 are formed in the rhombus shape, it is not limited to this. What is necessary is just to form so that an electrostatic capacitance may be formed between the 1st transparent electrode part 31 and the 2nd transparent electrode part 41. FIG.

<Second Embodiment>
8 and 9 show an input device according to the second embodiment. FIG. 8 is a partially enlarged cross-sectional view of the input device, and FIG. 9 is a partially enlarged plan view showing the relative positional relationship between the sub-pixel array and the sub-bridge wiring of the display device. As shown in FIG. 8, the input device 11 according to the present embodiment is used by being arranged on a display screen of a display device 50 such as a liquid crystal panel or an OLED (Organic Light Emitting Diode) panel. The input device 11 and the display device 50 are used by being bonded together by the optical adhesive layer 53. Alternatively, the input device 11 and the display device 50 can be used integrally in a state where the input device 11 and the display device 50 are incorporated in the housing without being bonded by the optical adhesive layer 53.

  FIG. 9 schematically shows an arrangement of three-color sub-pixels 52R, 52G, and 52B constituting a color filter 51 (not shown in FIG. 8) used in the liquid crystal panel. The subpixel 52R is a red layer, the subpixel 52G is a green layer, and the subpixel 52B is a blue layer. As shown in FIG. 9, the three-color sub-pixels 52R, 52G, and 52B all have the same shape and the same area, the short sides are parallel to the X1-X2 direction, and the long sides are Y1-Y2. A rectangular shape oriented parallel to the direction. Three color sub-pixels 52R, 52G, and 52B form one set, and each set is regularly arranged in the X1-X2 direction and the Y1-Y2 direction.

  In the input device 11 of the present embodiment, the sub-bridge wiring 34a is formed in a direction inclined with respect to the Y1-Y2 direction. That is, it is formed in a direction inclined with respect to the long sides of the subpixels 52R, 52G, and 52B.

  When the sub-bridge wiring 34a is formed in parallel to the long sides of the sub-pixels 52R, 52G, and 52B as the input device of the comparative example, the display light from the display device 50 passes through the color filter 51 and the input device. The flicker may be visually recognized from the outside due to the reaction of the edge of the sub-bridge wiring 34a. Since the edge of the sub-bridge wiring 34a and the long sides of the sub-pixels 52R, 52G, and 52B are parallel, the sub-bridge wiring 34a is often formed so as to overlap one sub-pixel. Then, it is considered that light of the same hue emitted from one subpixel is reflected and scattered at the edge of the sub-bridge wiring 34a, and the light of the same hue is more emphasized when viewed from the outside.

  In the input device 11 of this embodiment, since the sub-bridge wiring 34a is formed to be inclined with respect to the Y1-Y2 direction, the sub-bridge wiring 34a is overlapped with the plurality of sub-pixels 52G and 52B as shown in FIG. In many cases, the bridge wiring 34a is formed. Therefore, light of the same hue is emphasized at the edge of the sub-bridge wiring 34a and is prevented from being visually recognized as flickering when viewed from the outside, so that the invisible characteristics can be improved.

  Similarly, the connection portions 35a and 35b formed at the end portions of the main bridge wirings 33a and 33b in the X1-X2 direction are preferably inclined with respect to the Y1-Y2 direction. In this way, light flickering at the edges of the connecting portions 35a and 35b is prevented, and the invisible characteristics are improved.

  In FIG. 9, the case where the input device 11 of the present embodiment is disposed so as to overlap the color filter 51 of the liquid crystal panel has been described, but the present invention is not limited to this. For example, when arranged on an OLED panel, subpixels of a plurality of colors are formed in an array, and the same effect can be obtained by inclining the subbridge wiring 34a with respect to the subpixel arrangement direction.

DESCRIPTION OF SYMBOLS 10, 11 Input device 15 Input area 16 Non-input area 20 Transparent base material 22 Lead-out wiring 23 Terminal part 26, 53 Optical adhesion layer 27 Insulating layer 30 1st transparent electrode 31 1st transparent electrode part 32 Bridge part 33a, 33b 33c Main bridge wiring 33a1, 33a2, 33a3, 33b1, 33b2, 33b3 Main bridge wiring part 34a, 34b Sub bridge wiring 35a, 35b Connection part 37a, 37b, 37c, 37d Opening 40 Second transparent electrode 41 Second transparent electrode Transparent electrode part 42 Width details 50 Display device 51 Color filter 52R, 52G, 52B Subpixel

Claims (6)

A transparent substrate, a plurality of first transparent electrodes and a plurality of second transparent electrodes formed on the transparent substrate;
The first transparent electrode has a plurality of first transparent electrode portions, and the plurality of first transparent electrode portions are arranged at intervals in a first direction within the surface of the transparent substrate. And the first transparent electrode portions adjacent in the first direction are connected by a bridge portion,
The second transparent electrode includes a plurality of second transparent electrode portions arranged in a second direction intersecting the first direction, and the second transparent electrode portions adjacent to each other in the second direction. With connecting width details,
The bridge portion is formed over the width detail through an insulating layer,
The bridge portion includes a plurality of main bridge wires that connect the first transparent electrode portions in parallel, and a sub-bridge wire that connects between the plurality of main bridge wires,
The input device, wherein the sub-bridge wiring is formed in a direction crossing a longitudinal direction of the main bridge wiring.   The input device according to claim 1, wherein the sub-bridge wiring is formed at a position overlapping with the width detail in a plan view.   The input device according to claim 1, wherein a plurality of the sub-bridge wirings are formed.   A connection portion that connects the plurality of main bridge wires to each other is formed at an end portion of the plurality of main bridge wires connected to the first transparent electrode, and the connection portion is the first transparent electrode portion. The input device according to claim 1, wherein the input device is connected to the input device.   The main bridge wiring and the sub-bridge wiring each include a metal layer, and the metal layer is Cu or a Cu alloy. The input device according to item. An input device installed on the surface of the display device,
The display device includes a plurality of subpixels regularly arranged in both the first direction and the second direction;
The input device according to claim 1, wherein the sub-bridge wiring is formed in a direction inclined with respect to the second direction.