CN1038721A - Electronic unit, packaging of electronic parts agent and method for packing - Google Patents

Electronic unit, packaging of electronic parts agent and method for packing Download PDF

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CN1038721A
CN1038721A CN89103279A CN89103279A CN1038721A CN 1038721 A CN1038721 A CN 1038721A CN 89103279 A CN89103279 A CN 89103279A CN 89103279 A CN89103279 A CN 89103279A CN 1038721 A CN1038721 A CN 1038721A
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encapsulants
mould
electronic
polymerization
electronic unit
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CN1015584B (en
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贺内觉太郎
友重徹
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Mitsui Chemical Industry Co Ltd
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Mitsui Petrochemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A kind of electronic unit is provided, wherein electronic component (not comprising that light transmits and receives element) is with the polymer encapsulated of polymerizable liquid composition, said composition comprises as the monomer of the diallyl compound of main component or oligomer or its their mixture, it has improved chemical resistance and hardness, and not disturbed by chlorine impurity.

Description

Electronic unit, packaging of electronic parts agent and method for packing
The present invention relates to electronic unit or electronic device, for example integrated circuit and large scale integrated circuit, especially, the present invention relates to a kind of encapsulants of improving chemical resistance and hardness and not disturbed by chlorine impurity, a kind of method for packing of obtaining this encapsulants advantage, and with this method manufacturing and improve the electronic unit of its performance.
In prior art, resin such as epoxy encapsulation integrated circuit and like are usually used in the manufacturing of electronic unit such as integrated circuit and large scale integrated circuit.
Usually, epoxy resin has good chemical resistance, electrical property, mechanical performance and adhesiveness, in electronics and electrical material field, be widely used as encapsulants, because chloride such as chloropropylene oxide as the raw material of preparation epoxy resin, therefore leave chloride, free chlorine, hydrolysis chlorine or the like in the resin of making.
If such chlorine-containing resins is as encapsulants, under certain service condition, it will discharge quite a large amount of chloride ions, cause the reduction of electronic unit reliability, in addition, also prolong the curing time of resin significantly, cause inefficient program.
For this reason, Japanese Unexamined Patent Publication No 58-134112 suggestion is handled epoxy resin with the alkali compounds in the excessive mixed solvent that is dissolved in methylethylketone and isobutyl ketone, reduce the content of hydrolysis chlorine in the resin thus, the problem that this technology exists is that this alkali compounds plays catalytic action to ketone and makes the ketogenesis high boiling point condensate, and form tiny polymer gel, stay in the resin of generation, and be difficult to be subjected to chlorine chlorine to disturb insignificant degree except that going to.
An object of the present invention is to overcome above-mentioned the problems of the prior art, and a kind of electronic unit that improves chemical resistance and hardness and not disturbed by chlorine impurity is provided.
Another object of the present invention provides the useful encapsulants of a kind of electronic unit, and this encapsulants also has except that having above-mentioned performance and shortened curing time and good release property.
A further object of the invention provides a kind of packaging of electronic parts method with above-mentioned performance that is used to prepare.
According to first purpose of the present invention, a kind of electronic unit is provided, wherein electronic component (not comprising that light transmits and receives element) is the polymer encapsulated of usefulness polymerizable liquid composition, and described fluid composition comprises (a) monomer or oligomer or its their mixture as a kind of diallyl compound of main component.
According to second purpose of the present invention, a kind of encapsulants (A) that is used for electronic component-use is provided, it contains monomer or oligomer or its their mixture of (a) a kind of diallyl compound.
According to the 3rd purpose of the present invention, a kind of method of packaged electronic components is provided, it comprises electronic component (not comprising that light transmits and receives element) is placed mould, more above-mentioned encapsulants (A) is injected mould, and polymerization encapsulants (A).
According to the 4th purpose of the present invention, a kind of method of packaged electronic components is provided, it comprises electronic component (not comprising that light transmits and receives element) is placed mould, again above-mentioned encapsulants (A) is injected mould, liquid (C) (its density be lower than encapsulants (A) and in encapsulants (A) solubility less) be present in polymerization encapsulants (A) under the condition on the encapsulants (A).
According to the 5th purpose of the present invention, a kind of method of packaged electronic components is provided, it comprises electronic component (not comprising that light transmits and receives element) is placed mould, again above-mentioned encapsulants (A) is injected mould, polymerization encapsulants (A) under the condition that the surface that makes encapsulants (A) and inert gas (concentration of its oxygen is up to 1%) keep in touch.
Disclosed in the present invention containing as the monomer of the diallyl compound of main component or oligomer or its their mixture comprises a kind of independent monomer, a kind of independent oligomer, the mixture of a kind of monomer and a kind of oligomer, the mixture of two or more monomers, the mixture of two or more oligomer, and the mixture of at least a monomer and at least a oligomer.
With disclosed polymer in the present invention can be homopolymers, also can be copolymer.
Fig. 1 is the profile of ic package, and it is an example of electronic unit of the present invention.
Fig. 2 is the profile of ic package, and it also is another example of electronic unit of the present invention.
To describe the present invention in detail by the preference that accompanying drawing provides.
Electronic unit of the present invention is not comprise that light transmits and receives the electronic component of element, for example, and integrated circuit component, large scale integrated circuit element, semiconductor element or pellet parts, semiconductor impedance component, transistor and diode.
Electronic unit of the present invention is not comprise that light transmits and receives the electronic unit of element, for example, and integrated circuit components, lsi components, transistor component, diode part, piezo-resistance, controllable silicon and semiconductor integrated circuit parts.
Electronic unit, packaging of electronic parts agent and method for packing are not limited to the encapsulation of electronic component, and are applicable to encapsulation between the electronic component and the encapsulation of electronic unit a part or whole part.
Fig. 1 and Fig. 2 have illustrated ic package 1, and this is the preference of electronic unit of the present invention.
With ic package 1 is that the electronic unit of the present invention of typical case can be any such parts, and the shape of electronic unit or analogue do not have particular determination, for example, and with particular polymers 7 packaged integrated circuits elements 5.
Fig. 1 is the cutaway view of ic package, ic package 1 is to constitute like this, integrated circuit component 5 is installed on the integrated circuit fixed base plate 3 of lead frame 2, the electrode of integrated circuit component 5, by wiring 6, be connected with the respective lead of lead frame 4, and be packaged into assembly with polymer 7.
Electronic unit of the present invention is characterised in that with particular polymers and encapsulates, especially use the homopolymers or the copolymer encapsulation of polymerisable fluid composition (after this being called encapsulants A), said composition contains monomer or oligomer or its their mixture of (a) diallyl compound.
Chlorinity is preferably up to 50ppm in the fluid composition, and chlorinity is that (ASTM-B-2785 ASTM-C-758) records with Wick BOLd firing method in the fluid composition.
When this fluid composition when the packaging of electronic parts agent, chlorine does not take place to be disturbed because be substantially free of chlorine in the composition, and be retained in chlorinity in the potting resin up to 50ppm(preferably up to 20ppm).
Preferably a kind of fluid composition of encapsulants (A), it contains aliphatic series, alicyclic or the oligomer of two (allyl carbonate) that aromatic dihydroxy is pure or the mixture of its oligomer.
The example of composition comprises:
Composition contains (a ') general formula:
The aliphatic series of (R is the remainder of dihydroxy alcohol in the formula, and n is 1 to 10, is preferably a number or its average in the 2-10 scope), alicyclic or monomer or oligomer or its their mixture of two (allyl carbonate) that aromatic dihydroxy is pure.
Component (a ') is the product of carbonic acid diallyl and dihydroxy alcohol (mol ratio is 4: 1 or lower, and preferred mol ratio is 2: 1) preferably.
The preference of dihydroxy alcohol comprises independent ethylene glycol, 1, ammediol, 1,4 butanediols, 1,6-hexylene glycol, diethylene glycol (DEG), polyethylene glycol, DPG, propylene glycol, neopentyl glycol, TMPD, cyclohexanedimethanol, two (methylol) tristane, 2,7-norborneol glycol, α, α '-Xylene glycol, 1,4-pair-(hydroxyl-oxethyl benzene) and 2,2-pair-(4-(hydroxyl-oxethyl) phenyl)-propane, and their mixture.
Encapsulants of the present invention (A) preferably contain following component (a "), fluid composition (b) and (c), at this with reference to quoting Japanese Unexamined Patent Publication No 59-140214.
Preferred composition comprises:
The general formula of (a ") 10～90%(weight) is:
Figure 891032797_IMG3
(R is the remainder of dihydroxy alcohol in the formula, n is 1 to 10, number between preferred 2 to 10 or its average) aliphatic series, alicyclic or the oligomer of two (allyl carbonates) that aromatic dihydroxy is pure or the mixture of oligomer, its condition for the optional amount that is present in dihydroxy alcohol two (allyl carbonate) monomer in the oligomer for up to 50%(weight);
(b) 0～90%(weight) be selected from following compounds:
(b-1) general formula is:
Figure 891032797_IMG4
(in the formula R ' be two or the remainder of trihydroxy alcohol), n ' equals 2 or 3) two or three (allyl carbonate) monomers or its their mixture of aliphatic series, alicyclic, aromatics two or trihydroxy alcohol, its condition for optional be present in monomer or the mixture two oligomeric two (allyl carbonates) of trihydroxy alcohol or two or the amount of poly-(allyl carbonate) of trihydroxy alcohol up to 30%(weight)
(b-2) general formula is
Figure 891032797_IMG5
Aliphatic series or the aromatics two or the tricarboxylic allyl ester of (R in the formula " being two or tricarboxylic remainder, n " equals 2 or 3).
(b-3) be triallyl cyanurate or cyamelide triallyl.
(c) 0 to 30%(weight) acrylic acid or vinyl monomer; Its condition is that component (b) and summation (c) are greater than 0.
(a ") is the product of carbonic acid diallyl and dihydroxy alcohol (its mol ratio is 4: 1 or lower, and more preferably mol ratio is 2: 1) to preferred ingredient.Dihydroxy alcohol preferably is selected from ethylene glycol, 1, ammediol, 1,4-butanediol, 1,6-hexylene glycol, diethylene glycol (DEG), polyethylene glycol, DPG, propylene glycol, neopentyl glycol, TMPD, cyclohexanedimethanol, two (methylol) tristane, 2,7-norborneol glycol, α, α '-Xylene glycol, 1,4-two (hydroxyl-oxethyl benzene) and 2, two (4(hydroxyl-oxethyl) phenyl of 2-) propane.
Preferred ingredient (b) is carbonic acid diallyl and two or the product of trihydroxy alcohol (its mol ratio is 6: 1 or higher, and preferred mol ratio is 12: 1).Two or trihydroxy alcohol preferably be selected from independent ethylene glycol, 1, ammediol, 1,4-butanediol, 1,6-hexylene glycol, diethylene glycol (DEG), polyethylene glycol, DPG, propylene glycol, neopentyl glycol, TMPD, cyclohexanedimethanol, two (hydroxymethyl) tristane, 2,7-norborneol glycol, α, α '-Xylene glycol, 1,4-two (hydroxyl-oxethyl benzene), 2, two (4-(hydroxyl-oxethyl) phenyl of 2-) propane, trimethylolpropane, three (hydroxyethyl) isocyanuric acid ester and their mixture thereof.
Also comprise dially phthalate, disuccinic acid diallyl, diallyl adipate, diallyl chlorendate, Glycolic acid diallyl, diallyl naphthalene dicarboxylic acids ester and mellitic acid triallyl (triallyl mellitate) in the component (b).
Component (c) preferably is selected from vinylacetate, vinyl benzoic acid ester, methyl methacrylate, phenyl methacrylate, methyl acrylate, maleic acid methyl esters, maleic anhydride, vinylidene chloride and their mixture thereof.
Other example of diallyl compound comprises:
(I) copolymerizable composition, it contains benzene dicarboxylic acid diallyl and diethylene glycol (DEG) diallyl carbonic ester (as disclosing among the Japanese Unexamined Patent Publication No 59-45312) that nuclear is replaced by halogen.
(II) copolymerizable composition, it (for example contains benzene dicarboxylic acid that at least a nuclear replaced by halogen, diallyl 2,4-dichloro four phthalic acid esters) and at least a that have a ring and can form refractive index be at least 1.55 homopolymers polymerizable groups simple function group monomer (for example, phenyl methacrylate), as in Japanese Unexamined Patent Publication No 59-8709, disclosing.
(III) copolymerizable composition, it contains, and at least a diene propyl carbonate or two-the Beta-methyl allyl carbonate (for example, 1, two (hydroxyl-oxethyl) benzene diallyl carbonic esters of 4-) and at least a have aromatic ring also can form refractive index be at least 1.55 homopolymers polymerizable groups simple function group monomer (for example, phenyl methacrylate), as in Japanese Unexamined Patent Publication No 59-8710, disclosing.
(IV) copolymerizable composition, it by dihydroxylic alcohols (for example contains, the 4-benzylphenol) with unsaturated carboxylic acid or its chloride (for example, acrylic acid or its chloride) monomer that obtains of reaction and (for example can form the monomer that polymerizable groups is arranged that refractive index is at least 1.55 homopolymers, styrene), as in Japanese Unexamined Patent Publication No 59-96109, disclosing.
(V) copolymerizable composition, it (for example contains chlorobenzene formic acid allyl ester, 2,3-dichlorobenzoic acid diallyl ester) and bifunctional monomer's (for example tetrabromo-benzene dioctyl phthalate diallyl ester) as in Japanese Unexamined Patent Publication No 59-96113, disclosing.
(VI) copolymerizable composition is as disclosing in Japanese Unexamined Patent Publication No 59-184210.
(VII) diethylene glycol bis-allyl carbonate and
The copolymerizable composition of (VIII) diallyl compound and the vinyl monomer composition that contains aromatic ring, wherein diallyl compound such as diethylene glycol (DEG) diallyl carbonic ester, 1, two (hydroxyl-oxethyl) benzene diallyl carbonic esters and 2 of 4-, 4-dichloro para Toluic Acid diallyl ester; Vinyl monomer such as phenyl methacrylate and benzyl methacrylate.
The polymerizable liquid composition can contain other monomer and filler, and its amount is not as the criterion for not damaging the physical property that generates polymer.For example, can add monobasic (methyl) acyclic compound, binary (methyl) acyclic compound, or unsaturated carboxylic acid such as maleic anhydride, addition is up to 30%(weight), or can add silicon coupling agent such as vinyltriethoxysilane, its addition is up to 10%(weight) (based on the weight of polymer).
In practice of the present invention, encapsulants (A) also can contain polymerization initiator (B).
The polymerization initiator (B) that is used in the polymerization encapsulants (A) can be any Photoepolymerizationinitiater initiater, thermal polymerization, light and heat polymerization initiator, and their mixture.
Photoepolymerizationinitiater initiater comprises electron beam and radiation polymerization initator and Photoepolymerizationinitiater initiater.
The exemplary of Photoepolymerizationinitiater initiater is 2-hydroxy-2-methyl-1-phenyl-third-1-ketone.
The example of thermal polymerization comprises: peroxy dicarbonate, for example, diisopropyl peroxydicarbonate, di-secondary butyl peroxy two carbonic esters, dicyclohexyl peroxide two carbonic esters and t-butyl peroxy benzoic ether; Organic peroxide, for example, benzoyl peroxide, acetyl peroxide, TBHP, cumene peroxide, di-tert-butyl peroxide, tert butyl peroxy benzoate, lauryl peroxide, diisopropyl peroxydicarbonate, peroxidating dimethyl ethyl ketone and diacyl peroxide; Free-radical initiator, for example, azodiisobutyronitrile and azo dimethyl isobutyl cyanide.
The exemplary of light and heat polymerization initiator is the compound of following chemical formula
Figure 891032797_IMG6
The amount that can be used for the polymerization initiator of polymerization encapsulants (A) is 0.1～10%(weight), be preferably 1-6%(weight) (based on encapsulants (A).
If desired, encapsulants (A) can be used with semi-cured state or B level.
Although method for packing below preferred the use does not have particular determination with the method for encapsulants (A) encapsulated integrated circuit 5 or analog.
(1) polymerization encapsulants (A) under inert gas (its oxygen concentration is up to 1%, preferably up to 0.5%, more preferably up to 0.01%) protection.
If the encapsulants of polymerization (A) contacts with air in the presence of free radical polymerization initiator, oxygen will consume active group, so that the surface of the polymerization encapsulants that contacts with air sometimes may stay the viscous liquid or the gel of the molecular weight that does not reach enough.
In order to finish polymerization reaction equably; so that make case hardness reach 2B at least; the preferred pencil hardness of HB at least; preferably under the protection of inert gas such as nitrogen and argon gas, carry out polymerization reaction; the concentration of oxygen is up to 1% in the inert gas; preferably up to 0.5%, more preferably up to 0.01%.
(2) be used in the surface that liquid (C) that the low and density of solubility in the encapsulants (A) is lower than encapsulants (A) covers encapsulants in the mould, encapsulants in the polymerization mould (A).
There is no particular limitation for liquid (C), is lower than encapsulants (A) with density and just can as long as its solubility in encapsulants (A) is low.
The density of liquid (C) is preferably 0.7 to 1 gram per centimeter 3, 0.8 to 0.95 gram per centimeter more preferably 3
The consumption of free radical in the same manner control encapsulants (A) in the methods availalbe (1).
Liquid (C) can be water, and its salable anti-block is invaded, because the vapour pressure height of water, so it is suitable for the polymerization reaction under the suitable low temperature.
Liquid (C) also can be the synthetic low-molecular-weight hydrocarbon polymer of liquid, can also be the mixture of liquid hydrocarbon, as mineral oil.
The example of synthetic hydrocarbon polymer comprises: polymerization of Alpha-olefin oil, as poly decene-1, alkylaromatic hydrocarbon oil is as alkyl benzene, polybutene oil or liquid polybutene, polyhexene, alkyl naphthenate oil is as 2,4-dicyclohexyl-2-methylpentane oil, and ethene-alpha-olefin random copolymer oil is as ethylene-propylene random copolymer oil.
Preferably wherein molecular weight is at least 500, and more preferably molecular weight is 1000 to 10000 above-mentioned polymer.
Number-average molecular weight (Mn) is 500-5000, and especially 1500 to 3000 ethene-alpha-olefin random copolymer oil is advisable.
Particularly preferably be liquid, low-molecular-weight ethene-alpha-olefin copolymer, this copolymer contains the ethylene unit of 30 to 70 moles of % and the alpha-olefin unit of 30 to 70 moles of %, its number-average molecular weight (M n) be 1000 to 5000 and Q value (weight-average molecular weight/number-average molecular weight) amount up to 3.
When liquid (C) was liquid polyolefin or analog, liquid itself had demoulding effect, helped stripping operation greatly; Polymerization can easily exclude liquid polyolefin with organic solvent such as hexane, kerosene and trichloroethylene after finishing.
(3) method for packing (1) and (2) can be used in combination.
The surface of encapsulants covers and the encapsulants (A) in (its oxygen concentration is up to 1%) polymerization mould under inert gas shielding with liquid (C) in the mould.
Being used in combination of method for packing (1) and (2) obtained result preferably.
Polymerization reaction can be carried out under various conditions, and its condition is decided with the homogeneity of polymerization initiator.Under the situation of thermal polymerization, in heating tank, composition is heated to about 30 to 150 ℃, is preferably about 40 to 120 ℃, about 0.5 to 72 hour of heating time, preferably approximately 1 to 4 hour, although exact value becomes with shape and size, under the photopolymerization situation, polymerization reaction can be carried out under the high-pressure mercury lamp of 60 to 150W/cm power, about 1 minute to 2 hours of polymerization time, preferred 3 to 30 minutes, about 40 to 120 ℃ of polymerization temperature, preferably approximately 60 to 100 ℃.
Embodiment
The present invention provides the following example, these embodiment implication of the present invention without limits for explanation.
Example 1
As shown in Figure 1, integrated circuit component 5 is installed on the fixed base plate 3 of lead frame 2, electrode on the integrated circuit 5 is received on the corresponding lead riser 4 of lead frame by wiring 6, the preparation sub-assembly, and put it in the mould, then mixed uniformly fluid composition (following provide with encapsulants (A)-1) is injected mould.Mould is inserted in the vacuum drying oven, use the argon gas purge, progressively be heated to 90 ℃ from 40 ℃ then, in 5 hours, finish polymerization reaction, obtain ic package.
(A)-1, in the presence of the caustic alcohol and under the condition of Japanese Unexamined Patent Publication No 56-133246 description, make the diethylene glycol bis-allyl carbonate and the 70%(weight of the product (containing 30%(weight) that obtains of carbonic acid diallyl and diethylene glycol (DEG) (mol ratio 2: 1) reaction) oligo-ester carbonate, n=3 to 10) ... 55%(weight)
React three (allyl carbonates) of three (hydroxyethyl) isocyanuric acid ester that obtains by carbonic acid diallyl and three (hydroxyethyl) isocyanuric acid ester (mol ratio 12: 1) ... 12.4%(weight)
Diethylene glycol (DEG) diallyl carbonic ester ... 27.5%(weight)
Vinylacetate ... 5%(weight)
Polymerization initiator (component of per 100 minutes fronts is a benchmark)
Diisopropyl peroxydicarbonate ... 2.5pbw
Example 2
As shown in Figure 2, the sub-assembly of the integrated circuit component of similar type used in the example 1 is inserted in the mould, composition (following provide with encapsulants (A)-II form) is poured in the mould, (Mn is 2500 to use liquid ethylene-propylene copolymer again, Q is 2.0, and proportion is 0.846) about as shown in Figure 22 millimeters thick of layer 8() cover, mould is placed baking oven, and progressively be heated to 90 ℃ from 40 ℃, in 2 hours, finish polymerization reaction.
A-Ⅱ
Under the condition that caustic alcohol exists and Japanese Unexamined Patent Publication No 56-133246 describes, make the diethylene glycol (DEG) carbonic acid diallyl and the 70%(weight of the product (containing 30%(weight) that obtains of carbonic acid diallyl and diethylene glycol (DEG) (mol ratio is 2: 1) reaction) oligo-ester carbonate, n=3 to 10) ... 58%(weight)
React three (allyl carbonates) of three (hydroxyethyl) isocyanuric acid ester that obtains by carbonic acid diallyl and three (hydroxyethyl) isocyanuric acid ester (mol ratio 12: 1) ... 13%(weight)
Diethylene glycol (DEG) diallyl carbonic ester ... 29%(weight)
Polymerization initiator (component is a benchmark above per 100 minutes)
Diisopropyl peroxydicarbonate ... 2.7pbw
Example 3
Repeat the process of example 2, difference is that encapsulants (A)-II is replaced by (A)-I, finishes polymerization reaction as example 2 in 3 hours.
Comparative Examples 1
Put into mould with one as integrated circuit component used in the example 1-lead frame sub-assembly, a kind of epoxy resin (contains 100 fens main reagent, pelnox xN-1886-3 and 110 fens curing agent, peLcure XV-2236(is made by Japanese PelNOX KK)) be injected in the mould, 120 ℃ with epoxy resin cure 8 hours, obtain ic package.
Resulting integrated circuit encapsulants in embodiment and the Comparative Examples the results are shown in table 1 above the following commentary.
(1) demoulding:
Under the situation of not using release agent, from mould, slough cured resin and estimate the demoulding:
◎: be easy to the demoulding
Zero: the demoulding of manual energy
X: by hand can not the demoulding
(2) case hardness
The cutting encapsulation is measured the case hardness of dividing tangent plane with resin surface smooth 9 according to the JIS-K5401 method.
(3) according to ASTMB-2785, the wick Bold combustion method of ASTM-C-758 is measured the chlorinity that encapsulates with in the fluid composition.
Table 1
Embodiment comparative example 1
1 2 3
The demoulding zero ◎ ◎ X
Polymerization time 5 hours 2 hours 3 hours 8 hours
Case hardness 4H 4H 4H 3H
Chlorine in the fluid composition
Content (ppm) 333 2200
Electronic unit of the present invention with the particular polymers encapsulation is not subjected to the interference of chlorine in the potting resin basically, and has improved chemical resistance and had high rigidity.
Encapsulants of the present invention is used to have the electronic unit of above-mentioned characteristic, and it has shortened curing time, and has improved the demoulding after solidifying.
It is resin-sealed to use the made electronic unit of method for packing of the present invention that covers liquid to have high surface hardness, and the covering liquid with demolding performace makes the demoulding be easy to.
The method for packing of the present invention that uses inert gas (its oxygen concentration is up to 1%) to protect can prepare and have the electronic unit that high surface hardness is resin-sealed and cost is low, because used cheap blanket gas.

Claims (6)

1, a kind of electronic unit, wherein electronic component (not comprising that light transmits and receives element) is with the polymer encapsulated of polymerizable liquid composition, and described composition comprises as the monomer of the diallyl compound of main component or oligomer or its their mixture.
2, a kind of electronic unit of stating according to claim 1, the chlorinity in the wherein said fluid composition is up to 50ppm.
3, the encapsulants of a kind of electronic unit (not comprising that light transmits and receives element) comprises monomer or oligomer or its their mixture of diallyl compound.
4, a kind of method of packaged electronic components comprises:
Electronic component (not comprising that light transmits and receives element) is put into mould,
To be injected in the mould by the encapsulants of statement in the claim 2 and
The described encapsulants of polymerization (A).
5, a kind of method of packaged electronic components comprises:
Electronic component (not comprising that light transmits and receives element) is put into mould,
To be injected in the mould by the encapsulants of statement in the claim 2 and
There is the described encapsulants of polymerization (A) under the condition on the encapsulants (A) at liquid (C) (its solubility in described encapsulants (A) is low, and lower than the density of described encapsulants (A)).
6, a kind of method of packaged electronic components comprises:
Electronic component (not comprising that light transmits and receives element) is put into mould,
To be injected in the mould as the encapsulants (A) of statement in the claim 2 and
Described encapsulants (A) surface is the described encapsulants of polymerization (A) under inert gas (oxygen concentration is up to 1%) protection.
CN89103279A 1988-03-31 1989-03-31 Electronic parts Expired CN1015584B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP78916/88 1988-03-31
JP63078916A JPH02256261A (en) 1988-03-31 1988-03-31 Electronic part, electronic part sealing agent and sealing method

Publications (2)

Publication Number Publication Date
CN1038721A true CN1038721A (en) 1990-01-10
CN1015584B CN1015584B (en) 1992-02-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106634765A (en) * 2016-12-16 2017-05-10 深圳市华星光电技术有限公司 Black sealing compound and LCD (liquid crystal display) special-shaped screen, and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903027A (en) * 1974-05-13 1975-09-02 Cpc International Inc Diallyl isophthalate encapsulating compositions and process for preparing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106634765A (en) * 2016-12-16 2017-05-10 深圳市华星光电技术有限公司 Black sealing compound and LCD (liquid crystal display) special-shaped screen, and manufacturing method thereof

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AU3222289A (en) 1989-10-05
JPH02256261A (en) 1990-10-17
CN1015584B (en) 1992-02-19
AU619815B2 (en) 1992-02-06

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