CN103862823B - The method that contact-type microcircuit card is manufactured by continuous laminating - Google Patents
The method that contact-type microcircuit card is manufactured by continuous laminating Download PDFInfo
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- CN103862823B CN103862823B CN201310757263.2A CN201310757263A CN103862823B CN 103862823 B CN103862823 B CN 103862823B CN 201310757263 A CN201310757263 A CN 201310757263A CN 103862823 B CN103862823 B CN 103862823B
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- card
- contact surface
- integrated circuit
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- network
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- 238000010030 laminating Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000010292 electrical insulation Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 238000003475 lamination Methods 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
Abstract
A kind of method that contact-type microcircuit card is manufactured by continuous laminating, including：Prepare continuous electrical insulation tape 10, the network of network and integrated circuit on the surface of band including contact surface, also prepare continuous supporting strip 20, realize that the network with integrated circuit has the network of the chamber of same geometry in continuous supporting strip, then it is electrical insulation tape 10 and continuous supporting strip 20 and the Intermediate Gray 30 of cohesive material is laminated together, to form laminating strips 50；Partial cut is realized, so that microcircuit card individuation, these microcircuit cards remain connected to the remainder of band by join domain, the join domain is positioned laterally only with respect to the length of laminating strips；Carry out such partial cut into microcircuit card possible personalization, and by the tape wrapping into partial cut into card storage roller 80.
Description
Technical field
The present invention relates to a kind of manufacture method of small-format microcircuit card (or " chip card "), the form that the card has is less than
Known code name is ID-1 (also referred to as 1FF, for referring to the first form) standardized format (see standard ISO7816), i.e. bank
The common format of card；The length of this card is 85.6 millimeters, width is 54 millimeters and thickness is 0.76 millimeter.
Background technology
At these compared with small-format, it is particularly possible to quote：
- be widely used in mobile-phone carrier customization identification card form ID-000 (or " plug-in type SIM ")；Also referred to as
2FF forms；Its length is 25 millimeters, width is 15 millimeters and thickness is 0.76 millimeter,
- it is referred to as " mini-UICC " or 3FF form；Its length is 15 millimeters, width is 12 millimeters and thickness is about
0.76 millimeter.
In the recent period, it has been suggested that (length is 12.3 millimeters to smaller than the 3FF form form for being referred to as 4FF, width is 8.8 millimeters
It it is 0.67 millimeter with thickness).
The microcircuit card of " touch " type is generally included：Card main body, the external dimensions (length, width and thickness) of card main body
Follow considered form；With the module with support membrane, support membrane has that be used for can be with by contact on a surface
The contact that read/write device is engaged, and there is the integrated circuit being connected with contact with penetrating (to be also called on another surface
" microcircuit ")；Such module is arranged in such card main body, so that contact and body surfaces flush and integrated electricity
Road is positioned in the chamber of the card main body；Chamber is arranged on card body interior, to cause the position where contact meets fixed
Justice considers the standard of form.
The microcircuit card of referred to as " contactless " is it is known that, itself and outside connection are the thickness by means of being embedded in card main body
On antenna ensure；The antenna is actually connected with integrated circuit, and integrated circuit is also embedded on the thickness of card main body.
Up to the present, it is less and less develop form when (change of 4FF forms that from now on can be with due regard to foregoing),
The size of module is substantially identical.
The method that possible multiplication ground result in the card for developing very efficient this form of manufacture using 1FF cards, so that
Obtain within long-term, implement manufacture using the manufacturing technology for the 1FF format cards being proficient in has more small-format very much than ID-1 or 1FF forms
Card, that is to say, that implement the card compared with small-format by being cut in the card of 1FF forms, then abandon with compared with small-format
The remaining structure of 1FF forms after card separation.
In the high efficiency manufacture technology of microcircuit card, DE-19502468 can be especially quoted, it advocates manufacture by injecting mould
The big plate face obtained is moulded, manufacture wherein is distributed in multiple card main bodys on multiple row and column grids.On the contrary, document EP-
1923821 record and manufacture each card main body by molding, implemented using hardening time card in same mould whole or
Partial individual operation.
The mode of another known type provides at least one tape, prepares in advance as winding article, to the tape in continuous work
Operation is performed on platform；It can especially quote：
- US-5637858 teachings manufacture the module that be used to be integrated in the card main body with chamber, chamber in a continuous manner
Room is defined before being integrated into printed circuit independently of printed circuit；In final stage, by these modules and band
Remainder is separated,
Manufacture blocks in a continuous manner for-US-5745988 teachings, and the position distribution of card is multiple rows of form continued, will blocked
It is little by little longitudinally split to open these cards before being separated from each other entirely,
- FR-2803412 teachings are by the way that integrated circuit is separately fixed on the master tape of the card main body of carrying antenna come to connect
Continuous mode manufactures noncontact types of cards, and by the master tape and at least another covering tape lamination, covering is with sufficiently flexible with embedded collection
Into circuit, card is then cut the strip into, printing processing next is carried out to card；Can be temporary to the band between continuous work platform
When wind,
- US-6305609 teaching by lamination therebetween respectively introduce include integrated circuit module two continuous bands and
Then the card for the laminating strips being achieved in that being cut into stacking continuously manufactures card.
The single integrated circuit for extracting and being brought by continuous band is pointed out in different field, US-7242996, is then being examined
After the kilter of these integrated circuits, equally individually integrated circuit is fixed on the antenna brought by another continuous band
On；The RF tag so produced is actually similar to the module being related to during blocking is made；Retouched for label is subsequently isolated out
Without any details of offer for the system stated.
In the recent period, propose to realize without any small-format card with reference to 1FF forms, it especially allows to save lot of materials.
As an example, can citation WO-2007/048927, it is instructed by ensuring if grafting is (i.e. by each mould collection
Into in card main body), the Multi-tip tool of the operation of printing and personalization etc makes inside initial strip (can be greater depth)
Make small-format card grid；Initial strip is preferably obtained as below：By molding, chamber, pattern of windows and profile otch are formed, so as to
In being finally separating for card.It may be noted that the technology means that handle is plugged into supporting strip in supply belt by pre-cut module
In grafting operation, window and/or otch are formed on the initial stage to form card in supporting strip, in order to by these card
Separated again after property.
Can also citation US-2007/0108298 (correspond to EP-1785916), which teach be prepared to the length of roller
The formation of multiple parallel series of lesser calorie on conductor band, cut out on long conductor band partly (remaining join domain it
The window of the profile of limited area outside), forms the network (according to the printed circuit of future card) of printed circuit, this in the zone
Second tape lamination of first band and dielectric substance, forms the main body (net shape) around each printed circuit by molding
And the chamber of the presumptive area relative to printed circuit is shown, each integrated circuit is fixed on to the printed circuit of chamber interior
On；Then between the roller of two windings, the layer of closure chamber is formed with the band with card main body (if layer is personal printing
Purpose, then therefore the lamination of this layer allow the personalization only in terms of figure to card implementation).Laterally adjacent card main body with band
It is connected in the major part of the size of the parallel card main body of length.Any details is not provided for ensuing operation, directly
To arrangement by electronic personalization and separated card.It could be noted that the technology mean on the stage of the manufacture method of card
The operation of profile window is formed on conductor band, single card main body is then formed using these profile windows, while making permission list
The individual chamber for placing integrated circuit exists, and the finally operation for these chambers of closing.
For document US-2003/0008118, it is not that (unit, width is in fact in the arrowband that width is 5 centimetres that it, which is instructed,
Be pointed out as such as two inches) on prepare electronics inlay, but take preparation broader.Application widget cutting behaviour is taken with this
Work starts, will pass through the carrier card for being formed with antenna above isolation in addition to small join domain；Therefore with profile window
The band be cut into and include the thin slice of carrier card matrix.Then these thin slices be laminated on plastic material bottom sheet and upper piece it
Between, may make the thin slice complete by extra play, especially graph layer, heat and pressure are applied on extra play, with around
Carrier card pastes these thin slices；It is clear that these bottom sheet and upper piece each other paste but do not paste central plate；Connect down
The thin slice being so laminated is cut into card.It may be noted that being limited to the technology of the situation of " noncontact " types of cards means
With interior formation profile window on the stage of the manufacture method of card, band is cut flakiness, had with relative to central lamellar body
Have special attribute material a number of other thin slices between be laminated, be then cut into single card.
It should be understood that profile window is performed on the stage of the manufacture method of card means have between so defined position
The risk being broken accidentally；In addition, the work to thin slice does not allow continuous manufacture.
Known solution described above has various advantages, however, no one of these solutions permit
Perhaps continuous manufacture form is more equal to the contact-type microcircuit card of 3FF forms, without being included on the manufacture method stage
The profile window or otch in electronic module supply band and/or supplied in card main body in band.
The content of the invention
It is an object of the invention to meet the demand；In addition, in a complementary manner, it is contemplated that allowing to easily store
Or the card of (figure and/or electric personalization including these cards) is so realized in transport (or sending).
Therefore, the present invention proposes a kind of method for the longitudinal sequence for manufacturing contact-type microcircuit card, each card includes card master
Body and module, the card main body have the chamber opened, and the module includes having on the support of electric insulation, a face of support
There is the contact surface formed by contact area and there is integrated circuit on another side, the integrated circuit is located at the open-minded of card main body
Chamber inside, in the method：
Continuous electrical insulation tape is prepared, on one face the network including contact surface, it is at least that the contact surface, which is arranged,
The longitudinal sequence of one contact surface, each contact surface is formed by the multiple contact areas set according to given pattern；And another
Simultaneously the upper network for including integrated circuit is with so that each integrated circuit is connected to a contact in contact surface through the band
Face is simultaneously coated by protection resin,
The continuous supporting strip with electrical insulation tape same widths is prepared, the collection with insulating tape is realized in the continuous supporting strip
There is the network of the chamber of same geometry into circuit network, can be respectively by quilt simultaneously so as to obtain multiple such integrated circuits
It is contained in multiple such chambers,
Intermediate Gray electrical insulation tape and continuous supporting strip and cohesive material is laminated together, to form laminating strips,
Implement the partial cut of the otch of definition profile inside the laminating strips, so that microcircuit card individuation, these
Microcircuit card remains connected to the remainder of band by join domain, and the join domain is horizontal only with respect to the length of laminating strips
Positioned to ground and abreast there is the size significantly less than these cards with the length, each microcircuit card is included in contact surface
The part and the part being located in the chamber of integrated circuit with chamber of one contact surface, supporting strip, and
By the tape wrapping be partial cut into card roller.
In a particularly advantageous manner, if having carried out personalisation process from electric angle and from graphic point simultaneously,
Formed before the roller that therefore can be formed by card, personalisation process is carried out to the local microcircuit card cut into.However, being used as change
Type, can perform personalization step whole or in part after card to be wound into roller.Preferably, electric and graphical personalisation is with same
Step mode performs or carries out either almost mutually successively carrying out immediately simultaneously.In such cases, it is appreciated that personalization behaviour
Make to perform advantageously before the remainder of card and band is separated.
The concept of continuous band refers to herein, except presumable fixed to ensure to guide it during forward (FWD)
Outside the hole of position, with longitudinal direction (on expansion/coiling direction of the band considered) and laterally (from side to opposite side, in width
Direction) successional band.
The concept of network can refer to, contact surface, chamber and final partial cut into the simple longitudinal direction of card continue；Therefore
This network is only one-dimensional.
It should be understood that partial cut into the roller of card may be subject not only to memory phase and be also possible to be subjected to the haulage stage, for example
It is addressed to terminal client.For up to roller may undergo packing processes operation, and for that comparatively large number of may block, (such as hundreds of are arrived
Thousands of cards；In this case, an operation roller rather than obvious simplify simultaneously can the fact that multiple single cartridges be constituted
Bring the reduction of volume).The terminal client for receiving the roller of such packing processes can be with, as needed, if formed roller it
It is preceding then to perform individual operation without individual operation is carried out, then card is separated from the remainder of band；Otherwise perform
The lock out operation is just much of that for the customer.
The general knowledge of the fact that the individual operation of card is performed before any separating action therefore with those skilled in the art
On the contrary, general knowledge means the personalization blocked after by be possible to combination manufacture components apart, or hardly this
Carried out before separation personalized；In fact, personalized is usually a part for all final steps that blocking is made and generally several
Do not implement before the vanning processing before sending to terminal user；But this vanning is traditionally individually implemented.
The present invention is therefore in new use logic.
It may be noted that the present invention implements two continuous bands, one of band include all component with electronic action or
Element (electric insulation continuous band) and another mechanical property with following card.Band with electronic action can be in supplier
Supply condition under band, it is also possible to integrated circuit；This band can have 35 millimeters of width, and specifically this is fine
The form of control, this be in terms of the manipulation in the case of in view of developing powerful technology (especially for regarding institute field) and
Speech.
According to the present invention, each card is only connected to laminating strips by the join domain of the length located lateral relative to band
Remainder the fact that help to keep the integrality of card during winding, without bending card because of the winding.
The advantage for the fact that the size of these join domains is significantly less than the side of its remainder for being connected to band is just
Finally separated in by the remainder of these cards and band；It is worth noting that, with those skilled in the art can assume on the contrary,
The difference of the size will not significantly affect the transversely arranged hardness of the card in band.
In addition, the outline definition of various cards is occurred in metal tape and the phase of supporting strip for the formation of the otch of predetermined format
The advantage of the fact that after mutually fixing is to ensure that the card wheel well limited is wide, independently of the layer that laminating strips are formed in laminating operation
The performance of (more particularly to Intermediate Gray of cohesive material).
According to the width of the band can with tens meters or longer, there can be unique sequence (such as bandwidth of successive card
To be used for the card for manufacturing 2FF forms in the case of 35 millimeters), or two Parallel Sequence (such as bands are had according to rectangular mesh net
Width is to be used to manufacture the cards of 3FF or 4FF forms in the case of 35 millimeters).In other words, band advantageously comprises contact surface extremely
Many two Parallel Sequences, it is preferably along rectangular mesh network settings.
It should be understood, however, that the quantity of the flanking sequence of card depends on the width of band and the size of the card to be realized；Actually
It should be noted that, it is contemplated that the actual setting of contact surface, block during tape transport relative to laterally setting (their large-size
Perpendicular to the length of band), this is easy to be personalized the capacity with the band of the card of partial cut；But can provide can by contact
Orient to manufacture card on the longitudinal direction of supply band on face and integrated circuit.Can have on the width of band and be more than in two
Can, such as three, four or five, the band without making to be shown partially cut with personalized card are wound at it and then in terminal
Client there significantly decreases mechanical strength during being unfolded.
Compare document US-2003/0008118 (it has been described that it only relates to non-contact type card), the area of method of the invention
Not part in particular, in that, constitute the module of following card of contact-type and constitute following card main body assembling before do not send out
Raw any cutting；As a result best mechanical strength, and less unexpected risk of breakage are caused, this allows to improve productivity ratio.
Compare document US-2007/0108298, method difference part of the invention in particular, in that, constituting the mould of following card
Do not occur any cutting before the thin dress of the main body of block and the following card of composition；In fact, not being by around partial cut
Region molded, but card main body is obtained by the lamination with another continuous band；This can cause more preferable mechanical strength, and
Less unexpected risk of breakage, it allows to improve productivity ratio.In addition, the method for the present invention is not included in form the laggard of card main body
The installation operation of line integrated circuit.In addition, the join domain between adjacent card is much smaller, its advantage makes in partial cut
The bending stress that the card of partial cut is applied to during the operating winding of card is minimized.
Document FR-2803412 (it is stated that crossing its manufacture for being related to non-contact type card) is compared, it is outstanding in place of difference of the invention
It is that the card of contact-type is partly cut (and being not entirely separate each other), is then advantageously entered before roller is wound into
Row is personalized；Its advantage is can jointly to carry out personalized and storage and/or transport, without providing indivedual process；It is tied
Tab phenolphthaleinum causes the possible raising of productivity ratio.
Another advantageous feature of the present invention, the realization operation of profile otch causes the phase on the length direction of laminating strips
After card only by otch separate；Therefore, at least one sequence of the card along length, there is no any want after card is separated
The transverse belt of derelict material；This can cause material more completely using composition metal tape and supporting strip, and between card
Separation bigger convenience (it is sufficient that partial cut of separation band is into side in place of card).But, with this area
Technical staff will be able to think of on the contrary, it will not significantly reduce the mechanical strength for the band to form roller.
Preferably, the lateral region of band has the facing breach of these otch of the card successive with separating longitudinal direction.
Cutting forms operation and is advantageously pre-slit action with join domain, with order to will block and partial cut
And the band wound is finally separated.
According to further particularly preferred feature of the present invention, the join domain of the remainder for being connected to laminating strips of card is flat
Row is differed in the size on the length direction of band in the both sides of card main body.Its advantage is, when separating single card, always same
It is initially separated at one position, is actually to be initially separated at the position of most narrow join domain, this is easy to card after roller expansion
Start to automatically separate.The position being initially separated is also relied on the bearing of trend of card body profile on join domain both sides
The breach being likely to occur, with minimize carry out the separation when any flash.
The size difference is obviously preferred, therefore advantageously, the ratio of the size of the join domain is at least
1.25, even 1.5.
The present invention also provides a kind of machine for implementing methods described, and this method is used for the longitudinal direction for manufacturing contact-type microcircuit card
Sequence, each card includes card main body and module, and the card main body has the chamber opened, and the module includes the supporting of electric insulation
There is the contact surface formed by contact area on portion, a face of support and there is integrated circuit, the collection on another side
It is located at the inside of the chamber opened of card main body into circuit, the machine includes：
* the first work platform, deploys the roller formed by continuous electrical insulation tape, electrical insulation tape includes contact surface on one face
Network, the contact surface is arranged as the longitudinal sequence of at least one contact surface, and each contact surface according to given pattern by setting
Multiple contact areas formed；And include the network of integrated circuit on another side to cause each integrated circuit to pass through the band
A contact surface being connected in contact surface is simultaneously coated by protection resin,
* the second work platform, deploys the roller by having the continuous supporting strip of same widths to be formed with electrical insulation tape, described continuous
Realize that the IC network with insulating tape has the network of the chamber of same geometry in supporting strip, so as to obtain multiple such
Integrated circuit can be accommodated in multiple such chambers simultaneously respectively,
* work platform is laminated, wherein the Intermediate Gray electrical insulation tape and continuous supporting strip and cohesive material is laminated together, so as to
Form laminating strips,
* partial cut work platform, wherein the otch of profile is realized inside the laminating strips, so that microcircuit card individuation, this
Circuit card remains connected to the remainder of band, length of the join domain only with respect to laminating strips by join domain slightly
It is positioned laterally and abreast there is the size significantly less than these cards with the length, each microcircuit card is included in contact surface
A contact surface, the part and the part being located in the chamber of integrated circuit with chamber of supporting strip, and
* the winding work platform of laminating strips, wherein make partial cut into card it is personalized.
By with the content phase analogy indicated by the above method, it is advantageous that the machine include such partial cut into
Card at least one individual character chemical industry platform, wherein can carry out to inside laminating strips partial cut go out at least electric of microcircuit card
Or figure, even electrically and figure personalization.It is furthermore advantageous to which Design spreading work platform is the roller of 35 mm wides to be deployed.
Brief description of the drawings
Referring to the drawings, objects, features and advantages of the present invention will be provided from mode nonrestrictive with schematic example
Detailed description in be made apparent from, wherein：
Fig. 1 is the exploded perspective of the laminating strips formed in the manufacturing process of contact type card according to the inventive method
Figure,
Fig. 2 is to use the installation schematic diagram for implementing the inventive method with lower band, Intermediate Gray and upper band,
Fig. 3 is the details enlarged drawing of Fig. 1 upper band,
Fig. 4 is the partial cross sectional views of band on this,
Fig. 5 is the perspective view of lower band, and the surface facing with upper band of lower band is shown through Intermediate Gray,
Fig. 6 is in lower band, the lamination of Intermediate Gray and upper band and the top view for forming the final band obtained after window outline
Figure,
Fig. 7 is the partial illustrations of the horizontal section of the band, and
Fig. 8 is bottom view.
Embodiment
Fig. 1 schematically shows three bands, based on these three with the output end for forming the machine as shown in Fig. 2
Contact type card in obtained roller.
Being marked as 10 first band includes continuously (being that is marked as outside 10A positioning hole, especially indulging
It is free of discontinuities to adjacent edges) support membrane 11；The support membrane is electric insulation.
Be formed with the support membrane be marked as 12 contact surface；Each in these contact surfaces is by multiple contact zones
Domain is formed, the multiple contact area according to actually at least in part as the standard as iso standard 7816 define to
Go out pattern and set；In fact, being the microcircuit card in future is entered by means of card reader with outside by means of these contact areas
Row communication.
From Fig. 3 it is also seen that this point, Fig. 3 represents a part for band 10, each contact surface has at least six contact zones
Domain, corresponding to C1 to the C3 regions and C5 to C7 regions of ISO7816 standards.These contact areas be it is conductive, generally (can by copper
Phosphorus can be combined), nickel, gold or palladium formed.
See in figure 3 in addition, film 11, i.e. upper strata 11A can be formed by two superimposed layers of same widths and can be with upper strata
There is the lower floor 11B of identical natural quality；Film 11 can also be formed by the single layer of such as expoxy glass.
The band is advantageously 35 millimeters of the form that current many guide order machines can be handled.
The band 10 includes printed circuit on its opposing face, is provided with printed circuit and is also known as the integrated of microcircuit
Circuit 13.In a conventional manner, installed with " flip-chip ", i.e. from the back side, or it is available from integrated like that as shown
The electric connection line 14 (being installed with " wire bonding ") that the Free Surface of circuit extends to the contact point of printed circuit is installed；
By the hole (puits) formed through support membrane, these printed circuits are electrically connected to contact area in itself.With known per se
Mode, these integrated circuits are encapsulated in a bulk of protection resin 15.
Therefore, band on this 10 can be considered as to multiple card modules with contact microcircuit to be formed, but do not limited
The profile of future card.
Labeled as 20 the second band by it is continuous (positioning hole 20A it is external it is vertical or horizontal it is free of discontinuities) band constitutes, its
Material is selected by the material of card main body；Be used for first band it is facing, more properly with being fixed in first band
On the facing surface of integrated circuit, the band 20 includes multiple chambers 21, and the size of chamber 21 allows in each of which
Accommodate this integrated circuit and its protection resin.In fact, these chambers form have with the net of the contact surface of band 10 it is identical
The net of spacing or same mesh.The band is for example formed by PVC ABS.By way of example, the nominal thickness 0.48 that the band has
Millimeter and 0.12 millimeter of cavity bottom thickness (chamber has 0.36 millimeter of depth).It is identical with band 10 with 20 width.
The known materials for being referred to as heating by cohesive material, for example labeled as 30 the 3rd band are formed.Band 30 additionally advantageously has
Have and the identical width of band 10 and 20.However, be used to flow between layer 10 and 30 due to constituting the material of the band, so excellent
The width that selection of land can give band 30 is slightly lower than the width of band 10 and 20, and such as width is about 29 millimeters.
These three bands be used to be laminated each other, and band 10 is located on band 20 to be separated by adhesive tape 30 simultaneously.
From Fig. 2 it also shows that the manufacture machine 40 of microcircuit card includes parallel rotary shaft 41,42 and 43, rotary shaft 41,42
With 43 on can be provided with respectively by these three band in each with three rollers 10,20 and 30 formed；These axles are by synchronization
Control to allow these bands to reach the lamination work platform labeled as 45 with identical tape running speed.
In a way known, the lamination work platform 45 includes two rollers 45A and 45B, between roller 45A and 45B band with
Continuous form is sent, make it that band is extruded from being integrated by this；Advantageously heater platform (not shown) is at these
To soften Intermediate Gray and to be easy to the integration between layer before roller；As modification, these rollers are heated to by roller certainly in itself
Body is to the useful heat of transmission.
In addition to possible (being collectively forming by the positioning hole of band 10 and 20) positioning hole 50A, 50 are integrally marked as
The laminating strips of such formation be continuous, as forming the band of laminating strips.Comparatively, laminating strips have had not
Come the major part of card, possible decorative layer or protective layer except being next added to laminating strips again by lamination；So
And, these possible decorative layers or protective layer are preferably formed on band 20.
Next partial cut operation is carried out to the laminating strips 50 on the partial cut work platform for be marked as 60, in cutting
During by otch limit card following profile, in addition to some join domains.Such partial cut generally passes through punching
Hole operation is formed.The formation of otch is preferably accompanied by the advance of join domain and cuts out action, so as at least substantially by otch
Breach is formed in join domain on the wide bearing of trend of the card wheel of realization, to ensure in the final separation of card, in connection
There is no flash presence on region.
The laminating strips of such partial cut then be preferably subjected at least electronics at the work platform labeled as 70 or figure
Personalisation process.Therefore the individual operation of the electronics or figure is also by foregoing join domain each other one in each card
What body was carried out when connecting.
The laminating strips preferably in work platform 70 or in back to back two steps advantageously simultaneously to partial cut
Carry out the personalisation process of electronics and figure.The information of this individual operation is found in cited document EP-1923821
In.
Next partial cut and personalized laminating strips are centered around and are marked as 80 around winding axle 81
Roller on.
In the simple version of machine, individual character chemical industry platform can be omitted；In this case, can be right including individual character chemical industry platform
It is to deploy roller on another machine for wind work platform afterwards, or before card is separated from the remainder of band in personalization machine
Expansion.
In more complete version, work platform can be followed by packing processes work platform, to allow to user's transport roller.
The laminating strips for being shown partially cut and being personalized due to the presence of profile window are shown in Fig. 6 to Fig. 8.
In figure 6 it may be noted that the card of partial cut is arranged on the chamber of the veil of the contact with band 10 network or band 20
Network identical network on；In fact, the spacing between two continuous cards or the contact surface of laterally adjacent card is contact surface
Spacing and chamber spacing.
Graphical personalisation, which may be embodied in, prints customizing messages on rear surface (see Fig. 8).
It can be observed in the figure 7, the section of the card so obtained is consistent with known microcircuit card.
These cards marked by reference number 100 are only connected to each other or are connected to its remaining part of band 80 by join domain
Point, the join domain merely transversely is positioned relative to the length of band, on the direction parallel with the length, the chi of join domain
The very little size for being substantially less than these cards.More specifically, labeled as 81,82 and 83 these join domains from Fig. 6 left side to
The right is extended transversely with relative to band 80.
It may be noted that the join domain of card and the remainder of band, on the direction of the length parallel to band 80, its size
It is different in card main body both sides.Therefore, the width (longitudinally measure) in region 81 positioned at the left side of the card of the leftmost side is more than and is located at
The width in the region 83 on the right side of the card with 80 rightmost sides.For region 82, its left side is identical with the width of region 83, and right side
It is identical with the width of region 81.These intermediate connection zones have step-like shape, but can have in modification trapezoidal shape.
Therefore, there is no any direct connection between two cards in a longitudinal direction.
It is further noted that there is no any be directly connected between the lateral edges of the band outside card；In other words, by even
Continuous simple windows separate successive card.Therefore, when card is subsequently isolated, only these lateral edges constitute waste products.
Advantageously, it is facing in the horizontal in the presence of the otch with continuously blocking on separation longitudinal direction in the lateral region of band
Breach 90.Due to can slightly fold these lateral regions outside the region of connection card, so these breach can be easy to individual
The winding of band 80 after property.
Have described above in the inside of band with the situation of Parallel Sequence formation card；As long as it should be understood, however, that it is internal to change band
Contact surface distribution, it is possible to implement the Parallel Sequence differed, but present substantially staggeredly configuration, this can allow by even
Connect region and fix one and be scheduled on two of flanking sequence cards, this can allow to be laminated, cut and personalized card it is bigger
Flexibility, but do not block the risk prematurely departed from.
Intermediate Gray can be disposed by any suitable mode；Therefore Intermediate Gray can be opened up based on the roller with transmission sheet material
Open, but Intermediate Gray can also be formed in supporting strip and is only released before the lamination of electricity consumption insulating tape.
Claims (14)
1. the method for longitudinal sequence of one kind manufacture contact-type microcircuit card (100), each card includes card main body and module, described
Card main body has the chamber opened, and the module includes having by contact area on the support of electric insulation, a face of support
The contact surface of formation and on another side have integrated circuit, the integrated circuit be located at card main body the chamber opened inside,
In the method：
Continuous electrical insulation tape (10) is prepared, the network of contact surface (12) is included on one face, the contact surface (12) is arranged
Cloth is the longitudinal sequence of at least one contact surface, and each contact surface is formed by the multiple contact areas set according to given pattern；
And include the network of integrated circuit (13) on another side each integrated circuit is connected to through the electrical insulation tape
A contact surface in contact surface is simultaneously coated by protection resin (15),
The continuous supporting strip (20) with electrical insulation tape same widths is prepared, is realized in the continuous supporting strip and electrical insulation tape
IC network has the network of the chamber (21) of same geometry so that multiple such integrated circuits can respectively by
It is accommodated in multiple such chambers,
Electrical insulation tape (10) and continuous supporting strip (20) and the Intermediate Gray (30) of cohesive material is laminated together, so as to forming layer
Pressure zone (50),
Implement the partial cut of the otch of definition profile inside the laminating strips, so that microcircuit card individuation, this is slightly electric
An outpost of the tax office remains connected to the remainder of laminating strips by join domain (81,82,83), and the join domain is only with respect to lamination
The length of band is positioned laterally and abreast has the size significantly less than these cards with the length, and each microcircuit card includes
A contact surface, continuous supporting strip in contact surface have a part for chamber and being located in the chamber for integrated circuit
Part, and
By the laminating strips be wound as partial cut into card roller (80).
2. according to the method described in claim 1, wherein, make card the step of for making card be separated from the remainder of laminating strips
Figure and/or electric personalization step are carried out before separation.
3. method according to claim 2, wherein, figure and/or the electric personalization are carried out before winding steps
Step.
4. the method according to any one of Claim 1-3, wherein, the implementation of partial cut, which is operated, to be caused in laminating strips
Length direction on continuous card only incision separate.
5. method according to claim 4, wherein, the implementation operation of partial cut is designed to be formed in the side of laminating strips
The breach (90) laterally faced with these otch in portion region.
6. the method according to any one of Claim 1-3, wherein, the forming step of partial cut includes cutting out in advance
The action of join domain.
7. the method according to any one of Claim 1-3, wherein, snap into the connection of the remainder of laminating strips
Region is of different sizes on the length direction parallel to laminating strips in the both sides of card main body.
8. method according to claim 7, wherein, the ratio of the size of the join domain is at least 1.25.
9. the method according to any one of Claim 1-3, wherein, according to rectangular mesh network, laminating strips include contact
At most two flanking sequences in face.
10. the method according to any one of Claim 1-3, wherein, laminating strips have 35 millimeters of width.
11. the method according to any one of Claim 1-3, includes the packing processes step of take-up roll.
12. it is a kind of be adapted for carrying out before any one of method described in claim machine, this method is used to manufacturing contact-type micro-
Longitudinal sequence of circuit card, each card includes card main body and module, and the card main body has the chamber opened, and the module includes electricity
There is the contact surface formed by contact area on the support of insulation, a face of support and have on another side integrated
Circuit, the integrated circuit is located at the inside of the chamber opened of card main body, and the machine includes：
First work platform (41), deploys the roller formed by continuous electrical insulation tape, and electrical insulation tape includes contact surface on one face
Network, the contact surface is arranged as the longitudinal sequence of at least one contact surface, and each contact surface according to given pattern by setting
Multiple contact areas formed；And include the network of integrated circuit on another side to cause each integrated circuit to pass through the electricity
A contact surface that insulating tape is connected in contact surface is simultaneously coated by protection resin,
Second work platform (42), deploys the roller by having the continuous supporting strip of same widths to be formed with electrical insulation tape, described continuous
The network for the chamber that there is same geometry with the IC network of electrical insulation tape is realized in supporting strip so that it is multiple so
Integrated circuit can be accommodated at respectively in multiple such chambers,
Work platform (45) is laminated, wherein the Intermediate Gray electrical insulation tape and continuous supporting strip and cohesive material is laminated together, so as to
Form laminating strips,
Partial cut work platform (60), wherein the otch of profile is realized inside the laminating strips, so that microcircuit card individuation, these
Microcircuit card remains connected to the remainder of laminating strips, length of the join domain only with respect to laminating strips by join domain
Degree is positioned laterally and abreast has the size significantly less than these cards with the length, and each microcircuit card includes contact surface
In a contact surface, the part and the part being located in the chamber of integrated circuit with chamber of continuous supporting strip, with
And
The winding work platform (81) of laminating strips, wherein make partial cut into card it is personalized.
13. machine according to claim 12, before winding work platform, including be designed to ensure it is electrically personalized and/
Or the individual character chemical industry platform of graphical personalisation.
14. the machine according to claim 12 or 13, wherein, expansion work platform (41,42) is designed to 35 mm wides
Roller expansion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1262016A FR2999753B1 (en) | 2012-12-13 | 2012-12-13 | PROCESS FOR THE MANUFACTURE BY CONTINUOUS LAMINATION OF CONTACT TYPE MICROCIRCUIT CARDS |
| FR1262016 | 2012-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103862823A CN103862823A (en) | 2014-06-18 |
| CN103862823B true CN103862823B (en) | 2017-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310757263.2A Active CN103862823B (en) | 2012-12-13 | 2013-12-13 | The method that contact-type microcircuit card is manufactured by continuous laminating |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103862823B (en) |
| BR (1) | BR102013032060B1 (en) |
| FR (1) | FR2999753B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101897944B1 (en) * | 2015-12-04 | 2018-09-12 | 잉 셍 엔지 | Method for Embedding an Integrated Circuit Flip Chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2803412A1 (en) * | 1999-12-30 | 2001-07-06 | Schlumberger Systems & Service | Continuous mfr. of integrated circuit cards includes enclosure of integrated circuits between two sheets of support material supplied from spools |
| CN1319215A (en) * | 1998-09-24 | 2001-10-24 | 格姆普拉斯公司 | Large format smart card comprising removable minicard and method for making same |
| CN1710603A (en) * | 2004-06-16 | 2005-12-21 | 台湾典范半导体股份有限公司 | Memory card constituting method and structure thereof |
| CN101008988A (en) * | 2006-01-24 | 2007-08-01 | 卓恩民 | Flash memory packaging method and structure thereof |
| CN102449642A (en) * | 2009-05-29 | 2012-05-09 | 德国捷德有限公司 | Method for producing portable data carriers |
| CN102663474A (en) * | 2010-12-06 | 2012-09-12 | 欧贝特科技公司 | Method for manufacturing microcircuit device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3639630A1 (en) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME |
-
2012
- 2012-12-13 FR FR1262016A patent/FR2999753B1/en active Active
-
2013
- 2013-12-12 BR BR102013032060-9A patent/BR102013032060B1/en active IP Right Grant
- 2013-12-13 CN CN201310757263.2A patent/CN103862823B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319215A (en) * | 1998-09-24 | 2001-10-24 | 格姆普拉斯公司 | Large format smart card comprising removable minicard and method for making same |
| FR2803412A1 (en) * | 1999-12-30 | 2001-07-06 | Schlumberger Systems & Service | Continuous mfr. of integrated circuit cards includes enclosure of integrated circuits between two sheets of support material supplied from spools |
| CN1710603A (en) * | 2004-06-16 | 2005-12-21 | 台湾典范半导体股份有限公司 | Memory card constituting method and structure thereof |
| CN101008988A (en) * | 2006-01-24 | 2007-08-01 | 卓恩民 | Flash memory packaging method and structure thereof |
| CN102449642A (en) * | 2009-05-29 | 2012-05-09 | 德国捷德有限公司 | Method for producing portable data carriers |
| CN102663474A (en) * | 2010-12-06 | 2012-09-12 | 欧贝特科技公司 | Method for manufacturing microcircuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103862823A (en) | 2014-06-18 |
| BR102013032060B1 (en) | 2021-03-02 |
| FR2999753A1 (en) | 2014-06-20 |
| BR102013032060A2 (en) | 2018-10-30 |
| FR2999753B1 (en) | 2015-02-13 |
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