CN103856857B - Electronic installation - Google Patents
Electronic installation Download PDFInfo
- Publication number
- CN103856857B CN103856857B CN201310524575.9A CN201310524575A CN103856857B CN 103856857 B CN103856857 B CN 103856857B CN 201310524575 A CN201310524575 A CN 201310524575A CN 103856857 B CN103856857 B CN 103856857B
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- Prior art keywords
- conduit
- microphone
- sound
- cavity
- sound hole
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Abstract
The present invention discloses a kind of electronic installation, including a housing, a sound-insulating structure, one first microphone and a second microphone.Housing includes one first sound hole and one second sound hole.Sound-insulating structure includes one first conduit and one second conduit, and first conduit is connected to first sound hole, and second conduit is connected to second sound hole.First microphone connects first conduit.Second microphone connects second conduit.The coverage of the plurality of microphone can be increased by the conduit of different directions.
Description
Technical field
The present invention relates to a sound-insulating structure, as conduit, be inserted in an electronic installation have multiple sound holes in its housing with
And between the microphone array inside the case of electronic device；Also relate to a kind of shelling machine of microphone array with
Coordinate the sound-insulating structure to provide optimal airtight and phase matched for the electronic installation.
Background technology
It is increasingly popular using the microphone array of two or more microphones on the market.Due to receiving more sound
Information, its needs can provide more microphone segregation.CMOS-MEMS (CMOSs-microcomputer
Electricity) microphone array can be implemented in an one chip and single encapsulation to be integrated into size and pin single in one by technology
MEMS (micro electronmechanical) microphone.In this situation, the distance at two microphone element centers is smaller than 2 millimeters in the shell.But
For small array microphone (SAM) acoustic processing application, the sound hole spacing of apparatus surface is more than 5 millimeters.The present invention is in order to extend
Distance between two voice entries of two microphone cases, the relatively large distance between two sound holes of device case, by inserting
Located at sound-insulating structure therebetween.
The content of the invention
The present invention has two sounds i.e. for the electronic installation provided the problem of known technology to be solved on its housing
Hole.
One sound-insulating structure, there is the conduit of two extensions.
Each conduit has two sound ports.First sound port of the first conduit connects first sound hole, and it second
Microphone diaphragm in sound port connection the first voice entry to shell.
First sound port of the second conduit connects second sound hole, and its second sound port connection second sound entrance is extremely
Microphone diaphragm in shell.
Using embodiments of the invention, the coverage of the microphone can be increased by the conduit of different directions.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the stereogram for the electronic installation for showing the embodiment of the present invention；
Fig. 2 is the sectional view for the electronic installation for showing the embodiment of the present invention；
Fig. 3 is the electronic installation for showing another embodiment of the present invention；
Fig. 4 is the electronic installation for showing another embodiment of the present invention, wherein, surface-mounted integrated circuit is located among housing；
Fig. 5 is the electronic installation for showing another embodiment of the present invention, wherein, the first conduit of sound-insulating structure and second lead
Pipe extends parallel to each other；
Fig. 6 is a modified example of another implementation of the present invention；
Fig. 7 A, 7B are the electronic installations for showing another embodiment of the present invention, wherein, extension conduit is removably inserted
Among the perforation for entering housing；
Fig. 8 is the variation for showing Fig. 6.
Main element symbol description:
10th, 10 '~case of electronic device
11~the first sound holes
12~the second sound holes
13~fitting portion
14~perforation
16~upper surface
17~side surface
20th, 20 ', 20 ' '~sound-insulating structure
21st, the 21 ', 21 ' '~the first conduit
211st, 212~sound port
216th, 217~convex hole
22nd, the 22 ', 22 ' '~the second conduit
221st, 222~sound port
226th, 227~convex hole
30~microphone case
31~the first cavitys
32~the second cavitys
33~recess
41~the first thin grams of wind shake films
42~the second thin grams of wind shake films
50~printed circuit board (PCB)
51st ,~first sound hole
52~the second sound holes
60~surface-mounted integrated circuit
61~separation structure
Embodiment
Fig. 1, Fig. 2 are the electronic installations 1 for showing one embodiment of the invention, including a case of electronic device 10, a sound insulation knot
Structure 20, a microphone case 30, one first microphone diaphragm 41, a second microphone vibrating diaphragm 42 and a printed circuit board (PCB) 50.
First microphone diaphragm 41 and the second microphone vibrating diaphragm 42 are located among the shell 30, and electrically connect printed circuit board (PCB)
50.Case of electronic device 10 includes one first sound hole 11, one second sound hole 12 and a fitting portion 13.The sound-insulating structure 20 is chimeric
In the fitting portion 13, the sound-insulating structure 20 includes one first conduit 21 and one second conduit 22, and first conduit 21 connection should
First sound hole 11 and one first microphone voice entrance, second conduit 22 connection second sound hole 12 and 1 second Mike
Wind voice entry.Reference picture 2, first microphone diaphragm 41 and the second microphone vibrating diaphragm 42 are located among the housing 30,
Wherein first voice entry connects first conduit 21, and the second sound entrance connects second conduit 22.
In an embodiment of the present invention, this first and second microphone a small battle array can be integrated in through MEMS technology
Row microphone (SAM).
The sound-insulating structure 20 is removably embedded in the fitting portion 13 (Fig. 1), or is inserted in the consistent of housing 10 '
Hole 14 (Fig. 7 A, Fig. 7 B), by rubber or plastic cement sound-insulating structure, to be closely connected with housing 10.Therefore, sound channel
Air-tightness can be with elevated.Shell 30 can be metal, plastic material or CMOS-MESM encapsulation, and the housing 10 can be modeling
Glue or metal material.
Reference picture 1, first conduit 21 have a sound port 211 and a sound port 212, and second conduit 22 has
There are a sound port 221 and a sound port 222.One convex hole 216 is around the sound port 211.One convex hole 226 is surround
The sound port 221.One convex hole 217 is around the sound port 212.One convex hole 227 is around the sound port 222.It surround
It can more improve the airtight effect of sound passage in the convex hole of sound port.
In this embodiment, the housing 10 has a upper surface 16, and first sound hole 11 and second sound hole 12 are formed
In the upper surface 16.
Reference picture 3, among a variation, the housing 10 includes a upper surface 16 and a side surface 17, the upper surface
16 are formed at the upper surface 16 perpendicular to the side surface 17, first sound hole 11, and second sound hole 12 is formed at the side surface 17.
Reference picture 1, Fig. 2, the microphone case 30 include one first cavity 31, one second cavity 32 and a recess 33,
First cavity 31 and second cavity 32 in the microphone case 30 are separated by the recess 33, first microphone 41
Within first cavity 31, the second microphone 42 is within second cavity 32.
Reference picture 4, it is the variation for showing the present invention, wherein, a surface-mounted integrated circuit 60 is located among the shell 30,
Wherein, the surface-mounted integrated circuit 60 protrudes thereon including a separation structure 61, and the separation structure 61 abuts the recess 33 to separate
(sound insulation) first cavity 31 and second cavity 32.One printed circuit board (PCB) 50 is located within the shell 30, wherein, this is integrated
Circuit board 60 is on the printed circuit board (PCB) 50.
According to one embodiment of the invention, the sound port of the plurality of conduit, compared to the sound hole of housing, can have larger
Or equal size, think and obtained the acoustic energy of abundance.Reference picture 2, Fig. 3, using embodiments of the invention, microphone
Coverage d can be by the conduit of different directions and the housing, and it is D to increase.For example, in one embodiment, housing leads to
The length in road can be 4 millimeters, and the height of the sound-insulating structure can be 1~2 millimeter, and the thickness of the shell can be 0.2 millimeter.
The electronic installation can be proficiency machine, flat board or other portable electronic devices.The electronic installation can also be
TV, computer or other electronic installations.
Fig. 5 be show the present invention a variation, wherein, first conduit 21 ' of the sound-insulating structure 20 ' and this second
Conduit 22 ' can have a square-section.In one embodiment, a noise insulation block can be located at first conduit 21 ' and second be led with this
Between pipe 22 ', to improve soundproof effect.
Fig. 6 is the variation for showing the present invention, wherein, the sound-insulating structure 20 ' ' first conduit 21 ' ' and this
Two conduits 22 ' ' extend in parallel each other.
Fig. 8 is the another variation of Fig. 6 embodiments, wherein, the printed circuit board (PCB) 50 includes one first sound hole 51 and one
Second sound hole 52, first conduit 21 ' ' first sound hole 51 is connected, second conduit 22 ' ' connect second sound hole 52.
Although the present invention is disclosed as above with specific preferred embodiment, so it is not limited to the present invention, Ren Hesuo
Belong to those of ordinary skill in the art, a little change and retouching can be made, without departing from the spirit and scope of the present invention.
Claims (16)
1. a kind of electronic installation, including：
Housing, including the first sound hole and the second sound hole；
Sound-insulating structure, wherein, the sound-insulating structure includes the first conduit and the second conduit, and first conduit is connected to first sound
Hole, second conduit are connected to second sound hole, and the sound-insulating structure is rubber or plastic cement sound-insulating structure, removably close
Feud is embedded in the housing；
First microphone, connect first conduit；
Second microphone, connect second conduit；And
Microphone case, the microphone case include the first cavity and the second cavity, and first conduit connects first sound hole
And first cavity, second conduit connect second sound hole and second cavity, first microphone located at this first
Within cavity, the second microphone is located within second cavity,
Wherein, the sound-insulating structure also includes a wall, is shaped between first cavity and second cavity, is somebody's turn to do with separating
First microphone and the second microphone.
2. electronic installation as claimed in claim 1, wherein, the electronic installation also includes printed circuit board (PCB), first microphone
And the second microphone is on the printed circuit board (PCB).
3. electronic installation as claimed in claim 1, wherein, the sound-insulating structure is located at same surface with the housing.
4. electronic installation as claimed in claim 1, wherein, first conduit has first entrance and first outlet, and this
Two conduits have second entrance and second outlet, the sound-insulating structure include multiple convex holes each around the first entrance and
The second entrance.
5. electronic installation as claimed in claim 1, wherein, first conduit has first entrance and first outlet, and this
Two conduits have second entrance and second outlet, and multiple elastomeric materials are used to provide airtight effect, the plurality of elastic material
Expect to surround the first entrance, the first outlet, the second entrance and the convex hole of the second outlet.
6. electronic installation as claimed in claim 1, wherein, first conduit has first entrance and first outlet, and this
Two conduits have second entrance and second outlet, the sound-insulating structure include multiple convex holes each around the first outlet and
The second outlet.
7. electronic installation as claimed in claim 1, wherein, the housing includes the first shell channel and the second shell channel,
First shell channel connects first sound hole and first conduit, and second shell channel connects second sound hole and should
Second conduit.
8. electronic installation as claimed in claim 7, wherein, the housing includes a upper surface, first sound hole and this second
Sound hole is formed at the upper surface.
9. electronic installation as claimed in claim 7, wherein, the housing includes a upper surface and a side surface, the upper surface
Perpendicular to the side surface, first sound hole is formed at the upper surface, and second sound hole is formed at the side surface.
10. electronic installation as claimed in claim 1, it also includes a microphone case, wherein, first microphone and should
Second microphone is located among the shell.
11. electronic installation as claimed in claim 10, wherein, the microphone case include the first cavity, the second cavity and
Recess, first cavity and second cavity in the microphone case are separated by the recess, and first microphone is located at
Within first cavity, the second microphone is within second cavity.
12. electronic installation as claimed in claim 11, it also includes a surface-mounted integrated circuit, among the shell, wherein, should
Surface-mounted integrated circuit includes a separation structure and protruded thereon, and the separation structure abuts the recess to separate first cavity and be somebody's turn to do
Second cavity.
13. electronic installation as claimed in claim 12, wherein, the integrated circuit and first microphone and second Mike
Wind is integrated through CMOS-micro-electromechanical technology.
14. electronic installation as claimed in claim 12, it also includes a printed circuit board (PCB), under the shell, wherein, should
Surface-mounted integrated circuit is on the printed circuit board (PCB).
15. a kind of electronic installation, including：
Housing, including the first sound hole and the second sound hole；
Sound-insulating structure, wherein, the sound-insulating structure includes the first conduit and the second conduit, and first conduit is connected to first sound
Hole, second conduit are connected to second sound hole, and the sound-insulating structure is rubber or plastic cement sound-insulating structure, removably close
Feud is embedded in the housing；
First microphone, connect first conduit；
Second microphone, connect second conduit；And
Microphone case, the microphone case include the first cavity, the second cavity and separate first cavity and second chamber
The wall of body, first conduit connect first sound hole and first cavity, and second conduit connects second sound hole and should
Second cavity, first microphone is within first cavity, and the second microphone is within second cavity.
16. a kind of electronic installation, including：
Housing, including the first sound hole and the second sound hole；
Sound-insulating structure, wherein, the sound-insulating structure includes the first conduit and the second conduit, and first conduit is connected to first sound
Hole, second conduit are connected to second sound hole, and the sound-insulating structure is rubber or plastic cement sound-insulating structure, removably close
Feud is embedded in the housing；
First microphone, connect first conduit；
Second microphone, connect second conduit；And
Microphone case, the microphone case include the first shell and second housing, first conduit connect first sound hole with
And first shell, second conduit connect second sound hole and the second housing, first microphone is located at this outside first
Within shell, the second microphone within the second housing, with the second housing closely put together by first shell.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261734035P | 2012-12-06 | 2012-12-06 | |
| US61/734,035 | 2012-12-06 | ||
| US13/834,658 | 2013-03-15 | ||
| US13/834,658 US9357292B2 (en) | 2012-12-06 | 2013-03-15 | Implementation of microphone array housing receiving sound via guide tube |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103856857A CN103856857A (en) | 2014-06-11 |
| CN103856857B true CN103856857B (en) | 2018-01-05 |
Family
ID=50863989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310524575.9A Active CN103856857B (en) | 2012-12-06 | 2013-10-30 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103856857B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3065418B1 (en) * | 2015-03-05 | 2020-05-13 | Oticon A/s | Microphone inlet for hearing aid |
| US9967662B2 (en) * | 2016-09-12 | 2018-05-08 | Fortemedia, Inc. | Microphone device |
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| CN109413521A (en) * | 2017-08-18 | 2019-03-01 | 丁绍杰 | Mobile phone real-time phonetic translates bi-directional microphones |
| CN216599960U (en) * | 2021-09-27 | 2022-05-24 | 北京罗克维尔斯科技有限公司 | Vehicle-mounted microphone and vehicle |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
| DE102011087963A1 (en) * | 2010-12-14 | 2012-06-14 | Robert Bosch Gmbh | Microphone package, has housing cover connected with housing bottom by connection material that has low hardening temperature and/or requires short time for curing than another connection material connecting cover with microphone chip |
| CN102740211A (en) * | 2011-04-13 | 2012-10-17 | 奥迪康有限公司 | Hearing device with two or more microphones |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6151399A (en) * | 1996-12-31 | 2000-11-21 | Etymotic Research, Inc. | Directional microphone system providing for ease of assembly and disassembly |
| CN101014205A (en) * | 2005-12-02 | 2007-08-08 | 美商富迪科技股份有限公司 | Electronic device |
| US7664284B2 (en) * | 2006-09-14 | 2010-02-16 | Fortemedia, Inc. | Microphone array in housing |
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2013
- 2013-10-30 CN CN201310524575.9A patent/CN103856857B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011087963A1 (en) * | 2010-12-14 | 2012-06-14 | Robert Bosch Gmbh | Microphone package, has housing cover connected with housing bottom by connection material that has low hardening temperature and/or requires short time for curing than another connection material connecting cover with microphone chip |
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
| CN102740211A (en) * | 2011-04-13 | 2012-10-17 | 奥迪康有限公司 | Hearing device with two or more microphones |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103856857A (en) | 2014-06-11 |
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