CN103849921B - electroplating rack - Google Patents
electroplating rack Download PDFInfo
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- CN103849921B CN103849921B CN201310537571.4A CN201310537571A CN103849921B CN 103849921 B CN103849921 B CN 103849921B CN 201310537571 A CN201310537571 A CN 201310537571A CN 103849921 B CN103849921 B CN 103849921B
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Abstract
The present invention provides a kind of Electroplating Rack, is suitable to temporarily to position workpiece to be plated and is spread by electroplating and be handed to workpiece to be plated.Electroplating Rack includes electric-conductor, frame member, locking device and conductive pin.Frame member is assembled to electric-conductor, has accommodating area and spacing zone, and wherein accommodating area can accommodate workpiece to be plated.Locking device is connected to frame member, and can engage the workpiece to be plated being contained in accommodating area, to be positioned in accommodating area by workpiece to be plated.Conductive pin is electrically connected to electric-conductor and extends in spacing zone, and can be moved along axis by the limitation of spacing zone, the workpiece to be plated being contained in accommodating area with contact.
Description
Technical field
The invention relates to a kind of Electroplating Rack, and to be plated in order to temporarily location in particular to one
Workpiece being spread by electroplating is handed to the Electroplating Rack of workpiece to be plated.
Background technology
Before workpiece to be plated is electroplated, workpiece to be plated must be positioned on Electroplating Rack, then by electricity
Plating hanger is hung on and flies on target (flybar), and then the mobile target that flies immerses electricity by Electroplating Rack with workpiece to be plated
In coating bath, to carry out the plating of workpiece to be plated.
The conductive pin of tradition Electroplating Rack presents the state of exposing, and the every necessary contact workpiece to be plated of conductive pin,
This results in staff and is difficult to carry out the operation that picks and places of workpiece to be plated, thus reduces production efficiency.
Additionally, conductive pin only relies on the elastic force of conductive pin itself when being resisted against workpiece to be plated.If Electroplating Rack
Move in process of production, rock or collide, be easy for making conductive pin slide and scratch workpiece to be plated.Value
As long as obtaining it is noted that there is a conductive pin to be subjected to displacement on workpiece to be plated, this will result in work to be plated
The scratch of part.
Furthermore, if the conductive pin of the corresponding single workpiece to be plated of Electroplating Rack is the most, it would be desirable to bigger folder
Holding force is to position workpiece to be plated, and this also easily causes the slip of conductive pin and scratch workpiece to be plated, even makes
Become the problem that workpiece to be plated deforms so that staff pick and place in operation more difficult.In order to solve this
The problem of sample, often reduces the quantity of workpiece to be plated set on Electroplating Rack, finally improves work
Make the production costs such as time, manpower and defective products quantity.
It addition, conductive pin is through long-term pulling the most back and forth, the bottom of conductive pin is easily and the joint of conductive pole
Rupture in place, and the region corresponding to the conductive pin ruptured cannot carry out electroplating activity to workpiece to be plated.
Additionally, conductive pin is lost in electrolytic process and gradually shortens.
The patent relevant to Electroplating Rack has China Patent No. CN102080253, U.S. Patent number
US8221600 and european patent number EP1809792.
Summary of the invention
The present invention refers to a kind of Electroplating Rack, in order to temporarily to position workpiece to be plated and to be transmitted by electroplating stream
To workpiece to be plated.
The present invention provides a kind of Electroplating Rack, is suitable to temporarily position workpiece to be plated and transmitted by electroplating stream
To workpiece to be plated.Electroplating Rack includes electric-conductor, frame member, locking device and conductive pin.Frame member
Being assembled to electric-conductor, have accommodating area and spacing zone, wherein accommodating area can accommodate workpiece to be plated.Locking device
It is connected to frame member, and the workpiece to be plated being contained in accommodating area can be engaged, so that workpiece to be plated is positioned
In accommodating area.Conductive pin is electrically connected to electric-conductor and extends in spacing zone, and can be by spacing zone
Limit to and move along axis, the workpiece to be plated being contained in accommodating area with contact.
The present invention provides a kind of Electroplating Rack, is suitable to temporarily position workpiece to be plated and transmitted by electroplating stream
To this workpiece to be plated, it is characterised in that this Electroplating Rack includes: electric-conductor;Frame member, is assembled to
This electric-conductor, has the accommodating area in order to this workpiece accommodating and is positioned at the spacing zone of this accommodating area;And
Conductive pin, has the first end being electrically connected with this electric-conductor and the second end limited to by this spacing zone, this limit
Position fauna limits this second end on the direction close to or away from this workpiece to be plated being contained in this accommodating area
Mobile, and the surface of this workpiece to be plated it is resisted against with this second end.
Based on above-mentioned, the present invention allows conductive pin pass by being provided with spacing zone in frame member, thus fall
Low conductive pin is in the skew of workpiece to be plated, to avoid causing the scratch of workpiece to be plated.
For the features described above of the present invention and advantage can be become apparent, special embodiment below, and coordinate
Institute's accompanying drawings is described in detail below.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of a kind of Electroplating Rack of one embodiment of the invention;
Fig. 2 is the exploded view of the Electroplating Rack of Fig. 1;
The stop block of the locking device that Fig. 3 A illustrates Fig. 1 is in locking position;
The stop block of the locking device that Fig. 3 B illustrates Fig. 1 is in non-locking position;
Fig. 4 is the axonometric chart of the locking device of Fig. 1;
Fig. 5 is the exploded view of the locking device of Fig. 4;
Fig. 6 illustrates the stacked state of the Electroplating Rack of two identical Fig. 1;
Fig. 7 illustrates the electric-conductor of the Electroplating Rack of Fig. 1 and the connection status of conductive pin;
Fig. 8 illustrates the electric-conductor of the Electroplating Rack of another embodiment of the present invention and the connection status of conductive pin.
Description of reference numerals:
100,100a: Electroplating Rack;
110: electric-conductor;
110a: hook;
120: frame member;
120-1: outer part;
120-2: separating part;
120-3: protuberance;
120a: accommodating area;
120b: spacing zone;
120c: fastening groove;
120d: recess;
121: the first frameworks;
122: the second frameworks;
123: connecting rod;
124: connecting rod spiral lock;
125: post spiral lock;
130: locking device;
131: stop block;
132: locking spiral lock;
132a: bar portion;
132b: head;
133: helical spring;
140: conductive pin;
140a: fixing end;
140b: free end;
150: elastic component;
200: workpiece to be plated;
A: axis.
Detailed description of the invention
Fig. 1 is the axonometric chart of a kind of Electroplating Rack of one embodiment of the invention, and Fig. 2 is the electricity of Fig. 1
The exploded view of plating hanger.Refer to Fig. 1 and Fig. 2, the Electroplating Rack 100 of the present embodiment is suitable to the most fixed
Electroplating is also spread and is handed to workpiece 200 to be plated by the multiple workpiece 200 to be plated in position.Electroplating Rack 100 wraps
Include electric-conductor 110, frame member 120, multiple locking device 130 and multiple conductive pin 140.In this enforcement
In example, electric-conductor 110 is long cylinder, and the top of electric-conductor 110 has hook 110a, as hook 110a
Be hung on fly target (not illustrating) upper time, electroplating stream can be transferred to this conductive pin via electric-conductor 110
140, it is then passed to workpiece 200 to be plated.Additionally, electric-conductor 110 can also conductor wire along non-conductive post
Body is extended.
In the present embodiment, frame member 120 can include first framework the 121, second framework 122, multiple
Connecting rod 123 and multiple connecting rod spiral lock 124.First framework 121 and the second framework 122 have similar
Structure.As a example by the first framework 121, the first framework 121 has the general outer part 120-1 in long rectangle
And the separating part 120-2 that multiple peripherally portions 120-1 length is arranged in outer part 120-1 to compartment of terrain, with
Constitute multiple adjacent and be spaced the accommodating area 120a of configuration, as shown in Figure 2.Additionally, these connecting rods 123
Individually between the first framework 121 and the second framework 122, and these connecting rod spiral locks 124 are respectively
Through the outer part 120-1 of the first framework 121, the second framework 122 outer part 120-1 after, be locked in
In each connecting rod 123.
Additionally, in order to frame member 120 is solidly connected to electric-conductor 110, frame member 120 may also include
Multiple post spiral locks 125, and these post spiral locks 125 are through electric-conductor 110, and post spiral lock 125
Two ends are locked in each outer part 120-1 the most respectively so that electric-conductor 110 and each outer part 120-1 locking exist
Together.Additionally, outer part 120-1 has multiple spacing zone 120b, and these spacing zones 120b sets respectively
In the accommodating area 120a that it is corresponding.In the present embodiment, the inner side of outer part 120-1 protrudes many
Individual protuberance 120-3, and spacing zone 120b is the perforation formed on protuberance 120-3.Conductive pin 140
Through spacing zone 120b (perforation) and can be by the limitation of spacing zone 120b (perforation) along axis A
Mobile.
Fig. 4 is the axonometric chart of the locking device of Fig. 1, and Fig. 5 is the exploded view engaging device of Fig. 4.Please join
Examining Fig. 4 and Fig. 5, in the present embodiment, this locking device 130 is connected to the outside of outer part 120-1, and
The workpiece to be plated 200 being contained in the 120a of accommodating area can be engaged, to be positioned to house workpiece 200 to be plated for
In district 120a.In order to stop block 131 is pivotally arranged on outer part 120-1, locking device 130 may also include card
Only spiral lock 132 and helical spring 133.Locking spiral lock 132 passes the axis hole 120c of outer part 120-1
And secure to stop block 131, so that stop block 131 is pivotally arranged on outer part 120-1.Additionally, helical spring
133 circles are around engaging the bar portion 132a of spiral lock 132 and being positioned at locking device 130 and locking spiral lock 132
Between head 132b, to guarantee stop block 131 to be maintained relative to periphery by postrotational stop block 131
The position of portion 120-1.
The stop block of the locking device that Fig. 3 A illustrates Fig. 1 is in locking position, and Fig. 3 B illustrates the locking of Fig. 1
The stop block of device is in non-locking position, refer again to Fig. 3 A and Fig. 3 B, in the present embodiment, engages device
130 include stop block 131, and it is pivotally arranged on outer part 120-1.Stop block 131 can be relative to outer part 120-1
It is rotated into engaging the position of workpiece 200 to be plated, as shown in Figure 3A.Or, stop block 131 can be relatively
It is rotated into not engaging the position of workpiece 200 to be plated in outer part 120-1, as shown in Figure 3 B.Therefore,
When accommodating area 120a put into by workpiece 200 to be plated, whether stop block 131 is in locking workpiece 200 to be plated
Position determine can from accommodating area 120a take out workpiece 200 to be plated.
Refer again to Fig. 3 A and Fig. 3 B, stop block 131 is embedded in the fastening groove 120c on outer part 120-1,
And be positioned at the position engaging workpiece 200 to be plated relative to outer part 120-1, and helical spring 133 forces card
Stops 131 is embedded in fastening groove 120c.Therefore, in electroplating process, no matter outer part 120-1 how by
Move, rock or collide, stop block 131 can be maintained to be positioned at locking workpiece to be plated relative to outer part 120-1
The position of 200, not drop out in workpiece 200 to be plated is positioned accommodating area 120a.
Refer again to Fig. 3 A, the material of stop block 131 can comprise polypropylene (Polypropylene, PP),
To avoid stop block 131 to cause the surface damage of workpiece 200 to be plated when contacting workpiece 200 to be plated, and have
There is the ability of acid-alkali-corrosive-resisting.Additionally, the material of conductive pin 140 can comprise titanium (Ti), to electroplate
Will not be lost in journey so that conductive pin 140 need not maintenance.
Fig. 6 illustrates the stacked state of the Electroplating Rack of two identical Fig. 1.Refer to Fig. 1 and Fig. 6,
In the present embodiment, the outer part 120-1 of the first framework 121 and the outer part 120-1 group of the second framework 122
It is loaded on the two opposite sides of electric-conductor 110 and is substantially parallel to each other, and being assembled to the periphery of the first framework 121
These locking device 130 (particularly locking devices 130 of the outer part 120-1 of portion 120-1 and the second framework 122
Stop block 131) orthographic projection on the outer part 120-1 of the first framework 121 is the most overlapping.Therefore, when
When two identical Electroplating Racks 100 flatly stack, these locking device 130 (particularly locking devices 130
Stop block 131) structurally will not interfere with, thus help in reduce Electroplating Rack 100 parking space.
Fig. 7 illustrates the electric-conductor of the Electroplating Rack of Fig. 1 and the connection status of conductive pin.Refer to Fig. 7, lead
Acusector 140 is electrically connected to electric-conductor 110 and extends in corresponding spacing zone 120b, and can be limited
The position limitation of district 120b and move along axis A, the workpiece to be plated being contained in the 120a of accommodating area with contact
200.Specifically, spacing zone 120b is the perforation formed on protuberance 120-3.Conductive pin 140 is worn
Cross spacing zone 120b (perforation) and can be moved along axis A by the limitation of spacing zone 120b (perforation).
One end of conductive pin 140 is solidly connected to electric-conductor 110, and carrys out contact by the elasticity of conductive pin 140 itself and treat
Plating workpiece 200.In the present embodiment, conductive pin 140 substantially L-shaped and have fixing end 140a and from
By end 140b.The fixing end 140a of conductive pin 140 is fixed to electric-conductor 110, and conductive pin 140 from
Extended to by end 140b in the spacing zone 120b of correspondence.When accommodating area 120a inserted by workpiece 200 to be plated,
Conductive pin 140 will deflect with fixing end 140a for fulcrum, and free end 140b will shrink back along axis A,
And can by the elastic force of conductive pin 140 itself flexibly contact workpiece to be plated 200.Due to conductive pin 140
Extend in the 120b of spacing zone, and spacing, so conductive pin 140 is relative to appearance by spacing zone 120b institute
The workpiece to be plated 200 being contained in the 120a of accommodating area is not susceptible to slide, thus reduces workpiece 200 to be plated
Scratch.
Fig. 8 illustrates the electric-conductor of the Electroplating Rack of another embodiment of the present invention and the connection status of conductive pin.Please
With reference to Fig. 8, the Electroplating Rack 100 compared to Fig. 7, Electroplating Rack 100a also includes elastic component 150, its
It is arranged between protuberance 120-3 and conductive pin 140, to force conductive pin 140 contact workpiece to be plated 200.
When workpiece 200 to be plated is inserted accommodating area 120a and is pressed against the free end 140b of conductive pin 140, L-type
Conductive pin 140 will deflect with fixing end 140a for fulcrum, and free end 140b will shrink back along axis A,
And by the elastic force of elastic component 150 and flexibly contact workpiece to be plated 200.
Refer again to Fig. 1 and Fig. 2, in order to reduce liquid accumulation in frame member 120, do not affecting
In the case of original function and structural strength, the region being likely to result in accumulation of fluid in framework 120 can be reduced.
In the present embodiment, the horizontal component of frame member 120 (i.e. prolongs on the horizontal plane be perpendicular to gravity direction
The part stretched) can have multiple recess 120d, it is likely to result in accumulation of fluid to reduce in frame member 120
Region.
In sum, the present invention allows conductive pin pass by being provided with spacing zone in frame member, thus reduces
Conductive pin is in the skew of workpiece to be plated, to avoid causing the scratch of workpiece to be plated.Additionally, the present invention passes through
Frame member is provided with locking device, and its stop block can rotate rapidly to locking or not engage and be contained in accommodating area
Interior workpiece to be plated, be beneficial to workpiece to be plated picks and places operation.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, rather than to it
Limit;Although the present invention being described in detail with reference to foregoing embodiments, the ordinary skill of this area
Personnel it is understood that the technical scheme described in foregoing embodiments still can be modified by it, or
The most some or all of technical characteristic is carried out equivalent;And these amendments or replacement, do not make phase
The essence answering technical scheme departs from the scope of various embodiments of the present invention technical scheme.
Claims (12)
1. an Electroplating Rack, is suitable to temporarily to position workpiece to be plated and electroplating spreads to be handed to this to be plated
Workpiece, it is characterised in that this Electroplating Rack includes:
Electric-conductor;
Frame member, is assembled to this electric-conductor, has accommodating area and spacing zone, and wherein this accommodating area can hold
Receive this workpiece to be plated, and this spacing zone is located in this accommodating area;
Locking device, is connected to this frame member, and can engage this workpiece to be plated being contained in this accommodating area,
So that this workpiece to be plated is positioned in this accommodating area;And
Conductive pin, is electrically connected to this electric-conductor and extends in this spacing zone, and can be by this spacing zone
Limit to and move along axis, this workpiece to be plated being contained in this accommodating area with contact.
Electroplating Rack the most according to claim 1, it is characterised in that this locking device includes:
Stop block, is pivotally arranged on this frame member, with can relative to this frame member be rotated into locking or not
Engage the position of this workpiece to be plated.
Electroplating Rack the most according to claim 2, it is characterised in that this locking device includes:
Locking spiral lock, has bar portion and connects the head of this one end of the rod, and this frame member has axis hole,
This locking spiral lock secures to this stop block, with by this stop block pivot through this axis hole of this frame member
If to this frame member;And
Helical spring, circle is around this bar portion and between this frame member and this head.
Electroplating Rack the most according to claim 3, it is characterised in that this frame member has locking
Groove, this stop block is embedded in this fastening groove and is positioned at the position of this workpiece to be plated of locking, and this helical spring
This stop block is forced to be embedded in this fastening groove.
Electroplating Rack the most according to claim 1, it is characterised in that the material of this conductive pin comprises
Titanium.
Electroplating Rack the most according to claim 1, it is characterised in that this frame member includes first
Framework and the second framework, this first framework and this second framework are assembled in two opposite sides and the reality of this electric-conductor
Being parallel to each other in matter, this first framework and this second framework are respectively provided with multiple accommodating area and assemble many respectively
This locking device individual, and it is connected to those locking devices of this first framework and this second framework in this first framework
On orthographic projection the most overlapping.
Electroplating Rack the most according to claim 1, it is characterised in that one end of this conductive pin connects
To this electric-conductor, and support this workpiece to be plated by the elastic top of this conductive pin itself.
Electroplating Rack the most according to claim 1, it is characterised in that this conductive pin is L-shaped, should
One end of conductive pin is solidly connected to this electric-conductor, and the other end of this conductive pin is by the elasticity of this conductive pin itself
This workpiece to be plated of contact.
Electroplating Rack the most according to claim 1, it is characterised in that also include:
Elastic component, is arranged between this frame member and this conductive pin, and to force this conductive pin contact, this is treated
Plating workpiece.
Electroplating Rack the most according to claim 1, it is characterised in that this spacing zone is this framework
The perforation formed on component, and this conductive pin is through this perforation and the limitation that can be bored a hole by this along this
Axis moves.
11. Electroplating Racks according to claim 1, it is characterised in that hanging down of this frame member
The straight part extended on the horizontal plane of gravity direction has recess, causes liquid to reduce in this frame member
The region of body accumulation.
12. 1 kinds of Electroplating Racks, are suitable to temporarily to position workpiece to be plated and are spread by electroplating and be handed to this and treat
Plating workpiece, it is characterised in that this Electroplating Rack includes:
Electric-conductor;
Frame member, is assembled to this electric-conductor, has the accommodating area in order to this workpiece accommodating and is positioned at this appearance
Put the spacing zone in district;And
Conductive pin, has the first end being electrically connected with this electric-conductor and the second end limited to by this spacing zone,
This spacing fauna limits this second end in the side close to or away from this workpiece to be plated being contained in this accommodating area
Move up, and be resisted against the surface of this workpiece to be plated with this second end.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261732647P | 2012-12-03 | 2012-12-03 | |
US61/732,647 | 2012-12-03 |
Publications (2)
Publication Number | Publication Date |
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CN103849921A CN103849921A (en) | 2014-06-11 |
CN103849921B true CN103849921B (en) | 2016-08-17 |
Family
ID=50858035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310537571.4A Active CN103849921B (en) | 2012-12-03 | 2013-11-04 | electroplating rack |
Country Status (2)
Country | Link |
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CN (1) | CN103849921B (en) |
TW (1) | TWI532885B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102041545A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Plating hanger |
CN102041544A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Automatical opening/closing type plating hanger |
-
2013
- 2013-09-17 TW TW102133721A patent/TWI532885B/en active
- 2013-11-04 CN CN201310537571.4A patent/CN103849921B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102041545A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Plating hanger |
CN102041544A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Automatical opening/closing type plating hanger |
Also Published As
Publication number | Publication date |
---|---|
CN103849921A (en) | 2014-06-11 |
TWI532885B (en) | 2016-05-11 |
TW201422853A (en) | 2014-06-16 |
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