CN103849921A - Electroplating hanger - Google Patents
Electroplating hanger Download PDFInfo
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- CN103849921A CN103849921A CN201310537571.4A CN201310537571A CN103849921A CN 103849921 A CN103849921 A CN 103849921A CN 201310537571 A CN201310537571 A CN 201310537571A CN 103849921 A CN103849921 A CN 103849921A
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- workpiece
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- frame member
- conductive pin
- electroplating
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Abstract
The invention provides an electroplating hanger suitable for temporarily positioning workipieces to be electroplated and transmitting electroplating current to the workipieces to be electroplated. The electroplating hanger comprises a conductive part, a frame body component, stoppers and conductive needles. The frame body component is assembled to the conductive part and provided with an accommodating area for accommodating the workipieces to be electroplated and a limiting area. The stoppers are connected to the frame body component and stopped to be accommodated in the workipieces to be electroplated in the accommodating area so that the workipieces to be electroplated are positioned in the accommodating area. The conductive needles are electrically connected to the conductive part and extend to the limiting area and are also capable of moving along an axis by limitation of the limiting area so that the workipieces to be electroplated accommodated in the accommodating area are ejected against.
Description
Technical field
The invention relates to a kind of Electroplating Rack, and relate to especially and a kind ofly spread and be handed to the Electroplating Rack of workpiece to be plated in order to temporary transient location workpiece to be plated and by electroplating.
Background technology
Before workpiece to be plated is electroplated, workpiece to be plated must be positioned on Electroplating Rack, then Electroplating Rack is hung on and flies target (flybar) above, then move and fly target by Electroplating Rack and workpiece immersion plating groove to be plated, to carry out the plating of workpiece to be plated.
The conductive pin of tradition Electroplating Rack presents the state of exposing, and the every necessary contact workpiece to be plated of conductive pin, and this results in the operation that picks and places that staff is difficult for carrying out workpiece to be plated, thereby reduces production efficiency.
In addition when, conductive pin is resisted against workpiece to be plated, only rely on the elastic force of conductive pin itself.If Electroplating Rack moves in process of production, rocks or collides, just easily make conductive pin slide and scratch workpiece to be plated.As long as it should be noted that a conductive pin is subjected to displacement on workpiece to be plated, this will cause the scratch of workpiece to be plated.
Moreover, if the conductive pin of the corresponding single workpiece to be plated of Electroplating Rack is more, by holding force larger needs, to locate workpiece to be plated, this also easily causes the slip of conductive pin and scratch workpiece to be plated, even cause the problem of workpiece deformation to be plated, make staff pick and place in operation more difficult.In order to solve such problem, tend to reduce the quantity of workpiece to be plated set on Electroplating Rack, finally improve the production costs such as working hour, manpower and defective products quantity.
In addition, conductive pin is through long-term pulling back and forth, easily ruptures with the joint of conductive pole in the bottom of conductive pin, and electroplating activity cannot be carried out to workpiece to be plated in the corresponding region of conductive pin of rupturing.In addition conductive pin loss and shortening gradually in electrolytic process.
The patent relevant to Electroplating Rack has China Patent No. CN102080253, U.S. Patent number US8221600 and european patent number EP1809792.
Summary of the invention
The present invention refers to a kind of Electroplating Rack, spreads and is handed to workpiece to be plated in order to temporary transient location workpiece to be plated and by electroplating.
The invention provides a kind of Electroplating Rack, be suitable for temporarily locating workpiece to be plated and electroplating is spread and is handed to workpiece to be plated.Electroplating Rack comprises electric-conductor, frame member, engagement device and conductive pin.Frame member is assembled to electric-conductor, has accommodating area and spacing zone, and wherein accommodating area can hold workpiece to be plated.Engagement device is connected to frame member, and can engagement be contained in the workpiece to be plated in accommodating area, so that workpiece to be plated is positioned in accommodating area.Conductive pin is electrically connected to electric-conductor and extends in spacing zone, and can be subject to the limitation of spacing zone and move along axis, is contained in the workpiece to be plated in accommodating area with contact.
The invention provides a kind of Electroplating Rack, be suitable for temporarily locating workpiece to be plated and electroplating is spread and is handed to this workpiece to be plated, it is characterized in that, this Electroplating Rack comprises: electric-conductor; Frame member, is assembled to this electric-conductor, has in order to the accommodating area of accommodating this workpiece and is positioned at the spacing zone of this accommodating area; And conductive pin, have and be electrically connected the first end of this electric-conductor and be subject to this spacing zone to arrest the second end of limit, this spacing fauna limits this second end in approaching or moving up away from the side that is contained in this workpiece to be plated in this accommodating area, and is resisted against the surface of this workpiece to be plated with this second end.
Based on above-mentioned, the present invention allows conductive pin pass by be provided with spacing zone in frame member, thereby reduces the skew of conductive pin at workpiece to be plated, to avoid causing the scratch of workpiece to be plated.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the stereographic map of a kind of Electroplating Rack of one embodiment of the invention;
Fig. 2 is the exploded view of the Electroplating Rack of Fig. 1;
Fig. 3 A illustrates the stop block of engagement device of Fig. 1 in engagement position;
Fig. 3 B illustrates the stop block of engagement device of Fig. 1 in engagement position not;
Fig. 4 is the stereographic map of the engagement device of Fig. 1;
Fig. 5 is the exploded view of the engagement device of Fig. 4;
Fig. 6 illustrates the stacked state of the Electroplating Rack of two identical Fig. 1;
Fig. 7 illustrates the electric-conductor of Electroplating Rack and the connection state of conductive pin of Fig. 1;
Fig. 8 illustrates the electric-conductor of Electroplating Rack and the connection state of conductive pin of another embodiment of the present invention.
Description of reference numerals:
100,100a: Electroplating Rack;
110: electric-conductor;
110a: hook;
120: frame member;
120-1: outer part;
120-2: separating part;
120-3: protuberance;
120a: accommodating area;
120b: spacing zone;
120c: fastening groove;
120d: recess;
121: the first frameworks;
122: the second frameworks;
123: connecting rod;
124: connecting rod spiral lock;
125: post spiral lock;
130: engagement device;
131: stop block;
132: engagement spiral lock;
132a: bar portion;
132b: head;
133: whisker;
140: conductive pin;
140a: inboardend;
140b: free end;
150: elastic component;
200: workpiece to be plated;
A: axis.
Embodiment
Fig. 1 is the stereographic map of a kind of Electroplating Rack of one embodiment of the invention, and Fig. 2 is the exploded view of the Electroplating Rack of Fig. 1.Please refer to Fig. 1 and Fig. 2, the Electroplating Rack 100 of the present embodiment is suitable for temporarily locating multiple workpiece 200 to be plated and electroplating being spread and is handed to workpiece 200 to be plated.Electroplating Rack 100 comprises electric-conductor 110, frame member 120, multiple engagement device 130 and multiple conductive pin 140.In the present embodiment, electric-conductor 110 is long column body, and the top of electric-conductor 110 has hook 110a, flies target (not illustrating) when upper when hook 110a is hung on, electroplating stream can be passed to this conductive pin 140 via electric-conductor 110, is then passed to workpiece 200 to be plated.In addition, electric-conductor 110 can also extend and arrange along non-conductive cylinder by conductor wire.
In the present embodiment, frame member 120 can comprise the first framework 121, the second framework 122, multiple connecting rod 123 and multiple connecting rod spiral lock 124.The first framework 121 and the second framework 122 have similar structure.Take the first framework 121 as example, the first framework 121 has and is generally the outer part 120-1 of long rectangle and is multiplely configured in the separating part 120-2 in outer part 120-1 to compartment of terrain along outer part 120-1 is long, to form multiple adjacent and accommodating area 120a of arranged spaced, as shown in Figure 2.In addition, these connecting rods 123 are individually between the first framework 121 and the second framework 122, and these connecting rod spiral locks 124 are respectively after the outer part 120-1 through the outer part 120-1 of the first framework 121, the second framework 122, are locked in each connecting rod 123.
In addition, for frame member 120 is solidly connected to electric-conductor 110, frame member 120 also can comprise multiple post spiral locks 125, and these post spiral locks 125 are through electric-conductor 110, two ends of post spiral lock 125 are locked in respectively each outer part 120-1, and electric-conductor 110 and each outer part 120-1 are locked together.In addition, outer part 120-1 has multiple spacing zone 120b, and these spacing zones 120b is located at respectively in its corresponding accommodating area 120a.In the present embodiment, the inner side of outer part 120-1 is extruded with multiple protuberance 120-3, and the perforation of spacing zone 120b for forming on protuberance 120-3.Conductive pin 140 is through spacing zone 120b(perforation) and bored a hole by spacing zone 120b() limitation and move along axis A.
Fig. 4 is the stereographic map of the engagement device of Fig. 1, and Fig. 5 is the exploded view of the engagement device of Fig. 4.Please refer to Fig. 4 and Fig. 5, in the present embodiment, this engagement device 130 is connected to the outside of outer part 120-1, and can engagement be contained in the workpiece to be plated 200 in the 120a of accommodating area, so that workpiece 200 to be plated is positioned in the 120a of accommodating area.For stop block 131 is pivotally arranged on to outer part 120-1, engagement device 130 also can comprise engagement spiral lock 132 and whisker 133.Engagement spiral lock 132 secures to stop block 131 through the axis hole 120c of outer part 120-1, so that stop block 131 is pivotally arranged on outer part 120-1.In addition, whisker 133 encloses around the 132a of bar portion of engagement spiral lock 132 and between engagement device 130 and the head 132b of engagement spiral lock 132, can maintain the position of stop block 131 with respect to outer part 120-1 with the stop block 131 after guaranteeing to be rotated.
Fig. 3 A illustrates the stop block of engagement device of Fig. 1 in engagement position, and Fig. 3 B illustrates the stop block of engagement device of Fig. 1 in engagement position not, refer again to Fig. 3 A and Fig. 3 B, and in the present embodiment, engagement device 130 comprises stop block 131, and it is pivotally arranged on outer part 120-1.Stop block 131 can be rotated to the position of engagement workpiece 200 to be plated, as shown in Figure 3A with respect to outer part 120-1.Or stop block 131 can be rotated to the position of engagement workpiece 200 to be plated not, as shown in Figure 3 B with respect to outer part 120-1.Therefore,, in the time that workpiece 200 to be plated is put into accommodating area 120a, can the stop block 131 whether determining positions in engagement workpiece 200 to be plated take out workpiece 200 to be plated from accommodating area 120a.
Refer again to Fig. 3 A and Fig. 3 B, stop block 131 is embedded in the fastening groove 120c on outer part 120-1, and is positioned at the position of engagement workpiece 200 to be plated with respect to outer part 120-1, and whisker 133 forces stop block 131 to be embedded in fastening groove 120c.Therefore, in electroplating process, no matter how outer part 120-1 is moved, rocks or collides, and can maintain stop block 131 and be positioned at respect to outer part 120-1 the position of engagement workpiece 200 to be plated, workpiece 200 to be plated is positioned in the 120a of accommodating area and do not drop out.
Refer again to Fig. 3 A, the material of stop block 131 can comprise polypropylene (Polypropylene, PP), to avoid stop block 131 to cause the surface of workpiece 200 to be plated impaired in the time contacting workpiece 200 to be plated, and has the ability of acid-alkali-corrosive-resisting.In addition, the material of conductive pin 140 can comprise titanium (Ti), with not loss to some extent in electroplating process, conductive pin 140 is not needed repairing.
Fig. 6 illustrates the stacked state of the Electroplating Rack of two identical Fig. 1.Please refer to Fig. 1 and Fig. 6, in the present embodiment, the outer part 120-1 of the outer part 120-1 of the first framework 121 and the second framework 122 is assembled in the two opposite sides of electric-conductor 110 and is parallel to each other in fact, and is assembled to the particularly stop block 131 of engagement device 130 of these engagement devices 130(of the outer part 120-1 of the first framework 121 and the outer part 120-1 of the second framework 122) orthographicprojection on the outer part 120-1 of the first framework 121 is not overlapping.Therefore, in the time that two identical Electroplating Racks 100 are flatly stacking, the particularly stop block 131 of engagement device 130 of these engagement devices 130() structurally can not interfere, thereby contribute to reduce the parking space of Electroplating Rack 100.
Fig. 7 illustrates the electric-conductor of Electroplating Rack and the connection state of conductive pin of Fig. 1.Please refer to Fig. 7, conductive pin 140 is electrically connected to electric-conductor 110 and extends in corresponding spacing zone 120b, and can be subject to the limitation of spacing zone 120b and move along axis A, is contained in the workpiece to be plated 200 in the 120a of accommodating area with contact.Particularly, the perforation of spacing zone 120b for forming on protuberance 120-3.Conductive pin 140 is through spacing zone 120b(perforation) and bored a hole by spacing zone 120b() limitation and move along axis A.One end of conductive pin 140 is solidly connected to electric-conductor 110, and carrys out contact workpiece 200 to be plated by conductive pin 140 elasticity own.In the present embodiment, conductive pin 140 is roughly L-shaped and have inboardend 140a and a free end 140b.The inboardend 140a of conductive pin 140 is fixed to electric-conductor 110, and the free end 140b of conductive pin 140 extends in corresponding spacing zone 120b.In the time that workpiece 200 to be plated is inserted accommodating area 120a, conductive pin 140 will be take inboardend 140a as fulcrum deflection, and free end 140b will shrink back along axis A, and can be subject to the elastic force of conductive pin 140 itself and contact workpiece 200 to be plated flexibly.Because conductive pin 140 extends in the 120b of spacing zone, and it is spacing to be subject to spacing zone 120b institute, so conductive pin 140 is difficult for sliding with respect to the workpiece to be plated 200 being contained in the 120a of accommodating area, thereby reduces the scratch of workpiece 200 to be plated.
Fig. 8 illustrates the electric-conductor of Electroplating Rack and the connection state of conductive pin of another embodiment of the present invention.Please refer to Fig. 8, compared to the Electroplating Rack 100 of Fig. 7, Electroplating Rack 100a also comprises elastic component 150, and it is arranged between protuberance 120-3 and conductive pin 140, to force conductive pin 140 contact workpiece 200 to be plated.In the time that workpiece 200 to be plated is inserted accommodating area 120a and be pressed against the free end 140b of conductive pin 140, the conductive pin 140 of L-type will be take inboardend 140a as fulcrum deflection, and free end 140b will shrink back along axis A, and be subject to the elastic force of elastic component 150 and contact workpiece 200 to be plated flexibly.
Refer again to Fig. 1 and Fig. 2, in order to reduce the accumulation of liquid in frame member 120, in the situation that not affecting original function and structural strength, can dwindle the region that may cause accumulation of fluid in framework 120.In the present embodiment, the horizontal component of frame member 120 (part of extending on the horizontal plane perpendicular to gravity direction) can have multiple recess 120d, to dwindle the region that may cause accumulation of fluid in frame member 120.
In sum, the present invention allows conductive pin pass by be provided with spacing zone in frame member, thereby reduces the skew of conductive pin at workpiece to be plated, to avoid causing the scratch of workpiece to be plated.In addition, the present invention is by be provided with engagement device in frame member, and its stop block can rotate rapidly to engagement or not engagement and be contained in the workpiece to be plated in accommodating area, is beneficial to the operation that picks and places of workpiece to be plated.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (12)
1. an Electroplating Rack, is suitable for temporarily locating workpiece to be plated and electroplating is spread and is handed to this workpiece to be plated, it is characterized in that, this Electroplating Rack comprises:
Electric-conductor;
Frame member, is assembled to this electric-conductor, has accommodating area and spacing zone, and wherein this accommodating area can hold this workpiece to be plated, and this spacing zone is located in this accommodating area;
Engagement device, is connected to this frame member, and can engagement be contained in this workpiece to be plated in this accommodating area, so that this workpiece to be plated is positioned in this accommodating area; And
Conductive pin, is electrically connected to this electric-conductor and extends in this spacing zone, and can be subject to the inflexible limit of this spacing zone and move along axis, is contained in this workpiece to be plated in this accommodating area with contact.
2. Electroplating Rack according to claim 1, is characterized in that, this engagement device comprises:
Stop block, is pivotally arranged on this frame member, being rotated to engagement or the position of this workpiece to be plated of engagement not with respect to this frame member.
3. Electroplating Rack according to claim 2, is characterized in that, this engagement device comprises:
Engagement spiral lock, has bar portion and connects the head of this bar portion one end, and this frame member has axis hole, and this engagement spiral lock secures to this stop block through this axis hole of this frame member, this stop block is pivotally arranged on to this frame member; And
Whisker, circle is around this bar portion and between this frame member and this head.
4. Electroplating Rack according to claim 3, is characterized in that, this frame member has fastening groove, and this stop block is embedded in this fastening groove and is positioned at the position of this workpiece to be plated of engagement, and this whisker forces this stop block to be embedded in this fastening groove.
5. Electroplating Rack according to claim 1, is characterized in that, the material of this conductive pin comprises titanium.
6. Electroplating Rack according to claim 1, it is characterized in that, this frame member comprises the first framework and the second framework, this first framework and this second framework are assembled in the two opposite sides of this electric-conductor and are parallel to each other in fact, this first framework and this second framework have respectively multiple accommodating areas assemble respectively multiple these engagement devices, and the orthographicprojection of those engagement devices that are connected to this first framework and this second framework in this first framework is not overlapping.
7. Electroplating Rack according to claim 1, is characterized in that, one end of this conductive pin is connected to this electric-conductor, and supports this workpiece to be plated by the elastic top of this conductive pin itself.
8. Electroplating Rack according to claim 1, is characterized in that, this conductive pin is L-shaped, and one end of this conductive pin is solidly connected to this electric-conductor, and the other end of this conductive pin supports this workpiece to be plated by the elastic top of this conductive pin itself.
9. Electroplating Rack according to claim 1, is characterized in that, also comprises:
Elastic component, is arranged between this frame member and this conductive pin, to force this workpiece to be plated of this conductive pin contact.
10. Electroplating Rack according to claim 1, is characterized in that, the perforation of this spacing zone for forming in this frame member, and this conductive pin is through this perforation and can be subject to the limitation of this perforation and move along this axis.
11. Electroplating Racks according to claim 1, is characterized in that, the part of extending on the horizontal plane perpendicular to gravity direction of this frame member has recess, to dwindle the region of causing accumulation of fluid in this frame member.
12. 1 kinds of Electroplating Racks, are suitable for temporarily locating workpiece to be plated and electroplating are spread and is handed to this workpiece to be plated, it is characterized in that, this Electroplating Rack comprises:
Electric-conductor;
Frame member, is assembled to this electric-conductor, has in order to the accommodating area of accommodating this workpiece and is positioned at the spacing zone of this accommodating area; And
Conductive pin, have and be electrically connected the first end of this electric-conductor and be subject to this spacing zone to arrest the second end of limit, this spacing fauna limits this second end in approaching or moving up away from the side that is contained in this workpiece to be plated in this accommodating area, and is resisted against the surface of this workpiece to be plated with this second end.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261732647P | 2012-12-03 | 2012-12-03 | |
| US61/732,647 | 2012-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103849921A true CN103849921A (en) | 2014-06-11 |
| CN103849921B CN103849921B (en) | 2016-08-17 |
Family
ID=50858035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310537571.4A Active CN103849921B (en) | 2012-12-03 | 2013-11-04 | electroplating rack |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103849921B (en) |
| TW (1) | TWI532885B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102041545A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Plating hanger |
| CN102041544A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Automatical opening/closing type plating hanger |
-
2013
- 2013-09-17 TW TW102133721A patent/TWI532885B/en active
- 2013-11-04 CN CN201310537571.4A patent/CN103849921B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102041545A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Plating hanger |
| CN102041544A (en) * | 2010-12-29 | 2011-05-04 | 佳辉设备(东莞)有限公司 | Automatical opening/closing type plating hanger |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103849921B (en) | 2016-08-17 |
| TWI532885B (en) | 2016-05-11 |
| TW201422853A (en) | 2014-06-16 |
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