CN103849909B - A kind of surface has the preparation method of reeded phosphorous copper balls - Google Patents
A kind of surface has the preparation method of reeded phosphorous copper balls Download PDFInfo
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- CN103849909B CN103849909B CN201410065553.5A CN201410065553A CN103849909B CN 103849909 B CN103849909 B CN 103849909B CN 201410065553 A CN201410065553 A CN 201410065553A CN 103849909 B CN103849909 B CN 103849909B
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- copper
- copper balls
- phosphorous copper
- phosphorous
- phosphor
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Abstract
The invention discloses a kind of surface and have the preparation method of reeded phosphorous copper balls, described phosphorous copper balls includes that phosphorous copper balls body, the groove being disposed on described phosphorous copper balls body surface, the trench bottom of described groove are 1 ~ 3mm with the difference in height on the surface of described phosphorous copper balls body.Compared with and phosphorous copper balls that smooth surface is smooth solid with existing, the surface that the present invention provides has reeded phosphorous copper balls, and to have surface area big, can bear electric current bigger, and it is many to release copper ion during plating, and utilization rate is high.
Description
Technical field
The present invention relates to a kind of surface for plating and have reeded phosphorous copper balls and preparation method thereof.
Background technology
Anodic phosphorous copper balls is the main plated material in copper-plating technique, is the root of copper ion generation.The phosphor-copper of existing plating
The phosphorous copper balls that the preparation method of ball is prepared is all the phosphorous copper balls of solid shape, and the smooth surface of phosphorous copper balls is smooth.This surface
Easily there is problems with when plating uses in smooth phosphorous copper balls: 1, phosphorous copper balls surface area is fixed, and can only have fixing copper
Ion discharges from the surface of phosphorous copper balls；Phosphorus film is generated because of the phosphorus of each several part due to each several part of phosphorous copper balls when 2, just beginning to use
Content is different, and the phosphorus film of generation has dividing of speed；3, the phosphorous copper balls that surface area is fixing, owing to use at the beginning needs the most false plating,
Make phosphorous copper balls produce phosphorus film uniformly, therefore the copper ion used in advance need to be wasted；When 4, big electric current being used, due to phosphorous copper balls table
Area is fixed, and can only select the copper ball that surface area is bigger, therefore phosphorous copper balls uses and becomes large-sized；5, owing to being solid and surfacing
Smooth phosphorous copper balls, its heavier mass, relatively costly.
Summary of the invention
It is an object of the invention to overcome the defect of prior art, it is provided that a kind of surface for plating has reeded phosphorous copper balls.
The present invention also provides for a kind of surface simultaneously and has the preparation method of reeded phosphorous copper balls.
For solving above technical problem, technical scheme is as follows:
A kind of surface has reeded phosphorous copper balls, and including phosphorous copper balls body, described phosphorous copper balls also includes being disposed on described phosphor-copper
Groove on ball body surface, the trench bottom of described groove is 1～3mm with the difference in height on the surface of described phosphorous copper balls body.
Described groove is arranged on the whole surface of described phosphorous copper balls body evenly distributedly.
Described groove is hemispherical, and the centre of sphere of all described grooves is all on same sphere.
A kind of above-mentioned surface has the preparation method of reeded phosphorous copper balls, and described preparation method comprises the following steps:
(1) using intermediate frequency induction heating device heating P-Cu mother alloy and copper raw material, dissolve stirring, the mass content obtaining phosphorus is
The phosphor-copper solution of 0.025%～0.065%, the temperature of described phosphor-copper solution is maintained at 1030 DEG C～1500 DEG C；
(2) phosphor-copper solution step (1) prepared produces the phosphor-copper bar of a diameter of 10～50mm through up-drawing method, by phosphorus
Copper bar stripping and slicing obtains phosphor-copper block base；
(3) the phosphor-copper block base that step (2) prepares is put into punching press in diel and obtains phosphorous copper balls base；
(4) the phosphorous copper balls base that step (3) prepares is polished, deburring, cleaning and drying and processing, obtain phosphor-copper
Ball；
The diel used in described step (3) includes the first mould and the second mould, described first mould and described second mould
Tool is respectively equipped with corresponding hemi-spherical cavities, when described first mould is together with described second die assembly, described in two
Hemi-spherical cavities collectively forms a complete spherical hollow space, is arranged at intervals with lobe, described projection in described cavity surface
The top in portion is 1～3mm with the difference in height of described cavity surface.
In step (1), described copper raw material is cathode copper or purity is the bright copper of 99.99%.
Described lobe is arranged on described cavity surface evenly distributedly.
Described lobe is hemispherical, and the centre of sphere of all described lobe is all on same sphere.
Due to the enforcement of technique scheme, the present invention compared with prior art has the advantage that
The preparation method technique of the present invention is simple, uses the phosphorous copper balls that the preparation method of the present invention prepares, the surface of phosphorous copper balls
Being uniformly distributed fluted, the existence of groove can be greatly increased the external surface area of phosphorous copper balls, under equal bulb diameter, compares existing
Solid and that smooth surface is smooth phosphorous copper balls there is bigger surface area, copper ion can simultaneously from groove surfaces and phosphorous copper balls this
Surface releases copper ion simultaneously, so the copper ion released under identical conditions is many so that can bear circulating current bigger, can contract
The time of short plating, and the utilization rate of interdependent phosphorous copper balls is all high than existing phosphorous copper balls, so the profit of the phosphorous copper balls of the present invention
Higher by rate, electroplating time needed for workpiece can be reduced, and the surface reeded phosphorous copper balls of tool is compared existing phosphorous copper balls and also had matter
The advantage that amount is lighter, cost is lower.
Accompanying drawing explanation
Fig. 1 is the cross-sectional schematic of the phosphorous copper balls of the present invention；
In figure: 1, phosphorous copper balls body；10, groove；
Fig. 2 is the schematic diagram of the diel used in preparation method of the present invention；
In figure: 2, diel；20, the first mould；21, the second mould；22, cavity；23, lobe.
Detailed description of the invention
Below in conjunction with Figure of description and embodiment, the detailed description of the invention of the present invention is illustrated.
The surface of the present embodiment has reeded phosphorous copper balls, as it is shown in figure 1, it includes phosphorous copper balls body 1 and is disposed on phosphorus
The groove 10 on copper ball body 1 surface, groove 10 is evenly distributed in the whole surface of phosphorous copper balls body 1, is shaped as hemispherical,
And fluted 10 the centre of sphere all on same sphere.
The preparation method that above-mentioned surface has reeded phosphorous copper balls is as follows:
Copper raw material selects cathode copper or the bright copper of copper content 99.99%, and the phosphorous mass content of phosphorus material choice is the phosphorus of 5～15%
Copper foundry alloy, specifically includes following steps:
(1) using intermediate frequency induction heating device heating P-Cu mother alloy and copper raw material, dissolve stirring, the mass content obtaining phosphorus is
The phosphor-copper solution of 0.025%～0.065%, the temperature of described phosphor-copper solution is maintained at 1030 DEG C～1500 DEG C；
(2) phosphor-copper solution step (1) prepared produces the phosphor-copper bar of a diameter of 10～50mm through up-drawing method, by phosphorus
Copper bar stripping and slicing obtains phosphor-copper block base；
(3) the phosphor-copper block base that step (2) prepares is put into punching press in diel and obtains phosphorous copper balls base；
(4) the phosphorous copper balls base that step (3) prepares is polished, deburring, cleaning and drying and processing, obtain phosphor-copper
Ball；
As shown in Figure 2, it includes the first mould 20 and the second mould 21 in the diel 2 used in above-mentioned steps (3),
First mould 20 and the second mould 21 are respectively equipped with corresponding hemi-spherical cavities 22, when the first mould 20 and the second mould 21
When combining, two hemi-spherical cavities 22 collectively form a complete spherical hollow space, be spaced and set on cavity 22 surface
Being equipped with lobe 23, the top of lobe 23 is 1～3mm with the difference in height on cavity 22 surface.Lobe 23 is evenly distributedly
Being arranged on cavity 22 surface, and lobe 23 is hemispherical, the centre of sphere of all lobe 23 is all on same sphere.
The size of the phosphorous copper balls body 1 that the surface of the present invention has reeded phosphorous copper balls can produce, as required as selected
For arbitrary size in 10mm～70mm.
For example with the surface reeded phosphorous copper balls of tool of a diameter of 25mm that the method for the present invention is prepared, and by this surface
Have the reeded phosphorous copper balls phosphorous copper balls smooth with the existing solid surface of same diameter to be simultaneously used for electroplating (wherein, table
Groove radius on the reeded phosphorous copper balls of mask is 2mm), after using 72 hours, its result is as follows:
The phosphorous copper balls of the smooth a diameter of 25mm of the most solid and smooth surface: do not use front weight 73.5g, uses electric current density 3A,
Minus plate 16g, after using 72 hours, copper ball diameter 22mm, use rear weight 45g, minus plate weight 45g.
2. surface has reeded phosphorous copper balls: do not use front weight 70g, uses electric current density 3A, minus plate 16g, uses 72
After hour, copper ball diameter 20mm, use rear weight 40g, minus plate weight 48g.
The above results is it can be seen that surface has reeded phosphorous copper balls due to the surface area of the phosphorous copper balls more smooth than solid surface
Big advantage, in plating performance, the speed discharging copper ion is fast.
Above the present invention is described in detail, its object is to allow the personage being familiar with this art will appreciate that the present invention's
Content is also carried out, and can not limit the scope of the invention with this, and the invention is not restricted to the embodiments described, all
The equivalence change made according to the spirit of the present invention or modification, all should contain within protection scope of the present invention.
Claims (1)
1. the preparation method of the surface reeded phosphorous copper balls of tool, described phosphorous copper balls includes phosphorous copper balls body and is disposed on the groove on described phosphorous copper balls body surface, the trench bottom of described groove is 1 ~ 3mm with the difference in height on the surface of described phosphorous copper balls body, described groove is hemispherical, and the centre of sphere of all described grooves is all on same sphere；It is characterized in that, it comprises the following steps:
(1) using intermediate frequency induction heating device heating P-Cu mother alloy and copper raw material, dissolve stirring, obtain the phosphor-copper solution that mass content is 0.025% ~ 0.065% of phosphorus, the temperature of described phosphor-copper solution is maintained at 1030 DEG C ~ 1500 DEG C；
(2) phosphor-copper solution step (1) prepared produces the phosphor-copper bar of a diameter of 10 ~ 50mm through up-drawing method, and phosphor-copper bar stripping and slicing is obtained phosphor-copper block base；
(3) the phosphor-copper block base that step (2) prepares is put into punching press in diel and obtains phosphorous copper balls base；
(4) the phosphorous copper balls base that step (3) prepares is polished, deburring, cleaning and drying and processing, obtain phosphorous copper balls；
The diel used in described step (3) includes the first mould and the second mould, described first mould and described second mould are respectively equipped with corresponding hemi-spherical cavities, when described first mould is together with described second die assembly, two described hemi-spherical cavities collectively form a complete spherical hollow space, being arranged at intervals with lobe in described cavity surface, the top of described lobe is 1 ~ 3mm with the difference in height of described cavity surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410065553.5A CN103849909B (en) | 2014-02-26 | 2014-02-26 | A kind of surface has the preparation method of reeded phosphorous copper balls |
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| CN201410065553.5A CN103849909B (en) | 2014-02-26 | 2014-02-26 | A kind of surface has the preparation method of reeded phosphorous copper balls |
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| CN103849909A CN103849909A (en) | 2014-06-11 |
| CN103849909B true CN103849909B (en) | 2017-01-04 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104846419B (en) * | 2015-05-06 | 2017-10-13 | 江苏金奕达铜业股份有限公司 | A kind of copper ball and preparation method thereof |
| CN107557847B (en) * | 2017-08-21 | 2019-05-21 | 东又悦（苏州）电子科技新材料有限公司 | A kind of preparation method that copper ball is electroplated |
| CN110153642A (en) * | 2018-04-01 | 2019-08-23 | 江西江南新材料科技有限公司 | A kind of phosphorous copper balls and its processing method |
| CN108374193A (en) * | 2018-04-04 | 2018-08-07 | 鹰潭江南铜业有限公司 | A kind of phosphorous copper balls and its processing method with flash plate |
| CN108411353A (en) * | 2018-04-04 | 2018-08-17 | 鹰潭江南铜业有限公司 | A kind of galvanic anode phosphorous copper balls and preparation method thereof |
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| CN101698271A (en) * | 2009-10-12 | 2010-04-28 | 東又悦（蘇州）電子科技新材料有限公司 | Method for processing high-efficiency high-density phosphorus copper balls |
| CN101914801A (en) * | 2010-08-24 | 2010-12-15 | 胜华电子（惠阳）有限公司 | Anodic phosphorous copper balls and preparation method thereof |
| CN102383174A (en) * | 2010-09-01 | 2012-03-21 | 中芯国际集成电路制造(上海)有限公司 | Electroplating anode |
| CN102615482A (en) * | 2012-04-20 | 2012-08-01 | 铜陵有色股份铜冠电工有限公司 | Production method of oversized-diameter anode phosphorus copper ball |
| CN203700557U (en) * | 2014-02-26 | 2014-07-09 | 东又悦（苏州）电子科技新材料有限公司 | Phosphor copper ball with grooves in surface |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4123330B2 (en) * | 2001-03-13 | 2008-07-23 | 三菱マテリアル株式会社 | Phosphorus copper anode for electroplating |
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2014
- 2014-02-26 CN CN201410065553.5A patent/CN103849909B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101698271A (en) * | 2009-10-12 | 2010-04-28 | 東又悦（蘇州）電子科技新材料有限公司 | Method for processing high-efficiency high-density phosphorus copper balls |
| CN101914801A (en) * | 2010-08-24 | 2010-12-15 | 胜华电子（惠阳）有限公司 | Anodic phosphorous copper balls and preparation method thereof |
| CN102383174A (en) * | 2010-09-01 | 2012-03-21 | 中芯国际集成电路制造(上海)有限公司 | Electroplating anode |
| CN102615482A (en) * | 2012-04-20 | 2012-08-01 | 铜陵有色股份铜冠电工有限公司 | Production method of oversized-diameter anode phosphorus copper ball |
| CN203700557U (en) * | 2014-02-26 | 2014-07-09 | 东又悦（苏州）电子科技新材料有限公司 | Phosphor copper ball with grooves in surface |
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| CN103849909A (en) | 2014-06-11 |
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