CN103847192A - High-strength composite charge eliminating flat wire - Google Patents
High-strength composite charge eliminating flat wire Download PDFInfo
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- CN103847192A CN103847192A CN201410080536.9A CN201410080536A CN103847192A CN 103847192 A CN103847192 A CN 103847192A CN 201410080536 A CN201410080536 A CN 201410080536A CN 103847192 A CN103847192 A CN 103847192A
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- charge eliminating
- disappears
- flat wire
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Abstract
The invention discloses a novel composite charge eliminating flat wire which can synchronously meet the requirements on charge elimination and tensile strength and is used for manufacturing a Type-D conductive container bag. The novel composite charge eliminating flat wire mainly comprises a charge eliminating flat wire body composed of a PP (Polypropylene) enhanced layer. The novel composite charge eliminating flat wire is characterized in that two bonding layers stuck to PP charge eliminating layers covering two faces of the PP enhanced layer are arranged on the two faces of the PP enhanced layer, respectively; each bonding layer is coextruded between the PP enhanced layer and the corresponding PP charge eliminating layer; the PP enhanced layer is made from polypropylene. The bonding layers are made from vinyl acetate grafting materials. The PP charge eliminating layers are made from polypropylene permanent macromolecular static modified materials. Each of the two faces of the PP enhanced layer is provided with the bonding layer in a co-extruding manner and is stuck with the PP charge eliminating layer so that the composite charge eliminating flat wire has the properties of good charge elimination and high strength, and further meets the technical requirements on Type-D conduction of the conductive flexible container bag.
Description
Technical field:
The present invention relates to the material of preparing of flexible container bag, particularly the compound electric flat filament that disappears of high strength in a kind of Type-D of being applied in type compliant conductive container bag preparation.
Background technology:
As everyone knows, the electric flat filament that disappears is for flexible container bag, is used for making the indispensable material of Type-D type conductive bulk container, and the electrostatic charge that it is used for conduction generation, plays safe protective effect.Conventionally this product technology electric flat filament sheet resistance that requires to disappear is stabilized in 10
6-8Ω, monofilament grammes per square metre is less than 1600D (danier) and could meets the requirement of function.
But this product is all to rely on external import at present, because frosting resistance is 10
6-8Ω is the most rambunctious, and general domestic factory can only be controlled at: or exceed 10
9Ω, reaches antistatic requirement or is less than 10
6Ω, reaches the requirement of conduction, and will be controlled at 10
6-8Ω, need the antistatic material of permanent high score to solve, and this part material and Compatibility in Plastics is very poor, and can has a strong impact on the hot strength of monofilament.
Summary of the invention:
The object of the invention is to overcome above-mentioned deficiency, provide a kind of can meet simultaneously disappear electricity and hot strength for making the NEW TYPE OF COMPOSITE of the Type-D type conductive bulk container electric flat filament that disappears.This is compound disappears electric flat filament utilization at the every one side in the two sides of PP enhancement layer co-extrusion adhesive layer and adhere to the PP electricity layer that disappears and the whole compound electric flat filament that disappears is possessed disappear electricity good respectively, the characteristic that intensity is high, meets conductive flexible container bag Type-D type conduction technical requirement then.
Concrete technical scheme of the present invention is as follows:
A kind of high-intensity compound electric flat filament that disappears, mainly comprises the electric flat filament body that disappears being made up of PP enhancement layer, it is characterized in that, two aspects of described PP enhancement layer are respectively equipped with the disappear adhesive layer of electricity layer of a PP who is used for outside the bonding PP of covering enhancement layer two aspects respectively; Described each adhesive layer respectively co-extrusion disappears between electricity layer in PP enhancement layer and PP.
In such scheme, the material that described PP enhancement layer adopts is polypropylene.
In such scheme, the material that described adhesive layer adopts is vinylacetate grafted material.
In such scheme, the described PP material that electricity layer adopts that disappears is the permanent macromolecule static of polypropylene modified materials.
The beneficial effect of compound antistatic wire of the present invention is as follows:
Because this compound antistatic wire is made up of five tunic stacks, by having complementary functions between different plastic layers, improve combination property.Wherein, the top layer of flat filament adopts PP to disappear electric layer, and the electricity that disappears is effective, meets the electric requirement that disappears; Meanwhile, as core layer, adopted PP enhancement layer, intensity high (hot strength > 40N/ root), can increase flat filament intensity, meets and produces weaving process; And co-extrusion is at the two-layer adhesive layer on PP enhancement layer two sides, the bad material of adjacent two kinds of compatibilities can be well bonded together, be difficult for delamination, be easy to MULTILAYER COMPOSITE.
In sum, compound antistatic wire of the present invention, the electricity that disappears is good, and intensity is high, meets conductive flexible container bag Type-D type conduction technical requirement, and the electric flat filament sheet resistance that disappears is stabilized in 10
6-8Ω, monofilament grammes per square metre is less than 1600D (danier).
Accompanying drawing explanation:
Further illustrate the present invention below in conjunction with the drawings and specific embodiments.
Fig. 1 is the compound electric flat filament cross-sectional view in an embodiment that disappears of the present invention.
The specific embodiment:
For technological means, creation characteristic that the present invention is realized, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the present invention.
As shown in Figure 1, the high-intensity compound electric flat filament that disappears of the present invention is five-layer co-squeezing conductive filament, in actual fabrication process, become five layers of composite construction, wherein with PP enhancement layer for the main body of electric flat filament that disappears, be respectively equipped with the disappear adhesive layer of electricity layer of a PP who is used for outside the bonding PP of covering enhancement layer two aspects respectively in two aspects of this PP enhancement layer, each adhesive layer respectively co-extrusion between PP enhancement layer and PP disappear electricity layer.Shown in figure, be followed successively by PP electricity layer 1, the first adhesive layer 2, PP enhancement layer 3, the second adhesive layer 4, the 2nd PP electricity layer 5 that disappears that disappears from top to bottom.
It is pointed out that the material adopting in the whole compound electric flat filament that disappears is polypropylene.The material that the first adhesive layer and the second adhesive layer adopt is all vinylacetate grafted material.The one PP the disappear material of electricity layer employing of electricity layer and the 2nd PP that disappears is the permanent macromolecule static of polypropylene modified materials.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and description, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. the high-intensity compound electric flat filament that disappears, mainly comprise the electric flat filament body that disappears being formed by PP enhancement layer, it is characterized in that, two aspects of described PP enhancement layer are respectively equipped with the disappear adhesive layer of electricity layer of a PP who is used for outside the bonding PP of covering enhancement layer two aspects respectively; Described each adhesive layer respectively co-extrusion disappears between electricity layer in PP enhancement layer and PP.
2. according to the high-intensity compound electric flat filament that disappears of claim 1, it is characterized in that, the material that described PP enhancement layer adopts is polypropylene.
3. according to the high-intensity compound electric flat filament that disappears of claim 1, it is characterized in that, the material that described adhesive layer adopts is vinylacetate grafted material.
4. according to the high-intensity compound electric flat filament that disappears of claim 1, it is characterized in that, the described PP material that electricity layer adopts that disappears is the permanent macromolecule static of polypropylene modified materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410080536.9A CN103847192A (en) | 2014-03-03 | 2014-03-03 | High-strength composite charge eliminating flat wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410080536.9A CN103847192A (en) | 2014-03-03 | 2014-03-03 | High-strength composite charge eliminating flat wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103847192A true CN103847192A (en) | 2014-06-11 |
Family
ID=50855540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410080536.9A Pending CN103847192A (en) | 2014-03-03 | 2014-03-03 | High-strength composite charge eliminating flat wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103847192A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181914A (en) * | 2019-05-31 | 2019-08-30 | 无锡商业职业技术学院 | A kind of multimedia projector foam strip and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201520085U (en) * | 2009-11-02 | 2010-07-07 | 王天坤 | Anti-static dampproof film |
| CN202169732U (en) * | 2011-07-18 | 2012-03-21 | 石狮市炎英塑胶制品有限公司 | Antistatic packaging film |
| CN103087391A (en) * | 2013-03-11 | 2013-05-08 | 河南理工大学 | Antistatic polymer blending composition |
-
2014
- 2014-03-03 CN CN201410080536.9A patent/CN103847192A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201520085U (en) * | 2009-11-02 | 2010-07-07 | 王天坤 | Anti-static dampproof film |
| CN202169732U (en) * | 2011-07-18 | 2012-03-21 | 石狮市炎英塑胶制品有限公司 | Antistatic packaging film |
| CN103087391A (en) * | 2013-03-11 | 2013-05-08 | 河南理工大学 | Antistatic polymer blending composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181914A (en) * | 2019-05-31 | 2019-08-30 | 无锡商业职业技术学院 | A kind of multimedia projector foam strip and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140611 |