Summary of the invention
The present invention will solve current Electronic Packaging field without 565 ℃~585 ℃ temperature range solders and the low problem of weld strength, and a kind of preparation method of silver-base solder of soldering high-volume fractional silicon-carbide particle reinforced aluminium-base composite material is provided.
A kind of preparation method of silver-base solder of soldering high-volume fractional silicon-carbide particle reinforced aluminium-base composite material completes according to the following steps:
One, take raw material by mass percent 45~50%Ag, 16~20%Cu, 16~20%In, 15~18%Sn and 0.5~1.5%Ti;
Two, 45~50%Ag step 1 being taken and 16~20%Cu are placed in high-frequency induction vacuum melting furnace, be 1Pa in vacuum, smelting temperature is melting 15min~20min under the condition of 1350 ℃, after air cooling, obtain Ag-Cu intermediate alloy, by Ag-Cu intermediate alloy in two, obtain Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B, and the mass ratio of described Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B is 1:1;
Three, the Ag-Cu intermediate alloy A, 16~20%In and the 15~18%Sn that step 1 takes that in high-frequency induction vacuum melting furnace, add step 2 to obtain, be 1Pa in vacuum, smelting temperature is melting 5min~10min under the condition of 850 ℃, obtains Ag-Cu-In-Sn alloy after air cooling;
Four, then the Ag-Cu intermediate alloy B and the 0.5~1.5%Ti that in vacuum non-consumable electric arc smelting furnace, add step 2 to obtain are 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.04MPa~-0.02MPa, is melting 5min~10min under the condition of 1750 ℃ at smelting temperature, obtains Ag-Cu-Ti intermediate alloy after air cooling;
Five, then the Ag-Cu-Ti intermediate alloy that adds Ag-Cu-In-Sn alloy that step 3 obtains and step 4 to obtain in vacuum non-consumable electric arc smelting furnace is 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.04MPa~-0.02MPa, is melting 5min~10min under the condition of 1750 ℃ at smelting temperature, obtains the Ag-Cu-In-Sn-Ti alloying pellet mixing after air cooling;
Six, adopt emery wheel to polish to the Ag-Cu-In-Sn-Ti alloying pellet mixing, remove the oxide layer on Ag-Cu-In-Sn-Ti alloying pellet surface, then by Mechanical Method, the Ag-Cu-In-Sn-Ti alloying pellet after polishing is broken into the Ag-Cu-In-Sn-Ti alloy block that size is less than 30mm;
Cracking in the bottom of the quartz test tube that is seven, 30mm to internal diameter, stitches wide 0.4mm, and the Ag-Cu-In-Sn-Ti alloy block that then size is less than to 30mm is put into the quartz ampoule cracking in bottom, obtains being equipped with the quartz ampoule of Ag-Cu-In-Sn-Ti alloy fragment;
Eight, the quartz ampoule that Ag-Cu-In-Sn-Ti alloy fragment is housed is put into the heat induced coil getting rid of with machine, then getting rid of band machine inner chamber, to be evacuated to absolute pressure be 4 × 10
-3pa, then be filled with high-purity argon gas to getting rid of band machine inner chamber relative pressure for-0.07MPa~-0.04MPa;
Nine, get rid of the heat induced coil electricity with machine, in the time that the Ag-Cu-In-Sn-Ti alloy fragment in quartz ampoule is heated to molten condition, open the air accumulator getting rid of with machine, under take relative pressure as-0.05MPa~-0.02MPa, pass into argon gas to quartz ampoule, utilize argon gas that the solder of molten condition is blown out from gap, quartz ampoule bottom, being splashed to rotating speed is on the copper roller of 20m/s~40m/s, and throwing away thickness is the strip of 30 μ m~80 μ m, can obtain silver-base solder after cooling.
Advantage of the present invention: one, the invention provides a kind of high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self connection and the Novel silver-based solder with kovar alloy dissimilar material solder brazing thereof, further to improve joint quality, this kind of solder also expanded the scope of application of solder to mother metal kind simultaneously, and simplifies soldering processes; The silver-base solder of preparation is Ag47-Cu18-In17-Sn17-Ti1 solder, and its solidus is that 475 ℃, liquidus curve are 530 ℃.The matrix of welded composite can be not only A356 aluminium alloy but also can be 6063 aluminium alloys that contain more magnesium and a certain amount of silicon; Not only be applicable to the connection between high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self, be also applicable to being connected between high-volume fractional silicon-carbide particle reinforced aluminium-base composite material and kovar alloy; And compared with patent Zl200910073339-3, silver-base solder not with kovar alloy generation chemical reaction production fragility phase, heating temperature wide ranges is 565 ℃~585 ℃, more than being used in mother metal solidus; Compared with patent Zl200910073340-6, do not need weldering front in composite material surface nickel plating, need to be at solder coating on both sides brazing flux when welding yet, the resistance to corrosion of zinc-based solder weld seam is not as silver-base solder in addition.
Two, adopt vacuum to get rid of band legal system and make silver-based material, though for routine techniques means never people utilize vacuum to get rid of the solder of making soldering enhancing aluminum-base composite material by silicon carbide particles with legal system, and good silver-base solder has great difficulty to get rid of into plasticity, the one, material composition, the 2nd, the requirement of solder fusion process is strict, the 3rd, belt-rejecting technology parameter complexity, influence factor is a lot, the present invention is from the theoretical Scientific Establishment solder composition that combines with experiment, the strict solder smelting process of controlling, optimize foil-shaped brazing material and get rid of band parameter, successfully prepare the silver-base solder that soldering high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self connects and is connected with kovar alloy.
The specific embodiment
The specific embodiment one: present embodiment is that a kind of preparation method of silver-base solder of soldering high-volume fractional silicon-carbide particle reinforced aluminium-base composite material completes according to the following steps:
One, take raw material by mass percent 45~50%Ag, 16~20%Cu, 16~20%In, 15~18%Sn and 0.5~1.5%Ti; The purity of described Ag, Cu, In, Sn and Ti is greater than 99%;
Two, 45~50%Ag step 1 being taken and 16~20%Cu are placed in high-frequency induction vacuum melting furnace, be 1Pa in vacuum, smelting temperature is melting 15min~20min under the condition of 1350 ℃, after air cooling, obtain Ag-Cu intermediate alloy, by Ag-Cu intermediate alloy in two, obtain Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B, and the mass ratio of described Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B is 1:1;
Three, the Ag-Cu intermediate alloy A, 16~20%In and the 15~18%Sn that step 1 takes that in high-frequency induction vacuum melting furnace, add step 2 to obtain, be 1Pa in vacuum, smelting temperature is melting 5min~10min under the condition of 850 ℃, obtains Ag-Cu-In-Sn alloy after air cooling;
Four, then the Ag-Cu intermediate alloy B and the 0.5~1.5%Ti that in vacuum non-consumable electric arc smelting furnace, add step 2 to obtain are 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.04MPa~-0.02MPa, is melting 5min~10min under the condition of 1750 ℃ at smelting temperature, obtains Ag-Cu-Ti intermediate alloy after air cooling;
Five, then the Ag-Cu-Ti intermediate alloy that adds Ag-Cu-In-Sn alloy that step 3 obtains and step 4 to obtain in vacuum non-consumable electric arc smelting furnace is 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.04MPa~-0.02MPa, is melting 5min~10min under the condition of 1750 ℃ at smelting temperature, obtains the Ag-Cu-In-Sn-Ti alloying pellet mixing after air cooling;
Six, adopt emery wheel to polish to the Ag-Cu-In-Sn-Ti alloying pellet mixing, remove the oxide layer on Ag-Cu-In-Sn-Ti alloying pellet surface, then by Mechanical Method, the Ag-Cu-In-Sn-Ti alloying pellet after polishing is broken into the Ag-Cu-In-Sn-Ti alloy block that size is less than 30mm;
Cracking in the bottom of the quartz test tube that is seven, 30mm to internal diameter, stitches wide 0.4mm, and the Ag-Cu-In-Sn-Ti alloy block that then size is less than to 30mm is put into the quartz ampoule cracking in bottom, obtains being equipped with the quartz ampoule of Ag-Cu-In-Sn-Ti alloy fragment;
Eight, the quartz ampoule that Ag-Cu-In-Sn-Ti alloy fragment is housed is put into the heat induced coil getting rid of with machine, then getting rid of band machine inner chamber, to be evacuated to absolute pressure be 4 × 10
-3pa, then be filled with high-purity argon gas to getting rid of band machine inner chamber relative pressure for-0.07MPa~-0.04MPa;
Nine, get rid of the heat induced coil electricity with machine, in the time that the Ag-Cu-In-Sn-Ti alloy fragment in quartz ampoule is heated to molten condition, open the air accumulator getting rid of with machine, under take relative pressure as-0.05MPa~-0.02MPa, pass into argon gas to quartz ampoule, utilize argon gas that the solder of molten condition is blown out from gap, quartz ampoule bottom, being splashed to rotating speed is on the copper roller of 20m/s~40m/s, and throwing away thickness is the strip of 30 μ m~80 μ m, can obtain silver-base solder after cooling.
Present embodiment provides a kind of high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self connection and the Novel silver-based solder with kovar alloy dissimilar material solder brazing thereof, further to improve joint quality, this kind of solder also expanded the scope of application of solder to mother metal kind simultaneously, and simplifies soldering processes; The silver-base solder of preparation is Ag47-Cu18-In17-Sn17-Ti1 solder, and its solidus is that 475 ℃, liquidus curve are 530 ℃.The matrix of welded composite can be not only A356 aluminium alloy but also can be 6063 aluminium alloys that contain more magnesium and a certain amount of silicon; Not only be applicable to the connection between high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self, be also applicable to being connected between high-volume fractional silicon-carbide particle reinforced aluminium-base composite material and kovar alloy; And compared with patent Zl200910073339-3, silver-base solder not with kovar alloy generation chemical reaction production fragility phase, heating temperature wide ranges is 565 ℃~585 ℃, more than being used in mother metal solidus; Compared with patent Zl200910073340-6, do not need weldering front in composite material surface nickel plating, need to be at solder coating on both sides brazing flux when welding yet, the resistance to corrosion of zinc-based solder weld seam is not as silver-base solder in addition.
In present embodiment, adopt vacuum to get rid of band legal system and make silver-based material, though for routine techniques means never people utilize vacuum to get rid of the solder of making soldering enhancing aluminum-base composite material by silicon carbide particles with legal system, and good silver-base solder has great difficulty to get rid of into plasticity, the one, material composition, the 2nd, the requirement of solder fusion process is strict, the 3rd, belt-rejecting technology parameter complexity, influence factor is a lot, present embodiment is from the theoretical Scientific Establishment solder composition that combines with experiment, the strict solder smelting process of controlling, optimize foil-shaped brazing material and get rid of band parameter, successfully prepare the silver-base solder that soldering high-volume fractional silicon-carbide particle reinforced aluminium-base composite material self connects and is connected with kovar alloy.
The specific embodiment two: present embodiment is different from the specific embodiment one: step 1 takes raw material by mass percent 46%Ag, 19%Cu, 18%In, 16%Sn and 1%Ti.Other are identical with the specific embodiment one.
The specific embodiment three: present embodiment is different from the specific embodiment one or two: step 1 takes raw material by mass percent 48%Ag, 17%Cu, 16%In, 18%Sn and 1%Ti.Other are identical with the specific embodiment one or two.
The specific embodiment four: present embodiment is different from the specific embodiment one to three: step 1 takes raw material by mass percent 47%Ag, 18%Cu, 17%In, 17%Sn and 1%Ti.Other are identical with the specific embodiment one to three.
The specific embodiment five: present embodiment is different from one of specific embodiment one to four: step 1 takes raw material by mass percent 47.5%Ag, 17.5%Cu, 18%In, 16%Sn and 1%Ti.Other are identical with one of specific embodiment one to four.
The specific embodiment six: present embodiment is different from one of specific embodiment one to five: step 1 takes raw material by mass percent 50%Ag, 16%Cu, 16%In, 17%Sn and 1%Ti.Other are identical with one of specific embodiment one to five.
The specific embodiment seven: present embodiment is different from one of specific embodiment one to six: step 5 is filled with high-purity argon gas to vacuum chamber relative pressure and is-0.03MPa.Other are identical with one of specific embodiment one to six.
The specific embodiment eight: present embodiment is different from one of specific embodiment one to seven: step 8 is filled with high-purity argon gas and to getting rid of band machine inner chamber relative pressure is-0.05MPa.Other are identical with one of specific embodiment one to seven.
The specific embodiment nine: present embodiment is different from one of specific embodiment one to eight: step 9 passes into argon gas to quartz ampoule under take relative pressure as-0.03MPa.Other are identical with one of specific embodiment one to eight.
The specific embodiment ten: present embodiment is different from one of specific embodiment one to nine: step 9 is splashed on the copper roller that rotating speed is 30m/s, throws away the strip that thickness is 50 μ m.Other are identical with one of specific embodiment one to nine.
Adopt following verification experimental verification effect of the present invention:
Test one: one, take raw material by mass percent 47%Ag, 18%Cu, 17%In, 17%Sn and 1%Ti;
Two, 47%Ag step 1 being taken and 18%Cu are placed in high-frequency induction vacuum melting furnace, be 1Pa in vacuum, smelting temperature is melting 20min under the condition of 1350 ℃, after air cooling, obtain Ag-Cu intermediate alloy, by Ag-Cu intermediate alloy in two, obtain Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B, and the mass ratio of described Ag-Cu intermediate alloy A and Ag-Cu intermediate alloy B is 1:1;
Three, the Ag-Cu intermediate alloy A, 17%In and the 17%Sn that step 1 takes that in high-frequency induction vacuum melting furnace, add step 2 to obtain, be 1Pa in vacuum, and smelting temperature is melting 10min under the condition of 850 ℃, obtains Ag-Cu-In-Sn alloy after air cooling;
Four, then the Ag-Cu intermediate alloy B and the 1%Ti that in vacuum non-consumable electric arc smelting furnace, add step 2 to obtain are 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.03MPa, is melting 10min under the condition of 1750 ℃ at smelting temperature, obtains Ag-Cu-Ti intermediate alloy after air cooling;
Five, then the Ag-Cu-Ti intermediate alloy that adds Ag-Cu-In-Sn alloy that step 3 obtains and step 4 to obtain in vacuum non-consumable electric arc smelting furnace is 4 × 10 by being evacuated to absolute pressure in vacuum chamber
-3pa, then to be filled with high-purity argon gas to vacuum chamber relative pressure be-0.03MPa, is melting 10min under the condition of 1750 ℃ at smelting temperature, obtains the Ag-Cu-In-Sn-Ti alloying pellet mixing after air cooling;
Six, adopt emery wheel to polish to the Ag-Cu-In-Sn-Ti alloying pellet mixing, remove the oxide layer on Ag-Cu-In-Sn-Ti alloying pellet surface, then by Mechanical Method, the Ag-Cu-In-Sn-Ti alloying pellet after polishing is broken into the Ag-Cu-In-Sn-Ti alloy block that size is less than 30mm;
Cracking in the bottom of the quartz test tube that is seven, 30mm to internal diameter, stitches wide 0.4mm, and the Ag-Cu-In-Sn-Ti alloy block that then size is less than to 30mm is put into the quartz ampoule cracking in bottom, obtains being equipped with the quartz ampoule of Ag-Cu-In-Sn-Ti alloy fragment;
Eight, the quartz ampoule that Ag-Cu-In-Sn-Ti alloy fragment is housed is put into the heat induced coil getting rid of with machine, then getting rid of band machine inner chamber, to be evacuated to absolute pressure be 4 × 10
-3pa, then be filled with high-purity argon gas to getting rid of band machine inner chamber relative pressure for-0.05MPa;
Nine, get rid of the heat induced coil electricity with machine, in the time that the Ag-Cu-In-Sn-Ti alloy fragment in quartz ampoule is heated to molten condition, open the air accumulator getting rid of with machine, under take relative pressure as-0.03MPa, pass into argon gas to quartz ampoule, utilize argon gas that the solder of molten condition is blown out from gap, quartz ampoule bottom, being splashed to rotating speed is on the copper roller of 30m/s, throws away the strip that thickness is 50 μ m, can obtain silver-base solder after cooling.
Be to be incubated 30min, soldering high volume fraction grain enhanced aluminum-base compound material (55%SiC under 585 ℃, the vacuum condition that is 10-3Pa by test one silver-base solder making in temperature
p/ 6063) with kovar alloy electronic package shell, shear strength can reach 97MPa, and leak rate is 10
-10pa.m
3/ s, meets sealing requirements.
Fig. 1 is the silver-base solder photo in kind that test one makes, and is within the scope of 20m/s~40m/s as can be seen from Figure 1 in copper roller surface rotational line speed, and the solder appearance forming obtaining under different rotating speeds is all good;
Fig. 2 is the microscopic appearance figure of test one silver-base solder making, and smooth surface, even, fine and close as can be seen from Figure 2 continuously, does not have the shortcoming such as bubble, assorted point.
Fig. 3 is the energy spectrum analysis figure of test one silver-base solder making, and table 1, for the test one silver-base solder element wt percentage making and atomicity percentage, can find out that from Fig. 3 and table 1 the silver-base solder percentage composition making is consistent with design data.
Table 1: the test one silver-base solder element wt percentage making and atomicity percentage
Element |
Mass percent |
Atomic percent |
AgL |
46.90 |
42.22 |
InL |
18.28 |
15.46 |
SnL |
15.84 |
12.96 |
TiK |
00.67 |
01.35 |
CuK |
18.32 |
28.01 |
Fig. 4 is the dsc analysis curve map of test one silver-base solder making, and the silver-base solder solid-liquid phase line making is as can be seen from Figure 4 respectively 475 ℃ and 530 ℃.