CN103831547A - 一种新型助焊剂 - Google Patents

一种新型助焊剂 Download PDF

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Publication number
CN103831547A
CN103831547A CN201210492720.5A CN201210492720A CN103831547A CN 103831547 A CN103831547 A CN 103831547A CN 201210492720 A CN201210492720 A CN 201210492720A CN 103831547 A CN103831547 A CN 103831547A
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Prior art keywords
soldering flux
novel soldering
scaling powder
acid
ether
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CN103831547B (zh
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夏杰
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KUNSHAN TAROKO ELECTRONIC MATERIAL TECHNOLOGY Co Ltd
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KUNSHAN TAROKO ELECTRONIC MATERIAL TECHNOLOGY Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

本发明公开了一种新型助焊剂，包括如下成分：丁二酸、丙二酸、水杨酸、三乙醇胺、苯骈三氮唑、三羟基硬脂酸三甘油酯、油醇聚氯乙烯醚、苯基缩水甘油醚、改性松香、二乙二醇单丁醚；达到提高助焊剂的活性、保护生产环境和保证工作人员的身体健康。

Description

一种新型助焊剂
技术领域
本发明涉及电子焊接材料技术领域，具体涉及一种新型助焊剂。
背景技术
随着电子技术的不断发展以及集成电路应用的日益普及，助焊剂在电子行业及其相关行业中扮演着越来越重要的角色。现有技术中一般采用含有1-2%松香的助焊剂，为保证助焊剂活性，企业会增加其它活性剂的使用量，这样就造成了焊接后绝缘阻抗较低的问题，容易出现漏电风险；同时一般的助焊剂在使用时，由于其溶剂是酒精，挥发性很强，严重影响了工作环境，对工作人员的身体造成一定的危害。
发明内容
为解决上述技术问题，本发明提出了一种新型助焊剂，达到提高助焊剂的活性、保护生产环境和保证工作人员的身体健康。
为达到上述目的，本发明的技术方案如下：
一种新型助焊剂，按含量百分比计算，其包括如下组分：
Figure BDA00002479031500011
通过上述技术方案，本发明提供了一种新型助焊剂，在助焊剂中添加二乙二醚单丁醚和3-3.5%的改性松香等，达到提高助焊剂的活性、保护生产环境和保证工作人员的身体健康。
具体实施方式
本发明提供了一种新型助焊剂，其工作原理是在助焊剂中添加有二乙二醚单丁醚和3-3.5%的改性松香等，达到提高助焊剂的活性、保护生产环境和保证工作人员的身体健康。
一种新型助焊剂，按含量百分比计算，其包括如下组分：
工艺步骤：
1、将上述原料按含量比加入到反应釜中；
2、搅拌2-3小时，使原料充分溶解；
3、静置半小时，对产品进行过滤、包装。
通过以上的方式，本发明所提供的一种新型助焊剂，通过在助焊剂中添加二乙二醚单丁醚和3-3.5%的改性松香等，达到提高助焊剂的活性、保护生产环境和保证工作人员的身体健康。
以上所述的仅是本发明所公开的一种新型助焊剂的优选实施方式，应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (1)

1.一种新型助焊剂，其特征在于，按含量百分比计算，其包括如下组分：
Figure FDA00002479031400011
。
CN201210492720.5A 2012-11-28 2012-11-28 一种新型助焊剂 Expired - Fee Related CN103831547B (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084713A (zh) * 2014-06-20 2014-10-08 宁国新博能电子有限公司 一种用于铜线处理的免清洗助焊剂
CN104384751A (zh) * 2014-09-17 2015-03-04 明光市锐创电气有限公司 一种用于空调内部变压器处理的免清洗助焊剂

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1110205A (zh) * 1994-04-06 1995-10-18 化学工业部晨光化工研究院成都分院 无卤素非松香型低固含量免清洗助焊剂
CN101058135A (zh) * 2007-05-16 2007-10-24 天津瑞坚新材料科贸有限公司 免清洗助焊剂及其制备方法
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN101972906A (zh) * 2010-09-17 2011-02-16 丹凤县荣毅电子有限公司 一种无铅环保助焊剂及其制备方法
CN102513734A (zh) * 2011-12-27 2012-06-27 厦门市及时雨焊料有限公司 一种膏状助焊剂的制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1110205A (zh) * 1994-04-06 1995-10-18 化学工业部晨光化工研究院成都分院 无卤素非松香型低固含量免清洗助焊剂
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN101058135A (zh) * 2007-05-16 2007-10-24 天津瑞坚新材料科贸有限公司 免清洗助焊剂及其制备方法
CN101972906A (zh) * 2010-09-17 2011-02-16 丹凤县荣毅电子有限公司 一种无铅环保助焊剂及其制备方法
CN102513734A (zh) * 2011-12-27 2012-06-27 厦门市及时雨焊料有限公司 一种膏状助焊剂的制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084713A (zh) * 2014-06-20 2014-10-08 宁国新博能电子有限公司 一种用于铜线处理的免清洗助焊剂
CN104384751A (zh) * 2014-09-17 2015-03-04 明光市锐创电气有限公司 一种用于空调内部变压器处理的免清洗助焊剂

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