CN103796140A - Vibration module for sound transducer - Google Patents

Vibration module for sound transducer Download PDF

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Publication number
CN103796140A
CN103796140A CN201310464814.6A CN201310464814A CN103796140A CN 103796140 A CN103796140 A CN 103796140A CN 201310464814 A CN201310464814 A CN 201310464814A CN 103796140 A CN103796140 A CN 103796140A
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CN
China
Prior art keywords
voice coil
substrate
vibration module
diaphragm
attached
Prior art date
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Granted
Application number
CN201310464814.6A
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Chinese (zh)
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CN103796140B (en
Inventor
崔奎东
朴吉东
郑仁镐
权重鹤
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EM Tech Co Ltd
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EM Tech Co Ltd
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Publication of CN103796140A publication Critical patent/CN103796140A/en
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Publication of CN103796140B publication Critical patent/CN103796140B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/14—Non-planar diaphragms or cones corrugated, pleated or ribbed
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting

Abstract

The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion.

Description

For the vibration module of sonic transducer
Technical field
The present invention relates to a kind of vibration module for sonic transducer, and more specifically, relate to a kind of can by contact between diaphragm and voice coil loudspeaker voice coil is minimized prevent sound leakage, for the vibration module of sonic transducer.
Background technology
Fig. 1 is the cutaway view that traditional sonic transducer is shown.
As shown in the figure, typical sonic transducer (loud speaker) comprises framework 1, insert and be installed to the yoke 2 in framework 1, for sending magnetic flux to yoke 2 or receiving inner annular magnet 3 and the outside annular magnet 4 of magnetic flux from yoke 2, for receiving magnetic flux from inner annular magnet 3 or outside annular magnet 4 and sending inner annular top board 5 and the outside annular roof plate 6 of magnetic flux with right angle to voice coil loudspeaker voice coil 7, partial insertion is to the voice coil loudspeaker voice coil 7 in the air gap between inner annular magnet 3 and inner annular top board 5 and outside annular magnet 4 and outside annular roof plate 6, its included liaison circle 7 also carrys out vibrative diaphragm 8 for the vertical movement by voice coil loudspeaker voice coil 7, and there is audio emission hole 11 and protect the protector 10 of diaphragm 8.
As shown in Figure 1, the lead-out wire 12 of voice coil loudspeaker voice coil 7 exchanges fastener (this line exchange fastener is drawn by the side of framework 1 or by being formed at the groove (not shown) in framework 1) by line respectively and adheres to regularly the bottom surface of diaphragm 8, and is soldered to terminal 14 along the lateral surface of framework 1.Terminal 14 will be for going between to being connected to each other from outside with lug (not shown) and lead-out wire (input and output line).
Exchange engaging process as the line that exchange fastener by line lead-out wire 12 is fixedly joined to the bottom surface of diaphragm 8 and carry out engaging the lead-out wire 12 of voice coil loudspeaker voice coil 7 and the process of diaphragm 8.Although need high accuracy, this engaging process manually carries out, and this causes the long processing time and expensive.In addition, defect becomes this process to manufacture the weakest among the process of Microspeaker frequently.
In addition, because exchanging fastener by line, lead-out wire 12 is fixed to diaphragm 8, so in the time converting the electrical signal to acoustical signal by vibration, quality and the Stiffness Distribution of diaphragm 8 are inhomogeneous, this can cause diaphagras (split vibration) deteriorated acoustic characteristic.
Summary of the invention
An object of the present invention is to provide a kind of can be suitable for avoiding contact between diaphragm and the lead-out wire of voice coil loudspeaker voice coil, for the vibration module of sonic transducer.
Another object of the present invention be to provide a kind of can allow by voice coil loudspeaker voice coil be fixed to relatively less vibration part, for the vibration module of sonic transducer.
Another object of the present invention be to provide a kind of can reduce total weight, for the vibration module of sonic transducer.
According to the one aspect of the present invention for realizing above-mentioned purpose, vibration module for sonic transducer is provided, this vibration module comprises: the substrate with interior section and exterior section, on described interior section, be provided with the electrical connections for apply the signal of telecommunication to voice coil loudspeaker voice coil, and on described exterior section, being provided with terminal, described substrate is for carrying out the electrical connection between described electrical connections and described terminal; Be attached in the primary diaphragm between described interior section and the described exterior section of described substrate; And be arranged on inside the described interior section of described substrate apart from described primary diaphragm certain distance ground and be electrically connected to the voice coil loudspeaker voice coil of described electrical connections.
In addition, preferably, around, and secondary diaphragm is attached to the described interior section of described substrate in the perforation that described interior section is formed on described substrate.
In addition, preferably, the extension that is formed with electrical connections on it is arranged on the inside of the described interior section of described substrate.
In addition, preferably, be disposed in the described interior section that is attached to described voice coil loudspeaker voice coil of described substrate for the leader of guiding the lead-out wire of described voice coil loudspeaker voice coil to described electrical connections from the bottom surface of described voice coil loudspeaker voice coil.
In addition, preferably, described leader is through hole or groove.
In addition, preferably, described secondary diaphragm covers described through hole.
In addition, preferably, described secondary diaphragm comprises the base part that is attached to described extension, and in described secondary diaphragm, also comprises multiple vault parts of projection in opposite direction.
In addition, preferably, described primary diaphragm and described secondary diaphragm are attached to respectively the contrary face of described substrate.
In addition, preferably, described substrate plays the suspension effect of the vibration for supporting described diaphragm.
Can, by avoiding contact between diaphragm and the lead-out wire of voice coil loudspeaker voice coil to realize uniform quality and Stiffness Distribution, prevent diaphagras according to the vibration module for sonic transducer of the present invention.
In addition, can be by allowing the part that voice coil loudspeaker voice coil is fixed to relatively less vibration to simplify processing and improve product reliability according to the vibration module for sonic transducer of the present invention.
In addition, can reduce total weight according to the vibration module for sonic transducer of the present invention.
Accompanying drawing explanation
Fig. 1 is the cutaway view that traditional sonic transducer is shown.
Fig. 2 is the perspective view illustrating according to the vibration module for sonic transducer of the present invention.
Fig. 3 is the decomposition diagram of Fig. 2.
Fig. 4 is the profile perspective of getting along the line A-A' of Fig. 2.
Fig. 5 is the perspective cutaway view of getting along the line B-B' of Fig. 2.
The Reference numeral > of < accompanying drawing major part
20: voice coil loudspeaker voice coil 30: latallae
40: substrate 50: center diaphragm
Embodiment
Hereinafter, with exemplary embodiments, the present invention is described in more detail with reference to the accompanying drawings.
Fig. 2 is the perspective view illustrating according to the vibration module for sonic transducer of the present invention, and Fig. 3 is the decomposition diagram of Fig. 2, and Fig. 4 is the profile perspective of getting along the line A-A' of Fig. 2, and Fig. 5 is the perspective cutaway view of getting along the line B-B' of Fig. 2.
Vibration module comprises voice coil loudspeaker voice coil 20 for receiving the signal of telecommunication, is formed with annular shape by the latallae 30(boring a hole) and the diaphragm that forms of center diaphragm 50 and substrate 40(are for example, FPCB(flexible printed circuit board) substrate), substrate 40 by electrical signal transfer to voice coil loudspeaker voice coil 20 and be electrically connected to for receiving the terminal 48 of the signal of telecommunication from outside terminal and for supporting the suspension of vibration of diaphragm.
Voice coil loudspeaker voice coil 20 comprises and is electrically connected to terminal to 48 the first lead-out wire 24a and the second lead-out wire 24b and passes through the coil main body 22 that winding around forms.
Latallae 30 comprises the neighboring part 32 of the side base part 41 that is attached to substrate 40, around perforation, forms and be attached to the inner rim part 34 of central seat part 42 and form neighboring part 32 is connected to the vault coupling part 36 of inner rim part 34 with dome shape.
Substrate 40 comprises: the side base part 41 attached with the neighboring part 32 of latallae 30; The central seat part 42 attached with inner rim part 34, the voice coil loudspeaker voice coil 20He center diaphragm 50 of latallae 30; From inwardly outstanding extension 43 of substrate; Allow lead-out wire 24a and the through hole 44 of 24b from coil main body 22 to downward-extension; Be arranged in the electrical connections 45 on extension 43; Side base part 41 is connected to central seat part 42 and the coupling part 46 of damping is provided; And allow to be electrically connected to the terminal 48 of external equipment.In addition, substrate 40 arrives voice coil loudspeaker voice coil 20 by conductive pattern (not shown) by electrical signal transfer, this conductive pattern is from terminal 48 via side base part 41 and coupling part 46 and be connected to central seat part 42, and then by modes such as welding, electrical connections 45 places on the extension 43 that is arranged in central seat part 42 are electrically connected with lead-out wire 24a and the 24b of voice coil loudspeaker voice coil 20.
Coupling part 46 allows only vertically vibration of diaphragm, has prevented thus the improper vibration such as diaphagras or lateral vibration, and has improved the quality of sound.
Center diaphragm 50 comprise the back side of the central seat part 42 that is attached to substrate 40 neighboring part 52, be attached at least in part the extension 43 of substrate 40 interior base part 54, be arranged on neighboring part 52 inside a pair of the first vault part 56 and be arranged on this to the second vault part 58 between the first vault part 56.Interior base part 54 is connected to the two ends of the second vault part 58.The second vault part 58 to the first vault parts 56 are short, and the length of interior base part 54 equals its length difference.In addition, the first vault part 56 and the second vault part 58 are along contrary direction projection.
Center diaphragm 50 and latallae 30 can have different rigidity.Center diaphragm 50 is made up of lightweight rigid material, and latallae 30 is made up of lightweight flexible material.
In addition, the second vault part 58 of center diaphragm 50 is formed higher than interior base part 54, and the first vault part 56 is formed lower than interior base part 54, and this can structurally increase the rigidity of center diaphragm 50.In addition, because the second vault part 58 forms highlyer, so when Dang Jiang center diaphragm 50 is attached to the back side of central seat part 42, the second vault part 58 can be as the guide member of centre of location diaphragm 50.In addition, because the first vault part 56 is formed lower than interior base part 54, so in the time the end face of interior base part 54 being attached to the back side of central seat part 42 and extension 43 by bonding agent, residual bonding agent is to downstream to the first vault part 56, thereby can not be leaked to beyond center diaphragm 50.
The side base part 41 of substrate 40 is fixedly mounted on the framework of sonic transducer, thereby forms the vibration module of sonic transducer.In the time forming sonic transducer, the coil main body of voice coil loudspeaker voice coil 20 22 should be mounted in the magnetic circuit that is included in sonic transducer.
In addition, substrate 40 has perforation, and central seat part 42 is formed at around this perforation, and the total weight of substrate 40 can be reduced.But, because center diaphragm 50 is attached to central seat part 42, so rigidity can be maintained.
The neighboring part 32 of latallae 30 is attached to the side base part 41 of substrate 40, and the inner rim part 34 of latallae 30 is attached to the central seat part 42 of substrate 40, and voice coil loudspeaker voice coil 20 apart from inner rim part 34 certain distances be attached to central seat part 42.Even in the time that latallae 30 is attached to substrate 40, the terminal 48 of substrate 40 also can be exposed to outside.
To the syndeton of substrate 40 and voice coil loudspeaker voice coil 20 be described below.In the time manufacturing voice coil loudspeaker voice coil 20, in the present embodiment, in the time of winding around, lead-out wire 24a is placed on to coil main body 22 outsides, and lead-out wire 24b is placed on to coil main body 22 inner sides.Therefore, as shown in Figure 5, in the time that lead-out wire 24b is attached to electrical connections 45, lead-out wire 24b can be not being attached to electrical connections 45 by the situation that below coil main body 22.But in the time that lead-out wire 24a is attached to electrical connections 45, lead-out wire 24a should be by coil main body 22 below to be attached to electrical connections 45.
With reference to Fig. 4, according to the present invention, through hole 44 is formed in central seat part 42, on the placement lead-out wire 24a of coil main body 22 and the bottom side of 24b, to make lead-out wire 24a coil main body 22 be not attached to electrical connections 45 by the through hole 44 coil main body 22 in the situation that substrate 40 separates.In other words, the bottom surface of coil main body 22 can seamless unoccupied place, be attached to substrate 40(equably, central seat part 42).
As a result, lead-out wire 24a and 24b 43 places, extension in central seat part 42 are electrically connected with substrate 40, but not in the coupling part 46 places electrical connection as suspension.This makes it possible to prevent the vibration separately during the dither of sonic transducer of electrical connections 45 and lead-out wire 24a and 24b.
In addition, coil main body 22 is positioned on the end face of through hole 44, and the end face of the interior base part 54 of center diaphragm 50 is attached on the bottom surface of through hole 44, thereby covers through hole 44 and prevent sound leakage.
In the present embodiment, through hole 44 is formed in the part of central seat part 42.But, can in central seat part 42, form groove with the degree of depth of the thickness that is less than central seat part 42.In this sense, through hole 44 or groove are as a kind of leader of guiding lead-out wire 24a and 24b from coil main body 22 downwards.
In addition, as shown in the figure, latallae 30 and voice coil loudspeaker voice coil 20 are arranged on certain being spaced apart in a side of substrate 40, center diaphragm 50 is installed on the opposite side of substrate 40, and lead-out wire 24a and 24b are guided to electrical connections 45 by the leader being arranged on substrate 40, lead-out wire 24a can not contacted with diaphragm with 24b.
In addition, in the present embodiment, inner rim part 34 formation around the perforation of substrate 40, but inner rim part 34 can be solid and can omit center diaphragm 50.
In addition, in the present embodiment, latallae 30He center diaphragm 50 is attached to the contrary face of substrate 40, but also can be attached on the same face of substrate 40.
In addition in the present embodiment, on electrical connections 45 has been disposed in the face of voice coil loudspeaker voice coil 20 attached, but also can be arranged on contrary face.Here, lead-out wire 24a and 24b can be electrically connected to the electrical connections on the opposing face of extension 43 by through hole 44.
Although illustrate and described by reference to the accompanying drawings the present invention with preferred embodiment, the present invention is not limited to this, and is limited by claims.Therefore, it will be understood by those skilled in the art that and can carry out various modifications and change to it in the case of not departing from the spirit and scope of the present invention that limited by claims.

Claims (9)

1. for a vibration module for sonic transducer, comprising:
Substrate, it has interior section and exterior section, on described interior section, be provided with for apply the electrical connections of the signal of telecommunication to voice coil loudspeaker voice coil, and on described exterior section, be provided with terminal, described substrate is for carrying out the electrical connection between described electrical connections and described terminal;
Primary diaphragm, it is attached between the described interior section and described exterior section of described substrate; And
Described voice coil loudspeaker voice coil, is arranged on the described interior section inner side of described substrate the described primary diaphragm certain distance of its distance, and is electrically connected to described electrical connections.
2. vibration module according to claim 1, wherein, around, and secondary diaphragm is attached on the described interior section of described substrate in the perforation that described interior section is formed on described substrate.
3. vibration module according to claim 2, wherein, the extension that is formed with described electrical connections on it is arranged on the inner side of the described interior section of described substrate.
4. vibration module according to claim 3, wherein, leader is disposed on the described interior section that is attached to described voice coil loudspeaker voice coil of described substrate, and described leader is for guiding the lead-out wire of described voice coil loudspeaker voice coil to described electrical connections from the bottom surface of described voice coil loudspeaker voice coil.
5. vibration module according to claim 4, wherein, described leader is through hole or groove.
6. vibration module according to claim 5, wherein, described secondary diaphragm covers described through hole.
7. vibration module according to claim 4, wherein, described secondary diaphragm comprises the base part that is attached to described extension, and in described secondary diaphragm, comprises multiple vault parts of projection in opposite direction.
8. vibration module according to claim 2, wherein, described primary diaphragm and described secondary diaphragm are attached to respectively the contrary face of described substrate.
9. vibration module according to claim 1, wherein, described substrate plays the suspension effect of the vibration for supporting described diaphragm.
CN201310464814.6A 2012-10-29 2013-10-08 Vibration module for sonic transducer Active CN103796140B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0120484 2012-10-29
KR1020120120484A KR101392872B1 (en) 2012-10-29 2012-10-29 Vibration module for sound transducer

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CN103796140A true CN103796140A (en) 2014-05-14
CN103796140B CN103796140B (en) 2017-07-28

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US (1) US9088840B2 (en)
EP (1) EP2725820B1 (en)
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CN (1) CN103796140B (en)

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KR101439914B1 (en) * 2013-02-22 2014-09-15 주식회사 이엠텍 One magnet type microspeaker
KR102269152B1 (en) * 2014-10-07 2021-06-25 삼성전자주식회사 Speaker
CN106231508B (en) * 2016-08-30 2019-12-13 歌尔股份有限公司 Vibrating diaphragm
CN209201337U (en) * 2018-12-17 2019-08-02 瑞声科技(新加坡)有限公司 A kind of loudspeaker
CN209390327U (en) * 2018-12-17 2019-09-13 瑞声科技(新加坡)有限公司 A kind of loudspeaker
CN212936183U (en) * 2020-07-06 2021-04-09 瑞声科技(新加坡)有限公司 Loudspeaker

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Also Published As

Publication number Publication date
EP2725820A1 (en) 2014-04-30
EP2725820B1 (en) 2016-06-22
US20140119578A1 (en) 2014-05-01
CN103796140B (en) 2017-07-28
KR101392872B1 (en) 2014-05-12
US9088840B2 (en) 2015-07-21

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