CN103789770B - 大块非晶及纳米晶合金表面化学抛光工艺 - Google Patents
大块非晶及纳米晶合金表面化学抛光工艺 Download PDFInfo
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- CN103789770B CN103789770B CN201410052193.5A CN201410052193A CN103789770B CN 103789770 B CN103789770 B CN 103789770B CN 201410052193 A CN201410052193 A CN 201410052193A CN 103789770 B CN103789770 B CN 103789770B
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- chemical polishing
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- large block
- block amorphous
- crystal alloy
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- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 12
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- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 6
- 102000004160 Phosphoric Monoester Hydrolases Human genes 0.000 claims description 3
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- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 claims description 3
- 229910001488 sodium perchlorate Inorganic materials 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 101100317041 Caenorhabditis elegans vit-1 gene Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
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- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 1
- 229940005991 chloric acid Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
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- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
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CN201410052193.5A CN103789770B (zh) | 2014-02-14 | 2014-02-14 | 大块非晶及纳米晶合金表面化学抛光工艺 |
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CN103789770A CN103789770A (zh) | 2014-05-14 |
CN103789770B true CN103789770B (zh) | 2016-08-31 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7300601B2 (en) * | 2002-12-10 | 2007-11-27 | Advanced Technology Materials, Inc. | Passivative chemical mechanical polishing composition for copper film planarization |
CN101302403B (zh) * | 2008-07-03 | 2011-10-19 | 大连理工大学 | 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法 |
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Application publication date: 20140514 Assignee: Guangdong Rongtong Financial Leasing Co.,Ltd. Assignor: DONGGUAN EONTEC Co.,Ltd. Contract record no.: X2023980042709 Denomination of invention: Chemical polishing process for surface of bulk amorphous and nanocrystalline alloys Granted publication date: 20160831 License type: Exclusive License Record date: 20230927 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Chemical polishing process for surface of bulk amorphous and nanocrystalline alloys Effective date of registration: 20231007 Granted publication date: 20160831 Pledgee: Guangdong Rongtong Financial Leasing Co.,Ltd. Pledgor: DONGGUAN EONTEC Co.,Ltd. Registration number: Y2023980060036 |