CN103782125B - The motherboard material of heat exchange plate and employ the heat exchange plate of this motherboard material - Google Patents
The motherboard material of heat exchange plate and employ the heat exchange plate of this motherboard material Download PDFInfo
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- CN103782125B CN103782125B CN201280042807.0A CN201280042807A CN103782125B CN 103782125 B CN103782125 B CN 103782125B CN 201280042807 A CN201280042807 A CN 201280042807A CN 103782125 B CN103782125 B CN 103782125B
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- protuberance
- heat exchange
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- exchange plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K23/00—Making other articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/086—Heat exchange elements made from metals or metal alloys from titanium or titanium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The motherboard material of the heat exchange plate (4) of the present invention is made up of the flat-sheet material (1) being formed with fine concavo-convex titanium on surface, becomes heat exchange plate (4) after flat-sheet material (1) is implemented punch process。The form parameter G1 defined by the height (μm) of protuberance × [spacing (μm) of the protuberance of the width (μm) of recess/adjacent] is less than 85 μm。Additionally, about the heat exchange motherboard material of plate (4) of the present invention, the height (μm) of protuberance × [angle (deg) of spacing (μm)/protuberance of the protuberance of the width (μm) of recess/adjacent] the form parameter G2 defined is 0.94 μm/below deg。
Description
Technical field
The present invention relates to the motherboard material of heat exchange plate and employ the heat exchange plate of this motherboard material。
Background technology
Heat exchange plate in heat-exchangers of the plate type being encased in patent documentation 1 grade etc. requires good heat-transfer character。
At first technical literature
Patent documentation
Patent documentation 1: Japanese Laid-Open 2009-192140 publication
Summary of the invention
The problem that invention to solve
It is an object of the invention to provide the motherboard material of a kind of heat exchange plate, its conductivity of heat is very excellent, and as post processing stamping in processability very good, and can easily shape to the plate of heat exchange。
For solving the means of problem
The motherboard material of the heat exchange plate in the present invention is constituted by being formed with fine concavo-convex metal flat-sheet material on surface, heat exchange plate is become after this flat-sheet material enforcement punch process is used as post processing, about described concavo-convex, in the way of the form parameter G1 defined by the height (μm) of protuberance × [spacing (μm) of the protuberance of the width (μm) of recess/adjacent] becomes below 85 μm, set surface concavo-convex of described motherboard material。
Additionally, the motherboard material of the heat exchange plate in the present invention is constituted by being formed with fine concavo-convex metal flat-sheet material on surface, heat exchange plate is become after this flat-sheet material enforcement punch process is used as post processing, about described concavo-convex, in the way of the form parameter G2 defined by the height (μm) of protuberance × [angle (deg) of spacing (μm)/protuberance of the protuberance of the width (μm) of recess/adjacent] becomes 0.94 μm/below deg, set surface concavo-convex of described motherboard material。
Invention effect
The motherboard material of the technology of the application of the invention, it is possible to manufacture heat exchange plate when not producing when punch process to break etc.。The conductivity of heat of the heat exchange plate produced is very excellent。
Accompanying drawing explanation
Fig. 1 indicates that the figure of the manufacture method of heat exchange plate。
Fig. 2 is the configuration figure of the protuberance formed on the surface of motherboard material。
Fig. 3 is another configuration figure of the protuberance formed on the surface of motherboard material。
Fig. 4 indicates that the figure of L × Rz/P and the relation of stress concentration ratio。
Fig. 5 be for calculate press formability scoring with reference to figure。
Fig. 6 indicates that the figure of the excellent relation of the size shape of concaveconvex shape and the relation of heat transfer efficiency that are formed on the surface of motherboard material and the size shape of concaveconvex shape that formed on the surface of motherboard material and press formability。
Fig. 7 indicates that the figure of the overview of the device forming concaveconvex shape on the surface of motherboard material。
Fig. 8 is the explanation figure of the shape that protuberance is described。
Fig. 9 indicates that the figure of the angle η of protuberance and the relation of the flowing of fluid。
Figure 10 indicates that the figure of form parameter G2 and the relation of conductivity of heat increase rate。
Figure 11 indicates that the figure of form parameter G2 and conductivity of heat increase rate and the relation of press formability。
Figure 12 indicates that the figure of form parameter G2 and conductivity of heat increase rate and the relation of press formability。
Detailed description of the invention
Hereinafter, illustrate based on the example employing titanium material as flat-sheet material 1。
Titanium is to have anisotropic material, and the deformational behavior of the minimizing of thickness of slab of anisotropy counter stress collection center of material, strain gradient etc. produces impact。Therefore, compared with not having other material anisotropic, the press formability of titanium etc. is notable to be deteriorated。It addition, the material that titanium is easily burn, if occur the oil film of lubricating oil to interrupt when punching press, then easily produce the fracture of material, or because of with diel or contacting of instrument and easily produce damage, it is difficult to operation。Therefore, the following successful example utilizing titanium material can be applicable to other the metal material such as rustless steel, aluminum。
Hereinafter, based on accompanying drawing, embodiments of the present invention are described。
[the first embodiment]
Fig. 1 indicates that the concept map of the manufacture method of the heat exchange plate of the first embodiment。
First, as shown in Fig. 1 (a), the size of regulation will be formed as the flat-sheet material 1 of former material。Then, as shown in Fig. 1 (b), by flat-sheet material 1 is carried out punch process, produce the plate motherboard (motherboard material) being formed with fine concaveconvex shape at the surface 1a of flat-sheet material 1。Then, as shown in Fig. 1 (c), it is formed on the plate motherboard 2 (motherboard material) of fine concaveconvex shape at surface 2a, by the groove of multiple chevrons of stamping a few mm of the height～several cm being formed and being such as referred to as " herringbone (herringbone) ", thus manufacture heat exchange plate 4。
Flat-sheet material 1 shown in Fig. 1 (a) is titanium material, and its size, thickness of slab are considered as the desired size of heat exchange plate 4 of final products, thickness of slab determines。For the surface 1a of this flat-sheet material 1, use processing unit (plant) 10 described later to form fine concaveconvex shape (multiple protuberances 5 and the recess 6 clipped by protuberance 5), be consequently formed plate motherboard 2。It is formed with the conductivity of heat very good (heet transfer rate is very high) of the plate motherboard 2 of concaveconvex shape。Additionally, the plate motherboard 2 of the present invention is titanium system, therefore the characteristic such as corrosion resistance, intensity, lightweight is more excellent than other metals。Thus, plate motherboard 2 is suitable for the plate etc. of heat-exchangers of the plate type needs the product of corrosion resistance, intensity。
The herringbone 3 formed on plate motherboard 2 is the multiple chevron grooves in frame configuration, in the size of groove, is highly a few mm～several cm。Load in this motherboard 2 heat exchanger。Even if the oblique lattice shape representated by herringbone 3 grade is when the flowing of the working fluid of internal heat exchanger is uneven, concavo-convex can both becoming the wall orthogonal with working fluid relative to the flowing from which direction, improving thus contributing to the conductivity of heat that turbulent flow brings。
Hereinafter, the details of the concaveconvex shape on the surface of plate motherboard 2 is described。
As shown in Fig. 2 (a), being circular at the surface 2a of plate motherboard 2 protuberance 5 formed under overlooking, the diameter D of this protuberance 5 is more than 400 μm。Being configured under the vertical view of protuberance 5 is staggered。At this, staggered configuration (interconnected) refers to the meaning of the out-of-line arrangement in center of protuberance 5,5 adjacent in either one in longitudinal direction and transverse direction。
Specifically, on plate motherboard 2, protuberance 5,5 adjacent in the vertical can stagger half spacing in the horizontal。Protuberance 5 can also be configured as follows: be 60 ° by straight line (single dotted broken line) B angulation θ connected to each other with the center by protuberance 5 adjacent in the vertical for straight line (single dotted broken line) A connected to each other for the center of protuberance 5 adjacent in the horizontal。
So, by protuberance 5 being formed as staggered grid arrangement, thus the flowing of the working fluid in heat exchanger is uneven, concavo-convex can both become the wall orthogonal with working fluid relative to the flowing from which direction, hence help to the conductivity of heat that turbulent flow brings and improve。It addition, have for anisotropic material for titanium etc., it is possible to the stress that reply anisotropy causes is concentrated。
The distance L (the width L of recess 6) between protuberance 5 adjacent vertical or horizontal is preferably more than 200 μm。It should be noted that the width L of recess 6 is adjacent in the lateral or vertical direction protuberance 5 beeline each other, it is possible to tried to achieve by " the spacing P-(the diameter D/2 of protuberance 5) × 2 of the protuberance 5 adjacent for width L=of recess 6 "。It addition, the spacing P of adjacent protuberance 5 be adjacent in the lateral or vertical direction nearest protuberance 5 each other in distance in the heart (being in the protuberance 5 of beeline distance between centers each other)。
The width L of the recess 6 shown in Fig. 2 (a) is longitudinally and be transversely identical value。That is, adjacent in the vertical protuberance 5 distance each other and protuberance 5 adjacent in the horizontal distance each other are all identical value。The spacing P (distance between centers of protuberance 5) of preferably adjacent protuberance 5 is more than 600 μm。
As shown in Fig. 2 (b), the protuberance 5 formed on the surface of plate motherboard 2 is configured to generally trapezoidal shape by the sidewall 7 erected upward under section view with by the table wall 8 that the upper limb of this sidewall 7 flatly links。In other words, it is provided with par at the top of protuberance 5。Be more than 5 μm with the height of 10 mean roughness Rz protuberance 5 (sidewall 7) represented (following, to be sometimes denoted as height Rz), and be plate motherboard 2 thickness of slab t 1/10 (1/10th) below。
The height Rz making protuberance 5 is owing to when concaveconvex shape is excessive relative to thickness of slab, cannot guarantee flatness (shape) when the rolling transfer undertaken by processing unit (plant) 10 described later, it is impossible to obtain the reason of rolling stability for this scope。Further, due also to when the plate of flatness cannot be guaranteed, stress distribution is produced when subsequent handling stamping, thus producing to break at the position that stress is high。That is, if the height Rz of protuberance 5 is excessive when punch process, then becomes the reason (starting point) broken, and become the reason of damage。On the other hand, if height Rz excessively little (being less than 5 μm), then the raising of heat transfer efficiency cannot be realized。
It addition, the plan view shape of protuberance 5 is not completely rounded, also include the ellipse that flat ratio is about 0.2。It should be noted that about the plan view shape of protuberance 5, in addition further contemplate square etc. variously-shaped, but from the view point of stress when avoiding the punch process carried out in subsequent handling is concentrated, the plan view shape of protuberance 5 is preferably substantially round。
It addition, the interconnected state of protuberance 5 is not defined to the configuration status of Fig. 2 yet。
Such as shown in Fig. 3, it is also possible to configuration protuberance 5 as follows: be 45 ° by straight line (single dotted broken line) B ' angulation θ connected to each other with the center by protuberance 5 adjacent in the vertical for straight line (single dotted broken line) A ' connected to each other for the center of protuberance 5 adjacent in the horizontal。Angle, θ can also be other angle。
About the concaveconvex shape of above such plate motherboard 2, illustrate to become the item of its basis。
The all inventors of the present invention are when manufacturing plate motherboard 2, in order to make the height Rz of protuberance 5 formed on the surface of plate motherboard 2, the number (the width L of recess 6) of protuberance 5, adjacent protuberance spacing P become and meet the desired parameter requiring characteristic (heat-transfer character etc.), and be found that the form parameter G1 " [the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6]) " of the concaveconvex shape comprising above-mentioned parameter。
First, in above-mentioned form parameter G1, when considering make the height Rz of protuberance 5 fix and make the spacing P (L/P) of protuberance adjacent for width L/ of recess 6 change, as shown in Figure 4, along with L/P increases there is the tendency increased in stress concentration ratio。That is, when excessive or protuberance the spacing P of the width L of recess 6 is narrow, stress is concentrated, thus becoming the situation being susceptible to break when implementing stamping (for shaping the punch process of herringbone etc.) etc.。
On the other hand, in above-mentioned form parameter G1, when considering the situation improving the height Rz of protuberance 5, same with the spacing P of the width L of recess 6 or adjacent protuberance, when implementing stamping, producing uneven stress distribution, breaking thus being likely to generation at the position that stress is high。
Therefore, when considering the press formability of plate motherboard 2, the height Rz of the protuberance 5 or width L of recess 6 is not excessive and the situation not narrow for spacing P of protuberance is best suitable for。Think that the form parameter G1 representing above-mentioned parameter exists higher limit。
Therefore, the all inventors of the present invention by the plate motherboard 2 being formed with variously-shaped concavo-convex titanium is carried out experiment etc., specify that the relation of form parameter G1 " [the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6]) " and press formability。
In the evaluation test that the formability (press formability) in punch process is evaluated, first, as it is shown in figure 5, shape herringbone (groove) 3 on plate motherboard 2 to shape heat exchange plate 4。When making, first, the mould of a shaping using condition corresponding with heat exchanger is prepared in advance。Then, by mould, plate motherboard 2 shapes herringbone 3 and makes multiple heat exchange plates 4。Multiple heat exchange plates 4 make by conditions different for every 0.1mm with forming height。In the evaluation plate (heat exchange plate 4) produced, the shaping boundary height (not producing the maximum forming height of necking down) not produce the mould of necking down is evaluated as intrusion。
In above-mentioned evaluation test, the situation that intrusion is big can be referred to as to be difficult to produce necking down and press formability is good, and in evaluation test, the situation that intrusion is little can be referred to as outer easy generation necking down and press formability is poor。So, in evaluation test, it is possible to the Forming depth starting to shrink at (necking down), the dependent variable that can tolerate shaping are evaluated。
The scoring of the press formability of Fig. 6 is the scoring above-mentioned intrusion standardization being indicated, if it is more than 1 that all inventors of the present invention confirm the scoring of press formability, is then prevented from the generation of necking down, and is capable of stamping reliably simultaneously。
As shown in Figure 6, although along with form parameter G1 becomes the scoring of press formability reduction greatly, but if form parameter G1 is less than 85 μm, then the scoring that can make press formability is more than 1。Thereby, it is possible to prevent the generation of necking down。That is, if form parameter G1 is less than 85 μm, then the generation of necking down it is prevented from, therefore, it is possible to avoid press formability to reduce such situation。
If it should be noted that form parameter G1 is less than 65 μm, then can prevent increasing or the generation of burn phenomenon of the partial face pressure that the uneven distribution of lubricating status of the increase with height of concave convex causes further。Thus, the present invention all inventors can reliably manufacture heat exchange plate 4 when confirming by experiment etc. the fault when not producing punch process。
If as it has been described above, form parameter G1 is less than 85 μm, then it can be avoided that press formability reduces such situation, but the basis of plate that the plate motherboard 2 of the present invention be composition heat exchanger, for carrying out the next door of heat exchange。Therefore, in the plate motherboard 2 of the present invention, also require heet transfer rate big (heat transfer efficiency is big)。
Therefore, when the heat transfer efficiency that " will not form the flat board of concaveconvex shape " is as 1.00, considers the heat transfer efficiency being formed with the plate (heat exchange plate) of concaveconvex shape, the heat transfer efficiency of heat exchange plate needs bigger than 1.00。Further, in order to play obvious action in actual heat exchanger, it is desirable to heat transfer efficiency is more than 1.05。
At this, it is considered to the relation of heat transfer efficiency and form parameter G1。Such as, by reducing the height Rz of protuberance 5, or reduce the width L of recess 6, or increase the spacing P of protuberance, thus make form parameter G1 be gradually reduced from 85 μm。So, when making form parameter G1 be gradually reduced, as shown in Figure 6, heat transfer efficiency is also gradually reduced, thus heat transfer efficiency is close to not forming concavo-convex flat board。But, if form parameter G1 is more than 4 μm, then it is able to ensure that the heat transfer efficiency (more than 1.05) required for the heat exchanger of reality。
Therefore, from the aspect of heat transfer efficiency, when manufacturing plate motherboard 2, it is preferable that making form parameter G1 is more than 4 μm。It is preferred that form parameter G1 is bigger than 12 μm, more preferably form parameter G1 more than 12 μm and is less than 85 μm。
It addition, more reduce the width L of recess 6, then form parameter G1 more diminishes。If from the viewpoint of temperature boundary layer when flowing through fluid, when the width L of recess 6 is excessively little, can cause the reduction of conductivity of heat, therefore the width L of recess 6 also ensures that certain degree as well。Namely, it is believed that form parameter G1 is also required to certain degree big。
So, relational from the width L of temperature boundary layer and recess 6, even if form parameter G1 is less than 85 μm, it is also desirable to guarantee certain degree。Specifically, as noted above it is believed that form parameter G1 needs to be more than 4 μm。Make form parameter G1 be 4 μm～85 μm interior any one value, and as previously mentioned, making height Rz that is ten the mean roughness Rz of protuberance 5 is below more than 5 μm and (thickness × 0.1 of flat-sheet material) μm, thus necessity ground determines the width L (or spacing P of protuberance 5) of (can be derived that) recess 6。
If additionally, the processability considered in the stamping press implemented in subsequent handling or prevent the deformation of protuberance 5, then preferably the compression joint area in plate motherboard 2 meets formula (1) than S in the concaveconvex shape of Fig. 2 (a)。
During the yield stress σ y > punching press of flat-sheet material (titanium) on protuberance face pressure (P/S) of effect ... (1)
This, S1=P P tan (θ/180 π)/4
S2=π/4 D D/2
S=compression joint area ratio=S2/S1
Load during P=punch process
The S1 of formula (1) is the area (area of the triangle that straight line A as shown in Figure 2 and straight line B surrounds) of the plane in Fig. 2。The S2 of formula (2) is the area (area of the protuberance existed in above-mentioned triangle) of the protuberance in Fig. 2。
So, by using titanium system and be formed with form parameter G1 on surface be motherboard material 2 concavo-convex as 4 μm～85 μm such that it is able to not producing when punch process to break manufactures the heat exchange plate 4 of composition heat exchanger when waiting。The rate of heat exchange of the heat exchange plate 4 so manufactured is more than 1.05, and conductivity of heat is very excellent, and the heat exchanger effectiveness enclosing the heat exchanger of this heat exchange plate 4 is very high。
It addition, above-mentioned plate motherboard 2 can use processing unit (plant) 10 as shown in Figure 7 to be formed。This processing unit (plant) 10 possesses transfer roller 11, processing roller 12, backing roll 13。Transfer roller 11 is used for transferring flat-sheet material 1, is arranged in upstream side and downstream when observing from processing roller 12。
Processing roller 12 is the concavo-convex roller forming micron order (several μm～hundreds of μm) on the surface of the flat-sheet material 1 of transfer。Specifically, processing roller 12 makes form parameter G1 become in the way of 4 μm～85 μm on plate motherboard 2 after processing, forms protuberance 5 and recess 6 at the surface 1a of flat-sheet material 1。That is, the spacing P setting the height Rz of protuberance 5 for forming protuberance 5 and recess 6, the width L of recess 6, adjacent protuberance in the way of 4 μm～85 μm on processing roller 12 to make form parameter G1 become。
By etching or electric spark texturing, the complete cycle at the outer peripheral face of processing roller 12 is formed into the processing department 14 of convex (trapezoidal projection)。The height of processing department 14 is so that the height Rz of protuberance 5 in plate motherboard 2 after processing is more than 5 μm and is that the mode below (thickness t × 0.1 of flat-sheet material) μm is set。From the view point of load resistance or mar proof, the surface layer of processing roller 12 can carry out plating Cr or tungsten carbide processes。
In this processing unit (plant) 10, make processing roller 12 rotate, and make the processing department 14 arranged on processing roller 12 compress to the surface of flat-sheet material 1 simultaneously, it is possible on the surface of this flat-sheet material 1, form the identical protuberance 5 of the shape reverse with making processing department 14 and recess 6。That is, by processing unit (plant) 10, it is possible to being formed and have irregular plate motherboard 2, this concavo-convex form parameter G1 is 4 μm～less than 85 μm, and height Rz is less than the 10% of more than 5 μm and thickness of slab t。It should be noted that the formation of protuberance 5 is not defined to the machining of above-mentioned processing unit (plant) etc., it is also possible to for the process of the chemistry such as etch processes。
Heat exchange plate 4 manufactures by the plate motherboard 2 of the present invention is carried out punch process, but the punch process of plate motherboard 2 how can, it is also possible to be formed without lambdoid punch process as described above。
It addition, concavo-convex about what formed on plate motherboard 2, as long as it is at least some of of this plate motherboard 2 that form parameter G1 becomes the scope of 4 μm～less than 85 μm, it is preferable that throughout the entirety of plate motherboard 2。
[the second embodiment]
The part general with above-mentioned first embodiment is suitably omitted, and below, the second embodiment is illustrated。
Hereinafter, the details of the concaveconvex shape on the surface of plate motherboard 2 are described。
As shown in Figure 8, the sidewall 7 that erected by through-thickness (thickness direction of plate motherboard 2) of protuberance 5 that formed on the surface 2a of plate the motherboard 2 and table wall 8 that the upper end (upper limb) of sidewall 7 links is constituted。In other words, it is provided with par at the top of protuberance 5。When protuberance 5 is cylindrical shape or cone shape, sidewall 7 is one, but when protuberance 5 is prism shape or pyramidal shape, sidewall 7 is multiple。
As shown in Fig. 2 (a), being circular at the surface 2a of plate motherboard 2 protuberance 5 formed under overlooking, its diameter D is more than 400 μm。Protuberance 5 to overlook lower configuration identical with embodiment 1, for staggered, (distance between centers of protuberance 5, i.e. distance in the heart in table wall 8) preferably more than 600 μm it addition, the spacing P of adjacent protuberance 5。
As shown in Fig. 2 (b), identical with the first embodiment, the protuberance 5 formed on the surface of plate motherboard 2 is configured to generally trapezoidal shape。The height of the protuberance 5 (sidewall 7) represented by 10 mean roughness Rz (height Rz) is more than 5 μm, and be plate motherboard 2 thickness of slab t 1/10 (1/10th) below。The Rz of the protuberance 5 of plate motherboard 2 is such as about 25 μm (if representing with Ra, then be about 10 μm)。
About the concaveconvex shape of the plate motherboard 2 of the second embodiment, illustrate to become the item of its basis。
The all inventors of the present invention are when manufacturing plate motherboard 2, in order to make the height Rz of protuberance 5 formed on the surface of plate motherboard 2, the number (the width L of recess 6) of protuberance 5, the adjacent spacing P of protuberance, protuberance angle η become optimal parameter, and the form parameter G2 of the concaveconvex shape being conceived to comprise above-mentioned parameter " the angle η of the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6])/protuberance "。
First, in above-mentioned form parameter G2, when considering make the height Rz of protuberance 5 fix and make the spacing P (L/P) of protuberance adjacent for width L/ of recess 6 change, as shown in Figure 4, along with L/P increases there is the tendency increased in stress concentration ratio。That is, when the width L of recess 6 is excessive, or when the spacing P of protuberance is narrow, stress is concentrated, thus becoming the situation being susceptible to break when implementing stamping (for shaping the punch process of herringbone etc.) etc.。
On the other hand, in above-mentioned form parameter G2, when considering the height Rz change making protuberance 5 and improving the situation of height Rz of protuberance 5, same with the spacing P of the width L of recess 6 or adjacent protuberance, when implementing stamping, producing uneven stress distribution, breaking thus being likely to generation at the position that stress is high。
Therefore, when considering the press formability of plate motherboard 2, the height Rz of the protuberance 5 or width L of recess 6 is not excessive and the situation not narrow for spacing P of protuberance is best suitable for, it is believed that represent that the parameter of above-mentioned parameter exists higher limit。
Fig. 6 be by make except above-mentioned protuberance erect angle η except parameter " the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6) " change time this parameter and press formability and the figure that collects of the relation of heat transfer efficiency。The scoring of the press formability of Fig. 6 is the scoring following shown intrusion standardization represented。
At this, the evaluation test that the formability (press formability) in punch process is evaluated is identical with the first embodiment, therefore omits the description。
As shown in Figure 6, although along with parameter becomes the scoring of press formability reduction greatly, but if parameter is less than 85 μm, then the scoring that can make press formability is more than 1, it is possible to prevents the generation of necking down and realizes stamping reliably simultaneously。
As it has been described above, the basis that the plate motherboard 2 of the present invention is the plate constituting heat exchanger, for carrying out the next door of heat exchange。Therefore, in the plate motherboard 2 of the present invention, in order to play obvious action in actual heat exchanger, it is desirable to heat transfer efficiency is more than 1.05。
At this, it is considered to the relation of heat transfer efficiency and parameter。Such as, by reducing the height Rz of protuberance 5, or reduce the width L of recess 6, or increase the spacing P of protuberance, thus make parameter be gradually reduced from 85 μm。As shown in Figure 6, when making parameter be gradually reduced, heat transfer efficiency is also gradually reduced, thus heat transfer efficiency is close to not forming concavo-convex flat board。But, if parameter is more than 4 μm, then it is able to ensure that the heat transfer efficiency (more than 1.05) required for the heat exchanger of reality。Therefore, from the aspect of heat transfer efficiency, when manufacturing plate motherboard 2, it is preferable that making the parameter represented by " the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6) " is more than 4 μm and less than 85 μm。
As it has been described above, by the spacing P setting the height Rz of protuberance 5, the width L of recess 6 and adjacent protuberance such that it is able to manufacture the plate motherboard 2 that press formability is good and conductivity of heat is excellent。
Additionally, across heat exchange plate 4, (side) flows through the high fluid of temperature (high temperature fluid) overleaf, and flow through the low fluid of temperature (cryogen) surface (for opposite side, and being formed with the side of male and fomale(M&F))。At this, about cryogen, both there is (condensation) situation being changing into liquid from gas, there is also the situation keeping liquid condition。No matter become which kind of situation, in order to improve the heat transfer efficiency of heat exchange plate 4, make cryogen (liquid) side generation turbulent flow, forced convertion all important。Therefore, the all inventors of the present invention are when manufacturing mother metal and the plate motherboard 2 of heat exchange plate, not only consider the spacing P of the height Rz of protuberance 5, the width L of recess 6, protuberance 5, further contemplate the angle η (the erecting angle η of sidewall 7) of protuberance 5, verify the shape easily caused by turbulent flow, the protuberance 5 of forced convertion。
Fig. 9 (a) is the figure, Fig. 9 (b) of the flowing schematically showing the fluid when angle η of protuberance 5 is big is the figure of the flowing of the angle η schematically showing protuberance 5 fluid than Fig. 9 (a) hour。
As shown in Fig. 9 (a), protuberance angle η, in other words constitute the diapire 6a and sidewall 7 angulation η of recess 6 relatively larger time (when sidewall 7 gently erects), fluid becomes easily to be crossed protuberance 5 and is difficult to produce turbulent state。On the other hand, as shown in Fig. 9 (b), when the angle η of protuberance is smaller (when sidewall 7 erects sharp), fluid easily collides with protuberance 5 and easily produces turbulent flow。So, the angle η of protuberance 5 becomes main cause turbulent flow being produced impact and make conductivity of heat convert。That is, when the angle η of protuberance 5 becomes big, there is the tendency that conductivity of heat reduces, on the contrary when the angle η of protuberance 5 diminishes, conductivity of heat improves。Therefore, all inventors of the present invention not only allow for the spacing P of the height Rz of protuberance 5, the width L of recess 6, protuberance 5, are also added into conductivity of heat is produced the angle η of the protuberance 5 of impact, study more appropriate form parameter G2。
That is, above-mentioned parameter " the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6) " is obtained " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6)/protuberance 5 " as form parameter G2 divided by the angle η of protuberance 5。
Figure 10 is the figure relation of form parameter G2 and conductivity of heat increase rate collected。
As shown in Figure 10, when observing the tendency of the tendency of the heat transfer efficiency of condensation when making form parameter G2 increase and decrease and the heat transfer efficiency of forced convertion, both tendencies are identical。Therefore, above-mentioned form parameter G2 can be referred to as the heat-transfer character being best suitable for representing condensation and forced convertion。
At this, for the form parameter G2 of the heat-transfer character that can represent condensation and forced convertion more well, as mentioned above, it is also contemplated that basic demand characteristic and press formability。The figure that this form parameter G2 and press formability when Figure 11 is to be changed by the form parameter G2 " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6)/protuberance 5 " erecting angle η making to comprise protuberance and the relation of heat transfer efficiency are collected。
As shown in figure 11, although along with form parameter G2 increases and the scoring of press formability reduction, if but form parameter G2 is 0.94 μm/below deg, then the scoring that can make press formability is more than 1, it is possible to prevents the generation of necking down and is capable of stamping reliably。That is, if the form parameter also contemplating condensation and forced convertion is 0.94 μm/below deg, then it is prevented from the generation of necking down, and it can be avoided that press formability reduces such situation。
Namely, if so that the parameter represented by " the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6) " add the angle η of protuberance after form parameter G2 become the mode of 0.94 μm/below deg and formed concavo-convex, then can manufacture conductivity of heat very excellent and stamping might as well plate motherboard 2。It should be noted that, as illustrated by the parameter except the angle η of protuberance, form parameter G2 be have also contemplated that the situation of lower limit (guaranteeing that heat transfer efficiency is more than 1.05) as shown in figure 11, it is necessary to making form parameter G2 is 0.14 μm/more than deg。Preferable shape parameter G2 is 0.16 μm/more than deg, more preferably 0.2 μm/more than deg。
It is therefore preferable that form parameter G2 " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6)/protuberance 5 " is 0.14 μm/more than deg and 0.94 μm/below deg。
It addition, when forming protuberance 5, if considering to prevent deformation, then the compression joint area in preferred plate motherboard 2 meets formula (1) than S in the concaveconvex shape of Fig. 2 (a)。
During the yield stress σ y > punching press of flat-sheet material (titanium) on protuberance face pressure (P/S) of effect ... (1)
This, S1=P P tan (θ/180 π)/4
S2=π/4 D D/2
S=compression joint area ratio=S2/S1
Load during P=punch process
The S1 of formula (1) is the area (area of the triangle that straight line A as shown in Figure 2 and straight line B surrounds) of the plane in Fig. 2。The S2 of formula (2) is the area (area of the protuberance existed in above-mentioned triangle) of the protuberance in Fig. 2。
So, by using titanium system and be formed with form parameter G2 on surface be motherboard material 2 concavo-convex as 0.14～0.94 μm/deg such that it is able to not producing when punch process to break manufactures the heat exchange plate 4 of composition heat exchanger when waiting。The conductivity of heat of the heat exchange plate 4 so manufactured is very excellent, it is possible to the heat exchange as gas-liquid uses with plate, and also can use as the heat exchange plate of liquid liquid。
It addition, above-mentioned plate motherboard 2 is identical with the first embodiment, it is possible to use processing unit (plant) 10 as shown in Figure 7 to be formed。So that form parameter G2 becomes the mode of 0.14～0.94 μm/deg and sets the angle η for forming the height Rz of protuberance 5 of protuberance 5 and recess 6, the width L of recess 6, the spacing P of adjacent protuberance, protuberance on processing roller 12。
[the 3rd embodiment]
In the second above-mentioned embodiment, the form parameter G2 erecting angle η comprising protuberance is 0.14～0.94 μm/deg, but in the third embodiment, about form parameter G2, is verified also by experiment etc.。It should be noted that about the structure identical with the second embodiment, omit the description。
The figure that this form parameter G2 and press formability when Figure 12 is to be changed by the form parameter G2 " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance adjacent for width L/ of recess 6)/protuberance 5 " erecting angle η making to comprise protuberance and the relation of heat transfer efficiency are collected。
As shown in figure 12, although along with form parameter G2 increases and the scoring of press formability reduction, if but form parameter G2 is 0.94 μm/below deg, then the scoring that can make press formability is more than 1, it is possible to prevents the generation of necking down and is capable of stamping reliably。That is, if the form parameter G2 also contemplating condensation and forced convertion is 0.94 μm/below deg, then it is prevented from the generation of necking down, and it can be avoided that press formability reduces such situation。That is, that be verified as a result, the higher limit of form parameter G2 needs to be 0.94 μm/below deg, also become the result identical with the second embodiment in the third embodiment。
It addition, when using heat exchange with plate 4 in a variety of applications where, as mentioned above, it is necessary to making heat transfer efficiency is more than 1.05。But, for instance, when heat exchanger plate 4 is used as the heat exchange plate of gas-liquid or the heat exchange of liquid liquid with plate, as long as heat transfer efficiency is ensured more than 1.03。As shown in figure 12, if making form parameter G2 is 0.028 μm/more than deg, then can make heat transfer efficiency is more than 1.03, it is thus preferred to the lower limit of form parameter G2 is 0.028 μm/deg。It should be noted that the "○" of the "●" of the forced convertion shown in Figure 12 and condensation repeats and is roughly the same value。
It addition, when manufacturing plate motherboard 2, so that the mode that form parameter G2 becomes 0.028～0.94 μm/deg uses processing unit (plant) 10 (processing roller 12) to be formed concavo-convex。About manufacture method details, due to identical with the respective embodiments described above, therefore omit the description。
It addition, concavo-convex about what formed on plate motherboard 2, as long as form parameter G2 becomes at least some of of this plate motherboard 2 of scope of 0.14～0.94 μm/deg, it is preferable that throughout the entirety of plate motherboard 2。
Above, the embodiments of the present invention are illustrated, but the present invention is not limited to above-mentioned embodiment, as long as in the scope described in claims, it becomes possible to carry out various change and implement。The application is based on the Japanese patent application (Patent 2011-284605) of the Japanese patent application (Patent 2011-246574) applied in the Japanese patent application (Patent 2011-203422) of JIUYUE in 2011 application on the 16th, the Japanese patent application (Patent 2011-203423) of JIUYUE in 2011 application on the 16th, on November 10th, 2011 and December in 2011 application on the 27th, and its content is taken in this as reference。
Industrial applicibility
The motherboard material of the heat exchange plate of the present invention and employ the heat exchange plate of this motherboard material and be suitable as the motherboard of the plate constituting heat exchanger and employ the heat exchange plate of this motherboard, wherein, this heat exchanger uses in temperature difference generating etc.。
Symbol description:
1 flat-sheet material
The surface of 1a flat-sheet material
2 plate motherboards (motherboard material)
The surface of 2a plate motherboard
3 grooves
4 heat exchange plates
5 protuberances
6 recesses
7 sidewalls
8 table walls
10 processing unit (plant)s
11 transfer rollers
12 processing rollers
13 backing rolls
Claims (8)
1. a motherboard material for heat exchange plate, it is the motherboard material becoming heat exchange plate after implementing punch process, it is characterised in that
It is formed with fine concavo-convex by punch process on the surface of the metal flat-sheet material as former material, described concavo-convex in, protuberance is more than 400 μm for toroidal and its diameter under overlooking, 10 mean roughness Rz of the height of described protuberance are more than 5 μm, and be below the thickness of 0.1 × flat-sheet material, the spacing of adjacent protuberance is more than 600 μm, the width of recess is more than 200 μm, the scope that form parameter G1 is less than 85 μm defined by the height of protuberance × [spacing of the protuberance of the width of recess/adjacent]
Wherein, the unit of the spacing of the thickness of described flat-sheet material, the height of protuberance, the width of recess and adjacent protuberance is μm。
2. the motherboard material of heat exchange plate according to claim 1, it is characterised in that
Formed described concavo-convex on the surface of described motherboard material in the way of making described form parameter G1 become more than 4 μm。
3. the motherboard material of heat exchange plate according to claim 1 and 2, it is characterised in that
Described protuberance is configured to staggered on the surface of flat-sheet material。
4. a heat exchange plate, it is the heat exchange plate described in claim 1 or 2, it is characterised in that
Described heat exchange plate is formed by the motherboard material of described heat exchange plate is carried out punch process。
5. a motherboard material for heat exchange plate, it is the motherboard material becoming heat exchange plate after implementing punch process, it is characterised in that
It is formed with fine concavo-convex by punch process on the surface of the metal flat-sheet material as former material, described concavo-convex in, protuberance is more than 400 μm for toroidal and its diameter under overlooking, 10 mean roughness Rz of the height of described protuberance are more than 5 μm, and be below the thickness of 0.1 × flat-sheet material, the spacing of adjacent protuberance is more than 600 μm, the width of recess is more than 200 μm, the scope that form parameter G2 is 0.94 μm/below deg defined by the height of protuberance × [angle of the spacing/protuberance of the protuberance of the width of recess/adjacent]
Wherein, the unit of the spacing of the thickness of described flat-sheet material, the height of protuberance, the width of recess and adjacent protuberance is μm,
The unit of the angle of described protuberance is deg。
6. the motherboard material of heat exchange plate according to claim 5, it is characterised in that
So that the mode that described form parameter G2 becomes 0.14 μm/more than deg is formed described concavo-convex on the surface of described motherboard material。
7. the motherboard material of heat exchange plate according to claim 5, it is characterised in that
So that the mode that described form parameter G2 becomes 0.028 μm/more than deg is formed described concavo-convex on the surface of described motherboard material。
8. a heat exchange plate, its heat exchange plate according to any one of claim 5～7, it is characterised in that
Described heat exchange plate is formed by the motherboard material of described heat exchange plate is carried out punch process。
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-203423 | 2011-09-16 | ||
| JP2011-203422 | 2011-09-16 | ||
| JP2011203422 | 2011-09-16 | ||
| JP2011203423 | 2011-09-16 | ||
| JP2011246574A JP5208260B2 (en) | 2011-09-16 | 2011-11-10 | Original plate material for heat exchange plate and method for producing original plate material for heat exchange plate |
| JP2011-246574 | 2011-11-10 | ||
| JP2011284605A JP5208264B2 (en) | 2011-09-16 | 2011-12-27 | Original plate material for heat exchange plate and method for producing original plate material for heat exchange plate |
| JP2011-284605 | 2011-12-27 | ||
| PCT/JP2012/073661 WO2013039214A1 (en) | 2011-09-16 | 2012-09-14 | Raw plate material for heat exchanging plate, and heat exchanging plate using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103782125A CN103782125A (en) | 2014-05-07 |
| CN103782125B true CN103782125B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280042807.0A Active CN103782125B (en) | 2011-09-16 | 2012-09-14 | The motherboard material of heat exchange plate and employ the heat exchange plate of this motherboard material |
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| Country | Link |
|---|---|
| US (1) | US20140202677A1 (en) |
| EP (1) | EP2757341B1 (en) |
| KR (1) | KR101563830B1 (en) |
| CN (1) | CN103782125B (en) |
| DK (1) | DK2757341T3 (en) |
| PL (1) | PL2757341T3 (en) |
| WO (1) | WO2013039214A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6219199B2 (en) * | 2014-02-27 | 2017-10-25 | 株式会社神戸製鋼所 | Base plate material to be heat exchange plate, and method for manufacturing the base plate material |
| JP2015175507A (en) * | 2014-03-18 | 2015-10-05 | 株式会社神戸製鋼所 | Titanium weldment pipe and manufacturing method of titanium weldment pipe |
| JP2015193922A (en) * | 2014-03-24 | 2015-11-05 | 三菱重工業株式会社 | Liquid repellent surface fine structure, production method thereof, heat exchanger, and component of air conditioner |
| CN104279905A (en) * | 2014-10-14 | 2015-01-14 | 上海板换机械设备有限公司 | Heat transfer enhancing element for evaporation or condensation process |
| EP3023727B1 (en) * | 2014-11-24 | 2020-01-08 | Taiwan SRP Heat Exchanger Inc. | Fluid guide plate and associated plate heat exchanger |
| KR101839245B1 (en) * | 2016-12-14 | 2018-03-15 | 주식회사 포스코 | Rolling roll for plated steel sheet manufactured thereby |
| CN108691178B (en) * | 2017-03-31 | 2022-04-08 | Bsh家用电器有限公司 | Household appliance comprising at least one metal component |
| EP3382315B1 (en) * | 2017-03-31 | 2019-11-20 | BSH Hausgeräte GmbH | Laundry drying appliance comprising at least one finned-tube heat exchanger |
| US20220299244A1 (en) * | 2021-03-19 | 2022-09-22 | Daikin Industries, Ltd. | Shell and plate heat exchanger for water-cooled chiller and water-cooled chiller including the same |
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| CN201827175U (en) * | 2009-04-17 | 2011-05-11 | 美铝公司 | Carrier |
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| WO1993012897A1 (en) * | 1991-12-25 | 1993-07-08 | Nippon Steel Corporation | Steel sheet superior in coating brightness, anti-scratching properties and workability |
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| JP2012517910A (en) * | 2009-02-17 | 2012-08-09 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | Microstructured superhydrophobic material with flexibility |
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2012
- 2012-09-14 DK DK12832086.8T patent/DK2757341T3/en active
- 2012-09-14 KR KR1020147006764A patent/KR101563830B1/en active IP Right Grant
- 2012-09-14 EP EP12832086.8A patent/EP2757341B1/en active Active
- 2012-09-14 PL PL12832086T patent/PL2757341T3/en unknown
- 2012-09-14 US US14/232,549 patent/US20140202677A1/en not_active Abandoned
- 2012-09-14 CN CN201280042807.0A patent/CN103782125B/en active Active
- 2012-09-14 WO PCT/JP2012/073661 patent/WO2013039214A1/en active Application Filing
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| CN201827175U (en) * | 2009-04-17 | 2011-05-11 | 美铝公司 | Carrier |
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| KR20140049595A (en) | 2014-04-25 |
| US20140202677A1 (en) | 2014-07-24 |
| EP2757341A4 (en) | 2015-10-21 |
| PL2757341T3 (en) | 2020-09-21 |
| DK2757341T3 (en) | 2020-07-27 |
| EP2757341B1 (en) | 2020-05-13 |
| CN103782125A (en) | 2014-05-07 |
| KR101563830B1 (en) | 2015-10-27 |
| EP2757341A1 (en) | 2014-07-23 |
| WO2013039214A1 (en) | 2013-03-21 |
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