CN103782125A - Raw plate material for heat exchanging plate, and heat exchanging plate using same - Google Patents
Raw plate material for heat exchanging plate, and heat exchanging plate using same Download PDFInfo
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- CN103782125A CN103782125A CN201280042807.0A CN201280042807A CN103782125A CN 103782125 A CN103782125 A CN 103782125A CN 201280042807 A CN201280042807 A CN 201280042807A CN 103782125 A CN103782125 A CN 103782125A
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- protuberance
- plate
- heat exchange
- motherboard
- height
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K23/00—Making other articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/086—Heat exchange elements made from metals or metal alloys from titanium or titanium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
This raw plate material for a heat exchanging plate (4) comprises a titanium flat plate (1) having minute depressions and projections on the surface thereof, and the flat plate (1) is press-worked to obtain the heat exchanging plate (4). The shape parameter (G1), defined as [height ([mu]m) of the projections]*[width ([mu]m) of the depressions/pitch ([mu]m) of adjacent projections], is 85 [mu]m or less. Relating to this raw plate material for a heat exchanging plate (4), the shape parameter (G2), defined as [height ([mu]m) of the projections]*[width ([mu]m) of the depressions/pitch ([mu]m) of adjacent projections/angle (deg) of the projections], is 0.94 [mu]m/deg or less.
Description
Technical field
The present invention relates to the motherboard material of heat exchange plate and used the heat exchange plate of this motherboard material.
Background technology
The heat exchange plate being encased in heat-exchangers of the plate type of patent documentation 1 grade etc. requires good heat-transfer character.
Formerly technical literature
Patent documentation
Patent documentation 1: the JP 2009-192140 of Japan communique
Summary of the invention
The problem that invention will solve
The motherboard material that the object of the present invention is to provide a kind of heat exchange plate, its conductivity of heat is very good, and very good as the processability in post processing stamping, and the shaping of the plate that can easily use to heat exchange.
For solving the means of problem
Heat exchange in the present invention forms by be formed with fine concavo-convex metal flat-sheet material on surface with the motherboard material of plate, this flat-sheet material is being implemented to after punch process is used as post processing to become heat exchange plate, about described concavo-convex, with the height by protuberance (μ m) × [width of recess (and μ m)/spacing of adjacent protuberance (μ is m)] the form parameter G1 of definition becomes mode below 85 μ m and sets the surperficial concavo-convex of described motherboard material.
In addition, heat exchange in the present invention forms by be formed with fine concavo-convex metal flat-sheet material on surface with the motherboard material of plate, this flat-sheet material is being implemented to after punch process is used as post processing to become heat exchange plate, about described concavo-convex, with the height by protuberance (μ m) × [width of recess (and μ m)/spacing of adjacent protuberance (μ m)/angle (deg) of protuberance] the form parameter G2 of definition becomes mode below 0.94 μ m/deg and sets the surperficial concavo-convex of described motherboard material.
Invention effect
The motherboard material of the technology of the application of the invention can not produce and the in the situation that of breaking etc., manufactures heat exchange plate in the time of punch process.The heat exchange producing is very good by the conductivity of heat of plate.
Accompanying drawing explanation
Fig. 1 is the figure that represents the manufacture method of heat exchange plate.
Fig. 2 is the allocation plan at the protuberance of the surface of motherboard material formation.
Fig. 3 is another allocation plan at the protuberance of the surface of motherboard material formation.
Fig. 4 is the figure that represents the relation of L × Rz/P and stress concentration ratio.
Fig. 5 is the reference diagram for calculating press formability scoring.
Fig. 6 is the size shape of concaveconvex shape and the relation of heat transfer efficiency and the size shape of concaveconvex shape forming on the surface of motherboard material and the figure of the good relation of press formability that is illustrated in the surface formation of motherboard material.
Fig. 7 is the figure that is illustrated in the overview of the device of the surface formation concaveconvex shape of motherboard material.
Fig. 8 is the key diagram of the shape of explanation protuberance.
Fig. 9 is the figure that represents the angle η of protuberance and the mobile relation of fluid.
Figure 10 is the figure that represents the relation of form parameter G2 and conductivity of heat increase rate.
Figure 11 is the figure that represents the relation of form parameter G2 and conductivity of heat increase rate and press formability.
Figure 12 is the figure that represents the relation of form parameter G2 and conductivity of heat increase rate and press formability.
The specific embodiment
Below, based on used the example of titanium material to describe as flat-sheet material 1.
Titanium is to have anisotropic material, and the deformational behavior of minimizing, the strain gradient etc. of the thickness of slab of the anisotropy counter stress collection center of material exerts an influence.Therefore,, compared with there is no anisotropic other material, the press formability of titanium etc. are variation significantly.In addition, titanium is the material of easily burning, interrupt if there is the oil film of lubricating oil in the time of punching press, and the fracture that easily produces material, or because easily producing damage with contacting of diel or instrument, be difficult to operate.Therefore, utilize the following successful example of titanium material can be applicable to other the metal material such as stainless steel, aluminium.
Below, based on accompanying drawing, embodiments of the present invention are described.
[the first embodiment]
Fig. 1 is the concept map that represents the manufacture method of the heat exchange plate of the first embodiment.
First,, as shown in Fig. 1 (a), the size of regulation will be formed as the flat-sheet material 1 of former material.Then,, as shown in Fig. 1 (b), by flat-sheet material 1 is carried out to punch process, the surperficial 1a producing at flat-sheet material 1 is formed with the plate motherboard (motherboard material) of fine concaveconvex shape.Then, as shown in Fig. 1 (c), be formed with at surperficial 2a on the plate motherboard 2 (motherboard material) of fine concaveconvex shape, by the groove of the stamping multiple chevrons that for example form the height several mm～several cm that are called as " herringbone (herringbone) ", manufacture thus plate 4 for heat exchange.
Flat-sheet material 1 shown in Fig. 1 (a) is titanium material, and desired size, the thickness of slab of heat exchange plate 4 that its size, thickness of slab are considered as final products decides.For the surperficial 1a of this flat-sheet material 1, form fine concaveconvex shape (multiple protuberances 5 and the recess 6 being clipped by protuberance 5) with processing unit (plant) 10 described later, form thus plate motherboard 2.Be formed with the conductivity of heat very good (heet transfer rate is very high) of the plate motherboard 2 of concaveconvex shape.In addition, plate motherboard 2 of the present invention is titanium system, and therefore the characteristic such as corrosion resistance, intensity, lightweight is better than other metals.Thereby plate motherboard 2 is suitable for the product that plate of heat-exchangers of the plate type etc. needs corrosion resistance, intensity.
The herringbone 3 forming on plate motherboard 2 is the multiple chevron grooves that are frame configuration, in the size of groove, is highly several mm～several cm.In these motherboard 2 heat exchanger, pack into.Even if the oblique lattice shape of herringbone 3 representatives such as grade is in the case of the working fluid of heat exchanger inside mobile inhomogeneous, concavo-convex with respect to becoming the wall orthogonal with working fluid from flowing of which direction, thus contribute to the conductivity of heat that turbulent flow brings to improve.
Below, the details of the surperficial concaveconvex shape to plate motherboard 2 is narrated.
As shown in Fig. 2 (a), the protuberance 5 forming at the surperficial 2a of plate motherboard 2 is circular overlooking lower, and the diameter D of this protuberance 5 is more than 400 μ m.Being configured under the overlooking of protuberance 5 is staggered.At this, staggered configuration (interconnected) refers to the meaning of the out-of-line arrangement in center of protuberance 5,5 adjacent on the either party longitudinally and laterally.
Particularly, on plate motherboard 2, adjacent protuberance 5,5 half spacing that can stagger in the horizontal in the vertical.Can also configure as follows protuberance 5: by the straight line connected to each other center of adjacent in the horizontal protuberance 5 (single-point line) A be 60 ° by the straight line connected to each other center of adjacent in the vertical protuberance 5 (single-point line) B angulation θ.
Like this, arrange by protuberance 5 being formed as to staggered grid, in the case of the working fluid in heat exchanger mobile inhomogeneous, concavo-convex with respect to becoming the wall orthogonal with working fluid from flowing of which direction thus, therefore contribute to the conductivity of heat that turbulent flow brings to improve.In addition, for titanium etc. has anisotropic material, can tackle the stress that anisotropy causes and concentrate.
More than the distance L (the width L of recess 6) of 5 of adjacent protuberances is preferably 200 μ m vertical or horizontal.It should be noted that, the width L of recess 6 is in protuberance 5 adjacent laterally or longitudinally beeline each other, can try to achieve by " the spacing P (the diameter D/2 of protuberance 5) × 2 of the protuberance 5 that the width L=of recess 6 is adjacent ".In addition, the spacing P of adjacent protuberance 5 be nearest protuberance 5 adjacent laterally or longitudinally each other in distance (distance between centers each other of the protuberance 5 in beeline) in the heart.
The width L of the recess 6 shown in Fig. 2 (a) is being longitudinally and transversely identical value., in the vertical distance each other of adjacent protuberance 5 and in the horizontal adjacent protuberance 5 distance be each other all identical value.Preferably the spacing P (distance between centers of protuberance 5) of adjacent protuberance 5 is more than 600 μ m.
As shown in Fig. 2 (b), the protuberance 5 forming on the surface of plate motherboard 2 is configured to roughly trapezoidal shape by the sidewall 7 erecting upward under analysing and observe and table wall 8 that the upper limb of this sidewall 7 is flatly linked.In other words, be provided with par at the top of protuberance 5.The height (following, to be sometimes expressed as height Rz) of the protuberance 5 (sidewall 7) representing with 10 mean roughness Rz is more than 5 μ m, and is below 1/10 (1/10th) of thickness of slab t of plate motherboard 2.
Make the height Rz of protuberance 5 for this scope is due in the time that concaveconvex shape is excessive with respect to thickness of slab, in the time of the rolling transfer printing of being undertaken by processing unit (plant) 10 described later, cannot guarantee flatness (shape), cannot obtain the cause of rolling stability.And, also due in the case of the plate that cannot guarantee flatness, in the time of subsequent handling stamping, produce stress distribution, thereby produce and break at the high position of stress.That is, if the height Rz of protuberance 5 is excessive in the time of punch process, become the reason (starting point) of breaking, and become the reason of damage.On the other hand, if height Rz too little (being that 5 μ m are following) cannot realize the raising of heat transfer efficiency.
In addition, the plan view shape of protuberance 5 is not circular completely, comprises that flat ratio is the ellipse of 0.2 left and right yet.It should be noted that, about the plan view shape of protuberance 5, in addition also considering has various shapes such as square, but from avoid carrying out subsequent handling punch process time the concentrated viewpoint of stress, the plan view shape of protuberance 5 is preferably circular.
In addition, the interconnected state of protuberance 5 is not defined as the configuration status of Fig. 2 yet.
Example as shown in Figure 3, can also configure protuberance 5 as follows: by the straight line connected to each other center of adjacent in the horizontal protuberance 5 (single-point line) A ' be 45 ° by the straight line connected to each other center of adjacent in the vertical protuberance 5 (single-point line) B ' angulation θ.Angle θ can be also other angle.
About the concaveconvex shape of above such plate motherboard 2, the item that becomes its basis is described.
The all inventors of the present invention are in the time manufacturing plate motherboard 2, meet the desired parameter that requires characteristic (heat-transfer character etc.) for the spacing P of number (the width L of recess 6), adjacent protuberance of height Rz, protuberance 5 of the protuberance 5 forming on the surface of plate motherboard 2 is become, and found the form parameter G1 " [the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent]) " of the concaveconvex shape that comprises above-mentioned parameter.
First, in above-mentioned form parameter G1, in the time considering that the height Rz of protuberance 5 is fixed and the spacing P (L/P) of the protuberance that the width L/ of recess 6 is adjacent is changed, as shown in Figure 4, along with L/P increases and stress concentration ratio exists the tendency increasing.That is, in the time that the width L of recess 6 spacing P excessive or protuberance is narrow, stress occurs to concentrate, thereby becomes easy situation of breaking in the time implementing stamping (for the punch process of the herringbone that is shaped etc.) etc.
On the other hand, in above-mentioned form parameter G1, in the time considering the situation of the height Rz that improves protuberance 5, same with the spacing P of the width L of recess 6 or adjacent protuberance, in the time that enforcement is stamping, produces inhomogeneous stress distribution, thereby may produce and break at the high position of stress.
Therefore,, in the time considering the press formability of plate motherboard 2, the height Rz of protuberance 5 or the situation that the width L of recess 6 is not excessive and the spacing P of protuberance is not narrow are the most applicable.Think that the form parameter G1 that represents above-mentioned parameter exists higher limit.
Therefore, the all inventors of the present invention are by the plate motherboard 2 of the concavo-convex titanium system that is formed with various shapes being tested etc., the relation of clear and definite form parameter G1 " [the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent]) " and press formability.
In the evaluation test of evaluating in the formability in punch process (press formability), first, as shown in Figure 5, the herringbone that is shaped on plate motherboard 2 (groove) 3 plate 4 for heat exchange that is shaped.In the time making, first, prepare the mould of a shaping use corresponding with heat exchanger service condition in advance.Then,, by mould, the herringbone that is shaped on plate motherboard 23 is made multiple plates 4 for heat exchange.Multiple heat exchanges are made by the different condition of every 0.1mm with forming height of plate 4.In the plate for evaluation of producing (plate 4 for heat exchange), evaluate as the amount of being pressed into using the shaping boundary height (not producing the maximum forming height of necking down) of the mould that do not produce necking down.
In above-mentioned evaluation test, the situation that the amount of being pressed into is large can be referred to as to be difficult to produce necking down and press formability is good, in evaluation test, the situation that the amount of being pressed into is little can be referred to as outer easy generation necking down and press formability poor.Like this, in evaluation test, can be to starting to shrink the Forming depth of (necking down), the dependent variable that can tolerate shaping is evaluated.
The scoring of the press formability of Fig. 6 is the scoring that the above-mentioned amount of being pressed into standardization is represented, if it is more than 1 that all inventors of the present invention have confirmed the scoring of press formability, can prevent the generation of necking down, and can realize stamping reliably simultaneously.
As shown in Figure 6, although reduce along with form parameter G1 becomes scoring large and press formability, if form parameter G1 is below 85 μ m, the scoring that can make press formability is more than 1.Thus, can prevent the generation of necking down.That is, if form parameter G1 is below 85 μ m, can prevent the generation of necking down, therefore can avoid press formability to reduce such situation.
It should be noted that, if form parameter G1 is below 65 μ m, can further prevent increase that partial face that the uneven distribution of the lubricating status of the increase of following height of concave convex causes is pressed or the generation of burn phenomenon.Thus, all inventors of the present invention wait the fault of having confirmed in the time not producing punch process and can manufacture reliably plate 4 for heat exchange by experiment.
As mentioned above, if form parameter G1 is below 85 μ m, can avoid press formability to reduce such situation, but plate motherboard of the present invention 2 is for the basis of the plate of formation heat exchanger, for carrying out the next door of heat exchange.Therefore,, in plate motherboard 2 of the present invention, also require heet transfer rate large (heat transfer efficiency is large).
Therefore,, when the heat transfer efficiency that will " not form the flat board of concaveconvex shape " is as 1.00, while considering to be formed with the heat transfer efficiency of plate (heat exchange plate) of concaveconvex shape, heat exchange need to be larger than 1.00 with the heat transfer efficiency of plate.And, in actual heat exchanger, in order to play significant effect, expect that heat transfer efficiency is more than 1.05.
At this, the relation of Consideration of Heat Transfer efficiency and form parameter G1.For example, by reducing the height Rz of protuberance 5, or reduce the width L of recess 6, or increase the spacing P of protuberance, make thus form parameter G1 reduce gradually from 85 μ m.Like this, in the time that form parameter G1 is reduced gradually, as shown in Figure 6, heat transfer efficiency also reduces gradually, thereby heat transfer efficiency approaches and do not form concavo-convex flat board.But, if form parameter G1 is more than 4 μ m, can guarantee the needed heat transfer efficiency of actual heat exchanger (more than 1.05).
Therefore,, from the aspect of heat transfer efficiency, in the time manufacturing plate motherboard 2, it is more than 4 μ m preferably making form parameter G1.Further preferable shape parameter G1 is larger than 12 μ m, and more preferably form parameter G1 exceedes 12 μ m and is below 85 μ m.
In addition, more reduce the width L of recess 6, form parameter G1 more diminishes.If the viewpoint of the temperature boundary layer when flowing through fluid considers, when the width L of recess 6 too hour, can cause the reduction of conductivity of heat, therefore the width L of recess 6 also guarantees that certain degree is for well., think that form parameter G1 also needs large certain degree.
Like this, from the relation property of the width L of temperature boundary layer and recess 6, even if form parameter G1 is below 85 μ m, also need to guarantee certain degree.Particularly, as mentioned above, think that form parameter G1 need to be more than 4 μ m.Making form parameter G1 is any value in 4 μ m～85 μ m, and as previously mentioned, the height Rz that makes protuberance 5 i.e. 10 mean roughness Rz is that 5 μ m are above and (thickness × 0.1 of flat-sheet material) below μ m, thereby certainty ground determines the width L (or spacing P of protuberance 5) of (can draw) recess 6.
In addition, the processability in the stamping press of implementing in subsequent handling if consider or prevent the distortion of protuberance 5, preferably the compression joint area in plate motherboard 2 meets formula (1) in the concaveconvex shape of Fig. 2 (a) than S.
The face acting on protuberance when the yield stress σ y > punching press of flat-sheet material (titanium) is pressed (P/S) ... (1)
At this, S1=PPtan (θ/180 π)/4
S2=π／4·D·D／2
S=compression joint area ratio=S2/S1
Load when P=punch process
The S1 of formula (1) is the area (the leg-of-mutton area that straight line A as shown in Figure 2 and straight line B surround) of the plane in Fig. 2.The S2 of formula (2) is the area (area of the protuberance existing in above-mentioned triangle) of the protuberance in Fig. 2.
Like this, by using titanium system and be formed with form parameter G1 on surface be the such concavo-convex motherboard materials 2 of 4 μ m～85 μ m, the in the situation that of grade, manufacture the plate 4 for heat exchange of formation heat exchanger thereby can not produce to break in the time of punch process.The heat exchange of manufacturing is like this more than 1.05 with the rate of heat exchange of plate 4, and conductivity of heat is very good, and it is very high to have packed the heat exchanger effectiveness of heat exchanger of this heat exchange use plate 4 into.
In addition, above-mentioned plate motherboard 2 can form with processing unit (plant) 10 as shown in Figure 7.This processing unit (plant) 10 possesses transfer roller 11, working roll 12, backing roll 13.Transfer roller 11, for transferring flat-sheet material 1, is configured in upstream side and downstream in the time that working roll 12 is observed.
Working roll 12 is to form micron order (a few μ m～hundreds of μ concavo-convex roller m) on the surface of the flat-sheet material 1 of transferring.Particularly, working roll 12, to make form parameter G1 become the mode of 4 μ m～85 μ m on the plate motherboard 2 after processing, forms protuberance 5 and recess 6 at the surperficial 1a of flat-sheet material 1., so that becoming the mode of 4 μ m～85 μ m, form parameter G1 on working roll 12, sets the spacing P of the width L of the height Rz of the protuberance 5 that is used to form protuberance 5 and recess 6, recess 6, adjacent protuberance.
By etching or electric spark texturing, become the processing department 14 of convex (trapezoidal projection) at the complete cycle of the outer peripheral face of working roll 12.The height of processing department 14 so that the height Rz of protuberance 5 in the plate motherboard 2 after processing to be 5 μ m above and set for (thickness t × 0.1 of flat-sheet material) mode below μ m.From the viewpoint of resistance to load or mar proof, the superficial layer of working roll 12 can plate Cr or tungsten carbide processing.
In this processing unit (plant) 10, working roll 12 is rotated, and make the processing department 14 arranging on working roll 12 compress to the surface of flat-sheet material 1 simultaneously, can on the surface of this flat-sheet material 1, form thus the protuberance 5 identical with the shape that processing department 14 is put upside down and recess 6.That is, by processing unit (plant) 10, can form the irregular plate motherboard 2 of tool, this concavo-convex form parameter G1 is below 4 μ m～85 μ m, and height Rz is more than 5 μ m and below 10% of thickness of slab t.It should be noted that, the formation of protuberance 5 is not defined as the machining of above-mentioned processing unit (plant) etc., can be the processing of the chemistry such as etch processes yet.
Heat exchange is manufactured by plate motherboard 2 of the present invention is carried out to punch process with plate 4, but the punch process of plate motherboard 2 how can, can be also not form lambdoid punch process as described above.
In addition, concavo-convex about what form on plate motherboard 2, form parameter G1 becomes the scope below 4 μ m～85 μ m as long as be at least a portion of this plate motherboard 2, the entirety that preferably spreads all over plate motherboard 2.
[the second embodiment]
Suitably omit with the part that above-mentioned the first embodiment is general, below, the second embodiment is described.
Below, the details of the surperficial concaveconvex shape to plate motherboard 2 are narrated.
As shown in Figure 8, the sidewall 7 that the protuberance 5 forming on the surperficial 2a of plate motherboard 2 is erected by through-thickness (thickness direction of plate motherboard 2) and the table wall 8 that the upper end of sidewall 7 (upper limb) linked form.In other words, be provided with par at the top of protuberance 5.In the time that protuberance 5 is cylindrical shape or cone shape, sidewall 7 is one, but in the time that protuberance 5 is prism shape or pyramidal shape, sidewall 7 is multiple.
As shown in Fig. 2 (a), the protuberance 5 forming at the surperficial 2a of plate motherboard 2 is circular overlooking lower, and its diameter D is more than 400 μ m.Configuration under the overlooking of protuberance 5 is identical with embodiment 1, for staggered, in addition, more than the spacing P of adjacent protuberance 5 (distance between centers of protuberance 5, that is, distance in the heart in table wall 8) is preferably 600 μ m.
As shown in Fig. 2 (b), identical with the first embodiment, the protuberance 5 forming on the surface of plate motherboard 2 is configured to roughly trapezoidal shape.The height (height Rz) of the protuberance 5 (sidewall 7) being represented by 10 mean roughness Rz is more than 5 μ m, and is below 1/10 (1/10th) of thickness of slab t of plate motherboard 2.The Rz of the protuberance 5 of plate motherboard 2 is for example 25 about μ m (if represent with Ra, being 10 μ m left and right).
About the concaveconvex shape of the plate motherboard 2 of the second embodiment, the item that becomes its basis is described.
The all inventors of the present invention are in the time manufacturing plate motherboard 2, for the number (the width L of recess 6), spacing P, the angle η of protuberance of adjacent protuberance of the height Rz, the protuberance 5 that make the protuberance 5 forming on the surface of plate motherboard 2 become optimal parameter, and be conceived to the form parameter G2 " the angle η of the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent])/protuberance " of the concaveconvex shape that comprises above-mentioned parameter.
First, in above-mentioned form parameter G2, in the time considering that the height Rz of protuberance 5 is fixed and the spacing P (L/P) of the protuberance that the width L/ of recess 6 is adjacent is changed, as shown in Figure 4, along with L/P increases and stress concentration ratio exists the tendency increasing.That is, excessive as the width L of recess 6, or the spacing P of protuberance is when narrow, and stress occurs to concentrate, thereby becomes easy situation of breaking in the time implementing stamping (for the punch process of the herringbone that is shaped etc.) etc.
On the other hand, in above-mentioned form parameter G2, in the time considering make the height Rz variation of protuberance 5 and improve the situation of height Rz of protuberance 5, same with the spacing P of the width L of recess 6 or adjacent protuberance, in the time that enforcement is stamping, produce inhomogeneous stress distribution, thereby may produce and break at the high position of stress.
Therefore, in the time considering the press formability of plate motherboard 2, the height Rz of protuberance 5 or the situation that the width L of recess 6 is not excessive and the spacing P of protuberance is not narrow are the most applicable, think that the parameter that represents above-mentioned parameter exists higher limit.
Fig. 6 is the figure that the relation of this parameter when making except the erecting parameter angle η " the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent) " and change of above-mentioned protuberance and press formability and heat transfer efficiency is collected.The scoring of the press formability of Fig. 6 is by the amount of the being pressed into standardization shown in following and the scoring representing.
At this, the evaluation test that the formability in punch process (press formability) is evaluated is identical with the first embodiment, and therefore description thereof is omitted.
As shown in Figure 6, although reduce along with parameter becomes scoring large and press formability, if parameter is below 85 μ m, the scoring that can make press formability is more than 1, can prevent the generation of necking down and realize stamping reliably simultaneously.
As mentioned above, plate motherboard 2 of the present invention is for the basis of the plate of formation heat exchanger, for carrying out the next door of heat exchange.Therefore,, in plate motherboard 2 of the present invention, in actual heat exchanger, in order to play significant effect, expect that heat transfer efficiency is more than 1.05.
At this, the relation of Consideration of Heat Transfer efficiency and parameter.For example, by reducing the height Rz of protuberance 5, or reduce the width L of recess 6, or increase the spacing P of protuberance, make thus parameter reduce gradually from 85 μ m.As shown in Figure 6, in the time that parameter is reduced gradually, heat transfer efficiency also reduces gradually, thereby heat transfer efficiency approaches and do not form concavo-convex flat board.But, if parameter is more than 4 μ m, can guarantee the needed heat transfer efficiency of actual heat exchanger (more than 1.05).Therefore,, from the aspect of heat transfer efficiency, in the time manufacturing plate motherboard 2, the parameter that preferably makes to be represented by " the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent) " is that 4 μ m are above and below 85 μ m.
As mentioned above, by setting the width L of height Rz, recess 6 and the spacing P of adjacent protuberance of protuberance 5, thereby can manufacture the plate motherboard 2 that press formability is good and conductivity of heat is good.
In addition, across heat exchange with plate 4 overleaf (side) flow through the fluid that temperature is high (high temperature fluid), and flow through the fluid that temperature is low (cryogen) on surface (be opposite side, and be formed with a side of male and fomale(M&F)).At this, about cryogen, both there is (condensing) situation that is varied to liquid from gas, also there is the situation that keeps liquid condition.No matter become which kind of situation, in order to improve the heat exchange heat transfer efficiency of plate 4, make cryogen (liquid) side produce turbulent flow, forced convertion is all important.Therefore, the all inventors of the present invention are in the time that manufacture heat exchange is plate motherboard 2 with the mother metal of plate, not only consider height Rz, the width L of recess 6, the spacing P of protuberance 5 of protuberance 5, also consider the angle η (sidewall 7 erect angle η) of protuberance 5, verify the shape of the protuberance 5 that easily causes turbulent flow, forced convertion.
Fig. 9 (a) is the mobile figure that schematically shows the angle η of protuberance 5 fluid when large, and Fig. 9 (b) is the mobile figure of the fluid of angle η than Fig. 9 (a) hour that schematically show protuberance 5.
As shown in Fig. 9 (a), at the angle η of protuberance, the diapire 6a that in other words forms recess 6 and sidewall 7 angulation η, when larger (when sidewall 7 gently erects), fluid becomes easily to be crossed protuberance 5 and is difficult to produce turbulent state.On the other hand, as shown in Fig. 9 (b), in the time that the angle η of protuberance is smaller (when sidewall 7 erects sharp), fluid easily collides with protuberance 5 and easily produces turbulent.Like this, the angle η of protuberance 5 becomes turbulent flow is exerted an influence and makes the main cause of conductivity of heat conversion.That is, in the time that the angle η of protuberance 5 becomes large, the tendency that exists conductivity of heat to reduce, contrary in the time that the angle η of protuberance 5 diminishes, conductivity of heat improves.Therefore, all inventors of the present invention have not only considered height Rz, the width L of recess 6, the spacing P of protuberance 5 of protuberance 5, have also added the angle η of the protuberance 5 that conductivity of heat is exerted an influence, and study more suitable form parameter G2.
, above-mentioned parameter " the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent) " is obtained to " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent)/protuberance 5 " as form parameter G2 divided by the angle η of protuberance 5.
Figure 10 is the figure that the relation of form parameter G2 and conductivity of heat increase rate is collected.
As shown in figure 10, when the tendency of the heat transfer efficiency condensing when observation makes form parameter G2 increase and decrease and the tendency of the heat transfer efficiency of forced convertion, both tendencies are identical.Therefore, above-mentioned form parameter G2 can be referred to as that the most applicable expression is condensed and the heat-transfer character of forced convertion.
At this, for can represent more well to condense and the form parameter G2 of the heat-transfer character of forced convertion for, as mentioned above, also consider that basic demand characteristic is press formability.Figure 11 is the figure that the relation of this form parameter G2 when the form parameter G2 that erects angle η that makes to comprise protuberance " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent)/protuberance 5 " is changed and press formability and heat transfer efficiency is collected.
As shown in figure 11, although along with form parameter G2 increases and the scoring reduction of press formability, if but form parameter G2 is below 0.94 μ m/deg, the scoring that can make press formability is more than 1, can prevents the generation of necking down and can realize stamping reliably.That is, condense if also considered and the form parameter of forced convertion is below 0.94 μ m/deg, can prevent the generation of necking down, and can avoid press formability to reduce such situation.
; if so that the parameter being represented by " the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent) " added form parameter G2 after the angle η of protuberance become mode below 0.94 μ m/deg form concavo-convex, can manufacture conductivity of heat very good and stamping might as well plate motherboard 2.It should be noted that, as by except the parameter the angle η of protuberance describes, as shown in figure 11, it is more than 0.14 μ m/deg need to making form parameter G2 to the situation (guaranteeing that heat transfer efficiency is more than 1.05) that form parameter G2 has also been considered to lower limit.Preferable shape parameter G2 is more than 0.16 μ m/deg, more preferably more than 0.2 μ m/deg.
Therefore, preferable shape parameter G2 " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent)/protuberance 5 " is that 0.14 μ m/deg is above and below 0.94 μ m/deg.
In addition, in the time forming protuberance 5, prevent distortion if consider, the compression joint area in preferred plate motherboard 2 meets formula (1) in the concaveconvex shape of Fig. 2 (a) than S.
The face acting on protuberance when the yield stress σ y > punching press of flat-sheet material (titanium) is pressed (P/S) ... (1)
At this, S1=PPtan (θ/180 π)/4
S2=π／4·D·D／2
S=compression joint area ratio=S2/S1
Load when P=punch process
The S1 of formula (1) is the area (the leg-of-mutton area that straight line A as shown in Figure 2 and straight line B surround) of the plane in Fig. 2.The S2 of formula (2) is the area (area of the protuberance existing in above-mentioned triangle) of the protuberance in Fig. 2.
Like this, by using titanium system and be formed with form parameter G2 on surface be the such concavo-convex motherboard material 2 of 0.14～0.94 μ m/deg, the in the situation that of grade, manufacture the plate 4 for heat exchange of formation heat exchanger thereby can not produce to break in the time of punch process.The heat exchange of manufacturing is like this very good by the conductivity of heat of plate 4, and the heat exchange that can use as gas-liquid is used with plate, and the heat exchange plate that can use as liquid liquid uses.
In addition, above-mentioned plate motherboard 2 is identical with the first embodiment, can form with processing unit (plant) 10 as shown in Figure 7.So that becoming the mode of 0.14～0.94 μ m/deg, form parameter G2 on working roll 12, sets spacing P, the angle η of protuberance of the width L of the height Rz of the protuberance 5 that is used to form protuberance 5 and recess 6, recess 6, adjacent protuberance.
[the 3rd embodiment]
In the second above-mentioned embodiment, the form parameter G2 that erects angle η that comprises protuberance is 0.14～0.94 μ m/deg, but in the 3rd embodiment, about form parameter G2, also waits and verify by experiment.It should be noted that, about the structure identical with the second embodiment, description thereof is omitted.
Figure 12 is the figure that the relation of this form parameter G2 when the form parameter G2 that erects angle η that makes to comprise protuberance " the angle η (deg) of the height Rz of protuberance 5 × (the spacing P of the protuberance that the width L/ of recess 6 is adjacent)/protuberance 5 " is changed and press formability and heat transfer efficiency is collected.
As shown in figure 12, although along with form parameter G2 increases and the scoring reduction of press formability, if but form parameter G2 is below 0.94 μ m/deg, the scoring that can make press formability is more than 1, can prevents the generation of necking down and can realize stamping reliably.That is, condense if also considered and the form parameter G2 of forced convertion is below 0.94 μ m/deg, can prevent the generation of necking down, and can avoid press formability to reduce such situation., the result of verifying is that the higher limit of form parameter G2 need to be below 0.94 μ m/deg, in the 3rd embodiment, also becomes the result identical with the second embodiment.
In addition, the in the situation that of using heat exchange plate 4 in various uses, as mentioned above, it is more than 1.05 need to making heat transfer efficiency.But, for example, the heat exchange plate of using at heat exchange plate that heat exchanger plate 4 is used as gas-liquid or liquid liquid uses, as long as heat transfer efficiency is guaranteed to be more than 1.03.As shown in figure 12, be more than 0.028 μ m/deg if make form parameter G2, it is more than 1.03 can making heat transfer efficiency, therefore the lower limit of preferable shape parameter G2 is 0.028 μ m/deg.It should be noted that, the "●" of the forced convertion shown in Figure 12 and the "○" of condensing repeat and are roughly the same value.
In addition, in the time manufacturing plate motherboard 2, so that becoming the mode of 0.028～0.94 μ m/deg, form parameter G2 use processing unit (plant) 10 (working roll 12) to form concavo-convex.About manufacture method details, due to identical with the respective embodiments described above, therefore description thereof is omitted.
In addition, concavo-convex about what form on plate motherboard 2, form parameter G2 becomes the scope of 0.14～0.94 μ m/deg as long as at least a portion of this plate motherboard 2, the entirety that preferably spreads all over plate motherboard 2.
Above, the embodiments of the present invention are illustrated, but the present invention is not limited to above-mentioned embodiment, as long as in the scope of recording at claims, just can carry out various changes and implement.Japanese patent application (Patent 2011-203422), the Japanese patent application (Patent 2011-203423) of 2011 year September 16 day application, the Japanese patent application (Patent 2011-246574) of 2011 year November 10 day application and the Japanese patent application (Patent 2011-284605) of 2011 year December 27 day application of the application based on application on September 16th, 2011, and be taken in this its content as reference.
Industrial applicibility
Heat exchange of the present invention is with the motherboard material of plate and used the heat exchange plate of this motherboard material to be suitable as the motherboard of the plate that forms heat exchanger and used the heat exchange plate of this motherboard, wherein, and the use in temperature difference generating etc. of this heat exchanger.
Symbol description:
1 flat-sheet material
The surface of 1a flat-sheet material
2 plate motherboards (motherboard material)
The surface of 2a plate motherboard
3 grooves
4 heat exchange plates
5 protuberances
6 recesses
7 sidewalls
8 table walls
10 processing unit (plant)s
11 transfer rollers
12 working rolls
13 backing rolls
Claims (10)
1. a motherboard material for plate for heat exchange, it is at the motherboard material of implementing to become after punch process heat exchange plate, it is characterized in that,
Be formed with on the surface of the metal flat-sheet material as former material fine concavo-convex, the described concavo-convex height by protuberance (μ m) × [width of recess (and μ m)/spacing of adjacent protuberance (μ is m)] the form parameter G1 of definition is the scope below 85 μ m.
2. the motherboard material of plate for heat exchange according to claim 1, is characterized in that,
So that the mode that described form parameter G1 becomes more than 4 μ m forms described concavo-convex on the surface of described motherboard material.
3. the motherboard material of plate for heat exchange according to claim 1 and 2, is characterized in that,
Described protuberance is toroidal overlooking lower, is configured to staggered on the surface of flat-sheet material.
4. the motherboard material of plate for heat exchange according to claim 1 and 2, is characterized in that,
10 mean roughness Rz of the height of described protuberance are more than 5 μ m, and be 0.1 × flat-sheet material thickness (μ m) below.
5. a heat exchange plate, it is the heat exchange plate described in claim 1 or 2, it is characterized in that,
Described heat exchange forms by the motherboard material of described heat exchange plate is carried out to punch process with plate.
6. a motherboard material for plate for heat exchange, it is at the motherboard material of implementing to become after punch process heat exchange plate, it is characterized in that,
Be formed with on the surface of the metal flat-sheet material as former material fine concavo-convex, the described concavo-convex height by protuberance (μ m) × [width of recess (and μ m)/spacing of adjacent protuberance (μ m)/angle (deg) of protuberance] the form parameter G2 of definition is the scope below 0.94 μ m/deg.
7. the motherboard material of plate for heat exchange according to claim 6, is characterized in that,
So that the mode that described form parameter G2 becomes more than 0.14 μ m/deg forms described concavo-convex on the surface of described motherboard material.
8. the motherboard material of plate for heat exchange according to claim 6, is characterized in that,
So that the mode that described form parameter G2 becomes more than 0.028 μ m/deg forms described concavo-convex on the surface of described motherboard material.
9. the motherboard material with plate according to the heat exchange described in any one in claim 6～8, is characterized in that,
10 mean roughness Rz of the height of described protuberance are more than 5 μ m, and be 0.1 × flat-sheet material thickness (μ m) below.
10. a heat exchange plate, it is the heat exchange plate described in any one in claim 6～8, it is characterized in that,
Described heat exchange forms by the motherboard material of described heat exchange plate is carried out to punch process with plate.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-203423 | 2011-09-16 | ||
| JP2011-203422 | 2011-09-16 | ||
| JP2011203423 | 2011-09-16 | ||
| JP2011203422 | 2011-09-16 | ||
| JP2011-246574 | 2011-11-10 | ||
| JP2011246574A JP5208260B2 (en) | 2011-09-16 | 2011-11-10 | Original plate material for heat exchange plate and method for producing original plate material for heat exchange plate |
| JP2011284605A JP5208264B2 (en) | 2011-09-16 | 2011-12-27 | Original plate material for heat exchange plate and method for producing original plate material for heat exchange plate |
| JP2011-284605 | 2011-12-27 | ||
| PCT/JP2012/073661 WO2013039214A1 (en) | 2011-09-16 | 2012-09-14 | Raw plate material for heat exchanging plate, and heat exchanging plate using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103782125A true CN103782125A (en) | 2014-05-07 |
| CN103782125B CN103782125B (en) | 2016-06-22 |
Family
ID=50573002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280042807.0A Active CN103782125B (en) | 2011-09-16 | 2012-09-14 | The motherboard material of heat exchange plate and employ the heat exchange plate of this motherboard material |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140202677A1 (en) |
| EP (1) | EP2757341B1 (en) |
| KR (1) | KR101563830B1 (en) |
| CN (1) | CN103782125B (en) |
| DK (1) | DK2757341T3 (en) |
| PL (1) | PL2757341T3 (en) |
| WO (1) | WO2013039214A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279905A (en) * | 2014-10-14 | 2015-01-14 | 上海板换机械设备有限公司 | Heat transfer enhancing element for evaporation or condensation process |
| CN110062669A (en) * | 2016-12-14 | 2019-07-26 | Posco公司 | Roll and the coated steel sheet manufactured by it |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6219199B2 (en) * | 2014-02-27 | 2017-10-25 | 株式会社神戸製鋼所 | Base plate material to be heat exchange plate, and method for manufacturing the base plate material |
| JP2015175507A (en) * | 2014-03-18 | 2015-10-05 | 株式会社神戸製鋼所 | Titanium weldment pipe and manufacturing method of titanium weldment pipe |
| JP2015193922A (en) * | 2014-03-24 | 2015-11-05 | 三菱重工業株式会社 | Liquid repellent surface fine structure, production method thereof, heat exchanger, and component of air conditioner |
| EP3023727B1 (en) * | 2014-11-24 | 2020-01-08 | Taiwan SRP Heat Exchanger Inc. | Fluid guide plate and associated plate heat exchanger |
| EP3382315B1 (en) * | 2017-03-31 | 2019-11-20 | BSH Hausgeräte GmbH | Laundry drying appliance comprising at least one finned-tube heat exchanger |
| CN108691178B (en) * | 2017-03-31 | 2022-04-08 | Bsh家用电器有限公司 | Household appliance comprising at least one metal component |
| US11976856B2 (en) * | 2021-03-19 | 2024-05-07 | Daikin Industries, Ltd. | Shell and plate heat exchanger for water-cooled chiller and water-cooled chiller including the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030136547A1 (en) * | 2001-12-06 | 2003-07-24 | Dieter Gollan | Heat transfer surface with a microstructure of projections galvanized onto it |
| WO2010143564A1 (en) * | 2009-06-08 | 2010-12-16 | 株式会社神戸製鋼所 | Metal plate used for heat exchange and method for manufacturing metal plate used for heat exchange |
| CN201827175U (en) * | 2009-04-17 | 2011-05-11 | 美铝公司 | Carrier |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2290623A1 (en) * | 1974-11-06 | 1976-06-04 | Lorraine Laminage | SHEET FOR DEEP OR EXTRA-DEEP STAMPING AND PROCESS FOR OBTAINING SUCH SHEET |
| CA1155107A (en) * | 1981-02-11 | 1983-10-11 | Theodore C. Carnavos | Heat transfer boiling surface |
| JP2995950B2 (en) * | 1991-10-04 | 1999-12-27 | 住友金属工業株式会社 | Roll for cold rolling and method for rolling metal sheet |
| CA2126458A1 (en) * | 1991-12-25 | 1993-07-08 | Tetsuya Nishiura | Steel sheet excellent in coating sharpness, defect-formation resistance and workability |
| WO1995007774A1 (en) * | 1993-09-17 | 1995-03-23 | Sidmar N.V. | Method and device for manufacturing cold rolled metal sheets or strips, and metal sheets or strips obtained |
| DE9408904U1 (en) * | 1994-05-31 | 1994-08-11 | Hans Güntner GmbH, 82256 Fürstenfeldbruck | Plate heat exchanger |
| JP4062961B2 (en) * | 2001-06-07 | 2008-03-19 | Ｊｆｅスチール株式会社 | High tensile hot-rolled steel sheet excellent in mold galling resistance and fatigue resistance and method for producing the same |
| KR100407377B1 (en) * | 2001-10-30 | 2003-11-28 | 전자부품연구원 | Method for manufacturing micro device and method of manufacturing mold for molding the same |
| JP2009192140A (en) | 2008-02-14 | 2009-08-27 | Atago Seisakusho:Kk | Plate type heat exchanger |
| JP2011530443A (en) * | 2008-08-05 | 2011-12-22 | アルコア インコーポレイテッド | Metal sheets and plates having friction-reducing textured surfaces and methods for their production |
| KR20110139228A (en) * | 2009-02-17 | 2011-12-28 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | Flexible microstructured superhydrophobic materials |
| AU2010341861B2 (en) * | 2010-01-15 | 2015-04-23 | Rigidized Metals Corporation | Methods of forming enhanced-surface walls for use in apparatae |
-
2012
- 2012-09-14 EP EP12832086.8A patent/EP2757341B1/en active Active
- 2012-09-14 US US14/232,549 patent/US20140202677A1/en not_active Abandoned
- 2012-09-14 DK DK12832086.8T patent/DK2757341T3/en active
- 2012-09-14 PL PL12832086T patent/PL2757341T3/en unknown
- 2012-09-14 KR KR1020147006764A patent/KR101563830B1/en active IP Right Grant
- 2012-09-14 CN CN201280042807.0A patent/CN103782125B/en active Active
- 2012-09-14 WO PCT/JP2012/073661 patent/WO2013039214A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030136547A1 (en) * | 2001-12-06 | 2003-07-24 | Dieter Gollan | Heat transfer surface with a microstructure of projections galvanized onto it |
| CN201827175U (en) * | 2009-04-17 | 2011-05-11 | 美铝公司 | Carrier |
| WO2010143564A1 (en) * | 2009-06-08 | 2010-12-16 | 株式会社神戸製鋼所 | Metal plate used for heat exchange and method for manufacturing metal plate used for heat exchange |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279905A (en) * | 2014-10-14 | 2015-01-14 | 上海板换机械设备有限公司 | Heat transfer enhancing element for evaporation or condensation process |
| CN110062669A (en) * | 2016-12-14 | 2019-07-26 | Posco公司 | Roll and the coated steel sheet manufactured by it |
Also Published As
| Publication number | Publication date |
|---|---|
| DK2757341T3 (en) | 2020-07-27 |
| EP2757341A1 (en) | 2014-07-23 |
| WO2013039214A1 (en) | 2013-03-21 |
| KR101563830B1 (en) | 2015-10-27 |
| EP2757341B1 (en) | 2020-05-13 |
| KR20140049595A (en) | 2014-04-25 |
| CN103782125B (en) | 2016-06-22 |
| EP2757341A4 (en) | 2015-10-21 |
| PL2757341T3 (en) | 2020-09-21 |
| US20140202677A1 (en) | 2014-07-24 |
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