CN103781312A - Casing structure and electronic device using same - Google Patents
Casing structure and electronic device using same Download PDFInfo
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- CN103781312A CN103781312A CN201210413731.XA CN201210413731A CN103781312A CN 103781312 A CN103781312 A CN 103781312A CN 201210413731 A CN201210413731 A CN 201210413731A CN 103781312 A CN103781312 A CN 103781312A
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- backboard
- conductor
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- dividing plate
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Abstract
Provided is a casing structure which comprises a backboard, a positioning member, and at least one conductive member. The positioning member comprises multiple separating boards arranged vertically on the backboard and divides the backboard into at least one positioning area. The conductive member is disposed in the positioning area in order to be limited by the separating boards. The conductive member is electrically connected with the backboard. Further, an electronic device is provided.
Description
Technical field
The invention relates to a kind of casing structure and apply its electronic installation, and its electronic installation of a kind of casing structure and application with conducting function particularly.
Background technology
In various electronic correlation industries now, the protection of electromagnetic interference (EMI, Electromagnetic Interference), is one of important problem for electronic correlation industry.At present, in order to solve the not good problem of EMI protection effect, the engineering method that prevents electromagnetic interference comprises attaching conducting element or the mode such as spraying, electroplated conductive layer on casing.
To attach conducting element as example, although it is by conducting element, for example conducting foam, directly be attached on electronic component and there is characteristic simply and easily, but along with the surface profile of electronic component is not the plane of homogeneous, thereby need be auxiliary with adhesive tape or other foams, conducting foam can be fixed on electronic component.This measure not only cannot be guaranteed the exposure level of electronic component and conducting foam, also can therefore increase material and assembly cost.
Summary of the invention
The invention provides a kind of electronic installation, it reaches the effect that prevents electromagnetic interference by casing structure.
One embodiment of the invention propose a kind of casing structure, comprise backboard, keeper and at least one electric-conductor.Keeper has multiple dividing plates.Dividing plate erects on backboard, and backboard is marked off at least one positioning area.Electric-conductor is arranged on positioning area to be limited to by dividing plate, and electric-conductor is electrically connected backboard.
One embodiment of the invention propose a kind of electronic installation, comprise housing, backboard, electronic component, keeper and at least one electric-conductor.Backboard is assembled to housing.Electronic component is arranged in housing.Keeper is arranged on backboard.Keeper has multiple dividing plates, erects on backboard, and backboard is marked off at least one positioning area.
Electric-conductor is arranged on positioning area to be limited to by dividing plate, and electric-conductor is connected between backboard and electronic component.
In one embodiment of this invention, above-mentioned keeper also comprises substrate, overlapped on backboard.Dividing plate deviates from backboard from substrate and extends.
In one embodiment of this invention, above-mentioned dividing plate is to cut and bend from substrate to form.
In one embodiment of this invention, above-mentioned substrate has opening, and above-mentioned dividing plate is around opening, and electric-conductor is overlapped on backboard and be positioned at opening.
In one embodiment of this invention, above-mentioned keeper also comprises multiple buckles.Part dividing plate is between buckle and opening.Buckle clasp is on dividing plate.
In one embodiment of this invention, in above-mentioned two adjacent dividing plates, wherein a dividing plate has a snap fit, with clasp another dividing plate adjacent with this dividing plate.
Based on above-mentioned, in the above embodiment of the present invention, by keeper is arranged on backboard, and make electric-conductor can be fixed on backboard and with backboard and be electrically connected because being limited to the dividing plate of keeper.Accordingly, in the time that backboard is assembled to housing, the electric-conductor on backboard just can be connected between backboard and electronic component, and then makes between electronic component, electric-conductor and backboard to form the state electrically conducting and effectively prevent electromagnetic interference.
State feature and advantage on the present invention and can become apparent for allowing, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.
Fig. 2 is the electronics portion member schematic diagram of Fig. 1.
Fig. 3 is that the electronic installation of Fig. 2 is in the partial enlarged drawing at keeper place.
Fig. 4 is the assembling schematic diagram that illustrates backboard, electric-conductor and the keeper of Fig. 3 with another visual angle.
Fig. 5 is the keeper of Fig. 4 view before being disposed at backboard.
[main element symbol description]
100: electronic installation
110: housing
120: backboard
130A, 130B: electronic component
140A, 140B: electric-conductor
150: keeper
152A, 152B, 152C, 152D: dividing plate
154: substrate
156: opening
158A, 158B: buckle
A1, A2: positioning area
C1, C2, C3, C4: holding part
H1, H2, H3, H4: snap fit
Embodiment
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.Fig. 2 is the electronics portion member schematic diagram of Fig. 1.Please refer to Fig. 1 and Fig. 2, electronic installation 100 is for example notebook computer, describes this pattern characteristics for knowing, Fig. 1 and Fig. 2 all illustrate with the main frame bottom of notebook computer, and wherein Fig. 2 removes to expose backboard by the drain pan of the notebook computer of Fig. 1.Moreover the present embodiment is only described the member of tool correlated characteristic, all the other persons of description can prior art as a reference, but not as limit.
In the present embodiment, electronic installation 100 comprises housing 110, is assembled to the backboard 120 of housing 110 and is configured in electronic component 130A, the 130B in housing 110.Wherein, the material of backboard 120 is metal, it is as the structural member of electronic installation 100, and the material of housing 110 is plastic cement, it is as appearance member electronic component 130A, the 130B of electronic installation 100, be for example central processing unit, graphic process unit or south bridge, the north bridge chips etc. of notebook computer, it is because high-frequency computing generates electromagnetic waves, therefore easily therefore have influence on other electronic components on motherboard.Do not limit pattern and the quantity of electronic component at this.
Fig. 3 be the electronic installation of Fig. 2 in the partial enlarged drawing at keeper place, omit backboard 120 can know the relation between identification electric- conductor 140A, 140B and electronic component 130A at this.Please also refer to Fig. 2 and Fig. 3, prevent the demand of electromagnetic interference for allowing electronic installation 100 meet, therefore can be connected between electronic component 130A, 130B and backboard 120 with electric-conductor, and the present embodiment is similar in the electric-conductor structure at electronic component 130A and 130B place, thus following by the electric-conductor 140A using electronic component 130A place and 140B as description object.
In the present embodiment, electric- conductor 140A and 140B, for example conducting foam, is connected between electronic component 130A and backboard 120, between backboard 120, electric- conductor 140A, 140B and electronic component 130A, be the state electrically conducting to allow, electronic component 130A is produced to the effect of ground connection.
Say further, Fig. 4 is the assembling schematic diagram that illustrates backboard, electric-conductor and the keeper of Fig. 3 with another visual angle.Please also refer to Fig. 3 and Fig. 4, for allowing configuration that electric- conductor 140A, 140B can be firm wherein, electronic installation 100 also comprises positioning piece 150, and it is arranged on backboard 120 and has multiple dividing plate 152A to 152D.These dividing plates 152A to 152D erects on backboard 120 and backboard 120 is marked off to multiple positioning area A1 and A2.Electric- conductor 140A, 140B are configured on backboard 120, and are located in positioning area A1 because the limitation of dividing plate 152A to 152D makes electric-conductor 140A, and electric-conductor 140B is located in positioning area A2.Accordingly, electric- conductor 140A, 140B are able to firmly contact with backboard 120 and are mutually electrically connected.When backboard 120 is assembled to housing 110 when interior, electric- conductor 140A, 140B can be pressed between electronic component 130A, 130B and backboard 120, and then reach the state that electrically conducts between backboard 120, electric- conductor 140A, 140B and electronic component 130A, 130B.
Fig. 5 is the keeper of Fig. 4 view before being disposed at backboard.Please also refer to Fig. 3 to Fig. 5, specifically, keeper 150, for example, be made with polyester film (Mylar), and it comprises a substrate 154 and above-mentioned multiple dividing plate 152A to 152D.In the present embodiment, the structure that substrate 154 and dividing plate 152A to 152D are formed in one, furthermore, keeper 150 was the two-dimension plane structure illustrating as Fig. 5 before being disposed on backboard 120, treat to cut further and bent out dividing plate 152A to 152D, square one-tenth is as 3-D solid structure that Fig. 4 illustrated.
In the present embodiment, substrate 154 can attach or welding mode overlapped on backboard 120, and substrate 154 has an opening 156, it cuts and bends rear left space for dividing plate 152A to 152D, and make dividing plate 152A to 152D around the above-mentioned positioning area A1 of this opening 156(, A2 also in the scope of this opening 156).Moreover the dividing plate 152A and the 152C that are positioned at opening 156 relative both sides have respectively a snap fit H1, H2, abut against dividing plate 152A and there is holding part C1, the C2 of corresponding snap fit H1, H2 respectively with the dividing plate 152D between 152C.When dividing plate 152A to 152C cut from substrate 154 and with respect to substrate 154 bending, snap fit H1, H2 can be snapped in holding part C1, C2 accordingly, to allow the dividing plate 152A to 152C can be connected to each other and present the state erecting on substrate 154.
Similarly, refer again to Fig. 4 and Fig. 5, keeper 150 also comprises multiple buckle 158A, 158B, and it has the snap fit H3, the H4 that are similar to dividing plate 152A, 152C.Dividing plate 152B is between buckle 158A, 158B and opening 156, and dividing plate 152B has holding part C3, C4.Accordingly, exist side by side while being located on substrate 154 when dividing plate 152B and buckle 158A, 158B bending, snap fit H3, H4 are snapped in holding part C3, C4 accordingly, and are firmly erected on substrate 154 by dividing plate 152B by buckle.
Based on above-mentioned, keeper 150 is by structures such as above-mentioned snap fit, holding part and buckles, and the dividing plate 152A to 152D after bending can firmly be erected on substrate 154, and after substrate 154 is configured on backboard 120, after dividing plate 152A to 152D bending, 156 left of openings expose backboard 120, and are divided into further positioning area A1, A2.Then, electric- conductor 140A, 140B are attached on the backboard 120 in opening 156, and allow electric- conductor 140A, 140B be subject to the limitation of dividing plate 152A to 152D and be located in respectively in positioning area A1, A2.
Thus, the positioning area A1, the A2 that on backboard 120, form by keeper 150, it is upper and have and be difficult for attaching that user just need not worry that electric- conductor 140A, 140B are directly configured in to electronic component 130A, 130B, or the easy situation because come off by external force.
Separately it is worth mentioning that, be two-dimension plane structure at keeper 150, be that dividing plate 152A to 152D is while not yet bending and erect on substrate 154, it is to present the double-layer lap interposed structure that part overlaps, as Fig. 5 illustrates, the part of buckle 158A, 158B and dividing plate 152B part overlap, and snap fit H1, the H2 of dividing plate 152A, 152C overlaps with dividing plate 152C part.
The position, quantity and the buckle mode that do not limit dividing plate at this, user can position according to the demand such as relative position and quantity of electronic component the correspondence design of part.
In sum, in the above embodiment of the present invention, by keeper is arranged on backboard, and make electric-conductor can be fixed on backboard and with backboard and be electrically connected because being limited to the dividing plate of keeper.Accordingly, in the time that backboard is assembled to housing, the electric-conductor on backboard just can be connected between backboard and electronic component, and then makes between electronic component, electric-conductor and backboard to form the state electrically conducting and effectively prevent electromagnetic interference.
This measure allows user pass through the face profile of backboard and can successfully electric-conductor be configured on it, electric-conductor is directly attached on electronic component and may produces and is difficult for the puzzlement that attaches to exempt.Moreover, also by the elastic characteristic of electric-conductor, and can allow electric-conductor be connected between electronic component and backboard after making backboard be assembled to housing, and save the inconvenience that electric-conductor need be changed with electronic component, to improve further the production efficiency of electronic installation.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on accompanying claim.
Claims (10)
1. a casing structure, comprising:
One backboard;
Positioning piece, has multiple dividing plates, erects on this backboard, and this backboard is marked off at least one positioning area; And
At least one electric-conductor, be arranged on this positioning area to be limited to by those dividing plates, and this electric-conductor is electrically connected this backboard.
2. casing structure as claimed in claim 1, is characterized in that, this keeper also comprises:
One substrate, overlapped on this backboard, those dividing plates deviate from this backboard from this substrate and extend.
3. casing structure as claimed in claim 2, is characterized in that, those dividing plates are to cut and bend from this substrate to form.
4. casing structure as claimed in claim 2, is characterized in that, this substrate has an opening, and those dividing plates are around this opening, and this electric-conductor is overlapped on this backboard and be positioned at this opening.
5. casing structure as claimed in claim 4, is characterized in that, this keeper also comprises:
Multiple buckles, those dividing plates of part are between those buckles and this opening, and those buckle clasps are on those dividing plates.
6. casing structure as claimed in claim 1, is characterized in that, in two adjacent dividing plates, wherein a dividing plate has a snap fit, with clasp another dividing plate adjacent with this dividing plate.
7. an electronic installation, comprising:
One housing;
One backboard, is assembled to this housing;
One electronic component, is arranged in this housing;
Positioning piece, is arranged on this backboard, and this keeper has multiple dividing plates, erects on this backboard, and this backboard is marked off at least one positioning area; And
At least one electric-conductor, is arranged on this positioning area to be limited to by those dividing plates, and this electric-conductor is connected between this backboard and this electronic component.
8. electronic installation as claimed in claim 7, is characterized in that, this keeper also comprises:
One substrate, overlapped on this backboard, those dividing plates deviate from this backboard from this substrate and extend.
9. electronic installation as claimed in claim 8, is characterized in that, this substrate has an opening, and those dividing plates are around this opening, and this electric-conductor is overlapped on this backboard and be positioned at this opening.
10. electronic installation as claimed in claim 9, is characterized in that, this keeper also comprises:
Multiple buckles, those dividing plates of part are between those buckles and this opening, and those buckle clasps are on those dividing plates, and in two adjacent dividing plates, wherein a dividing plate has a snap fit, with clasp another dividing plate adjacent with this dividing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210413731.XA CN103781312A (en) | 2012-10-25 | 2012-10-25 | Casing structure and electronic device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210413731.XA CN103781312A (en) | 2012-10-25 | 2012-10-25 | Casing structure and electronic device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103781312A true CN103781312A (en) | 2014-05-07 |
Family
ID=50572968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210413731.XA Pending CN103781312A (en) | 2012-10-25 | 2012-10-25 | Casing structure and electronic device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103781312A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006041140A (en) * | 2004-07-27 | 2006-02-09 | Funai Electric Co Ltd | Remote controller |
| CN102548276A (en) * | 2010-12-13 | 2012-07-04 | 广达电脑股份有限公司 | Method for preparing conductive ribs on machine shell, machine shell and electronic device assembling method |
| TWM434431U (en) * | 2011-12-15 | 2012-07-21 | Kinpo Electronics China Co Ltd | Shielding case and assembling equipment thereof |
-
2012
- 2012-10-25 CN CN201210413731.XA patent/CN103781312A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006041140A (en) * | 2004-07-27 | 2006-02-09 | Funai Electric Co Ltd | Remote controller |
| CN102548276A (en) * | 2010-12-13 | 2012-07-04 | 广达电脑股份有限公司 | Method for preparing conductive ribs on machine shell, machine shell and electronic device assembling method |
| TWM434431U (en) * | 2011-12-15 | 2012-07-21 | Kinpo Electronics China Co Ltd | Shielding case and assembling equipment thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140507 |