CN103779690A - Connector terminal process - Google Patents
Connector terminal process Download PDFInfo
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- CN103779690A CN103779690A CN201210408759.4A CN201210408759A CN103779690A CN 103779690 A CN103779690 A CN 103779690A CN 201210408759 A CN201210408759 A CN 201210408759A CN 103779690 A CN103779690 A CN 103779690A
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- metal sleeve
- open
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- pedestal
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Abstract
The invention provides a connector terminal process. The system of the connector terminal process comprises a metal sleeve, a probe and an elastic body. A hollow cylinder body extends outward from the base of the metal sleeve, and the probe and the elastic body are contained in the containing room in the cylinder body. The base of the metal sleeve is provided with a through hole which is communicated with the outside, then the metal sleeve is soaked in the electric plating solution of electric plating equipment, thus through current, the electric plating solution evenly flows to the inner and outer surfaces of the metal cylinder to carry out electric plating processing so as to increase the rate of diffusion deposition of a metal plated layer, the metal sleeve with a deposited metal layer is subjected to mechanical processing such that the through hole bears stress and is deformed and the aperture size of the hole is reduced to form a closed state, the connector terminal process of the invention is completed, the quality of metal sleeve overall electric plating is ensured and the electric plating cost is reduced, and the signal transmission efficiency and stability are raised at the same time.
Description
Technical field
The invention provides a kind of bonder terminal technique, especially fingerstall cylinder bottom is for offering open-work, after making electroplating solution in electroplating device by electric current, electroplate processing through being distributed in sleeve surfaces externally and internally by the reduction of fractions to a common denominator of through-hole position uniform-flow, recycling machining mode is dwindled through-hole position distortion back aperture and is formed a closed state, to guarantee the quality that sleeve entirety is electroplated and to reduce electroplating cost, promote signal transmission efficiency and stability simultaneously.
Background technology
Press, the fast development of electronics technology and multimedia messages now, make the electronic installations such as mobile phone, intelligent mobile phone, global navigation satellite machine, personal digital assistant (PDA) all be prevalent in upper each corner of society, and because electronic installation design at present all trends towards light, thin, short, little, therefore the component structure on electronic installation internal circuit board needs small but excellent close, overall construction intensity also needs to strengthen thereupon, with the development trend in response to current.
And general electronic installation big city utilizes connector to reach and being connected of circuit board, and connector can provide cable to be arranged in it mostly, and be connected with plural signal terminal or the power supply terminal work one of connector inside, signal or power supply can be sent in control circuit through circuit board for another matching connector, along with connector volume is more and more small, just develop the connector of various different types, for example probe (Pogo Pin) connector, to be provided with multiple metal probes in insulating body inside, and probe is for including sleeve and probe, and contain a spring between sleeve and probe, in the time that probe is subject to the effect of external force and is pressed in sleeve, be that compressible spring is a strain, and utilize probe to support and be contacted with on sleeve lining face, thereby can realize the object of electric connection, because probe type connecter is little for having volume, electric current is large, contact point is strong, long service life and electric connection stability advantages of higher, and be widely used in battery of mobile phone, antenna connects, global navigation satellite machine, plane formula or handheld computer, on the electronic installation such as radio system or communication apparatus, in order to the use of On current or transmission signal.
Moreover, when being pressed in sleeve, probe can press on spring, and the elastic restoring force of utilizing spring institute tool supports to arrive in probe bottom surface place, the side place that makes to pop one's head in just can contact on sleeve lining face to form and is electrically connected, but, stability while electric connection in order to ensure probe adapter, the surfaces externally and internally of general sleeve all can carry out metallized electroplating processing process, to complete enough conductions and the surface of welding, and electroplating processing process is mainly that base material is immersed in the electroplating solution of electroplating device slaine as negative electrode, metallic plate is as anode, and make dissolving metal after by electric current or separate out to be attached on base material, to deposit required coating, in order to change surface nature or the size of base material.
Only this sleeve is a blind hole kenel, when the gas of in the process of electroplating, the electroplating solution causing in plating bath being separated out (as hydrogen etc.), to accumulate on blind hole inner and very easily cause the disappearance of coat of metal embrittlement, or electric current is difficult for arriving blind hole, and inner institute causes CURRENT DISTRIBUTION inequality, and affect the speed of coat of metal diffusion deposition, and then make the coat of metal reach the required electroplating time of certain thickness relatively to increase, current efficiency (dissolving or the percentage by weight number of precipitating metal in plating bath when plating) reduces and causes sleeve inner to be difficult for plating the problem of coating and high cost, needing to be engaged in this journey dealer redesigns effectively and is solved.
Summary of the invention
The object of the present invention is to provide a kind of bonder terminal technique, to improve the defect existing in known technology.
For achieving the above object, bonder terminal technique provided by the invention, include metal sleeve, probe and at least one elastomer, and the pedestal of metal sleeve is the cylindrical shell that is outward extended with hollow, and contain and pop one's head in and be positioned at the elastomer between metal sleeve and probe in the room of inner barrel, process according to following step:
(A) on the pedestal of metal sleeve, connect to outside open-work for offering, metal sleeve is immersed in the electroplating solution of electroplating device, the pedestal and the cylindrical shell surfaces externally and internally that make electroplating solution be distributed in metal sleeve by electric current via the reduction of fractions to a common denominator of through-hole position uniform-flow are electroplated processing again;
(B) metal sleeve that deposits the coat of metal is utilized machining mode make the stressed generation distortion of through-hole position back aperture dwindle and form a closed state, just complete bonder terminal process of the present invention.
Described bonder terminal technique, wherein, the open-work of this step (A) metal sleeve on pedestal is for utilizing drilling or milling machinery processing mode to be offered and connected to outside by inner barrel downwards.
Described bonder terminal technique, wherein, the open-work aperture of this step (A) metal sleeve is for being less than elastomeric internal diameter, and elastomer is a spring, and spring one end is for being held on pedestal, and another end supports to arrive in probe bottom surface place and is an elastic deformation.
Described bonder terminal technique, wherein, the open-work peripheral region of this step (B) metal sleeve is to be outwards formed with the protuberance that is nozzle-like, and after depositing the coat of metal, can on the protuberance of open-work peripheral region, utilize the inside riveted extruding of riveted or extrusion machinery processing mode, and after protuberance crimp, can make open-work aperture dwindle and form a closed state.
Described bonder terminal technique, wherein, the protuberance place that this metal sleeve riveted or extruding back aperture are dwindled closely sealed open-work forms a smooth face that compresses for can again pushing.
Described bonder terminal technique, wherein, the open-work below peripheral region of this step (B) metal sleeve is for can flush in base bottom surface place, and after depositing the coat of metal, can around open-work, locate to utilize extrusion machinery processing mode inwardly to push and form a depressed part, and depressed part can be annular ditch groove and open-work aperture dwindled and form a closed state.
The pedestal that the invention reside in metal sleeve is outward extended with the cylindrical shell of hollow, and on pedestal, offer perforation to outside open-work, again metal sleeve is immersed in the electroplating solution of electroplating device, after making electroplating solution by electric current, electroplate processing through being distributed in metal sleeve surfaces externally and internally by the reduction of fractions to a common denominator of through-hole position uniform-flow, the metal sleeve that deposits the coat of metal can be utilized machining mode the stressed generation of through-hole position distortion back aperture is dwindled and form a closed state, with this through hole structure design, can increase the speed of coat of metal diffusion deposition, and guarantee the quality that metal sleeve entirety is electroplated and reduce electroplating cost, and can effectively prevent because of metal sleeve be a blind hole kenel cause gas buildup or electric current be difficult for being distributed to its inside cause electroplating time increase, current efficiency reduces and is difficult for plating the problem of coating and high cost, promote signal transmission efficiency and stability simultaneously.
Accompanying drawing explanation
Fig. 1 is stereo appearance figure of the present invention.
Fig. 2 is three-dimensional exploded view of the present invention.
Fig. 3 is the three-dimensional exploded view at another visual angle of the present invention.
Fig. 4 is the manufacturing flow chart of metal sleeve of the present invention.
Side cutaway view when Fig. 5 is metal sleeve boring of the present invention.
Fig. 6 is the side cutaway view after metal sleeve of the present invention is electroplated.
Side cutaway view when Fig. 7 is metal sleeve riveted of the present invention.
Fig. 8 is the side cutaway view after metal sleeve extruding of the present invention.
Fig. 9 is the stereo appearance figure of metal sleeve of the present invention.
Side cutaway view when Figure 10 is preferred embodiment metal sleeve boring of the present invention.
Figure 11 is the side cutaway view after preferred embodiment metal sleeve of the present invention is electroplated.
Figure 12 is the side cutaway view after preferred embodiment metal sleeve extruding of the present invention.Main element symbol description in accompanying drawing:
1 metal sleeve; 10 rooms; 131 protuberances; 101 openings; 132 compress face; 11 pedestals; 133 depressed parts; 12 cylindrical shells; 14 coats of metal; 13 open-works; 2 probes; 21 stop parts; 22 contact sites; 3 elastomers.
Embodiment
The technology used in the present invention means and structure thereof, illustrate that with regard to preferred embodiment of the present invention its features and functions is as follows by reference to the accompanying drawings in detail, in order to understanding completely.
Refer to Fig. 1, Fig. 2, shown in Fig. 3, be respectively stereo appearance figure of the present invention, the three-dimensional exploded view at three-dimensional exploded view and another visual angle, by knowing and find out in figure, the present invention is for including metal sleeve 1, probe 2 and the elastomer 3 that at least one is positioned at metal sleeve 1 and pops one's head between 2, wherein this metal sleeve 1 is for having a pedestal 11, and be outward extended with the cylindrical shell 12 of hollow in pedestal 11, and cylindrical shell 12 inside are formed with the room 10 of tool opening 101, room 10 inside of metal sleeve 1 contain probe 2 and elastomer 3, its probe 2 is for having columniform stop part 21, and be outward extended with and protrude from the less contact site 22 of opening 101 place's external diameters by stop part 21 1 side places, and stop part 21 external diameters are the aperture that is greater than opening 101, elastomer 3 can be on the pedestal 11 that spring one end is held in metal sleeve 1 again, another end supports to arrive in the stop part 21 bottom surface places of probe 2 and is an elastic deformation.
Please arrange in pairs or groups and consult shown in Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, side cutaway view and stereo appearance figure after side cutaway view, extruding while being respectively manufacturing flow chart, the side cutaway view in when boring of metal sleeve of the present invention, side cutaway view after electroplating, riveted, by knowing and find out in figure, when utilizing bonder terminal technique of the present invention, be to process according to following step:
(101) on the pedestal 11 of metal sleeve 1, connect to outside open-work 13 for offering, metal sleeve 1 is immersed in the electroplating solution of electroplating device, the pedestal 11 and cylindrical shell 12 surfaces externally and internallies that make electroplating solution be distributed in metal sleeve 1 by electric current via open-work 13 place's uniform-flow reduction of fractions to a common denominators are electroplated processing again.
(102) metal sleeve 1 that deposits the coat of metal 14 is utilized machining mode make open-work 13 place's stressed generation distortion back aperture dwindle and form a closed state, just complete bonder terminal process of the present invention.
Can know and learn by above-mentioned implementation step, above-mentioned member is in the time manufacturing, implementation step is to utilize drilling on the pedestal 11 prior to 1 tool of metal sleeve, milling or other machining mode are to be offered downwards and connected to outside open-work 13 by cylindrical shell 12 inside, and be outwards formed with the protuberance 131 that is nozzle-like in open-work 13 peripheral regions, and the aperture of this open-work 13 is the spring inside diameter that is less than elastomer 3, again by metal sleeve 1 for to be immersed in the electroplating solution of electroplating device (not shown) in plating bath, after making electroplating solution by electric current, electroplates to process and deposit the required coat of metal 14 through be distributed in the pedestal 11 of metal sleeve 1 and cylindrical shell 12 surfaces externally and internallies by open-work 13 place's uniform-flow reduction of fractions to a common denominators.
Open-work 13 structural designs of metal sleeve 1 of the present invention, in the process that can make to electroplate, balanced current distribution is in metal sleeve 1 surfaces externally and internally and the gas of separating out (as hydrogen etc.) loss fast, to increase the speed of the coat of metal 14 diffusion depositions, and guarantee that quality and the coat of metal 14 even thickness that metal sleeve 1 entirety is electroplated distribute and reduce electroplating cost, and can effectively prevent from increasing by a blind hole kenel causes gas buildup or electric current to be difficult for being distributed to its inner electroplating time that caused because of metal sleeve 1, current efficiency reduces and is difficult for plating the problem of coating and high cost, thereby the coat of metal 14 of realizing metal sleeve 1 has good electrical conductivity, thermal endurance and resistance to wearing, the surface nature such as antirust, and coordinate probe 2 and elastomer 3 to be assembled after becoming one to reach low-impedance electrical laser propagation effect, promote signal transmission efficiency and stability simultaneously.
Continuous the metal sleeve 1 that deposits the coat of metal 14 is taken out after, can utilize riveted at open-work 13 peripheral regions, extruding or other machining mode are dwindled the open-work 13 stressed generation distortion of peripheral region back aperture, wherein riveted mode is to utilize pressurization tool (not shown) that inside the protuberance of open-work 13 peripheral regions 131 riveted is pushed, and after protuberance 131 crimps, make open-work 13 apertures dwindle and form a closed state, fashion of extrusion is that either direction is done inwardly extruding on the protuberance 131 of open-work 13 peripheral regions, and after protuberance 131 crimps, make open-work 13 apertures dwindle and form a closed state, again push and form smooth compressing after face 132 at protuberance 131 places that also metal sleeve 1 riveted or extruding back aperture can be dwindled to closely sealed open-work 13, just complete bonder terminal process of the present invention.
Please continue to refer to Figure 10, Figure 11, shown in Figure 12, side cutaway view while being respectively preferred embodiment metal sleeve boring of the present invention, side cutaway view after side cutaway view after metal sleeve is electroplated and metal sleeve extruding, by knowing and find out in figure, wherein on the pedestal 11 of this metal sleeve 1, utilizing machining mode is to offer to connect to outside open-work 13, and open-work 13 below peripheral regions are for flushing in pedestal 11 bottom surface places, again metal sleeve 1 is immersed in the electroplating solution of electroplating device, the pedestal 11 and cylindrical shell 12 surfaces externally and internallies that make electroplating solution circulate in metal sleeve 1 via open-work 13 places are electroplated processing, continue and utilize fashion of extrusion around open-work 13, to locate to do inwardly extruding formation one depressed part 133 metal sleeve 1 that deposits the coat of metal 14, open-work 13 apertures are dwindled and form a closed state.
But, how above-mentioned metal sleeve 1 electroplates processing through electroplating device deposits the coat of metal 14, and electroplate after processing open-work 13 places of pedestal 11 and utilize machining mode to push aperture to dwindle and form the category that a closed state is prior art, and the formation of this thin portion is not emphasis of the present invention place, do not remake and repeat, it only needs to provide in the process of plating, electroplating solution deposits the coat of metal 14 through the surfaces externally and internally that is distributed in metal sleeve 1 by open-work 13 place's uniform-flow reduction of fractions to a common denominators after by electric current, and the easy keyholed back plate of the quality that reaches plating, increase the speed of the coat of metal 14 diffusion depositions and the effectiveness that even thickness distributes, contained by the present invention therefore such as can reach the form of aforementioned effect, this kind of simple and easy modification and equivalent structure change, all should in like manner be contained in the scope of the claims of the present invention.
Refer to again Fig. 2, Fig. 4, Fig. 7, Fig. 8, shown in Fig. 9, the present invention is outward extended with cylindrical shell 12 for the pedestal 11 of metal sleeve 1, and on pedestal 11, offer perforation to outside open-work 13, again metal sleeve 1 is immersed in to electroplating solution in electroplating device and electroplates processing through being distributed in metal sleeve 1 surfaces externally and internally by open-work 13 place's uniform-flow reduction of fractions to a common denominators after by electric current, the metal sleeve 1 that deposits the coat of metal 14 can be utilized machining mode that open-work 13 place's distortion back aperture are dwindled and form a closed state, with these open-work 13 structural designs, can increase the speed of the coat of metal 14 diffusion depositions, and guarantee that quality and the coat of metal 14 even thickness that metal sleeve 1 entirety is electroplated distribute and reduce electroplating cost, promote signal transmission efficiency and stability simultaneously.
Above-mentioned detailed description is for preferably possible embodiments explanation of one of the present invention, only this embodiment is not in order to limit claim of the present invention, all other do not depart from the equalization that completes under disclosed skill spirit to be changed and changes with modifying, and all should be contained in the claim scope that the present invention contains.
Claims (6)
1. a bonder terminal technique, include metal sleeve, probe and at least one elastomer, and the pedestal of metal sleeve is the cylindrical shell that is outward extended with hollow, and contain and pop one's head in and be positioned at the elastomer between metal sleeve and probe in the room of inner barrel, process according to following step:
(A) on the pedestal of metal sleeve, connect to outside open-work for offering, metal sleeve is immersed in the electroplating solution of electroplating device, the pedestal and the cylindrical shell surfaces externally and internally that make electroplating solution be distributed in metal sleeve by electric current via the reduction of fractions to a common denominator of through-hole position uniform-flow are electroplated processing again;
(B) metal sleeve that deposits the coat of metal is utilized machining mode make the stressed generation distortion of through-hole position back aperture dwindle and form a closed state, just complete bonder terminal process of the present invention.
2. bonder terminal technique according to claim 1, wherein, the open-work of this step (A) metal sleeve on pedestal is for utilizing drilling or milling machinery processing mode to be offered and connected to outside by inner barrel downwards.
3. bonder terminal technique according to claim 1, wherein, the open-work aperture of this step (A) metal sleeve is for being less than elastomeric internal diameter, and elastomer is a spring, and spring one end is for being held on pedestal, and another end supports to arrive in probe bottom surface place and is an elastic deformation.
4. bonder terminal technique according to claim 1, wherein, the open-work peripheral region of this step (B) metal sleeve is to be outwards formed with the protuberance that is nozzle-like, and after depositing the coat of metal, can on the protuberance of open-work peripheral region, utilize the inside riveted extruding of riveted or extrusion machinery processing mode, and after protuberance crimp, can make open-work aperture dwindle and form a closed state.
5. bonder terminal technique according to claim 4, wherein, the protuberance place that this metal sleeve riveted or extruding back aperture are dwindled closely sealed open-work forms a smooth face that compresses for can again pushing.
6. bonder terminal technique according to claim 1, wherein, the open-work below peripheral region of this step (B) metal sleeve is for can flush in base bottom surface place, and after depositing the coat of metal, can around open-work, locate to utilize extrusion machinery processing mode inwardly to push and form a depressed part, and depressed part can be annular ditch groove and open-work aperture dwindled and form a closed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210408759.4A CN103779690A (en) | 2012-10-23 | 2012-10-23 | Connector terminal process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210408759.4A CN103779690A (en) | 2012-10-23 | 2012-10-23 | Connector terminal process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103779690A true CN103779690A (en) | 2014-05-07 |
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ID=50571679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210408759.4A Pending CN103779690A (en) | 2012-10-23 | 2012-10-23 | Connector terminal process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103779690A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2604012Y (en) * | 2003-02-20 | 2004-02-18 | 莫列斯公司 | Crimping terminal |
| CN2627675Y (en) * | 2003-05-27 | 2004-07-21 | 上海立沪五金弹簧有限公司 | Minitype contact |
| CN2627676Y (en) * | 2003-05-12 | 2004-07-21 | 叶圣兴 | Connecting terminal |
| CN2833929Y (en) * | 2005-06-08 | 2006-11-01 | 英硕科技股份有限公司 | Cell terminals and instantaneous power breakdown prevention structure |
-
2012
- 2012-10-23 CN CN201210408759.4A patent/CN103779690A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2604012Y (en) * | 2003-02-20 | 2004-02-18 | 莫列斯公司 | Crimping terminal |
| CN2627676Y (en) * | 2003-05-12 | 2004-07-21 | 叶圣兴 | Connecting terminal |
| CN2627675Y (en) * | 2003-05-27 | 2004-07-21 | 上海立沪五金弹簧有限公司 | Minitype contact |
| CN2833929Y (en) * | 2005-06-08 | 2006-11-01 | 英硕科技股份有限公司 | Cell terminals and instantaneous power breakdown prevention structure |
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Application publication date: 20140507 |