CN103778460A - Radio frequency identification integrated circuit with large contact plate - Google Patents
Radio frequency identification integrated circuit with large contact plate Download PDFInfo
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- CN103778460A CN103778460A CN201310472824.4A CN201310472824A CN103778460A CN 103778460 A CN103778460 A CN 103778460A CN 201310472824 A CN201310472824 A CN 201310472824A CN 103778460 A CN103778460 A CN 103778460A
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Abstract
A radio frequency identification integrated circuit with a large contact plate. A RFID integrated circuit having a re-passivation layer and a conductive redistribution layer can be assembled on a base board through an additional layer. The additional layer comprises one or more etching agent so as to form a notch on a non-conductive barrier layer between the assembly and the base board, and also comprises an adhesive so as to bonding the assembly to the base board.
Description
Technical field
The present invention relates to radio frequency identification (RFID) system, particularly a kind of radio frequency identification integrated circuit with large contact plate.
Background technology
Radio frequency identification (RFID) system generally includes RFID reader and RFID label, and RFID reader is also referred to as RFID read/write device or RFID interrogator.Rfid system can be used to stock, location, and identification, identifies, configuration starts/forbidding, and adheres to or embed the watch-dog of the article of this label.Rfid system may be applied to article inventory and the tracking of retail trade; Be applied to article configuration and the monitoring of consumer and industry-electron trade; Be applied to safety-protection system to prevent the loss of article and stolen; Be applied to Application in Anti-counterfeiting to guarantee the reliability of article; And other all application.
Rfid system is by using a less radio-frequency (RF) ripple to inquire that one or more labels operate by a RFID reader.This RF ripple is generally electromagnetic wave, at least at far-end field.This RF ripple still can be by significant electrification or magnetization in near-end field.This RF ripple can compile one or more commands direct label and make one or more action.
A label can be responded a response RF signal (response) in the time sensing demodulation RF signal.This RF signal may be produced by label, or also may be by tag reflection part demodulation RF signal formation in one is called as backscattered process.Backscattering may occur in many ways.This reader receives, demodulation, and decipher response.This may be comprised the data that are stored in label by the response of decipher, such as numbering, and price, date, time, destination, enciphered message, electronic signature, other attributes, the combination in any of attribute, or other supporting data.This may also be comprised the decipher status information of label by the response of decipher, the article that label is accompanying, or the embedded article of label are such as tag state information, article status information, configuration data, or other status information.
RFID label generally includes an antenna and a RFID integrated circuit (IC), and this integrated circuit comprises a radio part, a power management part, and generally include a logical gate or a storer, or both have concurrently.In some RFID integrated circuit, this logical gate comprises cryptographic algorithm, and this cryptographic algorithm may depend on one or more password or the key that are stored in tag ram.Power management part in early stage RFID integrated circuit is used an energy storage device such as battery conventionally.RFID label with an energy storage device is called as battery assisted tag, half active tag, or active tag.The development of semiconductor technology has promoted the microminiaturization of integrated circuit electronics, just can provide power for a RFID label thereby be only abutted against the RF signal of receiving.This RFID label does not comprise a long-time energy storage device and is called as passive label.Certainly, even if passive label also generally includes interim energy storage device and data/labelling storage such as capacitor or inductor.
Summary of the invention
Content of the present invention is provided to introduce in simplified form the concept through selecting, and its part that illustrates is below further described.Content of the present invention is also not inclined to key technical feature or the essential features of determining inventive point required for protection, is also not inclined to the protection domain that helps to determine inventive point required for protection.
Some embodiment are for RFID label assembly.Have one again the RFID integrated circuit package of passivation layer and a conductive layer can be assembled on a label construction with extra play.This extra play may comprise that one or more etchants or reactant form an electrical connection with an insulation barrier layer through this assembly and this label construction, and may also comprise that a kind of bonding agent is to be attached to described assembly in described structure.Other embodiment may be for the medelling on an integrated circuit and/or non-overlapped contact area, use the integrated circuit of liquid or other acting forces from combination, and/or integrated circuit detects.
By reading the following relevant drawings that illustrates and browse, these and other technical characterictic and advantage will be apparent.Be understandable that, the general introduction of aforementioned entirety and ensuing detailed description only, for explaining, do not form the restriction to claimed scope.
Accompanying drawing explanation
Following detailed description part coordinates corresponding accompanying drawing to describe, wherein:
Fig. 1 is the block diagram of the each parts of rfid system.
Fig. 2 is for showing a passive RFID label, as being used to the schematic diagram of each parts of passive RFID label of system shown in Figure 1.
Fig. 3 is the schematic diagram of a combined RFID label.
Fig. 4 has illustrated according to the structure of the different integrated circuit contact pads of embodiment.
Fig. 5 has illustrated a capacitive character and has embedded syndeton example.
Fig. 6 has illustrated a galvanically and has embedded syndeton example.
Fig. 7 has illustrated one according to the cross section part of the capacitive character embedding syndeton after heat bonding step of embodiment.
Fig. 8 has illustrated one according to the cross section part with the tectal capacitive character embedding of polyethylene terephthalate (PET) syndeton of embodiment, and wherein this overlayer is for increasing intensity.
Fig. 9 has illustrated one according to the schematic diagram that adopts the integrated rfid-tag of assemble method in Fig. 2 that is similar to of embodiment.
Figure 10 A and Figure 10 B have illustrated the label precursor with integrated circuit according to embodiment, and wherein this IC capacitor is connected in the antenna terminal being positioned in label substrate.
Figure 11 has described the passivation layer again on an integrated circuit according to embodiment.
Figure 12 has described the medelling contact area according to embodiment.
Figure 13 has described according to the non-overlapped of embodiment or compensation contact.
Figure 14 has illustrated according to embodiment label assembly method.
Figure 15 A and Figure 15 B illustrate according to the wafer scale probe of the integrated circuit of embodiment and detect.
Embodiment
In following detailed description, quote with reference to the accompanying drawings and made, wherein this accompanying drawing forms a part herein, and the mode of quoting by describing embodiment or example is shown.These aspects of embodiment are perhaps grouped together, and other side may be utilized, and under the prerequisite of the invention spirit and scope without prejudice to this exposure, may make structural variation.Therefore, following detailed description should not be regarded as restriction, and scope of the present invention is by appended claim and be equal to define.
Fig. 1 is the block diagram of a typical RFID system 100, in conjunction with the embodiments.A RFID reader 110 transmits an inquiry radiofrequency signal 112.Near RFID label 120 RFID reader 110 senses inquiry radiofrequency signal 112 and generates corresponding signal 126 as replying.RFID reader 110 induction decipher signals 126.Signal 112 and signal 116 may comprise rf wave and/or non-propagate radio frequency signals (such as near field reaction signal).
Communication between reader and label is used symbol, is also referred to as RFID symbol.A symbol can be one and define symbol, calibration value etc.In needs, symbol can be used to conversion binary data, such as " 0 " and " 1 ".In the time that symbol is processed by reader 110 and label 120, it can be treated to numerical value, numeral etc.
Fig. 2 is the schematic diagram of a RFID label 220, and this label can play the effect of label 120 in Fig. 1.Label 220 is painted as a passive label, means that it does not have the power source of oneself.A lot of descriptions in presents can be applied to initiatively and battery assisted tag equally.
Shown integrated circuit 224 has an antenna port, and it comprises can switching on for two and be coupled to the antenna contact of two antenna segment 227, and wherein these two antenna segment 227 show and form a dipole at this.Many other embodiment may use the port of any amount, contact, antenna, and/or antenna segment.
In operating process, antenna reception to signal is also transmitted to integrated circuit 224 by this signal, and if appropriate, based on input signal and IC interior state, both all can obtain energy and respond.If integrated circuit 224 uses backscattered modulation, can respond with the form of modulation antenna-reflected ratio, thereby produce response signal 126 from the signal 112 of reader transmission.Can switch on and couple mutually and disconnect the antenna that couples integrated circuit 224 and contact the reflectance that can modulate antenna, also can change the entering of a parallel circuit element that is coupled to antenna contact.The impedance that changes series circuit element is another method of modulation antenna-reflected ratio.
Embodiment shown in Fig. 2, antenna segment 227 is separated with integrated circuit 224.In other embodiment, antenna segment may be formed on integrated circuit 224.Label antenna in embodiment may be any form and be not limited to dipole.For example, label antenna may be a fragment, a slit, a coil, loudspeaker, a spiral or other suitable antennas.
Fig. 3 is a schematic diagram of combination RFID label.A RFID integrated circuit comprises circuit component (such as less radio-frequency loop 316) and is connected track.Integrated circuit may comprise the multilayer that comprises less radio-frequency and non-less radio-frequency loop.The electrical connection in less radio-frequency loop may be coupling in a less radio-frequency distribution bus 324 by coupling capacitance 326.Non-less radio-frequency track 318 may be separated with less radio-frequency track (such as less radio-frequency distribution bus).
The antenna of label 300 is shown as antenna trace 1(320 in Fig. 3) and antenna trace 2(322).This antenna is generally the thin track of metal (such as aluminium or copper), is attached on integrated circuit antenna is connected to (by less radio-frequency distribution bus 326) on less radio-frequency loop with one or more tie points.In the time using the oxidizable metal of a for example aluminium, the oxide layer 324 of self-assembling formation has been created a rigid surface between antenna trace and integrated circuit.
A shortcoming of multiple tag combination methods is that antenna stack must align to guarantee that antenna is coupled to less radio-frequency distribution bus rightly accurately with integrated circuit.In these combination techniques, antenna connection is used gold or similar salient point 312 to align with less radio-frequency distribution bus by a post-processing step conventionally.Nonetheless, combination is also abnormal difficult, because this needs assembly force and the high-precision integrated circuit layout of high degree of control.
Some combined methods may also can cause the reduction of performance of integrated circuits, and this is because less radio-frequency distribution bus resistance and stray capacitance 330 between non-less radio-frequency integrated circuit track 318 and antenna trace 320/322 cause.Be applied to integrated circuit high point 312, for permeating the high setting pressure of hard antenna oxide layer 324 with Contact antenna track 320, may cause the problem of reliability and earning rate.In addition, so high setting pressure also may worsen by reducing the spacing distance of antenna trace and integrated circuit surface the effect of stray capacitance.
Electroconductive binder (such as isotropy and anisotropy conductiving glue bonding agent) can be used for relaxing these inferior positions of part, but bonding agent may cause some other problem.Such as, many bonding agents may limit the throughput rate of tag combination, because they must, with the form application of viscous fluid before integrated circuit layout, also need lasting pressure and temperature simultaneously.
Fig. 4 has illustrated the different integrated circuit contact mat structures according to embodiment.In structure 440, integrated circuit 430 has four contact pads (432), and these contact pads may be the openings covering in a passivation layer of a metal level on integrated circuit 430.Structure 442 has been shown identical integrated circuit structure, and this integrated circuit has salient point (such as gold salient point processed) 439 and is positioned at the antenna plate 438 on salient point, and wherein this salient point increases in post-processing step.Increase salient point 439 and may to be the object (as mentioned above) in order aliging and to allow and the external contact of contact pad 432, this contact pad 432 may be embedded in passivation layer.
In order to solve above-mentioned salient point and integrated circuit antenna some shortcomings brought of aliging, the upper surface that one or more relatively large contact pads (as 434,436) can be formed on integrated circuit 430 replaces the little contact pad 432 as shown in structure 444 and 446.These large contact pads have formed the top layer of an integrated circuit and provide an electric capacity or resistively couple device for label antenna.Large contact pad provides more region for coupled tags antenna, thereby has reduced the requirement to stray capacitance and Accurate align.These large contact pads may cover the sizable part of integrated circuit 430 top layer.Such as large contact pad may cover 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90% of integrated circuit 430 top layers, or even 100%.In certain embodiments, large contact pad 434/436 may be formed on the insulation course of integrated circuit 430 or passivation layer again, then can switch on and be connected to insulation course or the contact pad (such as contact pad 432) of passivation layer below again.Although the relatively large contact pad 434/436 shown in Fig. 4 is roughly rectangle, large contact pad is not to be necessary for rectangle, may be other suitable shapes.Such as a large contact pad may be circular or annular.
In the time using large contact pad to connect antenna for capacitive character, electric capacity between large contact pad and antenna trace can be by the dielectricity of material between adjustment integrated circuit and antenna (such as composition, thickness) control, such as the non-conductive material being covered in contact pad, be covered in the non-conducting material (such as the oxide layer of self-assembling formation or increase on aluminum track) in antenna trace, and/or other additional insulating material.Electrical connection also can, by an antenna is pressed on integrated circuit and is provided, be connected with the direct of large contact pad on integrated circuit thereby make one or more indentures that are formed in antenna trace form one or more.In certain embodiments, as described below, electrical connection may not have indenture yet, salient point, or realize in the situation of other elevated regions.
Fig. 5 has shown the example of a capacitive couplings embedded structure.Integrated circuit 552 shown in schematic diagram 500 has a large contact pad 554.Although according to preferred embodiment, this large contact pad covers a big chunk of integrated circuit surface, and embodiment is not restriction like this, under principle as herein described, may use larger or less contact pad.In certain embodiments, in integrated circuit particular surface, the calmodulin binding domain CaM of all contact pads can not exceed this particular surface, and this lip-deep any contact pad is all limited in this surperficial boundary or extends to this surperficial border.Certainly, in other embodiments, contact pad may be extended outside the border of integrated circuit surface.Such as, contact pad is reeled or occupied adjacent integrated circuit surface, or cantilevered stretching out outside integrated circuit surface even.
First, label antenna may by dielectric 558(such as polyethylene terephtalate) the upper conductive antenna trajectory model 556 of placing formed.Also may use other dielectric substance, including, but not limited to mylar, polypropylene (PP), polystyrene (PS), polyester, polyimide (PI), or vinyl.Integrated circuit then may be near being connected to form a capacitive character with antenna.For example, integrated circuit may be heated to the plasticization temperature of dielectric 558, compresses into subsequently dielectric to obtain preset thickness (at Measurement Allowance) between contact pad 554 and antenna trace 556.Therefore, comprise according to the tag combination method of an embodiment: by forming at least one electric capacity with dielectric substance, antenna is attached on integrated circuit, and by antenna-coupled on integrated circuit.This dielectric substance may comprise an integrated circuit overlayer, an antenna cover layer, and/or other dielectric layer.Overlayer may comprise a non-conductive layer (such as large contact pad) that is coated in integrated circuit metal top layer, an antenna dielectric layer (such as oxide layer or the nitration case of metal antenna self-assembling formation).Other dielectric layer may comprise having the adhesive material that can control dielectric properties.The thickness of dielectric substance may be able to change according to the dielectric properties of material are different with the minimum capacity that will reach, and comprises 5nm and 1m in certain embodiments for 5nm to 1m().
As mentioned above, in certain embodiments, the large contact pad of integrated circuit surface may substantially cover whole integrated circuit.In the situation that having multiple large contact pad, may there is multiple electric capacity to form, wherein each specific electric capacity may be coupled on the circuit of specific integrated circuit, such as rectification circuit, demodulator circuit, or modulation circuit, thus guarantee that these circuit are in different DC potential.According to other embodiment, may have another antenna terminal to be attached on a second surface of integrated circuit (opposing face of first surface) thus on the surface of chip, form another electric capacity (or a series of electric capacity).In the situation that having multiple electric capacity (and/or two-sided coupling), one or more connections may be electrical connections, provide one or more direct contacts by providing on antenna trace and integrated circuit between one or more large contact pads.
Fig. 6 has illustrated an electrical connection embedded structure example.First, by non-conducting material, such as the PET672 shown in diagram 670, surface on place conduction mode 674 and form an antenna.(such as after embossing) subsequently, a small embossment (such as diameter is approximately 30m) 684 is placed on conduction mode 674, and it also can produce similarly projection conventionally on the PFT material 682 shown in diagram 680.As shown in diagram 690, an integrated circuit 692 with large contact pad 698 is crushed on antenna (as the description about Fig. 5 above), and to form an electrical connection between antenna 696 and large contact pad 698, wherein large contact pad 698 is positioned at 699 positions.
Fig. 7 has shown according to embodiment the cross section that the capacitive couplings after a thermal coupling step embeds.
As shown in diagram 700, a set of tags example comprises an integrated circuit 710 injecting in dielectric (such as PET) 708, and wherein this dielectric 708 has covered an antenna 706.Electric coupling between integrated circuit 710 and antenna 706 is to be provided by the one or more electric capacity that are formed between the lip-deep large contact pad of integrated circuit 710 and antenna 706.The dielectric of this electric capacity may comprise a part for dielectric 708, any non-conductive overlayer of integrated circuit 710, and/or an additional dielectric layer 712 between integrated circuit 710 and antenna 706.In certain embodiments, additional dielectric layer 712 may comprise antenna 706 self-assembling formations or the artificial oxide layer generating, cohesive dielectric substance, or other materials.According to some embodiment, integrated circuit perhaps not direct-coupling on antenna, but be coupled by intermediary layer.Such as, a tape may capacitively be coupling on aforementioned integrated circuit, and this antenna can be switched on and be coupled to this tape subsequently.Therefore, this set of tags may comprise the additional articulamentum between this antenna and this integrated circuit, and wherein this integrated circuit uses principle as herein described.
In other embodiment, antenna is attached on integrated circuit and may comprises that carrying out integrated circuit metal places and schema construction process, then place the passivating material that comprises dielectric material, integrated circuit is separated from complete wafer, with by antenna, dielectric material and integrated circuit force together.This dielectric material may comprise that one has the material of relatively high (such as being greater than 8) specific inductive capacity, such as hafnia, and zirconia, hafnia silicic acid, zirconia silicic acid, and strontium oxide strontia-titanium.Alternatively, this machining eyeglass step may be done as known in the art like that, and wherein art technology comprises Passivation Treatment and contact pad opening etching, and then this integrated circuit is separated and forces together with antenna and dielectric material.
Fig. 8 has shown a sectional view that the capacitive coupling with superimposed layer embeds, and this superimposed layer is for increasing intensity.
Tag combination shown in tag combination example and Fig. 7 of diagram 800 is similar, and it has a superimposed layer 814 for strengthening intensity.This superimposed layer 814 may comprise PET and/or any other suitable material, may be attached by bonding agent or additive method according to the design and use of label simultaneously.For example, antenna stack may directly be put in a main body, then in the manner described integrated circuit road is pressed on antenna stack, and superimposed layer 814 is placed in to integrated circuit and antenna stack top.This superimposed layer can be configured to realize by different modes other function, such as can writing labels and similar function as one.
Fig. 9 has shown a schematic diagram that is similar to the combination RFID label of Fig. 3, and Fig. 3 has used the combined method in embodiment.
Conventional labels combined method and the difference according to embodiment tag combination method have been shown in diagram 900.By use large contact pad 940 in integrated circuit surface, realize capacitive couplings between antenna (320,322) and less radio-frequency loop 316.This has reduced the stray capacitance between non-less radio-frequency track 942 and antenna 320/322.In addition,, because do not need less radio-frequency distribution bus, less radio-frequency distribution resistance has also been eliminated.
Electric capacity between antenna trace and integrated circuit may comprise that antenna trace and/or the tectal oxide layer 324 of antenna/integrated circuit are as dielectric material.The dielectric properties of these materials can be controlled by its component and thickness (such as strengthening the generation of oxide layer, control the thickness of oxide layer, etc.), thereby guarantee that label design reaches default capacitance.
Because large contact pad may be equally large with integrated circuit surface, so by the use such as gold salient point processed, the mechanical limitation that alignment, and the control of assembly force accurately etc. brings has also been reduced significantly.So therefore, reduced combination step and increased fiduciary level and turnout.
As above, about as described in Fig. 6, an integrated circuit may be electrically connected or can be connected to conductively on the conductive traces of antenna, for example, by using indenture track is directly connected to the large contact pad of integrated circuit on track.In certain embodiments, an integrated circuit contact pad may not use indenture, is electrically connected on an antenna in the situation of salient point or elevated regions.
Figure 10 A and Figure 10 B shown according to embodiment with the label precursor of integrated circuit that is electrically connected on antenna terminal, wherein this antenna interrupts in label substrate substrate.A label precursor is a part for complete RFID label, and comprises that a RFID integrated circuit and one have the substrate substrate of whole label antenna (such as an inlay) or one and only have the substrate substrate of a whole label antenna part (such as a tape).Under latter event, this tape may be attached on an inlay.
Figure 10 A has described an integrated circuit 1002 and a label substrate 1008.Integrated circuit 1002 comprises that one or more is similar to the large contact pad 1004 of contact pad 334 and 336 in Fig. 3, and these contact pads are electrically connected on one or more circuit component in integrated circuit 1002 scopes.The label substrate 1008 that may be a tape or an inlay comprises an antenna terminal 1010, and this antenna terminal may be for being similar to the metallic traces of the antenna trace 320 and 322 shown in Fig. 3.If antenna terminal 1010 comprises oxidizable metal, such as aluminium and copper, in terminal 1010 may because of such as in being exposed to air and produce layer of oxide layer 1012.Oxide layer 1012 can play the insulation course effect that forms electrical connection between surface-mounted integrated circuit 1004 and antenna terminal 1010 that stops.
In order to emphasize this problem, increase extra play 1006 can be added to promote the formation of the electrical connection between surface-mounted integrated circuit 1004 and antenna terminal 1010.In certain embodiments, thus annex layer 1006 comprise etchant with etching or penetrate oxide layer 1012 and form breach.The oxide layer 1012 that for example, ruptures when, extra play 1006 may comprise particle (spherical, ovum shape, angled, angular etc.) in heating and/or exert pressure is with at the interior formation breach of this oxide layer 1012.In one embodiment, particle is suspended in the liquid that quick-acting binder maybe may be applied to integrated circuit 1002 or substrate 1008, thus then bonding agent or liquid become dry form extra play 1006. extra plays 1006 also (or instead) comprise for etching oxide layer or the reagent that can react with oxide layer to form breach.Such as, if antenna terminal 1010 comprises aluminium, extra play 1006 may comprise etchant or the solubilizer for aluminium oxide.Be configured on antenna terminal 1010 when thering is the integrated circuit 1002 of extra play 1006, extra play 1006(is than particle described above and/or reagent) composition at the interior generation breach of oxide layer 1012, thereby allow that surface-mounted integrated circuit 1004 forms and being electrically connected of antenna terminal 1010.
In certain embodiments, this extra play 1006 may comprise that bonding agent is to be attached to integrated circuit 1002 in label substrate 1008.Such as, bonding agent may comprise isotropy or anisotropic conductive material and/or nonconductive adhesive.In certain embodiments, bonding agent may also comprise one or more machinery as herein described and/or chemical etchant or reactant (such as particle, etchant, solubilizer, ooze stain etc.), and in other some embodiment, bonding agent may be separated with etchant.
If extra play conducts electricity, the electrical connection between surface-mounted integrated circuit 1004 and antenna terminal 1010 may form by extra play 1006.Such as, if extra play 1006 comprise for the conductive particle at the interior formation breach of oxide layer 1012, conductive particle can help form electrical connection.If extra play 1006 is non-conductive, can, by heating, exert pressure or other processes are got rid of, thereby allow surface-mounted integrated circuit 1004 and antenna terminal 1010 directly contact with formation be electrically connected (such as heating, exert pressure or other programs after).In certain embodiments, surface-mounted integrated circuit 1004 itself may have a texturing surface (such as air spots, fold, projection, and/or other topological characteristics) with in heating and/or the lower etching or oxide layer 1012 is ruptured of exerting pressure.Such as, surface-mounted integrated circuit 1004 may be on its surface with certain rule or random relatively fold or the projection of point of angle that distributing.In certain embodiments, may use laser assisted etching or other optional engraving methods to form surface texturing on surface-mounted integrated circuit 1004.
Figure 10 B has described a diagram 1050 that is similar to diagram 1000 in Figure 10 A.But masking layer 1052 rather than oxide layer cover on antenna terminal 1010.Masking layer 1052 is placed and is formed after antenna terminal 1010 forms, using the protective seam as stoping antenna terminal oxide layer to form.This masking layer 1052 may comprise organic or Inorganic Dielectric Material, or even may comprise and be difficult for oxidized metal or other conductive materials.If masking layer 1052 comprises a kind of dielectric or insulating material, extra play 1006 may comprise can with masking layer 1052 particle that reacts, can etching or dissolve the medium of masking layer 1052, and/or the particle particle that masking layer 1052 ruptured in heating and/or while exerting pressure.If masking layer 1052 comprises conductive material, extra play 1006 may comprise the material that surface-mounted integrated circuit 1004 and masking layer 4052 are electrically connected, or extra play 1006 even may not exist.
When to the heating of integrated circuit or label substrate and/or while applying to form electrical connection (as previously mentioned), in certain embodiments, may also use other program rather than heating and/or exert pressure on surface-mounted integrated circuit 1004 and antenna terminal 1010, to form electrical connection.For example, using electric field between surface-mounted integrated circuit 1004 and antenna terminal.This electric field can promote the etching to any oxide layer (as oxide layer 1012) by for example improving the mode of rate of etch and/or etching selectance.This electric field also may by for example by circuit board electric welding in antenna or improve metallic ion electromigratory mode and promote the physics of electrical connection between surface-mounted integrated circuit 1004 and antenna terminal 1010 to form, thereby make plate 1004 can switch on antenna terminal 1010 phase short circuits.Another example is that using ultrasound wave soldering connects and oxide layer 1012 ruptured and/or make plate 1004 and antenna 1010 phase short circuits.
In certain embodiments, the etchant in extra play 1006 or reagent may and oxide layer 1012 or masking layer 1052 react and between surface-mounted integrated circuit 1004 and antenna terminal 1010, form conductive channel and needn't be at oxide layer 1012 or the interior formation breach of masking layer 1052.For example, masking layer 1052 may comprise non-conductive plastics.In the time that extra play 1006 contacts with masking layer 1052, oozing stain and may diffuse to part masking layer 1052 in extra play 1006, becomes these part masking layers conductor and generates conductive channel.In certain embodiments, may application of heat and/or the method for pressurization to promote diffusion/reaction.
In certain embodiments, integrated circuit may comprise a non-conductive passivation layer again.As shown in Figure 11 below, this again passivation layer may cover a surface of integrated circuit, and be arranged between integrated circuit and substrate (such as the extra play 712 in Fig. 7), or following Figure 11 describes and is arranged between connection of antenna touch pad and the remainder of this integrated circuit.This again passivation layer may alleviate because assembly force changes the wiring capacitance fluctuation causing, also may reduce the stray capacitance coupling between large connection of antenna touch pad and other integrated circuit components simultaneously.In certain embodiments, then passivation layer be limited in and/or extend in the boundary of its integrated circuit surface being set up.But in other some embodiment, then passivation layer may extend to outside integrated circuit surface boundary.For example, then passivation layer may reel or occupy to adjacent one or more integrated circuit surface, or may extend integrated circuit surface with the form of cantilever.
Figure 11 has shown diagram 1100, in diagram 1100, the RFID tape or the inlay that comprise substrate 1120 and antenna terminal 1127 utilize assembly force F1(1102) be compressed against on RFID integrated circuit 1124, at this, antenna terminal 1127 and contact layer 1112 separate with integrated circuit under the effect of passivation layer again.Mounting distance D1(1104) by passivation layer 1110 is definite again, and produce a similar fixing wiring capacitance C1.
In certain embodiments, the contact layer 1112 that is similar to the contact pad 434 or 436 in Fig. 4 has substantially covered most of region on RFID integrated circuit 1124 surfaces.This contact layer 1112 may comprise conductive material, such as metal or other optional conductive material or have the material of metallicity.In certain embodiments, contact layer 1112 may conduct electricity redistribution layer and forms by being applied in or being placed on again on passivation layer 1110.This conduction redistribution layer may be applied by the mode of evaporation, sputter or directly transplanting.In certain embodiments, conduction redistribution layer may fancy moulding (such as forming contact pad, tape or other are wanted the contact shape obtaining) to form contact layer 1112.For example, the evaporation of redistribution layer or sputter may with one cover step with form contact fancy (such as with photoresist) and the etching step (if covering step after layer is placed) of expecting or rise from/remove step (if covering step before layer placement).In certain embodiments, contact layer 1112 may be applied to another substrate, and then fancy moulding is transplanted on integrated circuit.Although only placed one deck contact layer 1112 in Figure 11, in other embodiment, may not only have contact layer, or contact layer 1112 may comprise multiple parts.For example, the contact layer 1112 on passivation layer 1110 again may be by moulding so that multiple contact areas to be provided, and can not switch on each other.
As passivation layer 1110 again, in certain embodiments, this contact layer 1112 is limited in passivation layer 1110 again, and/or extends to passivation layer 1110 borders again, and/or is limited in being placed with again in the integrated circuit surface of passivation layer and/or extends to the border of this integrated circuit surface.Certainly,, in other some embodiment, contact layer 1112 may extend to outside passivation layer or integrated circuit surface again.For example, contact layer 1112 may be reeled or occupy to adjacently situated surfaces, or even extends to outside surface with the form of cantilever.
Figure 115 0 has shown that RFID tape or inlay are pressed against on RFID integrated circuit by the assembly force F2 to be greater than assembly force F1.The existence of passivation layer 1110 has guaranteed mounting distance D2(1154 again) and mounting distance D1(1154) basic identical.Therefore, wiring capacitance C1 is substantially similar to wiring capacitance C2, and it is similar tuning and therefore have a similar performance characteristic that this can further assist in ensuring that label has.In certain embodiments, loop 1162 is electrically connected on contact layer 1112 by the salient point 1108 forming by the breach in passivation layer 1110 again.In other some embodiment, may there is no salient point 1108. in this case, loop 1162 may by passivation layer 1110 more capacitively or electric current be connected to contact layer 1112.For example, if there is no suitable conductive channel by passivation layer 1110 again, loop 1162 may capacitively be connected to contact layer 1112. in certain embodiments, and contact layer 1112 may directly be placed on the breach in passivation layer 1110 again, is therefore electrically connected to loop 1162.In other some embodiment, if Figure 10 A-B is above about the description of oxide layer 1012/ masking layer 1052, then a part for passivation layer may be made into conductor, and between loop 1162 and contact layer 1112, forms electrical connection along current-carrying part.
In certain embodiments, then passivation layer 1110 may comprise that the clearance that contact layer 1112 and integrated circuit 1124 are separated is to be further coupled these two element capacitive character solutions.This clearance may comprise both salient point of electrical connection by contact layer 1112 and integrated circuit 1124() between support column bridge joint.In certain embodiments, contact layer 1112 may comprise that metal system or conduction reticulate texture are to impel the formation of clearance.
Also can in the assembling process of integrated circuit, play the effect of assisting to protect again passivation layer 1110 as the contact layer 1112 of a relatively large metal making sheet.For example, contact layer 1112 may be as an etching veil being in program described in 7482251 files such as the U.S. Patent number that is issued on January 27th, 2009, cover and prevent etching or damage 1110 parts of passivation layer again of this etching veil below, wherein the full content of this patent is incorporated to herein by reference.
As mentioned above, in certain embodiments, contact layer may comprise having difform contact area.Figure 12 has described the contact area according to the medelling of embodiment.Figure 120 0 has described the vertical view of the integrated circuit 1202 with integrated circuit contact 1204 and 1206.This integrated circuit 1202 also comprises that covering is connected to switching on the contact area 1208 and 1210 contacting 1204 and 1206 respectively.This contact area 1208 and 1210 allows that integrated circuit contact is electrically connected on outside electric elements to 1204 and 1206, such as the antenna terminal (such as antenna terminal 1127) being positioned on RFID tape or inlay.This contact area 1208 and 1210 can be by above about the fancy moulding of the placement conduction redistribution layer of the description of Figure 11 and manufactured or be shaped.This shape of this contact area and/or orientation may be based on attractive in appearance, be easy to form be electrically connected with antenna terminal, and/or with integrated circuit 1202 in the coupling of element.For example, contact area 1208 and 1210 can be shaped to minimize with integrated circuit 1202 in the stray capacitance of sensitive element coupling.In these cases, thus conduction redistribution layer can the part redistribution layer that the partial parasite electric capacity of this integrated circuit 1202 is exceeded to a threshold value be stripped from forming process by moulding.For example, this part may remove with cover-etching program after this placement, or in advance application is covered-risen from program and stops its placement.This threshold value may be determined in advance before the moulding of redistribution layer, and may be based on determining than the partial parasite electric capacity of whole integrated circuit stray capacitance or partly integrated circuit as desired.
The vertical view of integrated circuit 1202 another embodiment has been described in diagram 1250.In diagram 1250, only have integrated circuit contact to contact with 1206 one be able to switch on to 1204 and be for example connected to contact area 1208 and 1210., do like this may in order to reduce contact area and integrated circuit contact between electric capacity.As shown in Figure 125 0, contact area 1208 and 1210 may have bending or mellow and full edge equally.This may make to cover, etching and/or rise become easy from forming process.
In certain embodiments, the contact position between contact layer (such as contact layer 1112 or contact area 1208/1210) and wireless terminal (such as wireless terminal 1127) may be different from the contact position between contact layer and integrated circuit (such as salient point 1108).Figure 13 has described non-overlapped or compensation contact according to embodiment, and has described vertical view 1300 and sectional view 1350(along the axle A-A' shown in view 1300).In Figure 13, integrated circuit 1302 has integrated circuit contact 1304 and 1306.On integrated circuit contact 1304 and 1306, place one deck passivation layer 1320 again, and contact pad 1308 and 1310 is placed on passivation layer 1320 again.This contact pad 1308 and 1310 may be formed by the form of moulding placement contact layer as above.Integrated circuit contact 1304 and 1306 can be switched on respectively and is connected to contact pad 1308 and 1310 by passivation layer 1320 again.As shown in Figure 135 0, integrated circuit contact 1306 may be similar to salient point 1108 by salient point 1322() can switch on is connected in contact pad 1310, and wherein this salient point 1322 forms through one at this breach of passivation layer 1320 again.Similarly salient point (not showing) may can be switched on integrated circuit contact 1304 and be connected in contact pad 1308 by another breach of passivation layer again.In certain embodiments, contact pad 1310 may directly can be connected with 1304 with integrated circuit contact 1306 respectively with 1308 in the situation that there is no salient point with switching on.For example, contact pad 1310/1308 may be positioned on a breach of passivation layer 1320 again, directly forms and being electrically connected of integrated circuit contact 1306/1304.
In certain embodiments, contact pad/integrated circuit contact connects and is connected with contact pad/antenna terminal that (and their breach and oxidation/masking layer in passivation layer again may stagger if any) mutually with not overlapped, as shown in figure 13.This may provide flexibility ratio for integrated circuit is disposed at antenna terminal.Certainly, in other some embodiment, connection/breach may partly overlap, or a connection (such as contact pad/antenna terminal connects) may be surrounded another connection (such as contact pad/integrated circuit connects) completely.
Large integrated circuit contact pad as herein described may contribute to an integrated circuit in suprabasil location.Figure 14 has shown a vertical view 1400 and a side view 1450 of label self combined method according to embodiment.In Figure 14, integrated circuit 1402 is positioned in a substrate with antenna terminal 1408 and 1410.More precisely, thereby integrated circuit 1402 is configured to make the first integrated circuit contact pad 1404 and the first antenna terminal 1408(rather than the second antenna terminal 1410) overlapping, the second integrated circuit contact pad 1406 and the second antenna terminal 1410(rather than the first antenna terminal 1408) overlapping.
The surface tension of liquid surface can be used to promote each contact pad to align with its antenna terminal separately.Surface tension is formed by bounding force between fluid molecule.When two similar liquid (or have similar surface can liquid) mutually near time, they are easily combined into an entirety, the molecular amounts that larger drop energy minimization exposes therefore minimum surface energy.If two drops are relevant from different objects respectively, the combination between two drops may combine two different objects.
In Figure 14, at least some contact pads and/or antenna terminal are relevant to a drop respectively.For example, contact pad 1404 may be relevant to drop 1412, and contact pad 1406 may be relevant with drop 1414, and antenna terminal 1408 may be relevant with drop 1416, and antenna terminal 1410 may be relevant with drop 1418.When integrated circuit 1402 is during near substrate (and antenna terminal 1408 and 1410), drop 1412 may be attracted to drop 14716, thus the contact (district) that traction integrated circuit contact pad 1404 enters with antenna terminal 1408.Same, drop 1414 may be attracted to drop 1418, thus the contact (district) that traction integrated circuit contact pad 1406 enters with antenna terminal 1410.
In one embodiment, drop 1412-1418 may comprise water.In certain embodiments, may also comprise one or more liquid adhesives, such as electroconductive binder, nonconductive adhesive, or anisotropic-electroconductive adhesive.Drop 1412-1418 may be from solid material.For example, may first solid film or solid particle be placed on contact pad and/or antenna terminal.Be placed solid material then heated, chemical modification, or be for example otherwise processed to drop 1412-1418., may now solid solder be placed on contact pad and/or antenna terminal.Thereby may first to integrated circuit 1402 and/or substrate heating, solid solder be melted for scolder drop before combinator.Then, make integrated circuit 1402 near substrate (and antenna terminal 1408 and 1410), thereby the scolder drop on integrated circuit contact pad and/or antenna terminal combine in conjunction with traction integrated circuit and substrate.In certain embodiments, may, before heating, allow integrated circuit 1402 near substrate.Then, heat with the solid solder on fusing contact pad and/or antenna terminal, can make like this contact pad and antenna terminal mutually close with combine under traction (by liquid combination).Certainly, also may use the solid material outside scolder.
In certain embodiments, dissimilar liquid can be used for every integrated circuit contact pad and antenna terminal pair.For example, the first liquid can be placed on integrated circuit contact pad 1404 and antenna terminal 1408, and the second liquid can be placed on integrated circuit contact pad 1406 and antenna terminal 1410.May select to have the kind of liquid of different surfaces tension force performance, thereby make the drop of the first liquid can not attract the drop of the second liquid.For example, on integrated circuit contact pad 1404 and antenna terminal 1408, place the drop of polar liquid (such as water), on integrated circuit contact pad 1406 and antenna terminal 1410, place the drop of non-polar liquid (such as oil).In certain embodiments, may use the material for liquid under different condition.For example, on integrated circuit contact pad 1404 and antenna terminal 1408, water droplet may be placed, on integrated circuit contact pad 1406 and antenna terminal 1410, solid solder may be placed.In the time that integrated circuit has just been applied in substrate, together with integrated circuit contact pad 1404 will be pulled in by water droplet with antenna terminal 1408.Then, thus the solid solder on heating integrated circuit and substrate fusing integrated circuit contact pad 1406 and antenna terminal 1410 is to combine contact pad and antenna terminal.
Although what describe is to be drop on each integrated circuit contact pad and antenna terminal, in certain embodiments, may be only on every integrated circuit contact pad and the right integrated circuit contact pad of antenna terminal or antenna terminal, there is drop in Figure 14.In these embodiments, first the drop on integrated circuit contact pad (or antenna terminal) may be attracted on the material of antenna terminal (or integrated circuit contact pad).For example, first the drop of polar liquid (such as water) may be attracted to (such as the metal of integrated circuit contact pad or antenna terminal) on a kind of metal.
May also can use other technology in substrate, to combine or align integrated circuit and antenna.Give an example, may use electrostatic attraction by a charged integrated circuit combination on the antenna terminal of a contrary electricity of band (lotus).Electric charge on integrated circuit and/or antenna terminal may be brought out by laser (such as just as laser printing) or other suitable modes.
Except promoting integrated circuit suprabasil placement, large integrated circuit contact described herein is paid somebody's debt and expected repayment later and can be promoted integrated circuit to detect.Figure 15 A and 15B, according to embodiment, have shown that the wafer scale probe of integrated circuit detects.Integrated circuit on wafer can detect by the mode that uses an integrated circuit contact pad of single probe contact.In certain embodiments, multiple detection probe are combined into a probe plate, and this probe plate serves as the interface between detection system and wafer.In order to detect integrated circuit on wafer, must exactly probe plate (or single probe) be alignd on wafer with integrated circuit contact pad.Large integrated circuit contact pad described herein has been simplified the alignment program of probe, because use the required precision for the alignment of popping one's head in of large contact pad with respect to the required precision for the alignment of popping one's head in of the little contact pad of little use.
Figure 15 A described one for contact wafer 1502 system 1500 for detecting.Wafer 1502 comprises multiple integrated circuit, only has one to be labeled.Integrated circuit 1504 comprises that 1506 and 1508. probe plates 1510 of two contact pads comprise multiple detection probe, and two probes are wherein noted as 1512 and 1514. Detection probe 1512 and 1514 can by respectively with contact pad 1506 and 1508 between form be electrically connected be mounted to detect the relatively large contact pad of integrated circuit 1504. sizes 1506 and 1508 can reduce pop one's head in plate 1510 be configured in the accuracy requirement on wafer 1502, thereby reduce the time of whole detection.
Figure 15 B has described a system 1550 that is similar to system 1500.In system 1550, probe plate 1552 comprises by having elasticity, the probe 1554 and 1556 that material flexible and conduction is made.The flexible characteristic of probe 1554 and 1556 can be reduced in the infringement to integrated circuit 1504 and/or wafer while detection, can also improve being electrically connected between each probe and contact pad simultaneously.In certain embodiments, probe plate 1552 itself may be to be also made up of flexible material, and this can improve on wafer and contacts with the probe of integrated circuit contact pad.
It is PCT/US12/54531 that integrated circuit described herein may also be configured to and/or realize application number, and the applying date is on September 10th, 2012, the function described in PCT patented claim.The disclosure of aforesaid PCT application is all incorporated to herein by reference.
Embodiment also comprises the method for assembling label as herein described.Presents has economic worth, because sometimes single description has just provided the function according to the method for embodiment and the equipment that makes according to embodiment.Embodiment may use the program of being carried out by full-automatic or semi-automatic label manufacturing equipment and be implemented.Due to the character of the technical characterictic of step and its sequence, a program is defined by realizing expection one group of step of object or operation conventionally.A program, in the time of the series of steps as a handling procedure or operation, is beneficial to execution, than structure described above.
Carry out the step of a program, illustrate or the calculating of action need physical quantity.Conventionally, although be not necessary, these physical quantitys may be converted according to step or explanation, and combination is compared and other calculating or processing, is also likely stored on the medium of computer-readable.These physical quantitys comprise, for example electricity, magnetic, and electromagnetism electric charge or particle charged particle, the state of material, in most cases may comprise the state of physical equipment or element.
Embodiment may also further comprise the storage medium for storing said procedure.According to embodiment, a storage medium is a machine-readable medium, such as storer, and is controlled a tag combination machine according to embodiment by one and reads with the processor of assembling label.If a storer, it can be carried out in many ways, such as ROM (read-only memory) (ROM), and random-access memory (ram) etc., some in them are unsettled, some are stable.
According to some embodiment, a radio-frequency (RF) identification (RFID) label precursor may comprise a combination with a RFID integrated circuit (IC), one in integrated circuit surface and at the non-conductive passivation layer being again limited in this surface compass, and one on passivation layer again and be limited in this lip-deep conduction redistribution layer.A Part I of redistribution layer may be electrically connected on integrated circuit by first breach on passivation layer again.
This RFID label may also comprise a substrate with first antenna terminal, in a non-conductive barrier on the Part I of the first antenna terminal and/or redistribution layer, form the etchant of second breach, and this combination is attached to suprabasil bonding agent by one.An electrical connection is formed between this first antenna terminal and the Part I of this redistribution layer by this second breach, and this first breach may be not overlapping with this second breach.
According to another embodiment, the combination that provides one to have RFID integrated circuit may be provided the method that combines a RFID label precursor, one in this integrated circuit surface and be limited in the non-conductive passivation layer again in this surface boundary, and one on passivation layer again and limit the conduction redistribution layer in this surface compass.The Part I of this redistribution layer may by this again first breach on passivation layer be electrically connected on this integrated circuit.
The substrate that provides one to have first antenna terminal may be further provided the method, utilize on the non-conductive barrier of etchant on this Part I of this first antenna terminal and/or this redistribution layer and form second breach, wherein the first breach and the second breach are not overlapping, utilize bonding agent that combination is attached in substrate, and between this first antenna terminal and the Part I of this redistribution layer, form one first electrical connection by the second breach.
According to another example, a radio-frequency (RF) identification (RFID) label precursor may comprise a combination with a RFID integrated circuit (IC), one in integrated circuit surface and be limited in the non-conductive passivation layer again in this surface boundary, and one on passivation layer again and be limited in the conduction redistribution layer in this surface boundary.A Part I of this redistribution layer may by this again first breach in passivation layer can switch on and be connected in integrated circuit.
This RFID label precursor may also comprise a substrate with first antenna terminal, one with this Part I of this first antenna terminal and/or this redistribution layer on a reactant that non-conductive barrier reacts, an and bonding agent that this combination is attached to this substrate.The reactive moieties of this non-conductive battery may be conduction, and forms one first electrical connection by this reactive moieties between this Part I of this first antenna terminal and this redistribution layer.
According to an embodiment, this redistribution layer may be by medelling, thereby the part with a stray capacitance that exceeds threshold value to integrated circuit is stripped from.This non-conductive barrier may be oxide layer or masking layer.This bonding agent may comprise an isotropy or anisotropic conductive material, and this first connection may comprise this bonding agent.This etchant may comprise on a texturing surface at redistribution layer and/or conductive particle to form the second breach by damaged this non-conductive battery.This etchant may be by reacting and form the second breach with non-conductive battery.In certain embodiments, this substrate may also comprise second antenna terminal, this redistribution layer may also comprise that one separates and be electrically connected on a Part II of integrated circuit with this Part I, this non-conductive battery may be positioned on this Part II of this second antenna terminal and/or this redistribution layer, this etchant may form the 3rd breach on this non-conductive battery, between this Part II of this second antenna terminal and this redistribution layer, may form one second electrical connection by the 3rd breach.
Above-mentioned explanation, gives an example and data provide a complete description of manufacturing and using embodiment component part.Although this theme is described for architectural feature and/or method action with language, be understandable that, in claim, must not be confined to above-mentioned architectural feature or action to defining of this theme.Above-mentioned specific features and action are disclosed to implement the claims with the exemplary form of embodiment.
Claims (20)
1. a RFID tag precursor, is characterized in that, comprising:
One comprises a RFID integrated circuit, one in integrated circuit surface and be limited in the non-conductive combination of passivation layer again of in a described surperficial border one, with one in described passivation layer surface again and be limited in the combination of in a described surperficial border one conduction redistribution layer, wherein at least described redistribution layer Part I can be switched on and is connected in described integrated circuit by first breach, and wherein said the first breach is at described passivation layer again;
A substrate, it comprises first antenna terminal;
A kind of etchant, described etchant forms second breach on a non-conductive barrier, and wherein said non-conductive barrier is present at least one in the described Part I of described the first antenna terminal and described redistribution layer, and;
Described combination is attached to described suprabasil bonding agent by one; One of them first electrical connection is formed between the described Part I of described the first antenna terminal and described redistribution layer by described the second breach; Not overlapping with described the first breach and described the second breach.
2. label precursor according to claim 1, is characterized in that, described redistribution layer is by medelling, thereby the part with a stray capacitance that exceeds threshold value to described integrated circuit is stripped from.
3. label precursor according to claim 1, is characterized in that, described non-conductive barrier be in a kind of oxide and a masking layer at least one of them.
4. label precursor according to claim 1, is characterized in that, described bonding agent comprise in a kind of isotropy conductive material and a kind of anisotropic conductive material at least one of them, and described the first electrical connection comprises described bonding agent.
5. label precursor according to claim 1, is characterized in that, described etchant comprises a texturing surface at described redistribution layer, and wherein said redistribution layer forms described the second breach by the described non-conductive barrier of breakage.
6. label precursor according to claim 1, is characterized in that, described etchant comprises conductive particle, and wherein said conductive particle forms described the second breach by the described non-conductive barrier of breakage.
7. label precursor according to claim 1, is characterized in that, described etchant is by reacting and form described the second breach with non-conductive barrier.
8. label precursor according to claim 1, is characterized in that,
Described substrate further comprises second antenna terminal;
Described redistribution layer further comprises a Part II, and wherein said Part II can be connected with described Part I electrical isolation and with described integrated circuit with switching on;
Described non-conductive barrier be further arranged in described the second antenna terminal and described redistribution layer described Part II at least one of them;
Described etchant further forms the 3rd breach at described non-conductive barrier; With
One second electrical connection is formed between the described Part II of described the second antenna terminal and described redistribution layer by described the 3rd breach.
9. radio-frequency (RF) identification (RFID) label combination of precursors method, is characterized in that, comprises the following steps:
Provide one to comprise a RFID integrated circuit, one in integrated circuit surface and be limited in the non-conductive combination of passivation layer again of in a described surperficial border one, in described passivation layer surface again and be limited in the combination of in a described surperficial border one conduction redistribution layer, wherein at least described redistribution layer Part I can be switched on and is connected in described integrated circuit by first breach of described passivation layer again with one;
A substrate is provided, and wherein said substrate comprises first antenna terminal;
Form second breach at described non-conductive barrier, wherein said non-conductive barrier is present in one of them in the described Part I of described the first antenna terminal and the described described redistribution layer with a kind of etchant, and wherein said the first breach and described the second breach are not overlapping;
Described combination is attached in described substrate with a kind of bonding agent; With
Between the described Part I of described the first antenna terminal and described redistribution layer, form one first electrical connection by described the second breach.
10. method according to claim 9, is characterized in that, thereby described redistribution layer is stripped from the part with a stray capacitance that exceeds threshold value to described integrated circuit by medelling.
11. methods according to claim 9, is characterized in that, described non-conductive barrier be in a kind of oxide and a masking layer at least one of them.
12. methods according to claim 9, is characterized in that, described bonding agent comprise in a kind of isotropy conductive material and a kind of anisotropic conductive material at least one of them, and described the first electrical connection comprises described bonding agent.
13. methods according to claim 9, is characterized in that, described etchant is that a kind of texturing at described redistribution layer surface and described method further comprise by forming described the second breach with the damaged described non-conductive barrier of described etchant.
14. methods according to claim 9, is characterized in that, described etchant comprises that conductive particle and described method further comprise by forming described the second breach with the damaged described non-conductive barrier of described conductive particle.
15. methods according to claim 9, is characterized in that, further comprise by etchant and non-conductive barrier and react and form described the second breach.
16. according to method claimed in claim 9, it is characterized in that, further comprise by using electric field, electric welding and ultrasonic soldering at least one of them form described first electrical connection.
17. methods according to claim 9, is characterized in that,
Described substrate further comprises second antenna terminal;
Described redistribution layer further comprises a Part II, wherein said Part II and described Part I from electrical isolation with can be connected with described integrated circuit with switching on; With
Described non-conductive barrier be further arranged in described the second antenna terminal and described redistribution layer described Part II at least one of them; With
Described method further comprises:
On described non-conductive barrier, form the 3rd breach with described etchant; With
Between the described Part II of described the second antenna terminal and described redistribution layer, form one second electrical connection by the 3rd breach.
18. 1 kinds of radio-frequency (RF) identification (RFID) label precursor, is characterized in that, comprising:
One comprises a RFID integrated circuit, one in integrated circuit surface and be limited in the non-conductive combination of passivation layer again of in a described surperficial border one, in described passivation layer surface again and be limited in the combination of in a described surperficial border one conduction redistribution layer, wherein at least described redistribution layer Part I can be switched on and is connected to described integrated circuit with one;
A substrate, wherein said substrate comprises first antenna terminal;
A kind of reactant, described reactant reacts with an at least part for the non-conductive barrier of one of them for the described Part I that is arranged in described the first antenna terminal and described redistribution layer, and
A kind of bonding agent that described combination is attached to described substrate; The reactive moieties of wherein said non-conductive barrier is conduction, and
One comprises the first electrical connection of described reactive moieties, and wherein said the first electrical connection is formed between the described Part I of described the first antenna terminal and described redistribution layer.
19. label precursors according to claim 18, wherein, thereby the part that described redistribution layer is had a stray capacitance by medelling with respect to this integrated circuit exceedes preset limit value and is stripped from.
20. label precursors according to claim 18, is characterized in that, described non-conductive barrier is one of them in both of a kind of oxide or a kind of masking layer;
Described bonding agent comprises at least one in a kind of isotropy conductive material and a kind of anisotropic conductive material; With
Described the first electrical connection comprises described bonding agent.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261713058P | 2012-10-12 | 2012-10-12 | |
| US61/713058 | 2012-10-12 | ||
| US13/776346 | 2013-02-25 | ||
| US13/776,346 US8881373B1 (en) | 2008-03-11 | 2013-02-25 | Assembling a radio frequency identification (RFID) tag precursor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103778460A true CN103778460A (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310472824.4A Pending CN103778460A (en) | 2012-10-12 | 2013-10-11 | Radio frequency identification integrated circuit with large contact plate |
| CN201320626885.7U Expired - Fee Related CN203773573U (en) | 2012-10-12 | 2013-10-11 | Front body of radio-frequency identification label |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320626885.7U Expired - Fee Related CN203773573U (en) | 2012-10-12 | 2013-10-11 | Front body of radio-frequency identification label |
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| CN103778460A (en) * | 2012-10-12 | 2014-05-07 | 上海中京电子标签集成技术有限公司 | Radio frequency identification integrated circuit with large contact plate |
| CN104266270B (en) * | 2014-10-10 | 2017-04-12 | 关浩波 | air purifier and purifying method thereof |
| CN111384587B (en) * | 2020-02-17 | 2021-04-20 | 珠海格力电器股份有限公司 | Antenna manufacturing method, antenna and terminal equipment |
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| CN203773573U (en) | 2014-08-13 |
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Application publication date: 20140507 |