CN103772896A - Heat-conducting POM (polyformaldehyde) material and preparation method thereof - Google Patents
Heat-conducting POM (polyformaldehyde) material and preparation method thereof Download PDFInfo
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- CN103772896A CN103772896A CN201410031837.2A CN201410031837A CN103772896A CN 103772896 A CN103772896 A CN 103772896A CN 201410031837 A CN201410031837 A CN 201410031837A CN 103772896 A CN103772896 A CN 103772896A
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- pom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
- B29C48/911—Cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/04—Particle-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
- B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92561—Time, e.g. start, termination, duration or interruption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
- B29C2948/92895—Barrel or housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92923—Calibration, after-treatment or cooling zone
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention discloses a heat-conducting POM (polyformaldehyde) material and a preparation method thereof. The heat-conducting POM material is prepared from the following components in parts by weight: 60-75 parts of POM, 8-15 parts of silicon carbide, 6-10 parts of polyethylene glycol, 1-3 parts of melamine, 1-3 parts of di(dioctylpyrophosphato) oxyacetate titanate, 0.5-2 parts of 2,6-di-tert-butyl-4-methylphenol and 0-1 part of sodium carbonate. The preparation method comprises the following steps: fully mixing the raw materials, adding the mixture to a twin screw extruder, extruding and granulating so as to obtain the heat-conducting POM material. The heat-conducting POM material prepared by the method has good compatibility, mechanical property and heat-conducting property.
Description
Technical field
The invention belongs to thermally conductive material field, relate in particular to a kind of heat conduction POM material and preparation method thereof.
Background technology
The poor thermal conductivity of polyoxymethylene (POM) own, because the excellence of its mechanical property often receives investigators' concern.
In order to improve the heat conductivility of POM, a kind of conventional method is by the allotment of different monomers and polymerization ratio, obtains the polymkeric substance with high thermal conductivity coefficient, but this preparation method's complex process is difficult to accomplish scale production; Another kind method is the method that adopts blend, by adding the component of high thermal conductivity, thereby improves the heat conductivility of whole POM system.But because POM degree of crystallinity is high, compound with regular structure degree is good, and high heat conductive filler mostly is high crystalline inorganic thing, for POM, because its molecular chain is regular, nonpolarity, degree of crystallinity is high, poor with mineral filler consistency, its Composite and functionalization difficulty.
Summary of the invention
The object of the invention has been to provide POM material of a kind of heat conduction and preparation method thereof, makes POM material and has good consistency, mechanical property and heat conductivility.
Object of the present invention can be achieved through the following technical solutions:
A kind of heat conduction POM material, mainly made by the component that comprises following weight part:
POM 60-75 part,
Silicon carbide 8-15 part,
Polyoxyethylene glycol 6-10 part,
Trimeric cyanamide 1-3 part,
Two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1-3 part,
2,6 di tert butyl 4 methyl phenol 0.5-2 part.
Described silicon carbide is nanometer particle.
Described component also comprises the sodium carbonate of 0-1 part.
A preparation method for heat conduction POM material, the method comprises the following steps:
(1) POM60-75 part, silicon carbide 8-15 part, polyoxyethylene glycol 6-10 part, trimeric cyanamide 1-3 part, two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1-3 part, 2,6 di tert butyl 4 methyl phenol 0.5-2 part and sodium carbonate 0-1 part;
(2) above-mentioned raw materials is put into high-speed mixer and mix, with metering material conveying device, the raw material mixing is added in twin screw extruder, extrude, granulation was incubated after 10 minutes at 180 ℃, cooling;
In step (2), the each zone temperatures of twin screw extruder is: a district 170-175 ℃, two district 180-190 ℃, three district 195-200 ℃, four district 200-210 ℃.
Beneficial effect:
In order to improve the heat conductivility of POM material, the present invention has added this material with excellent heat conductivity, conductivity and good mechanical property of silicon carbide, due to nano level silicon carbide have especially particle diameter little, be evenly distributed, specific surface area is large, high surface and fabulous mechanics, calorifics, electric property, has the features such as high rigidity, high-wearing feature, good self-lubricating, high thermoconductivity, low thermal coefficient of expansion.The present invention has added static inhibitor polyoxyethylene glycol to reduce the security hidden trouble producing because of static simultaneously, in order to prevent that POM from use decomposing the formaldehydogenic problem of producing, the present invention has added trimeric cyanamide to absorb the formaldehyde producing, and by adding some auxiliary agents, as coupling agent two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate and oxidation inhibitor 2,6 di tert butyl 4 methyl phenol make material have good consistency.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1
(1) POM60kg, silicon carbide 15kg, polyoxyethylene glycol 10kg, trimeric cyanamide 1kg, two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1kg, 2,6 di tert butyl 4 methyl phenol 0.5kg and sodium carbonate 0.1kg;
(2) above-mentioned raw materials is put into high-speed mixer and mix, with metering material conveying device, the raw material mixing is added in twin screw extruder, extrude, granulation was incubated after 10 minutes at 180 ℃, cooling;
In step (2), the each zone temperatures of twin screw extruder is: 175 ℃, a district, two 190 ℃, districts, three 200 ℃, districts, four 210 ℃, districts.
Embodiment 2
(1) POM75kg, silicon carbide 8kg, polyoxyethylene glycol 6kg, trimeric cyanamide 3kg, two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1kg and 2,6 di tert butyl 4 methyl phenol 0.5kg;
(2) above-mentioned raw materials is put into high-speed mixer and mix, with metering material conveying device, the raw material mixing is added in twin screw extruder, extrude, granulation was incubated after 10 minutes at 180 ℃, cooling;
In step (2), the each zone temperatures of twin screw extruder is: 170 ℃, a district, two 180 ℃, districts, three 195 ℃, districts, four 200 ℃, districts.
Embodiment 3
(1) POM70kg, silicon carbide 10kg, polyoxyethylene glycol 8kg, trimeric cyanamide 1kg, two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 3kg, 2,6 di tert butyl 4 methyl phenol 2kg and sodium carbonate 1kg;
(2) above-mentioned raw materials is put into high-speed mixer and mix, with metering material conveying device, the raw material mixing is added in twin screw extruder, extrude, granulation was incubated after 10 minutes at 180 ℃, cooling;
In step (2), the each zone temperatures of twin screw extruder is: 170 ℃, a district, two 180 ℃, districts, three 195 ℃, districts, four 200 ℃, districts.
Claims (5)
1. a heat conduction POM material, is characterized in that, is mainly made up of the component that comprises following weight part:
POM 60-75 part,
Silicon carbide 8-15 part,
Polyoxyethylene glycol 6-10 part,
Trimeric cyanamide 1-3 part,
Two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1-3 part,
2,6 di tert butyl 4 methyl phenol 0.5-2 part.
2. heat conduction POM material according to claim 1, is characterized in that, described silicon carbide is nanometer particle.
3. heat conduction POM material according to claim 1, is characterized in that, described component also comprises the sodium carbonate of 0-1 part.
4. a preparation method for heat conduction POM material, is characterized in that, the method comprises the following steps:
(1) POM60-75 part, silicon carbide 8-15 part, polyoxyethylene glycol 6-10 part, trimeric cyanamide 1-3 part, two (dioctyl pyrophosphoryl oxygen base) oxyacetate titanate 1-3 part, 2,6 di tert butyl 4 methyl phenol 0.5-2 part and sodium carbonate 0-1 part;
(2) above-mentioned raw materials is put into high-speed mixer and mix, with metering material conveying device, the raw material mixing is added in twin screw extruder, extrude, granulation, is incubated after 10 minutes at 180 ℃, cooling.
5. the preparation method of the POM material of heat conduction according to claim 4, is characterized in that, described in step (2), the each zone temperatures of twin screw extruder is: a district 170-175 ℃, two district 180-190 ℃, three district 195-200 ℃, four district 200-210 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410031837.2A CN103772896A (en) | 2014-01-24 | 2014-01-24 | Heat-conducting POM (polyformaldehyde) material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410031837.2A CN103772896A (en) | 2014-01-24 | 2014-01-24 | Heat-conducting POM (polyformaldehyde) material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103772896A true CN103772896A (en) | 2014-05-07 |
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ID=50565693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410031837.2A Pending CN103772896A (en) | 2014-01-24 | 2014-01-24 | Heat-conducting POM (polyformaldehyde) material and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN103772896A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330108A (en) * | 2000-06-22 | 2002-01-09 | 汎塑料株式会社 | Polyacetal resin composite |
| CN101942175A (en) * | 2010-09-09 | 2011-01-12 | 上海材料研究所 | Modified polyformaldehyde material for three-layer composite material |
| CN102634162A (en) * | 2012-05-09 | 2012-08-15 | 四川大学 | Heat-conduction polyformaldehyde composite material and preparation method thereof |
-
2014
- 2014-01-24 CN CN201410031837.2A patent/CN103772896A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330108A (en) * | 2000-06-22 | 2002-01-09 | 汎塑料株式会社 | Polyacetal resin composite |
| CN101942175A (en) * | 2010-09-09 | 2011-01-12 | 上海材料研究所 | Modified polyformaldehyde material for three-layer composite material |
| CN102634162A (en) * | 2012-05-09 | 2012-08-15 | 四川大学 | Heat-conduction polyformaldehyde composite material and preparation method thereof |
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Application publication date: 20140507 |