CN103770468B - Liquid injection apparatus and integrated forming manufacture method thereof - Google Patents
Liquid injection apparatus and integrated forming manufacture method thereof Download PDFInfo
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- CN103770468B CN103770468B CN201310733314.8A CN201310733314A CN103770468B CN 103770468 B CN103770468 B CN 103770468B CN 201310733314 A CN201310733314 A CN 201310733314A CN 103770468 B CN103770468 B CN 103770468B
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Abstract
The invention provides a kind of liquid injection apparatus and integrated forming manufacture method thereof, wherein, method is included in the first substrate and forms multiple spaced pressure generating part; The public chamber first surface of the first substrate forming the pressure chamber corresponding with multiple pressure generating part and is communicated with multiple pressure chamber; In pressure chamber, be formed with jet orifice plate by bonding technology and in jet orifice plate, be formed with the spray orifice be communicated with pressure chamber by photoetching process.Liquid injection apparatus provided by the invention and integrated forming manufacture method thereof, mineralization pressure chamber and public chamber on the first surface of the first substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent mineralization pressure chamber in the first substrate, thus the mechanical strength of the first substrate can not be reduced, the first substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
Description
Technical field
The present invention relates to printer technology, particularly relate to a kind of liquid injection apparatus and integrated forming manufacture method thereof.
Background technology
The liquid injection apparatus of printer is the distortion by piezoelectric element and oscillating plate, the volume of pressure chamber is changed, thus is sprayed from spray orifice by the ink in pressure chamber.
The jet orifice plate that existing a kind of liquid injection apparatus comprises substrate, be arranged on oscillating plate on substrate first surface and piezoelectric element and be bonded in substrate second (one side relative with first surface).The manufacture method of existing liquid injection apparatus is: form oscillating plate and piezoelectric element at the first surface of substrate, second in substrate is passed through etch process, etch the pressure chamber of multiple storage of liquids corresponding with piezoelectric element position and the public chamber corresponding with ink supply aperture position on this substrate, finally, in second bonding jet orifice plate of matrix, the multiple spray orifices in jet orifice plate are communicated with respectively with each pressure chamber.Operationally, piezoelectric element produces distortion to this liquid injection apparatus under voltage driven, and passes to oscillating plate and cause pressure chamber's Volume Changes, makes the liquid in pressure chamber spray from spray orifice and complete printing.
But, in order to improve the print resolution of printer, need the quantity of the pressure chamber increasing high liquid injection apparatus, pressure chamber due to existing liquid injection apparatus is that etching is formed in substrate, increase the sidewall thickness that pressure chamber's number needs will reduce adjacent pressure chambers, thus the mechanical strength as the silicon chip of substrate will inevitably be caused to decline, and easily occur substrate breakage in the fabrication process and the yield rate of liquid injection apparatus is reduced, manufacturing cost is higher; On the other hand, because nozzle plate is bonded in the substrate of pressure chamber by adhesive, if adhesive flows in pressure chamber, also print quality can be had influence on.
Summary of the invention
The invention provides a kind of liquid injection apparatus and integrated forming manufacture method thereof, for solving, the liquid injection apparatus yield rate that liquid injection apparatus integrated forming manufacture method in prior art produces is low, manufacturing cost is higher and the technological deficiency that print quality is poor.
A kind of liquid injection apparatus integrated forming manufacture method provided by the invention, comprising:
First substrate is formed multiple spaced pressure generating part;
The public chamber first surface of the first substrate forming the pressure chamber corresponding with multiple described pressure generating part and is communicated with multiple described pressure chamber;
In described pressure chamber, be formed with jet orifice plate by bonding technology and in described jet orifice plate, be formed with the spray orifice be communicated with described pressure chamber by photoetching process.
The present invention also provides a kind of liquid injection apparatus, and this liquid injection apparatus manufactures with above-mentioned liquid injection apparatus integrated forming manufacture method.
Liquid injection apparatus provided by the invention and integrated forming manufacture method thereof, mineralization pressure chamber and public chamber on the first surface of the first substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent mineralization pressure chamber in the first substrate, thus the mechanical strength of the first substrate can not be reduced, the first substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.Further, form jet orifice plate by bonding technology and in jet orifice plate, form spray orifice by photoetching process, adhesive can be avoided to flow in pressure chamber, the print quality of liquid injection apparatus can be improved.
Accompanying drawing explanation
The flow chart of a kind of liquid injection apparatus integrated forming manufacture method that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is the flow chart of a kind of detailed description of the invention of step 200 in Fig. 1;
Fig. 3 is the flow chart of a kind of detailed description of the invention of step 300 in Fig. 1;
Fig. 4 is the flow chart of a kind of detailed description of the invention of step 100 in Fig. 1;
The flow chart of the another kind of liquid injection apparatus integrated forming manufacture method that Fig. 5 provides for the embodiment of the present invention;
Fig. 6 is the structural representation of the liquid injection apparatus that the embodiment of the present invention manufactures;
Fig. 7 A-Fig. 7 H is the manufacture course of products topology view of a kind of detailed description of the invention of step 200 in the embodiment of the present invention;
Fig. 8 A-Fig. 8 G is the manufacture course of products topology view of another embodiment of the present invention;
Fig. 9 A-Fig. 9 C is the manufacture course of products topology view of the another embodiment of the present invention;
Figure 10 A-Figure 10 B is the manufacture course of products topology view of the present invention's embodiment again.
Detailed description of the invention
The flow chart of a kind of liquid injection apparatus integrated forming manufacture method that Fig. 1 provides for the embodiment of the present invention, as shown in Figure 1, the liquid injection apparatus integrated forming manufacture method that the present embodiment provides, comprising:
Step 100, the first substrate is formed multiple spaced pressure generating part.
Step 200, the public chamber first surface of the first substrate forming the pressure chamber corresponding with multiple described pressure generating part and is communicated with multiple described pressure chamber.
Particularly, Fig. 2 is the flow chart of a kind of detailed description of the invention of step 200 in Fig. 1; As shown in Figure 2, step 200, the public chamber first surface of the first substrate forming the pressure chamber corresponding with multiple described pressure generating part and is communicated with multiple described pressure chamber, can comprise:
Step 201, the first surface of the first substrate arranges chamber layer and exposes, and limits shape and the position of pressure chamber and public chamber.
Particularly, Fig. 6 is the structural representation of the liquid injection apparatus that the embodiment of the present invention manufactures; Fig. 7 A-Fig. 7 H is the manufacture course of products topology view of a kind of detailed description of the invention of step 200 in the embodiment of the present invention, as shown in figs. 6 and 7, first substrate 1 can be silicon base, the upper surface that the first surface of the first substrate 1 is the first substrate 1 shown in figure, chamber layer 5a can be coated with on the first surface of the first substrate 1, the material of chamber layer 5a can for having the negative light-sensitive glue SU8 of good mechanical processing characteristics, chamber layer 5a can fill whole first substrate 1 upper surface, and the height dimension of the thickness of chamber layer 5a and pressure chamber and public chamber matches.
As shown in Fig. 6 and 7B, mask plate 12a can be adopted to expose chamber layer 5a, and limit shape and the position of pressure chamber 5 and public chamber 7 by the version of mask plate 12a and exposure technology, wherein, chamber wall 5b is cured, and can not be removed by the developer solution that subsequent technique adopts.
Step 202, development mineralization pressure chamber and public chamber.
As seen in figure 7 c, can adopt developer solution 1,2 propane diols formic acid esters (PMEGA) develop chamber layer 5a, and the chamber wall 5b be cured is retained, and remaining part is removed shown in rear mineralization pressure chamber 5 and public chamber 7(Fig. 6).
Step 300, is formed with jet orifice plate by bonding technology and in described jet orifice plate, is formed with the spray orifice be communicated with described pressure chamber by photoetching process in described pressure chamber.Particularly, Fig. 3 is the flow chart of a kind of detailed description of the invention of step 300 in Fig. 1; As shown in Figure 3, step 300 can comprise:
Step 301, the second substrate is coated with ejection layer.
As illustrated in fig. 7d, the material of the second substrate 1 ' can be lucite etc., and the material of ejection layer 6a can for having the negative light-sensitive glue SU8 of good mechanical processing characteristics.
Step 302, is bonded together the chamber wall of described chamber layer and described ejection layer by bonding technology, as seen in figure 7e.
Step 303, peels off described second substrate, as shown in Figure 7 F.
Further, as shown in Fig. 7 G and Fig. 7 H, mask plate 12b can be adopted to expose ejection layer 6a, and shape and the position of spray orifice is limited by the version of mask plate 12b and exposure technology, wherein, spray orifice wall is cured, and can not be removed by the developer solution that subsequent technique adopts.Adopt developer solution 1,2 propane diols formic acid esters (PMEGA) to develop ejection layer 6a, the spray orifice wall be cured remains, and remaining part is removed rear formation spray orifice 6.
The liquid injection apparatus integrated forming manufacture method that the present embodiment provides, mineralization pressure chamber and public chamber on the first surface of the first substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent mineralization pressure chamber in the first substrate, thus the mechanical strength of the first substrate can not be reduced, the first substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.Further, form jet orifice plate by bonding technology and in jet orifice plate, form spray orifice by photoetching process, adhesive can be avoided to flow in pressure chamber, the print quality of liquid injection apparatus can be improved.
Fig. 4 is the flow chart of a kind of detailed description of the invention of step 100 in Fig. 1, and Fig. 8 A-Fig. 8 G is the manufacture course of products topology view of another embodiment of the present invention.As shown in Figure 4, on the basis of above-described embodiment technical scheme, step 100, the first substrate is formed multiple spaced pressure generating part, can comprise:
Step 101, the first surface etching the first substrate forms groove.
As shown in Figure 8 A, particularly, form groove 2 at the first surface of the first substrate 1 by dry etching or wet etching, this groove 2 is for being installed with pressure generating part.
Step 102, forms piezoelectric element in described groove, and the upper surface of this piezoelectric element is concordant with described first substrate first surface.
As shown in Figure 8 B, lower electrode layer 3c, piezoelectric body layer 3b and upper electrode layer 3a can be formed successively by sputtering method in groove 2; Wherein, lower electrode layer 3c is titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layer; Piezoelectric body layer 3b is lead zirconate titanate (PZT) layer; Upper electrode layer 3a is platinum (Pt) layer or gold layer.
Step 103, the first surface of the first substrate forms oscillating plate, and described oscillating plate lid is located at the outside of described piezoelectric element.
As shown in Figure 8 C, form oscillating plate 4 at the first surface of the first substrate 1 by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method, the material of oscillating plate 4 can be SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination; It is outside that oscillating plate 4 lid is located at upper electrode layer 3a, and outer edge is covered in the first surface of the first substrate 1.
Then, as in fig. 8d, integrated forming manufacture method mineralization pressure chamber 5, public chamber 7 and the spray orifice 6 that above-described embodiment can be adopted to provide, adopt the method to form above-mentioned chamber and spray orifice, can print resolution be improved, and the miniaturization of liquid injection apparatus can be realized.
The flow chart of the another kind of liquid injection apparatus integrated forming manufacture method that Fig. 5 provides for the embodiment of the present invention; As shown in Figure 5, further, in above-mentioned integrated forming manufacture method after step 300, can also comprise:
Step 400, two surfaces etching the first substrate are formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part.
As illustrated in fig. 8e, dry etching can be adopted to etch the second surface (illustrating the lower surface of the first substrate) of the first substrate 1, form the ink supply aperture 8 be communicated with public chamber 7 and the cavity 9 communicated with the lower electrode layer 3c in piezoelectric element 3, wherein, cavity 9 is the Oscillation Amplitudes that can improve piezoelectric element 3.
In order to improve the vibration performance of piezoelectric element 3 further, as shown in Figure 8 F, can form gap 10 between the both sides of piezoelectric element 3 and the first substrate 1, gap 10 can ensure the constraint of piezoelectric element 3 when vibrating not by the first substrate 1, improves Oscillation Amplitude.
Step 500, arranges cover plate at the second surface of the first substrate, and this cover plate lid to be established on described cavity and kept described ink supply aperture unimpeded.
As shown in fig. 8g, at the second surface bonding cover plate 11 of the first substrate 1, complete the manufacturing process of liquid injection apparatus, the material of cover plate 11 can be PMA (PMMA).
Step 100 in above-described embodiment technical scheme, describedly forms multiple spaced pressure generating part in the first substrate, and can also realize by other means, particularly, step 100 can comprise:
Step 101 ', the first surface of the first substrate forms oscillating plate.
As shown in Figure 9 A, oscillating plate can be formed by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method at the first surface of the first substrate 1; Wherein, the material of described oscillating plate is SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination.
Step 102 ', described oscillating plate forms piezoelectric element.
As shown in Figure 9 B, lower electrode layer 3c can be formed by sputtering method, sol-gal process forms piezoelectric body layer 3b and sputtering method forms upper electrode layer 3a; Wherein, lower electrode layer 3c can be titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layer; Piezoelectric body layer can be lead zirconate titanate (PZT) layer; Upper electrode layer can be platinum (Pt) layer or gold layer.
As shown in Figure 9 C, then, the integrated forming manufacture method that above-described embodiment can be adopted to provide is at the first surface mineralization pressure chamber 5 of the first substrate 1, public chamber 7 and spray orifice 6.The ink supply aperture 8 be communicated with public chamber 7 and the cavity 9 communicated with the lower electrode layer 3c of pressure elements 3 is formed in the first substrate 1 second surface etching.Arrange cover plate 11 at the second surface of the first substrate 1, this cover plate 11 covers to be established on cavity 9 and keeps ink supply 9 hole unimpeded.
Figure 10 A-Figure 10 B is the manufacture course of products topology view of the present invention's embodiment again.As shown in Figure 10 A, on the basis of above-described embodiment technical scheme, step 100, the first substrate is formed multiple spaced pressure generating part, is in particular:
At the first surface deposit film resistive layer 3 ' of the first substrate 1, the material of this thin film resistive layer 3 ' is tantalum aluminium alloy or nichrome or tungsten silicon nitride or titanium nitride.
As shown in Figure 10 B, further, the second surface etching the first substrate 1 forms the ink supply aperture 8 be communicated with public chamber 7.
The concrete hydrojet process of the liquid injection apparatus of this embodiment manufacture is: liquid arrives public chamber 7 by ink supply aperture 8, simultaneously, apply pulse signal rear film resistive layer 3 ' with the heating rate liquid of 1000 DEG C/μ s, approximately make volatile components gasification in liquid produce bubble to about 340 DEG C, bubble extrudes spray orifice 6 ink droplet from original position; The formation of bubble is reversible, and when removing pulse signal, passive cooling can cause bubble to be vanished instantaneously, and at this moment, ink droplet thoroughly will spray from spray orifice 6.
The present invention also provides a kind of liquid injection apparatus, and this liquid injection apparatus manufactures with the liquid injection apparatus integrated forming manufacture method that above-described embodiment provides.The liquid injection apparatus that the present embodiment provides, mineralization pressure chamber and public chamber on the first surface of the first substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent mineralization pressure chamber in the first substrate, thus the mechanical strength of the first substrate can not be reduced, the first substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.Further, form jet orifice plate by bonding technology and in jet orifice plate, form spray orifice by photoetching process, adhesive can be avoided to flow in pressure chamber, the print quality of liquid injection apparatus can be improved.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (11)
1. a liquid injection apparatus integrated forming manufacture method, is characterized in that, comprising:
First substrate is formed multiple spaced pressure generating part;
The public chamber first surface of the first substrate forming the pressure chamber corresponding with multiple described pressure generating part and is communicated with multiple described pressure chamber;
In described pressure chamber, be formed with jet orifice plate by bonding technology and in described jet orifice plate, be formed with the spray orifice be communicated with described pressure chamber by photoetching process;
The described public chamber forming the pressure chamber corresponding with multiple described pressure generating part and be communicated with multiple described pressure chamber on the first surface of the first substrate, comprise: chamber layer is set on the first substrate first surface and exposes, limit shape and the position of pressure chamber and public chamber, the material of described chamber layer is negative light-sensitive glue; Development mineralization pressure chamber and public chamber;
Describedly in described pressure chamber, be formed with jet orifice plate by bonding technology, comprising: in the second substrate, be coated with ejection layer, the material of described ejection layer is negative light-sensitive glue; By bonding technology, the chamber wall of described chamber layer and described ejection layer are bonded together; Peel off described second substrate.
2. liquid injection apparatus integrated forming manufacture method according to claim 1, is characterized in that, describedly in the first substrate, forms multiple spaced pressure generating part, comprising:
The first surface etching the first substrate forms groove;
In described groove, form piezoelectric element, the upper surface of this piezoelectric element is concordant with the first surface of described first substrate;
The first surface of the first substrate forms oscillating plate, and described oscillating plate lid is located at the outside of described piezoelectric element.
3. liquid injection apparatus integrated forming manufacture method according to claim 2, is characterized in that, describedly in described groove, forms piezoelectric element, comprising:
In described groove, lower electrode layer, piezoelectric body layer and upper electrode layer is formed successively by sputtering method; Wherein, described lower electrode layer is titanium layer, platinum layer or multiple titanium layer superimposed layer; Described piezoelectric body layer is lead zirconate titanate layer; Described upper electrode layer is platinum layer or gold layer.
4. the liquid injection apparatus integrated forming manufacture method according to Claims 2 or 3, it is characterized in that, described in described pressure chamber, be formed with jet orifice plate by bonding technology and in described jet orifice plate, be formed with the spray orifice that is communicated with described pressure chamber by photoetching process after, also comprise:
The second surface etching the first substrate is formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part;
Arrange cover plate at the second surface of the first substrate, this cover plate lid to be established on described cavity and is kept described ink supply aperture unimpeded.
5. liquid injection apparatus integrated forming manufacture method according to claim 4, is characterized in that, the second surface of described etching first substrate is formed with after the ink supply aperture of public chamber and the cavity that communicates with pressure generating part, also comprises:
Gap is formed between the both sides of described piezoelectric element and described first substrate.
6. liquid injection apparatus integrated forming manufacture method according to claim 1, is characterized in that, describedly in the first substrate, forms multiple spaced pressure generating part, comprising:
The first surface of the first substrate forms oscillating plate;
Described oscillating plate forms piezoelectric element.
7. the liquid injection apparatus integrated forming manufacture method according to Claims 2 or 3 or 6, is characterized in that:
The described first surface in the first substrate forms oscillating plate and comprises: form oscillating plate by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method; Wherein, the material of described oscillating plate is SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination.
8. liquid injection apparatus integrated forming manufacture method according to claim 6, it is characterized in that, described in described pressure chamber, be formed with jet orifice plate by bonding technology and in described jet orifice plate, be formed with the spray orifice that is communicated with described pressure chamber by photoetching process after, also comprise:
Formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part in the first substrate second surface etching;
Arrange cover plate at the first substrate second surface, this cover plate lid to be established on described cavity and is kept described ink supply aperture unimpeded.
9. liquid injection apparatus integrated forming manufacture method according to claim 1, is characterized in that, describedly in the first substrate, forms multiple spaced pressure generating part, comprising:
At the first surface deposit film resistive layer of the first substrate, the material of this thin film resistive layer is tantalum aluminium alloy or nichrome or tungsten silicon nitride or titanium nitride.
10. liquid injection apparatus integrated forming manufacture method according to claim 9, it is characterized in that, after being formed with jet orifice plate by bonding technology in described pressure chamber and being formed with the spray orifice that is communicated with described pressure chamber by photoetching process in described jet orifice plate, also comprise:
The second surface etching the first substrate forms the ink supply aperture with public chamber.
11. 1 kinds of liquid injection apparatus, is characterized in that, this liquid injection apparatus manufactures with the liquid injection apparatus integrated forming manufacture method according to any one of claim 1 to 10.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310733314.8A CN103770468B (en) | 2013-12-26 | 2013-12-26 | Liquid injection apparatus and integrated forming manufacture method thereof |
| PCT/CN2014/089454 WO2015096545A1 (en) | 2013-12-26 | 2014-10-24 | Liquid jet head and integrally shaped liquid spraying apparatus manufacturing method and device |
| JP2016552657A JP6333992B2 (en) | 2013-12-26 | 2014-10-24 | Integrated molding manufacturing method of liquid nozzle and liquid ejecting apparatus and apparatus therefor |
| US15/073,594 US9731508B2 (en) | 2013-12-26 | 2016-03-17 | Liquid jet head, method for integrally manufacturing a liquid jet apparatus, and device |
| US15/463,032 US9919527B2 (en) | 2013-12-26 | 2017-03-20 | Liquid jet head, method for integrally manufacturing a liquid jet apparatus, and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310733314.8A CN103770468B (en) | 2013-12-26 | 2013-12-26 | Liquid injection apparatus and integrated forming manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN103770468A CN103770468A (en) | 2014-05-07 |
| CN103770468B true CN103770468B (en) | 2016-02-03 |
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| CN201310733314.8A Active CN103770468B (en) | 2013-12-26 | 2013-12-26 | Liquid injection apparatus and integrated forming manufacture method thereof |
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| CN (1) | CN103770468B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015096545A1 (en) | 2013-12-26 | 2015-07-02 | 大连理工大学 | Liquid jet head and integrally shaped liquid spraying apparatus manufacturing method and device |
| CN106541706B (en) * | 2016-09-30 | 2019-04-16 | 西安交通大学 | A kind of through type piezoelectric ink jet printing head and its manufacturing method |
| CN111016434B (en) * | 2019-12-25 | 2021-07-27 | 西安交通大学 | Thin film type ink-jet printing head based on extrusion mode |
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| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
| CN101491973A (en) * | 2008-01-21 | 2009-07-29 | 精工爱普生株式会社 | Manufacturing mehtod of liquid spray head and liquid spraying device |
| CN103085479A (en) * | 2013-02-04 | 2013-05-08 | 珠海纳思达企业管理有限公司 | Ink nozzle and manufacturing method thereof |
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2013
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| CN1839046A (en) * | 2003-09-17 | 2006-09-27 | 惠普开发有限公司 | Plurality of barrier layers |
| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
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| CN103770468A (en) | 2014-05-07 |
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