CN103763888B - A kind of heat-pipe radiator and heat pipe radiating system - Google Patents
A kind of heat-pipe radiator and heat pipe radiating system Download PDFInfo
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- CN103763888B CN103763888B CN201310750359.6A CN201310750359A CN103763888B CN 103763888 B CN103763888 B CN 103763888B CN 201310750359 A CN201310750359 A CN 201310750359A CN 103763888 B CN103763888 B CN 103763888B
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Abstract
The invention discloses a kind of heat-pipe radiator and heat pipe radiating system.Wherein, the heat-pipe radiator includes：Radiator body, diffusion copper coin, longitudinal diffusion heat pipe, cross conduction heat pipe；Wherein, radiator body, including fin, for building air channel and area of dissipation；Diffusion copper coin, for thermal source to be diffused；Longitudinal diffusion heat pipe, is constituted using many heat pipes, for will spread the heat that copper coin is diffused out, is transmitted to the remainder of heat-pipe radiator；Cross conduction heat pipe, is constituted using many heat pipes, and the lower part of heat-pipe radiator is conducted heat to many heat pipes.By the present invention, central heat source is spread rapidly, and taken away heat by outer fan, while needing to reduce the thermal contact resistance between thermal source and radiator.Solve the heat dissipation problem of high heat flux power amplifier tube in correlation technique, the feature such as radiator of the invention has that radiating efficiency is high, appearance and size is small, uniform heat distribution and dependable performance.
Description
Technical field
The present invention relates to high heat flux cooling heat source field, more particularly to a kind of heat-pipe radiator and heat pipe heat radiation system
System.
Background technology
According to the need for national guide's engineering ADS projects, it is necessary to develop a power level be 1Kw power amplifier mould
Block, the dissipated power of the power amplifier module is about 520w, and the size of power tube installation pedestal is 4cm*1cm；Such heat of power tube
Current density（heat density）It is 130w/cm2, to solve the heat dissipation problem of the power tube, it is necessary to design a high efficiency and heat radiation
Device（heatsink）To improve the thermal reliability of power amplifier module.
For the heat dissipation problem of high heat flux power amplifier tube in correlation technique, effective solution party is not yet proposed at present
Case.
The content of the invention
For the heat dissipation problem of high heat flux power amplifier tube in correlation technique, the invention provides a kind of heat pipe heat radiation
Device and heat pipe radiating system, are used to solve above-mentioned technical problem.
According to an aspect of the present invention, the invention provides a kind of heat-pipe radiator, wherein, the heat-pipe radiator bag
Include：Radiator body, diffusion copper coin, longitudinal diffusion heat pipe, cross conduction heat pipe；Wherein, the radiator body, including
Fin, for building air channel and area of dissipation；The diffusion copper coin, for thermal source to be diffused；The longitudinal diffusion is used
Heat pipe, is constituted using many heat pipes, for the heat for diffusing out the diffusion copper coin, is transmitted to its of the heat-pipe radiator
Remaining part point；The cross conduction heat pipe, is constituted using many heat pipes, and the heat pipe heat radiation is conducted heat to many heat pipes
The lower part of device.
Further, the appearance and size size of the radiator body is 104mm*104mm*200mm.
Further, the spacing of the fin of the radiator body is 2.5mm, and the height of the fin is 90mm, institute
The material for stating fin is aluminium.
Further, the diffusion copper coin, is one piece of copper plate of 88mm*50mm*4mm.
Further, the longitudinal diffusion heat pipe, is constituted using 5 flat hot pipes.
Further, the cross conduction heat pipe, is constituted using 4 heat pipes of a diameter of 6mm.
Further, the inside of the heat pipe is filled with working medium, if the evaporator section of the heat pipe absorbs heat, can be by institute
The boiling water of evaporator section is stated, steam is formed, and under the effect of the pressure, move to the condensation segment of the heat pipe；If above-mentioned cold
After solidifying section is cooled down by outside, steam is changed into aqueous water, and the capillary materials sintered by gravity or circumferential wall, by liquid
Water is back to above-mentioned evaporator section, and aqueous water reabsorbs heat, forms steam；Wherein, the working medium is water.
According to another aspect of the present invention, present invention also offers a kind of heat pipe radiating system, wherein, the system includes：
Above-mentioned heat-pipe radiator, and power tube；Wherein, the power tube is arranged on the diffusion copper coin of the heat-pipe radiator.
Further, will be welded between the power tube and the diffusion copper coin using solder.
Further, the dissipated power of the power tube is 520w；The size of the installation pedestal of the power tube is 4cm*
1cm；The heat flow density of the power tube is 130w/cm2.
The heat-pipe radiator and heat pipe radiating system provided by the present invention, central heat source is spread rapidly, and by outer
Portion's blower fan takes away heat, while needing to reduce the thermal contact resistance between thermal source and radiator.Solve hyperpyrexia in correlation technique
The heat dissipation problem of current density power amplifier tube, radiator of the invention has that radiating efficiency is high, appearance and size is small, heat distribution is equal
The features such as even and dependable performance.
Described above is only the general introduction of technical solution of the present invention, in order to better understand technological means of the invention,
And can be practiced according to the content of specification, and in order to allow the above and other objects of the present invention, feature and advantage can
Become apparent, below especially exemplified by specific embodiment of the invention.
Brief description of the drawings
Fig. 1 is the structural representation of heat-pipe radiator according to embodiments of the present invention；
Fig. 2 is the structural representation of heat pipe radiating system according to embodiments of the present invention；
Fig. 3 is the first structure schematic diagram of radiator body according to embodiments of the present invention；
Fig. 4 is the second structural representation of radiator body according to embodiments of the present invention.
Specific embodiment
In order to solve the heat dissipation problem of high heat flux power amplifier tube in the prior art, the invention provides a kind of heat pipe
Radiator and heat pipe radiating system, below in conjunction with accompanying drawing and embodiment, the present invention will be described in further detail.Should manage
Solution, the specific embodiments described herein are merely illustrative of the present invention, does not limit the present invention.
A kind of heat-pipe radiator is present embodiments provided, Fig. 1 is the structure of heat-pipe radiator according to embodiments of the present invention
Schematic diagram, as shown in figure 1, the heat-pipe radiator includes：Radiator body, diffusion copper coin, longitudinal diffusion heat pipe, cross conduction
Use heat pipe；Wherein,
Radiator body, including fin, for building air channel and area of dissipation.Specifically, the profile of radiator body
Size is 104mm*104mm*200mm.The spacing of the fin of radiator body is 2.5mm, and the height of fin is
90mm, the material of fin is aluminium.
Diffusion copper coin, for thermal source to be diffused.The diffusion copper coin, is one piece of copper plate of 88mm*50mm*4mm.
Longitudinal diffusion heat pipe, using many heat pipes（heatpipe）Constitute, for the heat that copper coin is diffused out will to be spread,
It is transmitted to the remainder of heat-pipe radiator.The longitudinal diffusion heat pipe, is constituted using 5 flat hot pipes.
Cross conduction heat pipe, is constituted using many heat pipes, is conducted heat under heat-pipe radiator with many heat pipes
Part.The cross conduction heat pipe, is constituted using 4 heat pipes of a diameter of 6mm.
The heat-pipe radiator provided by the present embodiment, central heat source is spread rapidly, and by outer fan by heat
Take away, while needing to reduce the thermal contact resistance between thermal source and radiator.High heat flux power is put in solving correlation technique
The heat dissipation problem of big pipe, radiator of the invention has that radiating efficiency is high, appearance and size is small, uniform heat distribution and performance can
By etc. feature.
In the heat pipe that the present embodiment is introduced, filled with working medium inside it（For example：Water）If the evaporator section of heat pipe is absorbed
Heat, then can form steam, and under the effect of the pressure, move to the condensation segment of heat pipe by the boiling water of evaporator section；If on
State after condensation segment cooled down by outside, steam is changed into aqueous water, and the capillary materials sintered by gravity or circumferential wall, will
Aqueous water is back to above-mentioned evaporator section, and aqueous water reabsorbs heat, forms steam.
Based on the heat-pipe radiator that the present embodiment is provided, a kind of heat pipe radiating system is present embodiments provided, Fig. 2 is basis
The structural representation of the heat pipe radiating system of the embodiment of the present invention, as shown in Fig. 2 heat pipe radiating system includes above-described embodiment
Heat-pipe radiator, and power tube；Wherein, the power tube is arranged on the diffusion copper coin of heat-pipe radiator.
The dissipated power for being applied to the power tube of the heat-pipe radiator is 520w；The size of the installation pedestal of power tube is
4cm*1cm；The heat flow density of the power tube is 130w/cm2.Using solder by the power tube and the diffusion copper coin
Between weld.
The mentality of designing to the technical scheme of the embodiment of the present invention is introduced below.
（1）Air-cooled heat-pipe radiator design
Because the dissipated power of power tube is 520w, and the substrate size of power tube is 4cm*1cm, and the hot-fluid of power tube is close
Degree has reached 130w/cm2.If using traditional aluminum profile heat radiator, because the diffusion thermal resistance of the type radiator is higher, will
The ability that heat spreads rapidly is poor, it is impossible to take the heat that power amplifier bottom of the tube is concentrated out of rapidly, so as to cause power tube substrate
Temperature is too high, easily burns power tube.For that purpose it is necessary to try every possible means rapidly to take the heat of power tube base plate bottom out of, so that
Give full play to the heat-sinking capability of radiator；
In design of the invention, play a part of the characteristics of using heat pipe super-high heat-conductive coefficient to spread heat.
The main operational principle of heat pipe：Inside heat pipe is filled with working medium（For example：Water）, when heat pipe evaporator section absorbs heat, then will can be somebody's turn to do
The boiling water of section, forms steam, and under the effect of the pressure, move to the condensation segment of heat pipe；When condensation segment is carried out by outside
After cooling, steam is changed into aqueous water, and the capillary materials sintered by gravity or circumferential wall, and aqueous water is back into evaporator section,
Aqueous water reabsorbs heat, forms steam；Such circulation is constantly carried out, so as to play a part of to conduct heat；Due to
What inside heat pipe was carried out is boiling heat transfer.Thus, condensation segment is very small with the thermal resistance of evaporator section, and the thermal conductivity factor of heat pipe is very
It is high.Typically can at least reach 1000w/m DEG C.
The present embodiment is based on the These characteristics of heat pipe, and incorporation engineering reality, devises a heat-pipe radiator, should
Radiator is main by radiator body, longitudinal diffusion heat pipe section, cross conduction heat pipe section and diffusion copper coin composition；
Radiator body：Air channel and area of dissipation are mainly built, its appearance and size size is 104mm*104mm*200mm, such as Fig. 3 institutes
Second structural representation of the radiator body shown in the first structure schematic diagram and Fig. 4 of the radiator body for showing.
To improve the coefficient of heat transfer of radiator, the spacing of fin should be as far as possible small, and to expand area of dissipation, fin should be fitted
Work as high point, according to the optimization Simulation design to radiator, the radiator fin spacing of selection is 2.5mm, and fin height is 90mm,
It is simultaneously the weight of mitigation radiator body, material selection aluminium；Longitudinal diffusion uses 5 flat hot pipes with heat pipe, for that will expand
What scattered copper coin was diffused out is thermally conducted to radiator remainder；It is one piece of copper plate of 88mm*50mm*4mm that diffusion copper coin is used,
For thermal source to be first diffused, while being easy to the installation of power tube；Cross conduction heat pipe：For more fully using radiating
The area of dissipation of device, the lower part of radiator is conducted heat to the heat pipe of four a diameter of 6mm, so that radiator is whole
Temperature is more uniform.
（2）Reduce thermal contact resistance measure
In Practical Project, due to reasons such as machining accuracies, cause the flatness and surface roughness of contact surface not high,
In two spaces of plane contact, the air gap can be left, if not taking any measure, due to the thermal conductivity factor phase of air
To relatively low（About 0.0275w/m DEG C）, the problems such as so as to cause thermal contact resistance higher.Therefore, the method for routine is at two
Heat-conducting silicone grease is filled between contact surface, because the thermal conductivity factor of heat-conducting silicone grease is about 1~3w/m DEG C or so, specific to originally setting
The thermal contact resistance between power tube and diffusion copper coin in meter, is tested by Practical Project, finds thermal contact resistance between the two
0.1 DEG C/w can be reached.In the design, the heating power of single power tube is 520w, so will result in power tube with diffusion
There is 52 degree of the temperature difference in copper coin, so as to increased the design difficulty of radiator between the two.
In design of the invention, two are realized by being welded between power tube and diffusion copper coin using solder
The temperature difference is almost 0 purpose between person, so can further improve the reliability and stability of whole cooling system.
The performance indications of this air-cooled heat-pipe radiator：
（1）Heat-sinking capability：Heat flow density is not more than 130W/cm2；
（2）Use environment temperature：- 20~40 DEG C；
（3）Outer fan air quantity is not less than 2.1m3/min.
In actual mechanical process, it is possible to use temperature-uniforming plate replaces heat pipe, and the principle of temperature-uniforming plate is similar with heat pipe, but samming
Plate belongs to two dimensional conductive, and heat pipe belongs to one-dimensional conduction, but the current production technology of temperature-uniforming plate is not mature enough, and percent defective is higher, therefore
It is high that the radiator reliability realized with soaking plate is not so good as heat pipe.
The heat-pipe radiator that the present embodiment is provided, central heat source is spread rapidly, and is taken away heat by outer fan,
Need to reduce the thermal contact resistance between thermal source and radiator simultaneously.Solve high heat flux power amplifier tube in correlation technique
The spies such as heat dissipation problem, radiator of the invention has that radiating efficiency is high, appearance and size is small, uniform heat distribution and dependable performance
Levy.
Although being example purpose, the preferred embodiments of the present invention are had been disclosed for, those skilled in the art will recognize
Various improvement, increase and substitution are also possible, therefore, the scope of the present invention should be not limited to above-described embodiment.
Claims (7)
1. a kind of heat-pipe radiator, it is characterised in that the heat-pipe radiator includes：Radiator body, diffusion copper coin, longitudinal direction are expanded
Scattered heat pipe, cross conduction heat pipe；Wherein,
The radiator body, including fin, for building air channel and area of dissipation；
The diffusion copper coin, for thermal source to be diffused；
The longitudinal diffusion heat pipe, is constituted using 5 flat hot pipes, for the heat for diffusing out the diffusion copper coin, is passed
Lead the remainder of the heat-pipe radiator；
The cross conduction heat pipe, is constituted using 4 heat pipes of a diameter of 6mm, and the heat is conducted heat to 4 heat pipes
The lower part of tube radiator；
The inside of the heat pipe is filled with working medium, if the evaporator section of the heat pipe absorbs heat, can be by the evaporator section
Boiling water, forms steam, and under the effect of the pressure, move to the condensation segment of the heat pipe；If above-mentioned condensation segment is by outer
After portion is cooled down, steam is changed into aqueous water, and the capillary materials sintered by gravity or circumferential wall, and aqueous water is back to
Evaporator section is stated, aqueous water reabsorbs heat, forms steam；Wherein, the working medium is water.
2. heat-pipe radiator as claimed in claim 1, it is characterised in that the appearance and size size of the radiator body is
104mm*104mm*200mm。
3. heat-pipe radiator as claimed in claim 1, it is characterised in that the spacing of the fin of the radiator body is
2.5mm, the height of the fin is 90mm, and the material of the fin is aluminium.
4. heat-pipe radiator as claimed in claim 1, it is characterised in that the diffusion copper coin, is one piece of 88mm*50mm*4mm
Copper plate.
5. a kind of heat pipe radiating system, it is characterised in that including the heat-pipe radiator described in Claims 1-4, and power amplifier
Pipe；Wherein, the power tube is arranged on the diffusion copper coin of the heat-pipe radiator.
6. heat pipe radiating system as claimed in claim 5, it is characterised in that using solder by the power tube with it is described
Welded between diffusion copper coin.
7. the heat pipe radiating system as described in claim 5 or 6, it is characterised in that the dissipated power of the power tube is 520w；
The size of the installation pedestal of the power tube is 4cm*1cm；The heat flow density of the power tube is 130w/cm2。
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| CN201310750359.6A CN103763888B (en) | 2013-12-31 | 2013-12-31 | A kind of heat-pipe radiator and heat pipe radiating system |
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| CN201310750359.6A CN103763888B (en) | 2013-12-31 | 2013-12-31 | A kind of heat-pipe radiator and heat pipe radiating system |
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| CN103763888A CN103763888A (en) | 2014-04-30 |
| CN103763888B true CN103763888B (en) | 2017-07-04 |
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| CN107785338A (en) * | 2017-11-30 | 2018-03-09 | 广东美的厨房电器制造有限公司 | Radiating subassembly, semiconductor heater and semiconductor cooking apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101312227A (en) * | 2007-05-25 | 2008-11-26 | 黄明智 | Oil and metal combination natural heat dissipation method and apparatus for LED |
| US8294340B2 (en) * | 2010-10-22 | 2012-10-23 | Fu Zhen Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device and LED lamp using the same |
| CN202634976U (en) * | 2012-04-19 | 2012-12-26 | 京信通信系统（中国）有限公司 | Heat dissipation device |
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2013
- 2013-12-31 CN CN201310750359.6A patent/CN103763888B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101312227A (en) * | 2007-05-25 | 2008-11-26 | 黄明智 | Oil and metal combination natural heat dissipation method and apparatus for LED |
| US8294340B2 (en) * | 2010-10-22 | 2012-10-23 | Fu Zhen Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device and LED lamp using the same |
| CN202634976U (en) * | 2012-04-19 | 2012-12-26 | 京信通信系统（中国）有限公司 | Heat dissipation device |
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Address after: 100853 3 floor, 86 building, 50 Yongding Road, Haidian District, Beijing. Patentee after: Beijing Guangtong Aerospace Science and Technology Co Ltd Address before: 100854 three floor, 86 building, 50 Yongding Road, Haidian District, Beijing. Patentee before: Beijing Changfeng Broadcasting Communication Equipment Co., Ltd. |