CN103763219A - Method for stacking chips of exchanger - Google Patents
Method for stacking chips of exchanger Download PDFInfo
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- CN103763219A CN103763219A CN201310745041.9A CN201310745041A CN103763219A CN 103763219 A CN103763219 A CN 103763219A CN 201310745041 A CN201310745041 A CN 201310745041A CN 103763219 A CN103763219 A CN 103763219A
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- chip
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Abstract
The invention provides a method for stacking chips of an exchanger. The method comprises the steps that 1, the chips are connected through a higig interface; 2, module IDs are configured to the chips; 3, outcoming interfaces of the local chips are added in a module ID table, corresponding to a crossing chip forwarding table, of the chips. The chips of the exchanger are stacked to achieve a greater number of ports, the stacked chips are mutually forwarded, and the stacked chips are like one chip in function. Compared with the prior art, the method is simple and low in cost.
Description
Technical field
The present invention relates to a kind of stacking method of exchanger chip.
Background technology
Exchanger chip is stacked, can expands its port number and transfer capability.Existing stacking method is, utilizes special chip (Fabric chip) to access, and each needs stacking chip and special chip interconnects, realizes the function of exchange of distributed system.But this special chip is very expensive, this will strengthen the cost of product undoubtedly.
Summary of the invention
The technical problem that the present invention need solve has been to provide a kind of simple, the exchanger chip stacking method that cost is low.
For solving above-mentioned technical problem, designed a kind of exchanger chip stacking method, it comprises the following steps: step 1: each chip is interconnected by higig mouth; Step 2: be each chip configuration module ID; Step 3: transmit across chip the outgoing interface that corresponding module ID list item is added on local chip at chip.
According to the present invention, further improve, each chip adopts two higig mouth interconnection, so that enough bandwidth to be provided.
According to the present invention, further improve, two higig mouths of each chip are configured to a higig aggregation group, from logic, two higig mouths are an aggregation port.
According to the present invention, further improve, the rate broadband of two higig mouths that configures each chip is identical, guarantees that data flow on average transmits on two higig mouths.
The present invention is stacked exchanger chip, realizes the port of greater number, and the chip being stacked is realized mutually and being forwarded, in function, as the effect of same chip.Compared with prior art, the inventive method is simple, and cost is low.
Embodiment
In order to make relevant technical staff in the field understand better technical scheme of the present invention, below the technical scheme in embodiment of the present invention is clearly and completely described, obviously, described execution mode is only the present invention's part execution mode, rather than whole execution modes.
The invention provides a kind of exchanger chip stacking method, exchanger chip is stacked, realize the port of greater number.
In the present embodiment, the quantity of chip is 2, by 2 together chip-stacked, realize the double of port number.
First, by the higig mouth of 2 chips, utilize 4 differential pair line interconnection.More optimizedly,, for enough bandwidth are provided, each chip can adopt two higig mouth interconnection.That is, 2 chips all need at least 2 higig mouths of configuration, utilize 8 differential pair lines to realize two higig mouth interconnection of 2 chips, thereby it are double to reach bandwidth.For realizing the uniqueness of port identification, two higig mouths are configured to an aggregation group, and from logic, two higig mouths are an aggregation port.And the rate broadband of two higig mouths of each chip is configured identical, adopt equalization algorithm, assurance data flow is on average transmitted on two higig mouths.
Realize after the connection in physical structure, then be each chip configuration module ID, as, the module ID of first chip is that the module ID of 0, the second chip is 1.The information of E-Packeting can comprise the module ID of the chip of needs forwarding.
Realize after above-mentioned configuration, then across chip, transmit the outgoing interface that corresponding module ID list item is added on local chip at chip.Like this, the message across chip can arrive another chip by forwarding.Such as, the message that is this chip for module ID directly forwards in chip; For the message of non-chip of module ID,, by transmit corresponding module ID list item across chip, find the outgoing interface at local chip, forward.Thereby two together chip-stacked, as the effect of same chip.
The present invention is stacked exchanger chip, realizes the port of greater number, and the chip being stacked is realized mutually and being forwarded, in function, as the effect of same chip.
Below only expressed one embodiment of the present invention, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (4)
1. an exchanger chip stacking method, is characterized in that, comprises the following steps:
Step 1: each chip is interconnected by higig mouth;
Step 2: be each chip configuration module ID;
Step 3: transmit across chip the outgoing interface that corresponding module ID list item is added on local chip at chip.
2. exchanger chip stacking method according to claim 1, is characterized in that, each chip adopts two higig mouth interconnection.
3. exchanger chip stacking method according to claim 2, is characterized in that, two higig mouths of each chip are configured to an aggregation group.
4. exchanger chip stacking method according to claim 2, is characterized in that, the rate broadband of two higig mouths that configures each chip is identical.
Priority Applications (1)
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CN201310745041.9A CN103763219A (en) | 2013-12-30 | 2013-12-30 | Method for stacking chips of exchanger |
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CN201310745041.9A CN103763219A (en) | 2013-12-30 | 2013-12-30 | Method for stacking chips of exchanger |
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CN201310745041.9A Pending CN103763219A (en) | 2013-12-30 | 2013-12-30 | Method for stacking chips of exchanger |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105763488A (en) * | 2014-12-17 | 2016-07-13 | 中兴通讯股份有限公司 | Data center gathering core switcher and backboard thereof |
WO2016165643A1 (en) * | 2015-04-17 | 2016-10-20 | Hangzhou H3C Technologies Co., Ltd. | Generating system port identity |
CN107342957A (en) * | 2017-06-28 | 2017-11-10 | 山东超越数控电子有限公司 | It is a kind of to realize the attachment means and method for exchanging board full line speed more |
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CN103095568A (en) * | 2013-01-30 | 2013-05-08 | 迈普通信技术股份有限公司 | System and method for achieving stacking of rack type switching devices |
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2013
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Patent Citations (4)
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CN1412974A (en) * | 2002-05-27 | 2003-04-23 | 华为技术有限公司 | Method for implementing Ethernet exchange piling |
CN101605327A (en) * | 2009-06-29 | 2009-12-16 | 华为技术有限公司 | The switch of remote power feeding, repeater and virtual exchange system |
CN101729420A (en) * | 2009-12-15 | 2010-06-09 | 杭州迪普科技有限公司 | Data processing method and data processing device |
CN103095568A (en) * | 2013-01-30 | 2013-05-08 | 迈普通信技术股份有限公司 | System and method for achieving stacking of rack type switching devices |
Non-Patent Citations (1)
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105763488A (en) * | 2014-12-17 | 2016-07-13 | 中兴通讯股份有限公司 | Data center gathering core switcher and backboard thereof |
CN105763488B (en) * | 2014-12-17 | 2020-08-25 | 南京中兴软件有限责任公司 | Data center aggregation core switch and backboard thereof |
WO2016165643A1 (en) * | 2015-04-17 | 2016-10-20 | Hangzhou H3C Technologies Co., Ltd. | Generating system port identity |
CN106161288A (en) * | 2015-04-17 | 2016-11-23 | 杭州华三通信技术有限公司 | The method and apparatus realizing multiple devices stacking |
CN106161288B (en) * | 2015-04-17 | 2019-08-16 | 新华三技术有限公司 | Realize the method and apparatus that multiple devices stack |
US10574625B2 (en) | 2015-04-17 | 2020-02-25 | Hewlett Packard Enterprise Development Lp | Generating system port identity |
CN107342957A (en) * | 2017-06-28 | 2017-11-10 | 山东超越数控电子有限公司 | It is a kind of to realize the attachment means and method for exchanging board full line speed more |
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Application publication date: 20140430 |
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