Summary of the invention
Provide hereinafter about brief overview of the present invention, to the basic comprehension about some aspect of the present invention is provided.Should be appreciated that this general introduction is not about exhaustive general introduction of the present invention.It is not that intention is determined key of the present invention or pith, and nor is it intended to limit the scope of the present invention.Its object is only that the form of simplifying provides some concept, usings this as the preorder in greater detail of discussing after a while.
The invention provides dielectric material resistivity measurement device and method under a kind of illumination, to improve the accuracy of dielectric material resistivity measurement under illumination.
The invention provides dielectric material resistivity measurement device under a kind of illumination, comprising: target chamber, for the solar simulator of illumination simulation environment, for the quartz window of printing opacity, for by the evacuated vacuum-pumping system of described target chamber, dielectric material, the temperature control equipment that keeps temperature constant for controlling described dielectric material, worktable, voltage source, to power supply and the electrometer of described temperature control equipment power supply;
Wherein, described quartz window is arranged on the top of described target chamber; Described worktable is arranged on the bottom surface of described target chamber; Described temperature control equipment is positioned on described worktable; Described dielectric material is positioned on described temperature control equipment, described dielectric material upper surface is coated with ring electrode and guard electrode, the lower surface of described dielectric material is coated with voltage pole, described voltage pole is connected with the voltage source that is positioned at described target chamber outside, described guard electrode is connected with the electrometer that is positioned at described target chamber outside, described ring electrode ground connection;
It is outside that described voltage source, power supply, electrometer, solar simulator and vacuum-pumping system lay respectively at described target chamber; One end of described voltage source is connected with the voltage pole of dielectric material, the other end ground connection of described voltage source; Described power supply is connected with described temperature control equipment; One end of described electrometer is connected with the guard electrode of dielectric material, the other end ground connection of described electrometer; Described solar simulator is over against described quartz window and be positioned at the top of described quartz window; Described vacuum-pumping system is close to the outer wall of described target chamber.
The present invention also provides a kind of dielectric material resistivity measurement method under illumination, it is characterized in that, uses as dielectric material resistivity measurement device under above-mentioned illumination as described in arbitrary; Under described illumination, dielectric material resistivity measurement method comprises:
Dielectric material is positioned on the temperature control equipment that is positioned at worktable top in target chamber, and described dielectric material upper surface is coated with ring electrode and guard electrode, and the lower surface of described dielectric material is coated with voltage pole;
Opening vacuum-pumping system vacuumizes described target chamber;
Open solar simulator illumination simulation environment;
Power-on is given described temperature control equipment power supply, and described temperature control equipment is controlled described dielectric material and kept temperature constant;
Cut-in voltage source applies voltage to the voltage pole of dielectric material;
The leakage current of the guard electrode by electrometer measuring media material;
The leakage current of the guard electrode that the magnitude of voltage applying by voltage source and described electrometer measure, calculates the resistivity of described dielectric material under different light and different temperatures.
Compared with prior art, the present invention includes following advantage:
Dielectric material resistivity measurement device under illumination provided by the invention, can pass through solar simulator simulate photoenvironment, the quartz window that illumination sees through the top of target chamber impinges upon on dielectric material, by solar simulator, can simulate the intensity of illumination of different solar constants, by temperature control equipment control medium material, remain on different temperatures, then the voltage U applying to the voltage pole of dielectric material by voltage source, leakage current I with the guard electrode of the dielectric material measuring by electrometer, just can calculate the resistivity of the dielectric material of dielectric material under different light and different temperatures.For example, the intensity of illumination of a solar constant of solar simulator simulation, temperature control equipment control medium material remains on 100 ℃, just can be by dielectric material resistivity measurement device under illumination provided by the invention, the resistivity that obtains dielectric material under the illumination of a solar constant and at the temperature of 100 ℃.Due to solar simulator controlled light intensity accurately, temperature control equipment can guarantee the temperature stabilization of dielectric material, therefore can improve the measuring accuracy of dielectric material resistivity, adopt dielectric material resistivity measurement device under illumination provided by the invention, the accuracy of dielectric material resistivity measurement under illumination can be improved, and the resistivity of dielectric material under different light and different temperatures can be measured.
Embodiment
For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.The element of describing in an accompanying drawing of the present invention or a kind of embodiment and feature can combine with element and feature shown in one or more other accompanying drawing or embodiment.It should be noted that for purposes of clarity, in accompanying drawing and explanation, omitted expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and processing.Embodiment based in the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not paying creative work, belongs to the scope of protection of the invention.
Embodiment mono-:
With reference to Fig. 1, be the structured flowchart of dielectric material resistivity measurement device under a kind of illumination of the embodiment of the present invention, in the present embodiment, under illumination, dielectric material resistivity measurement device specifically can comprise: target chamber, for the solar simulator of illumination simulation environment, for the quartz window of printing opacity, for by the evacuated vacuum-pumping system of described target chamber, dielectric material, the temperature control equipment that keeps temperature constant for controlling described dielectric material, worktable, voltage source, give power supply and the electrometer of described temperature control equipment power supply.
As shown in Figure 1, described quartz window 3 is arranged on the top of described target chamber 1; Described worktable 8 is arranged on the bottom surface of described target chamber 1; Described temperature control equipment 7 is positioned on described worktable 8; Described dielectric material 5 is positioned on described temperature control equipment 7, described dielectric material 5 upper surfaces are coated with ring electrode 12 and guard electrode 13, the lower surface of described dielectric material 5 is coated with voltage pole 6, described voltage pole 6 is connected with the voltage source 9 that is positioned at described target chamber 1 outside, described guard electrode 13 is connected with the electrometer 11 that is positioned at described target chamber outside, described ring electrode 12 ground connection;
Described voltage source 9, power supply 10, electrometer 11, solar simulator 2 and vacuum-pumping system 4 lay respectively at described target chamber 1 outside; One end of described voltage source 9 is connected with the voltage pole 6 of dielectric material 5, the other end ground connection of described voltage source 9; Described power supply 10 is connected with described temperature control equipment 7; One end of described electrometer 11 is connected with the guard electrode 13 of dielectric material 5, the other end ground connection of described electrometer 11; Described solar simulator 2 is over against described quartz window 3 and be positioned at the top of described quartz window 3; Described vacuum-pumping system 4 is close to the outer wall of described target chamber 1.
It should be noted that; in the middle of the ring electrode 12 of dielectric material 5 upper surface platings and guard electrode 13, there is certain interval; as shown in Figure 2; electrode schematic diagram for dielectric material; the annular of outer ring is ring electrode 12; guard electrode 13 is circular electrode, the gap of 14 representative ring electrodes 12 and guard electrode 13 in figure.In a preferred embodiment of the present invention, described ring electrode 12, guard electrode 13 and/or voltage pole 6 are for adopting the metal electrode of sputtering method plating.In another kind of preferred embodiment of the present invention, the model of described electrometer is Keithley6517B.
It should be noted that, solar simulator can be simulated the intensity of illumination of certain solar constant, in a preferred embodiment of the present invention, utilizes the intensity of illumination of a solar constant of solar simulator simulation.Temperature control equipment can remain in certain temperature range by control medium material, and in a preferred embodiment of the present invention, temperature control equipment is the arbitrary temperature value within the scope of 50~150 ℃ by the temperature constant of described dielectric material.
It should be noted that; above-mentioned voltage source 9 apply voltage U can to the voltage pole 6 of dielectric material 5, and the leakage current I of guard electrode 13 that can measuring media material 5 by electrometer 11, according to above-mentioned voltage U and leakage current I; by U/I, can calculate the resistivity R of dielectric material.
Dielectric material resistivity measurement device under the illumination that the present embodiment provides, can pass through solar simulator simulate photoenvironment, the quartz window that illumination sees through the top of target chamber impinges upon on dielectric material, by solar simulator, can simulate the intensity of illumination of different solar constants, by temperature control equipment control medium material, remain on different temperatures, then the voltage U applying to the voltage pole of dielectric material by voltage source, leakage current I with the guard electrode of the dielectric material measuring by electrometer, just can calculate the resistivity of the dielectric material of dielectric material under different light and different temperatures.For example, the intensity of illumination of a solar constant of solar simulator simulation, temperature control equipment control medium material remains on 100 ℃, dielectric material resistivity measurement device under the illumination that just can provide by the present embodiment, the resistivity that obtains dielectric material under the illumination of a solar constant and at the temperature of 100 ℃.Due to solar simulator controlled light intensity accurately, temperature control equipment can guarantee the temperature stabilization of dielectric material, therefore can improve the measuring accuracy of dielectric material resistivity, adopt dielectric material resistivity measurement device under the illumination that the present embodiment provides, the accuracy of dielectric material resistivity measurement under illumination can be improved, and the resistivity of dielectric material under different light and different temperatures can be measured.
Embodiment bis-:
With reference to Fig. 3, be the process flow diagram of dielectric material resistivity measurement method under a kind of illumination of the embodiment of the present invention, the present embodiment can adopt dielectric material resistivity measurement device under any illumination of describing in embodiment mono-.In the present embodiment, under illumination, dielectric material resistivity measurement method specifically can comprise the following steps:
Step 100, is positioned over dielectric material on the temperature control equipment that is positioned at worktable top in target chamber, and described dielectric material upper surface is coated with ring electrode and guard electrode, and the lower surface of described dielectric material is coated with voltage pole.In a preferred embodiment of the present invention, described ring electrode, guard electrode and/or voltage very adopt the metal electrode of sputtering method plating.The electrode schematic diagram of dielectric material as described in Figure 2, specifically describes the related description referring to embodiment mono-, is originally implemented in this and does not repeat.
Step 101, opens vacuum-pumping system described target chamber is vacuumized.In a preferred embodiment of the present invention, described step 101 is opened vacuum-pumping system described target chamber is vacuumized, and specifically can comprise: open vacuum-pumping system; Described target chamber is evacuated to vacuum tightness higher than 5.0 * 10
-3the vacuum of Pa.
Step 102, opens solar simulator illumination simulation environment.It should be noted that, solar simulator can simulate photoenvironment, and the quartz window that illumination can see through target chamber top impinges upon on dielectric material.In a preferred embodiment of the present invention, described step 102 is opened solar simulator illumination simulation environment, specifically can comprise: open solar simulator; The intensity of illumination of a solar constant of simulation.
Step 103, power-on is given described temperature control equipment power supply, and described temperature control equipment is controlled described dielectric material and is kept temperature constant.In a preferred embodiment of the present invention, described step 103 temperature control equipment is controlled described dielectric material and is kept temperature constant, comprising: temperature control equipment is the arbitrary temperature value within the scope of 50~150 ℃ by the temperature constant of described dielectric material.Here keep temperature constant, can remain on different steady state values, for example, temperature control equipment is by the temperature constant of described dielectric material at 60 ℃, and temperature control equipment also can be by the temperature constant of described dielectric material at 100 ℃.
Step 104, cut-in voltage source applies voltage to the voltage pole of dielectric material.In a preferred embodiment of the present invention, described step 104 cut-in voltage source applies voltage to the voltage pole of dielectric material, specifically can comprise: cut-in voltage source; Apply the voltage within the scope of 0~1000V to the voltage pole of dielectric material.The voltage in the present embodiment, described voltage source being applied to dielectric material is designated as U.
Step 105, the leakage current of the guard electrode by electrometer measuring media material.In a preferred embodiment of the present invention, described step 105, by the leakage current of the guard electrode of electrometer measuring media material, comprising: the leakage current that adopts the guard electrode of the electrometer measuring media material that model is Keithley6517B.The leakage current of guard electrode that can certainly adopt the electrometer measuring media material of other models, the present embodiment is not restricted this.The leakage current of the guard electrode of the dielectric material in the present embodiment, described electrometer being recorded is designated as I.
Step 106, the leakage current of the guard electrode that the magnitude of voltage applying by voltage source and described electrometer measure, calculates the resistivity of described dielectric material under different light and different temperatures.The leakage current I of the guard electrode that the magnitude of voltage U that the present embodiment can apply by voltage source and described electrometer measure, calculates the resistivity of dielectric material by U/I.
Dielectric material resistivity measurement method under the illumination that the present embodiment provides; can be by opening solar simulator simulate photoenvironment; by temperature control equipment control medium material, remain on different temperatures; then cut-in voltage source applies voltage to the voltage pole of dielectric material; the leakage current of the guard electrode by electrometer measuring media material; the leakage current I of the guard electrode that the magnitude of voltage U finally applying by voltage source and described electrometer measure, calculates U/I and obtains the resistivity R of described dielectric material under different light and different temperatures.For example, the intensity of illumination of a solar constant of solar simulator simulation, temperature control equipment control medium material remains on 100 ℃, dielectric material resistivity measurement method under the illumination that just can provide by the present embodiment, the resistivity that obtains dielectric material under the illumination of a solar constant and at the temperature of 100 ℃.Due to solar simulator controlled light intensity accurately, temperature control equipment can guarantee the temperature stabilization of dielectric material, therefore can improve the measuring accuracy of dielectric material resistivity, adopt dielectric material resistivity measurement method under the illumination that the present embodiment provides, the accuracy of dielectric material resistivity measurement under illumination can be improved, and the resistivity of dielectric material under different light and different temperatures can be measured.
In the various embodiments described above of the present invention, the sequence number of embodiment and/or sequencing are only convenient to describe, and do not represent the quality of embodiment.Description to each embodiment all emphasizes particularly on different fields, and there is no the part of detailed description in certain embodiment, can be referring to the associated description of other embodiment.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can complete by the relevant hardware of programmed instruction, aforesaid program can be stored in a computer read/write memory medium, this program, when carrying out, is carried out the step that comprises said method embodiment; And aforesaid storage medium comprises: various media that can be program code stored such as ROM (read-only memory) (Read-Only Memory is called for short ROM), random access memory (Random Access Memory is called for short RAM), magnetic disc or CDs.
In the embodiment such as apparatus and method of the present invention, obviously, each parts or each step reconfigure after can decomposing, combine and/or decomposing.These decomposition and/or reconfigure and should be considered as equivalents of the present invention.Simultaneously, in the above in the description of the specific embodiment of the invention, the feature of describing and/or illustrating for a kind of embodiment can be used in same or similar mode in one or more other embodiment, combined with the feature in other embodiment, or substitute the feature in other embodiment.
Should emphasize, term " comprises/comprises " existence that refers to feature, key element, step or assembly while using herein, but does not get rid of the existence of one or more further feature, key element, step or assembly or add.
Finally it should be noted that: although described above the present invention and advantage thereof in detail, be to be understood that in the situation that do not exceed the spirit and scope of the present invention that limited by appended claim and can carry out various changes, alternative and conversion.And scope of the present invention is not limited only to the specific embodiment of the described process of instructions, equipment, means, method and step.One of ordinary skilled in the art will readily appreciate that from disclosure of the present invention, can use carry out with the essentially identical function of corresponding embodiment described herein or obtain process, equipment, means, method or step result essentially identical with it, that existing and will be developed future according to the present invention.Therefore, appended claim is intended to comprise such process, equipment, means, method or step in their scope.