CN103744275A - Thin film heating component for laser printer and production method thereof - Google Patents
Thin film heating component for laser printer and production method thereof Download PDFInfo
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- CN103744275A CN103744275A CN201410048823.1A CN201410048823A CN103744275A CN 103744275 A CN103744275 A CN 103744275A CN 201410048823 A CN201410048823 A CN 201410048823A CN 103744275 A CN103744275 A CN 103744275A
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Abstract
The invention discloses a thin film heating component for a laser printer. The thin film heating component comprises a ceramic substrate (200), a frontal conductor circuit layer (201), a frontal thin film resistance layer (203), a thin film medium layer (204) and a frontal insulation protection layer (205) arranged in sequence; meanwhile, the invention further provides a production method of the heating component; the production method comprises the steps of: (1) forming the frontal conductor circuit layer on the ceramic substrate; (2) forming a mask pattern layer (202) on the ceramic substrate; (3) forming the frontal thin film resistance layer (203) on the frontal conductor circuit layer and the ceramic substrate; (4) forming the thin film medium layer (204) on the frontal thin film resistance layer (203); (5) removing the mask pattern layer (202); (6) forming the frontal insulation protection layer (205). The heating component, provided by the invention, has the characteristics of low production cost, uniform heating, low energy consumption, stable heating power and long service life, and is suitable for high-temperature and high-humidity environments of the laser printer and a copying machine.
Description
Technical field
The invention belongs to the technical field of laser printer and duplicating machine accessory, film heating components and parts and the method for making of especially a kind of laser printer or used in copy machines.
Background technology
Heat fixer system is the important component part of Modern Laser printer and duplicating machine, its effect is to be adsorbed on the carbon dust image on printer paper through overcharging, after exposure, development, 4 steps of transfer printing, utilize the method for pressurization hot melt, the carbon dust being adsorbed on printer paper is heated to 180 ℃ to 220 ℃, the carbon dust dissolving is immersed in printer paper, form still image.This process is called " photographic fixing ".Heat fixer system is mainly comprised of several parts such as warm-up mill, heating element (ceramic heating element or heat filament), pressure rubber roll, temperature controller (thermistor), thermal protectors (thermoswitch).Wherein, heating element has ceramic heating flake and two kinds of modes of halogen lamp tube at present.And ceramic heating flake due to its power large (1100 to 1300W), power stability, quick heating, thermal losses is few, heat conduction velocity is fast, economize on electricity, the advantage such as easy for installation, is the main flow of current laser printer heat fixer heating element that system is used.
At present existing multiple ceramic heating flake is applied to laser printer and duplicating machine, is especially applied to the ceramic heating flake of high speed laser printer (duplicating machine), generally uses the production Technology of thick film hybrid integrated circuit, is at aluminium oxide (Al
2o
3) on ceramic substrate or aluminium nitride (AlN) ceramic substrate, by printed conductor layer, heating resistor layer, insulating protective layer, and by the high temperature sintering of 850 ℃, form thick film ceramic heating plate.As shown in Figure 1, it comprises the structure of these thick film ceramic heating plates: substrate (100), front surface conductors circuit (101), front resistive layer (102), front insulating medium protective seam (103).
The manufacture method of above-mentioned thick film ceramic heating plate comprises the steps:
1. upper at aluminium oxide or aluminum nitride ceramic substrate (100), by thick film silk-screen printing technique, printing front surface conductors line layer (101).And by the high temperature sintering of 850 ℃, the conductor layer that forming property is stable.Front surface conductors line layer generally comprises the conductor line overlapping with front resistive layer (102) and the pad overlapping with input terminal.Wherein conductor material generally need be selected silver/palladium (Ag/Pd) precious metal material.
2. the front surface conductors line layer (101) obtaining in above-mentioned steps 1 is upper, uses same sample making process, makes front resistive layer (102).And by the high temperature sintering of 850 ℃, the heating resistor rete that forming property is stable.And in order to guarantee thick film ceramic heating plate power stability in use, resistance slurry generally need be selected the palladium that temperature characterisitic is stable (Pd) noble metal.
3. the front resistive element layer (102) obtaining in above-mentioned steps 2 is upper, uses same sample making process, makes insulating medium protective seam (103).
, there is following problem in the thick film ceramic heating plate that the said goods structural design and method for making are manufactured:
1. resistive layer (101) is typically designed to elongated rectangular shape.
According to the computing formula of resistance:
R=R
□×S
The target resistance values of R---ceramic heating flake
R
□---resistance slurry sheet resistance
The design number formulary of S---resistive element, S=resistive element length (L) ÷ resistive element width (W)
Due to the elongated rectangular shape design of resistive layer, the resistance number formulary of resistive layer is very large.
According to the use power of 1300W, when operating voltage is 110V, according to P(power)=U
2(operating voltage) ÷ R(resistance) computing formula.The general 9 ohm of left and right of resistance of ceramic heat bar.
According to above-mentioned computing formula, the sheet resistance of resistance slurry must be in milliohm level (generally in 100 milliohm left and right).In order to reach so low sheet resistance slurry, and guarantee low temperature-coefficient of electrical resistance (TCR), to meet the requirement of thick film ceramic heating plate power stability, slurry producer must be used the function phase of the precious metal materials such as palladium (Pd) as resistance slurry.Like this, just make the cost of this series products high.
2. the resistive layer length dimension of this series products is generally all at 280mm to 400mm.Be subject to thick film silk-screen printing technique limitation and and the limitation of printing machine platform print stroke affect, the large-area resistance pattern of long size is in printing process, have the problem of the lack of homogeneity of resistive element print film layer thickness, the resistive layer deviation of resistive layer each position on ceramic substrate all exceeds 3 μ m conventionally.Make the heating of ceramic heating flake inhomogeneous, affect printing effect.When inhomogeneous heating causes accumulation of heat to a certain extent, even can cause ceramic heating flake fracture.
3. due to the limitation of the manufacture craft of thick-film resistor paste, the TCR of low square resistance resistance slurry is difficult to control in 50PPM/ ℃.Generally all at 50PPM/ ℃～150PPM/ ℃.Like this, the thick film ceramic heating plate that uses such low square resistance resistance slurry to produce, its temperature-coefficient of electrical resistance (TCR) is generally all at 100PPM/ ℃～200PPM/ ℃.When ceramic heating flake is printed use for a long time at laser printer, there is output power attenuation problem, affect the print quality of laser printer.
4. this product needed, could stable resistance, conductor and the defencive function rete of forming property through three high temperature sinterings of above 850 ℃.Production run power consumption is large, and the low energy consumption production requirement of the energy-conserving and environment-protective of advocating at present with China is misfitted.
Summary of the invention
The object of the invention is by special structural design, and the manufacture method of using thick film and film to combine, provide a kind of ceramic heating flake, the problem such as the production cost that can effectively solve existing thick film ceramic heating plate is high, inhomogeneous, the easy explosion of generating heat, energy consumption are high, power attenuation.
Laser printer film heating components and parts provided by the present invention as shown in Figure 1; comprise the ceramic substrate (200), front surface conductors line layer (201), front thin film resistive layer (203), thin film dielectrics layer (204) and the front insulating protective layer (205) that set gradually; described ceramic substrate (200) is aluminum nitride ceramic substrate, and described thin film resistive layer (203) is Ni/Cr alloy film or SnCl
4(butter of tin)/SnCl
3(antimony trichloride) oxide film; described thin film dielectrics layer (204) is made by pure aluminum material; described front insulating protective layer (205) is used the polyimide material with well high temperature resistant, resistance to high humidity and antiwear characteristic, also can adopt resin or the preparation of organosilyl compound.
The present invention also provides the method for making of these laser printer film heating components and parts, comprises the steps:
(1) first insulating ceramics substrate (200) is processed into as shown in Figure 3 there is horizontal paddle-tumble (11) and longitudinal paddle-tumble (12), recycling thick film film technique, at the upper front surface conductors line layer (201) that forms of ceramic substrate (200).
(2) utilize thick film film technique, at the upper mask figure layer (202) that forms of ceramic substrate (200).This mask figure layer just, for being sheet resistance film preparation below, plays shielding effect, and after sheet resistance Film preparation completes, this mask figure layer will be cleaned.
(3) utilize forming thin film technology, form front thin film resistive layer (203) on front surface conductors line layer and ceramic substrate, front thin film resistive layer (203) forms film heating resistive element after overlapping with front surface conductors line layer (201).
(4) utilize forming thin film technology, upper at front thin film resistive layer (203), form thin film dielectrics layer (204).This dielectric layer is used the pure aluminum material preparation with self-passivation characteristic.This passivation layer can protective film resistive layer (203) the physical shock of avoiding external force, meanwhile, there is high anti-moisture-proof, protective film resistive layer (203) is avoided outside wet gas corrosion.
(5) by cleaning, drying, sheet resistance rete (203) and thin film dielectrics layer (204) are removed and manifested to mask figure layer (202).
(6) utilize thick film film technique, on the basis of ceramic substrate (200), front surface conductors line layer (201), front thin film resistive layer (203), thin film dielectrics layer (204), form front insulating protective layer (205).
Described thick film film technique can be used screen printing mode, and described forming thin film technology can adopt hot evaporation, sputter, chemical vapor deposition or plasma enhanced chemical vapor deposition method.
The present invention compared with prior art, has the following advantages and good effect:
1. front heating resistor is used thin film deposition processes preparation.Heater even film layer, guarantees that the heating of product is even, avoids the resistive layer printing thick film of common thick film ceramic heating flake to differ to, the easy problem of explosion in heating process.
2. thin film resistive layer is used Ni/Cr alloy material or SnCl4/(butter of tin)/SbCl3(antimony trichloride) oxide film material.Compared with silver/palladium/ruthenium noble metal resistance material of common thick film ceramic heating flake, the cost of material is low.And product high temperatures, heat shock resistance and resistance to load capacity are stronger.
3. thin film dielectrics layer is used pure aluminum material preparation, this metallic diaphragm has self-passivation characteristic, in air, can, from blunt oxidation, by thin film aluminum metallic diaphragm, form burning aluminium dielectric layer, also can from obtuse, become alumina medium film at the heat treatment step of resistive layer simultaneously.Due to the existence of thin film dielectrics layer, make the moisture cannot etch thin film resistive layer, carry out double shielding, make the long-term work under severe wet environment of sheet resistance heating physical efficiency.
4. outer layer protection is used the polyimide material of high temperature resistant, resistance to high humidity and antiwear characteristic, the serviceable life of greatly improving product.
5. can on aluminum nitride ceramic substrate, prepare each functional film layer, product coefficient of heat conductivity is high, is suitable for high-speed printer (HSP) and high speed copier.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing thick film ceramic heating plate.
Fig. 2 is the structural representation of film heating components and parts in the present invention.
Fig. 3 is the structural representation of ceramic substrate in the present invention.
Fig. 4 is process chart of the present invention.
Embodiment
With a specific embodiment, be described implementation process of the present invention below, but the present invention is not limited only to this embodiment.Content of the present invention contain anyly on core content of the present invention, make an amendment, equivalence, the various schemes of replacing.
As shown in Figure 2, technological process as shown in Figure 4, specifically comprises the following steps basic structure of the present invention:
Step 1: insulating ceramics substrate (200) is processed into and has horizontal paddle-tumble (11) and longitudinal paddle-tumble (12), and these groovings contribute to operation to be below divided into the junior unit of rectangle, and its structure as shown in Figure 3.
Step 2: use thick film film technique, upper at insulating ceramics substrate (200), form front surface conductors line layer (201), then these semi-manufacture are put into 800 ℃ of above high temperature kiln roastings, to form conductor function rete.
Step 3: utilize thick film film technique, at the upper mask figure layer (202) that forms of ceramic substrate (200), then the semi-manufacture of acquisition are put into 240 ℃ of following low-temperature setting stoves (or curing case), mask figure layer (202) is carried out to low-temperature setting.
Step 4: use forming thin film technology, at front surface conductors line layer (201) with above mask figure layer (202), form sheet resistance rete (203).
Step 5: use forming thin film technology, at the upper thin film dielectrics layer (204) that forms of sheet resistance rete (203), this thin film dielectrics layer material is fine aluminium.Pure aluminum material can be from blunt oxidation in air, makes aluminum metal rete form burning aluminium dielectric layer, or from obtuse, becomes alumina medium film at the heat treatment step of the resistive layer in later stage.
Step 6: by obtained sheet resistance rete (203) and thin film dielectrics layer (204) semi-manufacture, put into the heat treatment box of 350 to 450 ℃, heat-treat the sheet resistance functional layer stable with forming property and thin film dielectrics diaphragm.
Step 7: the semi-manufacture that obtain through step 6, by cleaning, drying, mask figure layer (202) is disposed, manifest sheet resistance rete (203) and thin film dielectrics layer (204).
Step 8: use thick film film technique; first at front surface conductors line layer (201), sheet resistance rete (203), form insulation protection rete (205) above the special media coating of burning (204); again semi-manufacture are put into 240 ℃ of following low-temperature setting stoves (or curing case); carry out low-temperature setting, to form defencive function layer.
Step 9: utilize horizontal paddle-tumble (11) and longitudinal paddle-tumble (12) on ceramic substrate (200), by the semi-manufacture through above-mentioned processing procedure processing, break into two with one's hands and form wall scroll ceramic membrane fire-bar finished product.
Step 10: to wall scroll ceramic membrane fire-bar finished product, carry out performance test, sorting, packing, warehouse-in.
Claims (10)
1. a method for making for laser printer film heating components and parts, is characterized in that: comprise the steps:
(1) first ceramic substrate (200) is processed into and has horizontal paddle-tumble (11) and longitudinal paddle-tumble (12), recycling thick film film forming or forming thin film technology, at the upper front surface conductors line layer (201) that forms of ceramic substrate (200);
(2) utilize thick film film technique at the upper mask figure layer (202) that forms of ceramic substrate (200);
(3) utilize forming thin film technology on front surface conductors line layer and ceramic substrate, to form front thin film resistive layer (203), front thin film resistive layer (203) forms film heating resistive element after overlapping with front surface conductors line layer (201);
(4) utilize forming thin film technology upper at front thin film resistive layer (203), form thin film dielectrics layer (204);
(5) by cleaning, drying, sheet resistance rete (203) and thin film dielectrics layer (204) are removed and manifested to mask figure layer (202);
(6) utilize thick film film technique to form front insulating protective layer (205) on the basis of ceramic substrate (200), front surface conductors line layer (201), front thin film resistive layer (203), thin film dielectrics layer (204).
2. the method for making of laser printer film heating components and parts according to claim 1, is characterized in that: described thick film film technique is used screen printing mode.
3. the method for making of laser printer film heating components and parts according to claim 1, is characterized in that: described forming thin film technology adopts hot evaporation, sputter, chemical vapor deposition or plasma enhanced chemical vapor deposition method.
4. the method for making of laser printer film heating components and parts according to claim 1, it is characterized in that: in described step (1), the semi-manufacture with front surface conductors line layer (201) are put into 800 ℃ of above high temperature kiln roasting conductor function retes.
5. the method for making of laser printer film heating components and parts according to claim 1, it is characterized in that: in described step (2), the semi-manufacture with mask figure layer (202) are put into 240 ℃ of following low-temperature setting stove or curing casees and be cured.
6. the method for making of laser printer film heating components and parts according to claim 1; it is characterized in that: in described step (4), the semi-manufacture with thin film dielectrics layer (204) are put into the heat treatment box of 350 to 450 ℃ and heat-treated the sheet resistance functional layer stable with forming property and thin film dielectrics diaphragm.
7. the method for making of laser printer film heating components and parts according to claim 1; it is characterized in that: in described step (6), the semi-manufacture with front insulating protective layer (205) are put into 240 ℃ of following low-temperature setting stove or curing casees and be cured.
8. according to the method for making of the laser printer film heating components and parts described in claim 1 or 7; it is characterized in that: in described step (6); utilize horizontal paddle-tumble (11) and longitudinal paddle-tumble (12) on ceramic substrate (200); the obtained semi-manufacture with front insulating protective layer (205) are broken into two with one's hands and formed wall scroll ceramic membrane fire-bar finished product; then to wall scroll ceramic membrane fire-bar finished product, carry out performance test, sorting; packing, warehouse-in.
9. laser printer film heating components and parts; comprise the ceramic substrate (200), front surface conductors line layer (201), front thin film resistive layer (203), thin film dielectrics layer (204) and the front insulating protective layer (205) that set gradually, it is characterized in that: described thin film resistive layer (203) is Ni/Cr alloy film, SnCl
4oxide film or SnCl
3oxide film.
10. laser printer film heating components and parts according to claim 9, is characterized in that: described thin film dielectrics layer (204) is made by pure aluminum material.
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|---|---|---|---|
| CN201410048823.1A CN103744275B (en) | 2014-02-12 | 2014-02-12 | A kind of laser printer film heating components and parts and method for making |
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|---|---|---|---|
| CN201410048823.1A CN103744275B (en) | 2014-02-12 | 2014-02-12 | A kind of laser printer film heating components and parts and method for making |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08185069A (en) * | 1994-12-27 | 1996-07-16 | Toshiba Lighting & Technol Corp | Fixing heater and device, and image forming device |
| CN1149955A (en) * | 1995-03-28 | 1997-05-14 | 罗姆股份有限公司 | Heating device for sheet material |
| CN101598924A (en) * | 2009-07-13 | 2009-12-09 | 石磊 | Ceramic heating piece for laser printer and production technology thereof |
| CN201417364Y (en) * | 2009-07-13 | 2010-03-03 | 石磊 | Ceramic heating plate for laser printer |
| CN203745799U (en) * | 2014-02-12 | 2014-07-30 | 东莞市东思电子技术有限公司 | Thin film heating element for laser printing machine |
-
2014
- 2014-02-12 CN CN201410048823.1A patent/CN103744275B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08185069A (en) * | 1994-12-27 | 1996-07-16 | Toshiba Lighting & Technol Corp | Fixing heater and device, and image forming device |
| CN1149955A (en) * | 1995-03-28 | 1997-05-14 | 罗姆股份有限公司 | Heating device for sheet material |
| CN101598924A (en) * | 2009-07-13 | 2009-12-09 | 石磊 | Ceramic heating piece for laser printer and production technology thereof |
| CN201417364Y (en) * | 2009-07-13 | 2010-03-03 | 石磊 | Ceramic heating plate for laser printer |
| CN203745799U (en) * | 2014-02-12 | 2014-07-30 | 东莞市东思电子技术有限公司 | Thin film heating element for laser printing machine |
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| CN103744275B (en) | 2015-10-28 |
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