CN103739208B - A kind of manufacture method of the glass-ceramic clad plate with conductive glass layer - Google Patents
A kind of manufacture method of the glass-ceramic clad plate with conductive glass layer Download PDFInfo
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Abstract
The present invention relates to technical field of inorganic nonmetallic materials, especially a kind of manufacture method of the glass-ceramic clad plate with conductive glass layer, it comprises the steps: step 1) batch mixing: the inorganic conductive powder of a kind of in the titanate by inorganic conductive oxide, conduction or both compositions of mixtures is coated on glass particle uniformly, make compound, wherein the mass fraction of inorganic conductive powder is 3%～23%, and the mass fraction of glass particle is 77%～97%; Step 2) cloth: the compound that evenly charity step 1) is manufactured on Ceramic Tiles base substrate, the ulking thickness of compound is 2～8mm; Step 3) enters klining: burns till in roller kilns oxidizing atmosphere, and 1150～1250 DEG C of firing temperatures, firing period is 60～120 minutes; Step 4) rubbing down processing: carry out edging and polishing by going out the cooling goods of kiln, obtain the method for the glass-ceramic clad plate with conductive glass layer.
Description
Technical field
The present invention relates to technical field of inorganic nonmetallic materials, especially a kind of crystallite glass with conductive glass layerThe manufacture method of glass ceramic clad plate.
Background technology
Our common simple glass is a kind of insulator under normal conditions, thereby is not suitable for some special workJourney needs, particularly its demand of conducting electricity under normal conditions at needs. People have researched and developed a lot of production conductions for this reasonThe technique of glass, for example, add conductive ion in glass, at glass surface additional guide electrolemma etc. At glassIn add conductive ion mainly for the manufacture of solid electrolyte glass, electrocondution slurry conductive glass powder, aboveMain application is lithium ion battery etc.; At glass surface additional guide electrolemma mainly for the manufacture of electroconductive glass fibreAnd thering is the glassware of surface conductance ability, it is mainly used in FPD field, for example, at flat boardThe ITO(tin indium oxide being widely used in demonstration) glass. The electro-conductive glass of above two kinds of mode manufacturingsCost is high, and the scope of application is substantially fixing, and particularly ito glass manufacturing equipment costliness, needs plasmaBody sputtering equipment, and the electro-conductive glass of manufacturing only has the conducting film that one deck sputter forms on surface, basicCan only be used for FPD field.
In building and ornament materials, glassware occupies very large ratio. Along with entering of production technology and materialStep, except traditional building glass, glass Mosaic, devitrified glass brick, microcrystallite glass-ceramic composite brick,Throw the new product such as brilliant brick, throwing glazed brick and continue to bring out, in building internal and external ornament, bringing into play more and more importantEffect. If by conducting glass material for above product, can obtain there is electro-magnetic screen function, anti-The building decorative product of electrostatic function, electric heating function. But, two kinds of existing electro-conductive glass systems of above introductionTechnology for making is not suitable for manufacturing building and ornament materials electro-conductive glass.
Summary of the invention
The electro-conductive glass that the object of the invention is to propose a kind of cheapness, it has with low cost, manufacturing processThe feature such as simple, and can or set it as a kind of basic material by it and manufacture building and ornament materials, with thisPlant electro-conductive glass as material, can also produce for example conducting plate glass, electro-conductive glass mosaic, have and leadThe electro-conductive glass goods such as the glass-ceramic clad plate of electricity glassy layer, can provide comfortable, healthy to peopleLiving space.
For reaching this object, the present invention by the following technical solutions: a kind of electro-conductive glass, it is by leading inorganicAfter being coated on glass particle surface, electricity powder makes glass mixture, then melting at 1150 DEG C～1300 DEG C,Cooling making, the one or two in the titanate that described inorganic conductive powder is inorganic conductive oxide, conductionPerson's mixture, the mass fraction of making inorganic conductive powder in glass mixture is 3%～23%, glassGrain mass fraction is 77%～97%.
Melting at 1150 DEG C～1300 DEG C, does not have complete melting mixing, and is only to melt each other between glass particleBe combined, thereby the inorganic conductive powder that is coated on glass particle surface forms conductive mesh in electro-conductive glass,In net, be wrapped in glassy phase, therefore this electro-conductive glass resistance is even, and conductive effect is good.
Further, in above-mentioned electro-conductive glass, inorganic conductive oxide is for including but not limited to electric conductive oxidationOne or more mixing in tin, conductive zinc oxide, conductive titanium oxide, electric conductive oxidation iron.
Further, in above-mentioned electro-conductive glass, the titanate of conduction for include but not limited to conduct electricity barium titanate,One or more mixing in conduction lead titanates.
Further, in above-mentioned electro-conductive glass, glass particle can be low temperature glass particle, common buildingOne or more combinations in glass particle, ware glass particle, devitrified glass particle, glass frit particle.
Cryogenic glass powder refers to the glass dust that melt temperature is lower, for example nonex powder; Common building glassPowder refers to the powder that the discarded rear fragmentation of door and window plate glass used is made; Ware glass powder refer to vial,The powder that tank, cup, the discarded rear fragmentation of dish are made; Microcrystalline glass powder refers to the powder of making after devitrified glass fragmentationMaterial, glass frit powder refers to that cooling the glass direct-water-quenching of the molten state block making is broken into powder to be madePowder. In addition, glass frit is usually used as the glaze raw material of Production of Ceramics, and main rising made flux and carryHigh glaze quality effect, glass frit also can be used as the raw material of producing glass-ceramic clad plate in addition.
Further, in above-mentioned electro-conductive glass, the particle diameter of glass particle is 1mm～15mm, further excellentElect 2mm～8mm as, above particle size range is conducive to inorganic conductive powder and is wrapped on glass particle.
Above-mentioned electro-conductive glass can be made conducting plate glass, electro-conductive glass mosaic, have conductive glass layerGlass-ceramic clad plate.
The present invention also provides a kind of method of manufacturing electro-conductive glass, and it comprises the steps:
Step 1) batch mixing: by a kind of in the titanate by inorganic conductive oxide, conduction or both is mixedThe inorganic conductive powder of compound composition is coated on glass particle uniformly, makes compound, wherein inorganic leadingThe mass fraction of electricity powder is 3%～23%, and the mass fraction of glass particle is 77%～97%.
Step 2) to pile up: the compound that just step 1) makes is deposited on supporting body.
Step 3) is founded: by step 2) pile up and have the supporting body of compound to be placed in kiln to found, foundTemperature is 1150 DEG C～1300 DEG C; After cooling, obtain electro-conductive glass.
Further, in said method, the material of supporting body can be refractory material, ceramic green body,One in pottery biscuiting base substrate, high-temperature metal. Supporting body surface topography and while presenting different shape, madeStandby electro-conductive glass shape is also different, and for example supporting body surface topography is plane, can make conducting plateGlass; Supporting body surface has latticed grid, can make electro-conductive glass mosaic.
Further, in said method, between supporting body and compound, be provided with adherent layer, like this after sintering,Electro-conductive glass just can be easy to take off from supporting body. The material of adherent layer can be aluminium oxide, aluminium vanadine,The refractory materials such as mullite, carborundum, silicon nitride; Particularly, can be by above-mentioned refractory material ball milling pulpingMaterial, is coated on supporting body, and then dispenses compound.
Further, in said method, the conductive oxide using in step 1) includes but not limited toOne or more mixing in conductive tin oxide, conductive zinc oxide, conductive titanium oxide, electric conductive oxidation iron.
Further, in said method, the titanate of the conduction using in step 1) comprises but does not limitOne or more mixing in conduction barium titanate, conduction lead titanates.
Further, in said method, the particle diameter of the glass particle using in step 1) for 1mm～15mm; More preferably 2mm～8mm, above particle size range is conducive to inorganic conductive powder and is coated on inorganicConductive powder body surface.
For inorganic conductive powder can be wrapped in preferably on glass particle, in said method, step 1)Described inorganic conductive powder adds in advance to be made in the organic solvent such as water or ethanol after electrocondution slurry and glass againThe coated oven dry of particle makes compound. Preferably, the quality of the organic solvent such as water or ethanol is inorganic conductive powder1/3～3/2 times of weight.
In said method, the coated baking operation of electrocondution slurry and glass particle can adopt slurry atomizing spraying method,Slurry dipping paddling process. Above-mentioned slurry atomizing spraying method is by electrocondution slurry compressed air atomization, by sprayRifle is sprayed on glass particle surface, to be dried after, be formed on the coated one deck inorganic conductive powder in glass particle surfaceThe compound of body; Slurry dipping paddling process is that glass particle is immersed in electrocondution slurry, is then constantly stirred toEvenly, then dry, obtain compound.
Further, in said method, in electrocondution slurry, can also contain film forming agent, dispersant, fluxAgent, defoamer.
Film forming agent can be selected ethyl cellulose, methylcellulose, polyvinyl alcohol, glycerine etc., addition oneAs be the 0.5%-3% of stock quality, its Main Function is to allow slurry have viscosity, makes inorganic conductive powderCan form on glass particle surface firmly integument.
Dispersant also can be called water reducer, is mainly in order to reduce solvent in slurry, thereby reaches jointAbout resource effect, it can be spent pulping liquor, waterglass, polyacrylic acid, sodium phosphate trimer, it adds matterAmount is generally the 0.3%-0.5% of stock quality.
Cosolvent is mainly in order to reduce melt temperature, and makes the electro-conductive glass made finer and close, smooth flatWhole, the porosity is low, and it can be potassium, sodium, lithium feldspar, and spodumene, lead borate, glass dust etc. addAmount is generally below 5% of stock quality.
Defoamer is mainly in order to reduce the bubble in slurry, its can be ethanol, isopropyl alcohol, n-butanol,Dimethyl glycerine etc., addition is generally no more than 1% of stock quality.
Further, the present invention also provides a kind of method of manufacturing conducting plate glass, and it comprises the steps:
Step 1) batch mixing: by a kind of in the titanate by inorganic conductive oxide, conduction or both is mixedThe inorganic conductive powder of compound composition is coated on glass particle uniformly, makes compound, wherein inorganic leadingThe mass fraction of electricity powder is 3%～23%, and the mass fraction of glass particle is 77%～97%.
Step 2) cloth: on the supporting body that the even charity of compound prepared by step 1) is plane on surface.
Step 3) is melted system: in kiln, found, glass melting temperature is 1150 DEG C～1300 DEG C, temperature retention time againIt is 1～2 hour; After cold going, will obtain goods and take off from supporting body, obtain conducting plate glass.
The antistatic plate glass of more than making can carry out the machining in later stage, comprise cutting, grinding,Polishing etc.
Further, in said method, the material of supporting body can be refractory material, ceramic green body,One in pottery biscuiting base substrate, high-temperature metal.
Further, in said method, between supporting body and compound, be provided with adherent layer, like this after sintering,Conducting plate glass just can be easy to take off from supporting body. The material of adherent layer can be aluminium oxide, Mo LaiThe refractory materials such as stone, carborundum, silicon nitride; Particularly, can be by above-mentioned refractory material ball milling form slurry,Be coated on supporting body, and then dispense compound.
Further, the present invention also provides a kind of method of manufacturing electro-conductive glass mosaic, and it comprises following stepRapid:
Step 1) batch mixing: by a kind of in the titanate by inorganic conductive oxide, conduction or both is mixedThe inorganic conductive powder of compound composition is coated on glass particle uniformly, makes compound, wherein inorganic leadingThe mass fraction of electricity powder is 3%～23%, and the mass fraction of glass particle is 77%～97%.
Step 2) cloth: the compound cloth that step 1 is made be sprinkled into have latticed grid die cavity by resistance toIn the mould that fire material or high-temperature metal are made.
Step 3) is melted system: in kiln, found, glass melting temperature is 1150 DEG C～1300 DEG C, temperature retention time againIt is 1～2 hour; After cold going, will obtain goods and take out from mould, can obtain electro-conductive glass mosaic.
Further, in said method, the material of mould can be refractory material, ceramic green body, potteryOne in porcelain biscuiting base substrate, high-temperature metal.
Further, in said method, between mould and compound, be provided with adherent layer, like this after sintering,Electro-conductive glass mosaic just can be easy to take off from supporting body. The material of adherent layer can be aluminium oxide, notCarry out the refractory materials such as stone, carborundum, silicon nitride; Particularly, can be by above-mentioned refractory material ball milling form slurry,Be coated on mould, and then dispense compound.
Melting at 1150 DEG C～1300 DEG C, does not have complete melting mixing, and is only to melt each other between glass particleBe combined, thereby the inorganic conductive powder that is coated on glass particle surface forms in electro-conductive glass mosaicConductive mesh, is wrapped in glassy phase in net, therefore this electro-conductive glass mosaic resistance is even, and conduction effectFruit is good.
Further, the present invention also provides a kind of manufacture to have the glass-ceramic clad plate of conductive glass layerMethod, it comprises the steps:
Step 1) batch mixing: by a kind of in the titanate by inorganic conductive oxide, conduction or both is mixedThe inorganic conductive powder of compound composition is coated on glass particle uniformly, makes compound, wherein inorganic leadingThe mass fraction of electricity powder is 3%～23%, and the mass fraction of glass particle is 77%～97%.
Step 2) cloth: the compound that evenly charity step 1) is manufactured on ceramic body, the heap of compoundLong-pending thickness is 2～8mm.
Step 3) enters klining: burn till in roller kilns oxidizing atmosphere, 1150～1250 DEG C of firing temperatures, burnThe one-tenth cycle is 60～120 minutes.
Step 4) rubbing down processing: carry out edging and polishing by going out the cooling goods of kiln, hadThe method of the glass-ceramic clad plate of conductive glass layer.
In order to allow step 2) in compound can be on ceramic body better pile up, in the time of cloth, can spray solidDetermine agent; Fixative is viscosity solution, and it can be bonded in compound on ceramic body.
Compared to the prior art, the electro-conductive glass cheapness of manufacture of the present invention, technique be simple, be easy to realize, andAnd can be with it as the abundant construction material of raw material manufacture, for example plate glass, glass Mosaic, leadThe glass-ceramic clad plate etc. of electricity glassy layer, given glass for building purposes material electromagnetic shielding, antistatic,The new functions such as electrical heating.
Detailed description of the invention
Further illustrate technical scheme of the present invention below by detailed description of the invention.
The formula table that following table 1 is embodiment.
Table 1
Cryogenic glass powder refers to the glass dust that melt temperature is lower, for example lead glass powder; Common building glass dustRefer to the powder that the discarded rear fragmentation of door and window plate glass used is made; Ware glass powder refer to vial, tank,The powder that cup, the discarded rear fragmentation of dish are made; Microcrystalline glass powder refers to the powder of making after devitrified glass fragmentation,Glass frit powder refers to cooling the glass direct-water-quenching of the molten state block making is broken into the powder that powder is madeMaterial. In addition, glass frit is usually used as the glaze raw material of Production of Ceramics, and main rising made flux and improved glazeFace mass action, glass frit also can be used as the raw material of producing glass-ceramic clad plate in addition.
Embodiment 1～10: manufacture conducting plate glass.
Its manufacture method is as follows:
Step 1) batch mixing: according to the listed recipe ingredient of table 1, by the titanium by inorganic conductive oxide, conductionThe inorganic conductive powder of a kind of in hydrochlorate or both compositions of mixtures is coated on glass particle uniformly,Make compound, wherein the mass fraction of inorganic conductive powder is 3%～23%, the mass fraction of glass particleBe 77%～97%.
Step 2) cloth: on the supporting body that the even charity of compound prepared by step 1) is plane on surface,The thickness of feed layer that charity forms is about 5mm; Here supporting body is chosen as refractory brick, certain Ceramic Tiles base substrate,Or refractory metal etc. can be selected.
Step 3) is melted system: in kiln, found, glass melting temperature is 1150 DEG C～1300 DEG C, temperature retention time againIt is 1～2 hour; After cold going, will obtain goods and take off from supporting body, obtain conducting plate glass.
The plate glass of test manufacturing, its bulk resistor is 105～109Ω·m。
Embodiment 1 shakes inorganic conductive powder to stir to make coated material together with glass dust, because inorganicConductive powder body is difficult on glass particle, adhere to again, therefore wraps up effect poor.
In order to allow inorganic conductive powder and glass particle fully wrap up, in the manufacture method of embodiment 2-10,Inorganic conductive powder described in step 1) adds in the organic solvent such as water or ethanol in advance to be made after electrocondution slurryMake compound with coated oven dry of glass particle again, in slurry, the quality of the organic solvent such as water or ethanol is inorganic1/3～3/2 times of conductive powder body quality. Inorganic conductive powder can be wrapped in glass particle table uniformly like thisFace, can shorten melting time, raises the efficiency. Wherein embodiment 2-3 adopts water as solvent, water use matterAmount is 1/3 times of inorganic conductive powder quality, and in order to allow conductive paste part can be attached to preferably glassOn grain, in water, be also dissolved with mass fraction 2%～5% carboxymethyl cellulose; In embodiment 4-6, be by inorganicConductive powder body adds ball milling in ethanol to mix, and the quality of ethanol is 1 times of inorganic conductive powder quality, andIn ethanol, contain mass fraction and be 1%～3% polyvinyl alcohol (PVA) as film forming agent; Embodiment 7 and 8Select ethanol water to mix as solvent ball milling, the quality of ethanol water is inorganic conductive powder quality1.2 times, and in ethanol water, to contain mass fraction be that 1%～3% polyvinyl alcohol (PVA) is as film formingAgent; Embodiment 9 and 10 selects water as solvent, and the use quality of water is inorganic conductive powder quality1.5 times, in addition, in the time of ball milling, also add film forming agent, the 0.3%-0.5% of stock quality 0.5%-3% dispersant,≤ 5% cosolvent, after slurry ball milling is emitted well, in order to eliminate foam, then add≤stock quality 1%Defoamer.
Film forming agent can be selected ethyl cellulose, methylcellulose, polyvinyl alcohol, glycerine etc., addition oneAs be the 0.5%-3% of stock quality, its Main Function is to allow slurry have viscosity, makes inorganic conductive powderCan form on glass particle surface firmly integument. In above embodiment, be chosen as methylcellulose.
Dispersant also can be called water reducer, is mainly in order to reduce solvent in slurry, thereby reaches jointAbout resource effect, it can be spent pulping liquor, waterglass, polyacrylic acid, sodium phosphate trimer, it adds matterAmount is generally the 0.3%-0.5% of stock quality. In above embodiment, be chosen as sodium phosphate trimer.
Cosolvent is mainly in order to reduce melt temperature, and makes the electro-conductive glass made finer and close, smooth flatWhole, the porosity is low, and it can be potassium, sodium, lithium feldspar, spodumene, lead borate etc., and addition is generallyBelow 5% of stock quality. In above embodiment, be chosen as the spodumene of stock quality 3%.
Defoamer is mainly in order to reduce the bubble in slurry, its can be ethanol, isopropyl alcohol, n-butanol,Dimethyl glycerine etc., addition is generally no more than 1% of stock quality. In above embodiment, be chosen as diformazanBase glycerol.
In said method, the coated baking operation of electrocondution slurry and glass particle be adopt slurry atomizing spraying method,Slurry dipping paddling process. Above-mentioned slurry atomizing spraying method is by electrocondution slurry compressed air atomization, by sprayRifle is sprayed on glass particle surface, to be dried after, be formed on the coated one deck inorganic conductive powder in glass particle surfaceThe compound of body, embodiment 2-5 selects the method; Slurry dipping paddling process is that glass particle is immersed to conductionIn slurry, be then constantly stirred to evenly, then dry, obtain coated compound, embodiment 6-10 choosingUse the method.
In embodiment 10, between supporting body and compound, be provided with adherent layer, after sintering, conduction is flat like thisGlass sheet just can be easy to take off from supporting body. The refractory materials such as the materials of aluminum alumina of adherent layer; Particularly,Be that bauxite solubilizer ball milling is made, be coated on supporting body, and then dispense compound.
In addition, in order to eliminate the stress in conducting plate glass, it can be annealed at 400 DEG C～540 DEG C0.5～2 hour. Annealing can be eliminated the stress of glass kind, prevents the concentrated broken loss causing of stress.Also be convenient in addition carry out the machinings such as rubbing down, cutting.
Embodiment 11-20
Be a kind of method of manufacturing electro-conductive glass mosaic of class embodiment at this, formula in option table 1, respectivelyAs the formula of embodiment 11-20.
It is as follows that this is that class embodiment manufactures the method for electro-conductive glass mosaic:
Step 1) batch mixing: according to the technique described in embodiment 1-10, inorganic conductive powder is coated onOn glass particle, make compound.
Step 2) cloth: the compound cloth that step 1 is made be sprinkled into have latticed grid die cavity by resistance toIn the mould that fire material oxidation aluminium is made; On mould the specification of latticed grid die cavity be 50mm × 50mm ×12mm。
Step 3) is melted system: in kiln, found, glass melting temperature is 1150 DEG C～1300 DEG C, temperature retention time againIt is 1～2 hour; After cold going, will obtain goods and take out from mould, can obtain electro-conductive glass mosaic.
In said method, the material of mould can also be outer other refractory materials of alumina, for example oxidationAluminium, carborundum, silicon nitride etc., the refractory metals such as the alloy of certain such as tungsten or tungsten also can be used as mouldMaterial.
In embodiment 15-20, between mould and compound, be provided with adherent layer, like this after sintering, conduction glassGlass mosaic just can be easy to take off from supporting body. The material of adherent layer is alumina powder ball milling form slurry,Be coated on mould and form.
Melting at 1150 DEG C～1300 DEG C, does not have complete melting mixing, and is only to melt each other between glass particleBe combined, thereby the inorganic conductive powder that is coated on glass particle surface forms in electro-conductive glass mosaicConductive mesh, is wrapped in glassy phase in net, therefore this electro-conductive glass mosaic resistance is even, and conduction effectFruit is good.
In addition, in order to prevent that the glass paste forming after melting from overflowing, step 2) in compound cloth is sprinkled intoIn the mould that latticed refractory material or high-temperature metal are made time, fill up 1/2～2/3 degree of depth of gridCan. Be that class embodiment selected depth is 12mm at this, the maximum ulking thickness of compound in grid is6-8mm。
The electro-conductive glass mosaic that test has been manufactured, its bulk resistor is 105～109Ω·m。
Wherein embodiment 21-30
Be that a kind of glass-ceramic clad plate with conductive glass layer is provided in class embodiment at this, itsManufacture method is as follows:
Step 1) batch mixing: according to the technique described in embodiment 1-10, inorganic conductive powder is coated onOn glass particle, make compound.
Step 2) cloth: be evenly charity step 1) manufacture on 800mm × 800mm ceramic body in specificationCompound, the ulking thickness of compound is 2～8mm.
Step 3) enters klining: burn till in roller kilns oxidizing atmosphere, 1200～1250 DEG C of firing temperatures, burnThe one-tenth cycle is 60～120 minutes.
Step 4) rubbing down processing: carry out edging and polishing by going out the cooling goods of kiln, hadThe method of the glass-ceramic clad plate of conductive glass layer.
For fear of in charity, the compound on ceramic body drops because of factors such as transport vibrations, Ke YiIn cloth process, spray fixative, in embodiment 30, the carboxymethyl cellulose that sprinkling mass fraction is 5%The aqueous solution.
The crystallite glass composite plate that test has been manufactured, the bulk resistor of its watch crystal layer is 105～109Ω·m
Know-why of the present invention has below been described in conjunction with specific embodiments. These are described just in order to explain thisThe principle of invention, and can not be interpreted as by any way limiting the scope of the invention. Based on hereinExplain, those skilled in the art does not need to pay performing creative labour can associate other tool of the present inventionBody embodiment, within these modes all will fall into protection scope of the present invention.
Claims (6)
1. a manufacture method with the glass-ceramic clad plate of conductive glass layer, it comprises the steps:
Step 1) batch mixing: the inorganic conductive powder of a kind of in the titanate by inorganic conductive oxide, conduction or both compositions of mixtures is coated on glass particle uniformly, make compound, wherein the mass fraction of inorganic conductive powder is 3%～23%, and the mass fraction of glass particle is 77%～97%;
Step 2) cloth: the compound that evenly charity step 1) is manufactured on Ceramic Tiles base substrate, the ulking thickness of compound is 2～8mm;
Step 3) enters klining: burns till in roller kilns oxidizing atmosphere, and 1150～1250 DEG C of firing temperatures, firing period is 60～120 minutes;
Step 4) rubbing down processing: carry out edging and polishing by going out the cooling goods of kiln, obtain having the glass-ceramic clad plate of conductive glass layer.
2. the method for claim 1, is characterized in that, described inorganic conductive oxide is one or more mixing in conductive tin oxide, conductive zinc oxide, conductive titanium oxide, electric conductive oxidation iron.
3. the method for claim 1, is characterized in that, the titanate of described conduction is one or more mixing in conduction barium titanate, conduction lead titanates.
4. the method as described in any one in claim 1-3, is characterized in that, in said method, the inorganic conductive powder described in step 1) adds in advance after making electrocondution slurry in water or ethanol and makes compound with coated oven dry of glass particle again.
5. method as claimed in claim 4, is characterized in that, the quality of described water or ethanol is 1/3～3/2 times of inorganic conductive powder quality.
6. method as claimed in claim 1, is characterized in that described step 2) spray fixative when cloth; Fixative is viscosity solution.
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| WO2003090277A1 (en) * | 2002-04-19 | 2003-10-30 | Mitsubishi Materials Corporation | Circuit board, process for producing the same and power module |
| WO2005000575A1 (en) * | 2003-06-23 | 2005-01-06 | Princeton University | Carrier applied coating layers |
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