CN103737730A - Magnet positioning mechanism for diamond cutting line production equipment - Google Patents

Magnet positioning mechanism for diamond cutting line production equipment Download PDF

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Publication number
CN103737730A
CN103737730A CN201410034177.3A CN201410034177A CN103737730A CN 103737730 A CN103737730 A CN 103737730A CN 201410034177 A CN201410034177 A CN 201410034177A CN 103737730 A CN103737730 A CN 103737730A
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CN
China
Prior art keywords
magnet
diamond cutting
locating rack
production equipment
positioning frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410034177.3A
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Chinese (zh)
Other versions
CN103737730B (en
Inventor
任陆军
张建华
马瑞涛
刘丽阳
张辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SINO-CRYSTAL PRECISION MANUFACTURING CO LTD
Original Assignee
SINO-CRYSTAL PRECISION MANUFACTURING CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SINO-CRYSTAL PRECISION MANUFACTURING CO LTD filed Critical SINO-CRYSTAL PRECISION MANUFACTURING CO LTD
Priority to CN201410034177.3A priority Critical patent/CN103737730B/en
Publication of CN103737730A publication Critical patent/CN103737730A/en
Application granted granted Critical
Publication of CN103737730B publication Critical patent/CN103737730B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

A magnet positioning mechanism for diamond cutting line production equipment comprises a positioning frame which is cylindrical. At least four circles of step holes are arranged on a cylinder wall of the positioning frame at intervals, two step holes which are arranged oppositely form a circle, and a magnet is arranged in each step hole. The magnet positioning mechanism is reasonable in structure, simple and convenient to mount and demount, capable of realizing automatic positioning, free of causing mutual movement of the magnets and few in maintenance time, long-time, stable and continuous running of the equipment can be ensured, a guarantee is provided to the equipment to stably and continuously produce qualified diamond cutting lines, production efficiency can be greatly improved, production cost can be lowered, and labor intensity of staff is lowered. Four liquid leaking grooves are arranged and uniformly distributed on the right end face of the positioning frame to enable leaking plating liquid to be capable of timely being discharged from the inside of the positioning frame, so that the magnets are protected well, and the number of maintenance times caused by rusting of the magnets is reduced.

Description

A kind of diamond cutting secant production equipment magnet detent mechanism
Technical field
The invention belongs to diamond cutting secant production equipment technical field, particularly a kind of diamond cutting secant production equipment magnet detent mechanism.
Background technology
Because diamond cutting secant is more and more universal for the cutting processing of the hard brittle materials such as monocrystalline silicon, polysilicon, make the requirement of diamond cutting secant production equipment more and more higher, the reasonability of its equipment, stability on produce the manufacturability of diamond cutting secant and can stablize for a long time, operation plays vital impact constantly.
At present, in the detent mechanism of diamond cutting secant production equipment, adopt a plurality of magnet frame, and by titanium silk, a plurality of magnet frame have been linked to be to integral body, caused magnet frame to assemble, dismantle cumbersome.Meanwhile, also there is following defect in above-mentioned magnet frame: 1, magnet frame can not be discharged the plating solution leaking outside in time, cleans difficulty, easily makes magnet get rusty, and affects magnet serviceability; 2, magnet is positioned in magnet frame by jackscrew, and again because magnet frame is PP material, along with the increase of magnet dismounting number of times, the jackscrew screw thread in magnet frame very easily damages, and makes magnet frame scrappage higher, has also increased production cost and employee's labour intensity simultaneously; 3, after the jackscrew screw thread in magnet frame damages, magnet occurs loosening in magnet frame, cause magnet mutually to move in top wire hole, make magnet become excessive cooperation with the matched in clearance of lucite pipe, make the frictional force of magnet and lucite pipe become large thereupon, the magnet frame speed of rotating in work can decline gradually, until stop the rotation, causes diamond cutting secant defective.
Summary of the invention
The object of this invention is to provide a kind of rational in infrastructure, dismounting is easy and the diamond cutting secant production equipment magnet detent mechanism that can enhance productivity.
For achieving the above object, technical scheme of the present invention is: a kind of diamond cutting secant production equipment magnet detent mechanism, comprise locating rack, described locating rack is cylindric, on locating rack barrel, be at least arranged at intervals with four circle stepped holes, every circle comprises two stepped holes that are oppositely arranged, and is provided with magnet in stepped hole.
Described locating rack one end face is provided with liquid leakage tank.
On described locating rack barrel, be arranged at intervals with eight circle stepped holes, every circle comprises four stepped holes that are uniformly distributed along the circumference, and wherein in two relative stepped holes, is provided with magnet, and magnet is distributed on locating rack barrel.
Compared with prior art, advantage of the present invention is:
1, the present invention includes locating rack, described locating rack is cylindric, on locating rack barrel, be at least arranged at intervals with four circle stepped holes, every circle comprises two stepped holes that are oppositely arranged, in stepped hole, be provided with magnet, it is rational in infrastructure, dismounting is easy, can realize automatic location, can not produce magnet mobile phenomenon mutually, reduce magnet frame scrappage, reduce maintenance frequency, the equipment that can guarantee is stable for a long time, operation constantly, for equipment is stablized, producing constantly qualified diamond cutting secant provides safeguard, can greatly enhance productivity and reduce production costs, reduce staff labor intensity simultaneously.
2, on the right side of locating rack, be provided with liquid leakage tank; liquid leakage tank has four, and is evenly distributed on the right side of locating rack, and the plating solution leaking outside can be discharged timely in locating rack; magnet is played a good protection, reduce the maintenance times of getting rusty and causing because of magnet.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the right view of Fig. 1.
The specific embodiment
Diamond cutting secant production equipment magnet detent mechanism as depicted in figs. 1 and 2, it comprises locating rack 1, locating rack 1 is cylindric, on the barrel of locating rack 1, be arranged at intervals with eight circle stepped holes 2, every circle comprises four stepped holes that are uniformly distributed along the circumference, stepped hole 2 bottoms are provided with step 3, can not only make magnet 4 automatically locate well, can also stop to break down because magnet 4 moves the diamond cutting secant production equipment causing mutually.In two relative stepped holes 2, be provided with magnet 4, magnet 4 is by step 3 location of stepped hole 2, and magnet 4 has four pairs, and four pairs of magnet 4 are distributed on eight circle stepped holes 2.Relative magnet 4 is different in nature magnet.
On the right side of locating rack 1, be provided with liquid leakage tank 5; liquid leakage tank 5 has four, and is evenly distributed on the right side of locating rack 1, makes the plating solution leaking outside can be timely from the interior discharge of locating rack 1; magnet is played a good protection, reduce the maintenance times of getting rusty and causing because of magnet 4.
In operation principle of the present invention: magnet 3 is packed in the stepped hole 4 of magnet locating rack 2, and adopt different in nature magnet 3 relatively to pack into, the characteristic of utilizing their opposite sex to attract each other utilizes the step 5 of stepped hole 4 magnet 3 to be fixed on to the assigned address of magnet locating rack 2 simultaneously; Externally spill the plating solution that enters in magnet locating rack 2 by the dead of night mouthful 1 the ejecting of magnet locating rack 2 bottoms simultaneously, play the effect of protection magnet 3.

Claims (3)

1. a diamond cutting secant production equipment magnet detent mechanism, comprise locating rack, it is characterized in that: described locating rack is cylindric, on locating rack barrel, be at least arranged at intervals with four circle stepped holes, every circle comprises two stepped holes that are oppositely arranged, and is provided with magnet in stepped hole.
2. diamond cutting secant production equipment magnet detent mechanism as claimed in claim 1, is characterized in that: described locating rack one end face is provided with liquid leakage tank.
3. diamond cutting secant production equipment magnet detent mechanism as claimed in claim 1 or 2, it is characterized in that: on described locating rack barrel, be arranged at intervals with eight circle stepped holes, every circle comprises four stepped holes that are uniformly distributed along the circumference, wherein in two relative stepped holes, be provided with magnet, magnet is distributed on locating rack barrel.
CN201410034177.3A 2014-01-24 2014-01-24 A kind of diamond cutting secant production equipment magnet detent mechanism Expired - Fee Related CN103737730B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410034177.3A CN103737730B (en) 2014-01-24 2014-01-24 A kind of diamond cutting secant production equipment magnet detent mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410034177.3A CN103737730B (en) 2014-01-24 2014-01-24 A kind of diamond cutting secant production equipment magnet detent mechanism

Publications (2)

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CN103737730A true CN103737730A (en) 2014-04-23
CN103737730B CN103737730B (en) 2015-12-02

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CN201410034177.3A Expired - Fee Related CN103737730B (en) 2014-01-24 2014-01-24 A kind of diamond cutting secant production equipment magnet detent mechanism

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073852A (en) * 2014-06-24 2014-10-01 华晶精密制造股份有限公司 Rotary magnet mechanism of diamond cutting line production equipment
CN114000183A (en) * 2021-11-01 2022-02-01 江苏三超金刚石工具有限公司 Diamond wire magnetic suspension sanding assembly and electroplating sanding method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1216014A (en) * 1997-02-14 1999-05-05 住友电气工业株式会社 Wire-saw and its mfg. method
US6026725A (en) * 1995-04-10 2000-02-22 Best Cutting Die Company Panel cutting apparatus with waste repellant die structure
CN102658606A (en) * 2012-05-11 2012-09-12 香港雅诚国际有限公司 Manufacturing method of resin diamond wire
CN102935666A (en) * 2012-11-01 2013-02-20 张家港盈孚新材料技术有限公司 Method for producing resin diamond wire
CN202862426U (en) * 2012-09-18 2013-04-10 华晶精密制造有限公司 Magnetic field rotating mechanism for diamond cutting line production facility
CN203034117U (en) * 2012-12-31 2013-07-03 郑州磨料磨具磨削研究所 Sand feeding device of electroplated diamond wire saw
CN203197384U (en) * 2013-03-26 2013-09-18 蒙特集团(香港)有限公司 Scroll saw with abrasives
CN203726644U (en) * 2014-01-24 2014-07-23 华晶精密制造有限公司 Magnet locating mechanism for diamond cutting line production device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026725A (en) * 1995-04-10 2000-02-22 Best Cutting Die Company Panel cutting apparatus with waste repellant die structure
CN1216014A (en) * 1997-02-14 1999-05-05 住友电气工业株式会社 Wire-saw and its mfg. method
CN102658606A (en) * 2012-05-11 2012-09-12 香港雅诚国际有限公司 Manufacturing method of resin diamond wire
CN202862426U (en) * 2012-09-18 2013-04-10 华晶精密制造有限公司 Magnetic field rotating mechanism for diamond cutting line production facility
CN102935666A (en) * 2012-11-01 2013-02-20 张家港盈孚新材料技术有限公司 Method for producing resin diamond wire
CN203034117U (en) * 2012-12-31 2013-07-03 郑州磨料磨具磨削研究所 Sand feeding device of electroplated diamond wire saw
CN203197384U (en) * 2013-03-26 2013-09-18 蒙特集团(香港)有限公司 Scroll saw with abrasives
CN203726644U (en) * 2014-01-24 2014-07-23 华晶精密制造有限公司 Magnet locating mechanism for diamond cutting line production device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073852A (en) * 2014-06-24 2014-10-01 华晶精密制造股份有限公司 Rotary magnet mechanism of diamond cutting line production equipment
CN114000183A (en) * 2021-11-01 2022-02-01 江苏三超金刚石工具有限公司 Diamond wire magnetic suspension sanding assembly and electroplating sanding method

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Address after: 450016, Zhengzhou economic and Technological Development Zone, Henan, North four road north, Tenth Avenue West (Henan export processing zone)

Applicant after: The brilliant accurate limited-liability company that manufactures of China

Address before: 450000, Zhengzhou Economic Development Zone, Zhengzhou, Henan, four north of the road, tenth west of the street

Applicant before: Sino-crystal Precision Manufacturing Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: SINO CRYSTAL PRECISION MANUFACTURING LTD. TO: SINO CRYSTAL PRECISION MANUFACTURING CO., LTD.

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Granted publication date: 20151202

Termination date: 20210124

CF01 Termination of patent right due to non-payment of annual fee