CN103730603A - Method for encapsulating organic light-emitting device and organic light-emitting body - Google Patents
Method for encapsulating organic light-emitting device and organic light-emitting body Download PDFInfo
- Publication number
- CN103730603A CN103730603A CN201310738196.XA CN201310738196A CN103730603A CN 103730603 A CN103730603 A CN 103730603A CN 201310738196 A CN201310738196 A CN 201310738196A CN 103730603 A CN103730603 A CN 103730603A
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- sheet material
- glass packaging
- packaging glue
- organic electroluminescence
- electroluminescence device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a method for encapsulating an organic light-emitting device and an organic light-emitting body. The method for encapsulating the organic light-emitting device comprises the steps that a glass encapsulation adhesive pattern is formed on the surface of a first board, a heat absorption protective layer is arranged on the inner side of the edge of the glass encapsulation adhesive pattern, and the first board and a second board are connected. The organic light-emitting body comprises the first board and the second board, wherein a cavity is formed between the first board and the second board, and the heat absorption protective layer is arranged on the inner side of glass encapsulation adhesive. According to the method for encapsulating the organic light-emitting device, due to the fact that the heat absorption protective layer is arranged on the inner side of the glass encapsulation adhesive pattern, heat generated during solidification of the glass encapsulation adhesive in a glass encapsulation frame can be absorbed on one hand, the organic light-emitting device is prevented from being damaged, and the mechanical property of the organic light-emitting device is improved on the other hand. According to the organic light-emitting body, the heat absorption protective layer is arranged on the inner side of the glass encapsulation adhesive, the organic light-emitting device is prevented from being damaged, and the mechanical property of the organic light-emitting body is improved.
Description
Technical field
The present invention relates to electroluminescence field, particularly relate to a kind of method for packing and organic electroluminescent body of organic electroluminescence device.
Background technology
In recent years, display of organic electroluminescence (OLED) receives more concern gradually as a kind of novel flat-panel monitor.Owing to thering is active illuminating, luminosity is high, resolution is high, wide visual angle, fast response time, low energy consumption and can flexibility etc. feature, display of organic electroluminescence probably replaces liquid crystal display.Yet, in organic electroluminescent device, exist steam and the very responsive organic layer material of oxygen, so steam and oxygen can have a strong impact on the performance of organic electroluminescence device.At present, in order to address this problem, the method for taking is to utilize various materials by organic electroluminescence device and the isolation of extraneous space.
In the method for packing of organic electroluminescence device, glass encapsulation method is most widely used and is applicable to the method for small-medium size organic electroluminescence device at present.Glass encapsulation method is compared and is had significant advantage with other method for packing.
Common glass encapsulation method is specially: in nitrogen atmosphere, utilize laser beam to move the fusing of heating frit, the frit of fusing forms airtight encapsulation and connects between upper and lower two substrates, thereby hermetically sealing is provided.In this method for packing, need to utilize laser to carry out sintering to glass material, in sintering process, the temperature of glass material is higher, can reach more than 400 ℃, if the heat that high temperature produces can not effectively be controlled, can, to the luminescent device thermal radiation of package frame inside or heat conduction, reduce its luminescent properties.
Summary of the invention
The object of the present invention is to provide a kind of method for packing and organic electroluminescent body of organic electroluminescence device.
The method for packing of organic electroluminescence device of the present invention, comprises the steps:
Step 2, the heat absorption protective layer extending along the edge of glass packaging glue pattern is set in the inner side at the edge of glass packaging glue pattern;
Step 3, the first sheet material and the second sheet material are combined and are used above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
The method for packing of organic electroluminescence device of the present invention, wherein, also comprises between described step 1 and step 2: the first sheet material with glass packaging glue pattern is carried out to drying and processing.
The method for packing of organic electroluminescence device of the present invention, wherein, after the first sheet material with glass packaging glue pattern is carried out to drying and processing, before carrying out step 2, carries out sintering processes to the first sheet material with glass packaging glue pattern.
The method for packing of organic electroluminescence device of the present invention, wherein, described step 3 comprises:
Step 3 A: the ultra-violet curing glue-line extending along the edge of glass packaging glue pattern in the arranged outside at the edge of glass packaging glue pattern;
Step 3 B: the first sheet material and the second sheet material is involutory, to described ultra-violet curing glue-line irradiation ultraviolet radiation, make described ultra-violet curing curable adhesive layer;
Step 3 C: to above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
The method for packing of organic electroluminescence device of the present invention, wherein, described step 1 comprises: on the surface of the first sheet material, glass packaging glue is set, the mode by silk screen printing or spraying forms glass packaging glue pattern on the surface of the first sheet material.
The method for packing of organic electroluminescence device of the present invention, wherein, described the first sheet material is encapsulation cover plate, described the second sheet material is organic electroluminescence device substrate.
The method for packing of organic electroluminescence device of the present invention, wherein, the material of described heat absorption protective layer is heat-curable glue.
The method for packing of organic electroluminescence device of the present invention, wherein, the material of described heat absorption protective layer is adiabatic gum.
Organic electroluminescent body of the present invention; comprise the first sheet material and the second sheet material being oppositely arranged with the first sheet material; described the first sheet material and and the second sheet material between by glass packaging glue, enclose the chamber that is formed for accommodating organic electroluminescence devices, the inner side of described glass packaging glue is provided with the heat absorption protective layer extending along the edge of glass packaging glue.
Organic electroluminescent body of the present invention, wherein, the material of described heat absorption protective layer is heat-curable glue or adiabatic gum.
The method for packing of organic electroluminescence device of the present invention, arranges heat absorption protective layer in the inner side of glass packaging glue pattern, the heat that in heat absorbing glass package frame, glass packaging adhesive curing produces on the one hand, and protection organic electroluminescence device is not damaged; Form on the other hand solid-state glue-line, thereby block water and improve the mechanical performance of organic electroluminescence device.
Organic electroluminescent body of the present invention, the inner side of glass packaging glue arranges heat absorption protective layer, and protection organic electroluminescence device is not damaged and improve the mechanical performance of organic electroluminescent body.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the method for packing of organic electroluminescence device of the present invention;
Fig. 2 is the front view of the structural representation of organic electroluminescent body of the present invention;
Fig. 3 is the vertical view of the structural representation of organic electroluminescent body of the present invention.
Embodiment
The method for packing of organic electroluminescence device of the present invention, arranges heat-curable glue in glass packaging frame inner side, the heat that can produce by glass packaging adhesive curing in heat-curable glue heat absorbing glass package frame on the one hand, and protection organic electroluminescence device is not damaged; On the other hand, in glass packaging frame, form solid-state glue-line, thereby block water and improve the mechanical performance of organic electroluminescent body.
The method for packing of organic electroluminescence device of the present invention, comprises the steps:
Step 2, the heat absorption protective layer extending along the edge of glass packaging glue pattern is set in the inner side at the edge of glass packaging glue pattern;
Step 3, the first sheet material and the second sheet material are combined and are used above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
The method for packing of organic electroluminescence device of the present invention, wherein, also comprises between described step 1 and step 2: the first sheet material with glass packaging glue pattern is carried out to drying and processing.
The method for packing of organic electroluminescence device of the present invention, wherein, after the first sheet material with glass packaging glue pattern is carried out to drying and processing, before carrying out step 2, carries out sintering processes to the first sheet material with glass packaging glue pattern.
The method for packing of organic electroluminescence device of the present invention, wherein, described step 3 comprises:
Step 3 A: the ultra-violet curing glue-line extending along the edge of glass packaging glue pattern in the arranged outside at the edge of glass packaging glue pattern;
Step 3 B: the first sheet material and the second sheet material is involutory, to described ultra-violet curing glue-line irradiation ultraviolet radiation, make described ultra-violet curing curable adhesive layer;
Step 3 C: to above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
The method for packing of organic electroluminescence device of the present invention, wherein, described step 1 comprises: on the surface of the first sheet material, glass packaging glue is set, the mode by silk screen printing or spraying forms glass packaging glue pattern on the surface of the first sheet material.
The method for packing of organic electroluminescence device of the present invention, wherein, described the first sheet material is encapsulation cover plate, described the second sheet material is organic electroluminescence device substrate.
The method for packing of organic electroluminescence device of the present invention, wherein, the material of described heat absorption protective layer is heat-curable glue.
The method for packing of organic electroluminescence device of the present invention, wherein, the material of described heat absorption protective layer can be also adiabatic gum.
As shown in Figure 1, the embodiment of the method for packing of organic electroluminescence device of the present invention
Steps A, to the first sheet material 1 after the preliminary treatment such as cleaning, plasma polishing, on the surface of the first sheet material 1, glass packaging glue is set, form glass packaging glue pattern 11, specifically, the first sheet material 1 is put into silk screen printing chamber, mode by silk screen printing is 1 surface built in the first sheet material by glass packaging offset printing, forms glass packaging glue pattern 11, or on the surface of the first sheet material 1, forms glass packaging glue pattern 11 by the mode of spraying;
Step B, the first sheet material 1 with glass packaging glue pattern 11 is put into baking box, the first sheet material 1 is carried out to drying and processing;
Step C, the first sheet material 1 with glass packaging glue pattern 11 is put into high temperature sintering furnace, the first sheet material 1 with glass packaging glue pattern 11 is carried out to sintering processes;
Step D, the heat absorption protective layer 12 extending along the edge of glass packaging glue pattern 11 is set in the inner side at the edge of glass packaging glue pattern 11, specifically, after the first sheet material 1 is cooling, utilize manipulator to be imported in automatic double surface gluer, utilize the method for gluing protection glue to be applied to the inner side at the edge of glass packaging glue pattern 11, form heat absorption protective layer 12, the distance that makes to absorb heat between protective layer 12 and glass packaging glue pattern 11 is suitable, makes to protect glue can fully absorb heat and complete hot curing;
The ultra-violet curing glue-line 13 that step e, the method for utilizing gluing are extended along the edge of glass packaging glue pattern 11 in the arranged outside at the edge of glass packaging glue pattern 11;
Step F: the first sheet material 1 and the second sheet material 2 is involutory, to ultra-violet curing glue-line 13 irradiation ultraviolet radiations, ultra-violet curing glue-line 13 is solidified;
Step G: laser sintered to above-mentioned glass packaging glue, the first sheet material 1 and the second sheet material 2 are linked together by glass packaging glue.Specifically, with the laser beam annular sequential scanning glass packaging plastic of certain power and speed, make glass packaging glue form airtight encapsulation between the first sheet material 1 and the second sheet material 2.
The embodiment of the method for packing of organic electroluminescence device of the present invention, wherein, the first sheet material 1 is encapsulation cover plate, the second sheet material 2 is organic electroluminescence device substrate.
In other embodiment of the method for packing of organic electroluminescence device of the present invention, the first sheet material 1 can be organic electroluminescence device substrate, and the second sheet material 2 can be encapsulation cover plate.
The embodiment of the method for packing of organic electroluminescence device of the present invention, wherein, the material of described heat absorption protective layer 12 is heat-curable glue.
In other embodiment of the method for packing of organic electroluminescence device of the present invention, the material of above-mentioned heat absorption protective layer can be adiabatic gum.Adiabatic gum also can well be protected organic electroluminescence device; but the transmission that adiabatic gum can only block heat and can not well absorb heat; secondly adiabatic gum can not form afterwards the strong solid with cohesive force in heating as heat-curable glue, so block-water performance and mechanical performance are poor.
Heat-curable glue main component is Thermocurable polymer, after heat-curable glue heating, can form the strong solid with cohesive force, and it does not melt and do not dissolve after solidifying.Heat-curable glue has good creep-resistant property, can bear high load capacity, and high temperature, steam and chemical corrosion etc. are had to good resisting, and keeps for a long time physical property constant under high temperature, wet environment.Heat-curable glue mainly adopts the phenolic resins of epoxy resin, phenolic resins, nylon and vinyl modification as major ingredient.According to its function, can be divided into again adhesive glue, vacuum glue etc.
As shown in Figure 2 and Figure 3; the embodiment of organic electroluminescent body of the present invention; comprise the first sheet material 100 and the second sheet material 200 being oppositely arranged with the first sheet material 100; the first sheet material 100 and and the second sheet material 200 between by glass packaging glue 400, enclose the chamber 300 that is formed for accommodating organic electroluminescence devices 500, the inner side of glass packaging glue 400 is provided with the heat absorption protective layer 600 extending along the edge of glass packaging glue 400.
The embodiment of organic electroluminescent body of the present invention, wherein, the material of heat absorption protective layer 600 is heat-curable glue or adiabatic gum.
The embodiment of organic electroluminescent body of the present invention, wherein, the first sheet material 100 is encapsulation cover plate, the second sheet material 200 is Thin Film Transistor (TFT) substrate.
In other embodiment of organic electroluminescent body of the present invention, the first sheet material can be Thin Film Transistor (TFT) substrate, and the second sheet material can be encapsulation cover plate.
Organic electroluminescent body of the present invention, the inner side of glass packaging glue arranges heat absorption protective layer, and protection organic electroluminescence device is not damaged and improve the mechanical performance of organic electroluminescent body.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a method for packing for organic electroluminescence device, is characterized in that, comprises the steps:
Step 1, on the surface of the first sheet material, glass packaging glue is set, forms glass packaging glue pattern;
Step 2, the heat absorption protective layer extending along the edge of glass packaging glue pattern is set in the inner side at the edge of glass packaging glue pattern;
Step 3, the first sheet material and the second sheet material are combined and are used above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
2. the method for packing of organic electroluminescence device according to claim 1, is characterized in that, between described step 1 and step 2, also comprises: the first sheet material with glass packaging glue pattern is carried out to drying and processing.
3. the method for packing of organic electroluminescence device according to claim 2, it is characterized in that, after the first sheet material with glass packaging glue pattern is carried out to drying and processing, before carrying out step 2, the first sheet material with glass packaging glue pattern is carried out to sintering processes.
4. the method for packing of organic electroluminescence device according to claim 1, is characterized in that, described step 3 comprises:
Step 3 A: the ultra-violet curing glue-line extending along the edge of glass packaging glue pattern in the arranged outside at the edge of glass packaging glue pattern;
Step 3 B: the first sheet material and the second sheet material is involutory, to described ultra-violet curing glue-line irradiation ultraviolet radiation, make described ultra-violet curing curable adhesive layer;
Step 3 C: to above-mentioned glass packaging glue sintering, the first sheet material and the second sheet material are linked together by glass packaging glue.
5. the method for packing of organic electroluminescence device according to claim 1, it is characterized in that, described step 1 comprises: on the surface of the first sheet material, glass packaging glue is set, the mode by silk screen printing or spraying forms glass packaging glue pattern on the surface of the first sheet material.
6. the method for packing of organic electroluminescence device according to claim 1, is characterized in that, described the first sheet material is encapsulation cover plate, and described the second sheet material is organic electroluminescence device substrate.
7. the method for packing of organic electroluminescence device according to claim 1, is characterized in that, the material of described heat absorption protective layer is heat-curable glue.
8. the method for packing of organic electroluminescence device according to claim 1, is characterized in that, the material of described heat absorption protective layer is adiabatic gum.
9. an organic electroluminescent body; comprise the first sheet material and the second sheet material being oppositely arranged with the first sheet material; described the first sheet material and and the second sheet material between by glass packaging glue, enclose the chamber that is formed for accommodating organic electroluminescence devices; it is characterized in that, the inner side of described glass packaging glue is provided with the heat absorption protective layer extending along the edge of glass packaging glue.
10. organic electroluminescent body according to claim 9, is characterized in that, the material of described heat absorption protective layer is heat-curable glue or adiabatic gum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310738196.XA CN103730603A (en) | 2013-12-26 | 2013-12-26 | Method for encapsulating organic light-emitting device and organic light-emitting body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310738196.XA CN103730603A (en) | 2013-12-26 | 2013-12-26 | Method for encapsulating organic light-emitting device and organic light-emitting body |
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| Publication Number | Publication Date |
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| CN103730603A true CN103730603A (en) | 2014-04-16 |
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| CN201310738196.XA Pending CN103730603A (en) | 2013-12-26 | 2013-12-26 | Method for encapsulating organic light-emitting device and organic light-emitting body |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165082A (en) * | 2019-05-31 | 2019-08-23 | 昆山国显光电有限公司 | Display panel and display device |
| CN110391355A (en) * | 2019-06-18 | 2019-10-29 | 福建华佳彩有限公司 | Panel encapsulation process method and panel encapsulating structure |
| CN110831268A (en) * | 2019-12-05 | 2020-02-21 | 初元思 | Packaging method of heating body and heating film |
| CN111047970A (en) * | 2019-11-21 | 2020-04-21 | 昆山国显光电有限公司 | Display panel and display panel mother board |
| US11254101B2 (en) | 2016-07-22 | 2022-02-22 | 3M Innovative Properties Company | Structured film and articles thereof |
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| WO2009148722A2 (en) * | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
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| CN103367658A (en) * | 2013-07-17 | 2013-10-23 | 深圳市华星光电技术有限公司 | Glass packaging structure and packaging method |
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| CN101386470A (en) * | 2007-09-10 | 2009-03-18 | 东进世美肯株式会社 | Glass frit and sealing method for element using the same |
| WO2009148722A2 (en) * | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11254101B2 (en) | 2016-07-22 | 2022-02-22 | 3M Innovative Properties Company | Structured film and articles thereof |
| CN110165082A (en) * | 2019-05-31 | 2019-08-23 | 昆山国显光电有限公司 | Display panel and display device |
| CN110391355A (en) * | 2019-06-18 | 2019-10-29 | 福建华佳彩有限公司 | Panel encapsulation process method and panel encapsulating structure |
| CN111047970A (en) * | 2019-11-21 | 2020-04-21 | 昆山国显光电有限公司 | Display panel and display panel mother board |
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| CN110831268A (en) * | 2019-12-05 | 2020-02-21 | 初元思 | Packaging method of heating body and heating film |
| CN110831268B (en) * | 2019-12-05 | 2022-08-30 | 苏州拯救者智能科技有限公司 | Packaging method of heating body and heating film |
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Application publication date: 20140416 |
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