CN103730528B - Integrated backboard for solar cell module - Google Patents

Integrated backboard for solar cell module Download PDF

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CN103730528B
CN103730528B CN201210387211.6A CN201210387211A CN103730528B CN 103730528 B CN103730528 B CN 103730528B CN 201210387211 A CN201210387211 A CN 201210387211A CN 103730528 B CN103730528 B CN 103730528B
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ethylene
layer
methyl
copolymer
solar cell
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CN103730528A (en
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刘泽琳
吴秋菊
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DuPont Electronics Inc
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EI Du Pont de Nemours and Co
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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Abstract

The invention discloses a solar cell module which comprises a solar cell layer (a) and a multi-layer protective plate (b). The solar cell layer (a) comprises one or more electrically-connected solar cells, and has the front face and the back face; the multi-layer protective plate (b) comprises a (i) flexible substrate and an (ii) ethylene copolymer layer, wherein the (i) flexible substrate has the inner surface and the outer surface, the (ii) ethylene copolymer layer is directly extruded at the 270-330 DEG C extrusion temperature and is arranged on the inner surface of the (i) flexible substrate in a coating mode, the (iii) ethylene copolymers are mainly selected from an ethylene/(methyl) crylic acid alkyl ester copolymer, an ethylene/(methyl) crylic acid copolymer, ionomer and a combination of two or more of the ethylene/(methyl) crylic acid alkyl ester copolymer, the ethylene/(methyl) crylic acid copolymer and ionomer, a cross-linking agent and silane are not contained in (iv) basically, the ethylene copolymer layer (ii) of the multi-layer protective plate (b) is directly bonded with the front face or the back face of the solar cell layer (a).

Description

For the integrated backboard of solar module
Technical field
It relates to for the integrated backboard of photovoltaic module.
Background technology
Because solaode provides sustainable energy, therefore their use obtains Rapid Popularization.Based on used Light absorbent, solaode can be generally divided into two big class, i.e. block or chip class solaode and thin film solar electricity Pond.
Monocrystal silicon (c-Si), poly- or many-crystal silicon (poly- Si or mc-Si) and band silicon are to form most routine wafer base solar The most frequently used material during battery.The solar module Jing obtained by chip class solaode often includes a series of about 180 To the self-contained chip (or battery) of about 240 μ m-thicks, they are welded together and are electrically connected.This solar panel, with The layer of the connecting line deposited on electroconductive paste and/or its surface together, can be referred to as solar module.The solaode Component can be by polymer encapsulation layer encapsulating, sandwiched therebetween or laminated therebetween.Then resulting structures are clipped in again two protections Weatherability module is formed between outer layer (that is, header board and backboard).These protection outer layers can by glass, sheet metal or thin film or Person's plastic sheet or thin film are formed.But it is, in general, that the outer layer in the face of sunlight needs sufficiently transparent so that photon is reached too Positive energy battery.
Encapsulating material reaches several critical functions in solar module.For example, they encase solaode material Material(They may be crisp or to physical attacks such as wear sensitive)And protect it.Additionally, sealing in some solar modules Package material bonds solaode and module outer layer.It is right that the demand of encapsulating material durable, transparent, easy to process result in The research of thermoplastic polymer, for example, ethylene/vinyl acetate (EVA), polyvinyl acetaldehyde (for example, poly- second Enol butyral (PVB)), polychloride vinyl class, polyethylene (for example, linear low density polyethylene), alpha-olefin and α, β-ethylene linkage The copolymer (for example, ethylene/methyl acrylate copolymer and ethylene/butylacrylate copolymer) of formula esters of unsaturated carboxylic acids and Ionomer.
Chinese patent application discloses CN101823355 and PCT Patent Application WO2010/101582A1 discloses one kind and is used for The back board structure of solar module, it include basal layer (for example, polyester or fluoropolymer layer) and with basal layer in The connected ethylene copolymer articulamentum in surface.However it has been found that work as this backboard is laminated on the solaode of EVA encapsulatings When, the power output of gained solar module, particularly after aging, it is still desirable to improve.
The content of the invention
Present disclose provides a kind of solar module, it includes:(a) solar cell layer, the solar cell layer Including the solaode that one or more are electrically interconnected, and with front and back;(b) multilamellar protection board, the multilamellar protection Plate includes that (i) has flexible substrates and (ii) the directly extrusion painting under 270-330 DEG C of extrusion temperature of inner surface and outer surface Ethylene copolymer layer of the cloth on the inner surface of the flexible substrates, wherein, the ethylene copolymer layer is mainly by selected from following Ethylene copolymer in group is constituted:Ethylene/(methyl) alkyl acrylate copolymer, ethylene/(methyl) acrylic copolymer, from Polymers and its combination of two or more, and cross-linking agent and silane are substantially free of, and wherein, the multilamellar protection board The ethylene copolymer layer directly combined with the front or the back side of the solar cell layer.
In an embodiment of solar module, extrusion temperature of the ethylene copolymer layer at 280-330 DEG C On the lower directly extrusion coated inner surface to the flexible substrates of degree.
In another embodiment of solar module, the flexible substrates of the multilamellar protection board by metallic film or Person is selected from and is formed with the polymeric material in the following group:Polyester, fluoropolymer, and combinations thereof.
In a further embodiment of solar module, the ethylene copolymer is selected from ethylene/(methyl) acrylic acid Alkyl ester copolymer.
In a further embodiment of solar module, the multilamellar protection board is used as header board, and the ethylene Copolymer layer is directly combined with the front of solar cell layer, therebetween without encapsulating material.Or, the multilamellar protection board is used as Backboard, and the ethylene copolymer layer directly combined with the back side of solar cell layer, therebetween without encapsulating material.
In a further embodiment of solar module, the solaode is selected from crystal silicon battery and the thin film sun Can battery.
According to the disclosure, when a scope is given with two specific endpoints, it should be understood that it is special that the scope is included in the two Arbitrary value in the point of fixed end and the arbitrary value for being at or about any the two end points.
Specific embodiment
Disclosed herein is solar module, it includes:A () solar cell layer, the solar cell layer includes one The solaode of individual or multiple electrical interconnections, and with front and back;(b) multilamellar protection board, the multilamellar protection board bag Include the flexible substrates and (ii) of (i) with inner surface and outer surface directly extrusion coated under about 270-330 DEG C of extrusion temperature Ethylene copolymer layer on the inner surface of the flexible substrates, wherein, the ethylene copolymer layer (iii) it is main by selected from Ethylene copolymer in the following group is constituted:Ethylene/(methyl) alkyl acrylate copolymer, ethylene/(methyl) acrylic copolymer, Ionomer and its combination of two or more, and (iv) is substantially free of cross-linking agent and silane, and wherein, the multilamellar The ethylene copolymer layer of protection board is directly combined with the front or the back side of the solar cell layer.
The solar cell layer being included in solar module includes one or more solaodes.The sun Energy battery can be any photoelectric conversion device that can transform solar radiation to electric energy.They can by opto-electronic conversion body and The electrode being formed on two first type surface is constituted.Opto-electronic conversion body can be by any suitable photoelectric conversion material such as crystalline silicon (c-Si), amorphous silicon (a-Si), microcrystal silicon (μ c-Si), cadmium telluride (CdTe), copper indium diselenide (CuInSe2Or CIS), two selenium Change copper and indium/gallium (CuInxGa(1-x)Se2Or CIGS), extinction dyestuff and organic semiconductor to be making.Front electrode can be by by appointing Electrocondution slurry such as silver that what suitable print process is coated on the front surface of opto-electronic conversion body such as silk screen printing or ink jet printing Slurry is formed.Front electrocondution slurry can include multiple parallel conductive grid lines and perpendicular to conductive grid line and connected Or multiple conductive main gate lines above, and back electrode can be by the type metal slurry on the whole back surface of opto-electronic conversion body Formed.The suitable metal for forming back electrode includes but is not limited to aluminum, copper, silver, gold, nickel, cadmium and their alloy.
Solar cell layer can have in the face of front (the also referred to as front, and under active usage conditions of sunlight Generally face sunlight) and do not face the back side (the also referred to as back side, and be generally away from sun under active usage conditions of sunlight Light).In solar module, all materials being arranged in the laminate layers on the front in the face of sunlight of solar cell layer Material should have enough transparencys, so that enough sunlight reaches solaode.It is arranged in the not face of solar cell layer Need not be transparent to the material in the laminate layers on the back side of sunlight.
Flexible substrates used by the disclosure can be formed by metal forming (such as aluminium foil) or any appropriate polymeric material Thin film.The disclosure is used to be formed the suitable polymeric material of substrate and can include, but not limited to following material:Polyester (for example, polyethylene terephthalate and PEN), Merlon, polyolefin (for example, polypropylene, Polyethylene and cyclic polyolefin), norbornene polymer, polystyrene (for example, syndiotactic polystyrene), Styrene And Chloroalkyl Acrylates Ester copolymer, acrylonitritrile-styrene resin, polysulfones (for example, polyether sulfone, polysulfones, etc.), polyamide-based, polyurethaness, third It is olefin(e) acid resin, cellulose acetate class (for example, cellulose acetate, cellulose triacetate, etc.), cellophane, polysiloxanes, polychloride Vinyl) (for example, polyvinylidene chloride), fluoropolymer (for example, polyvinyl fluoride, polyvinylidene fluoride, politef and Ethylene-tetrafluoroethylene copolymer) and its combination of two or more.In some embodiments, flexible substrates are by comprising polyester And/or the material of fluoropolymer is formed.In another embodiment, flexible substrates by the material comprising polyester or it is main by The material of polyester composition is formed.Flexible substrates thin film can be non-oriented, or Jing uniaxial orientations, or Jing biaxial orientations 's.
(for example, the instantiation that can be used as the thin film of flexible substrates in the disclosure includes, but not limited to mylar Poly- (ethylene glycol terephthalate) thin film), fluoro-containing copolymer film (for example, WithIt is thin Film, can be from E.I.Du Pont De Nemours and Co. of the U.S.(E.I.du Pont de Nemours and Company, hereinafter referred to as " Du Nation ") obtain), metallic film (for example, aluminium foil).And the flexible substrates used by the disclosure can also be the form of plural layers, For example fluoropolymer/polyester/fluoropolymer plural layers are (for example,/PET/ Or TPT laminated thins Film, can be from Austrian IsovoltaAG companies or from Madico Inc. of the U.S.(Madico)Obtain).
Term " (methyl) alkyl acrylate " used by the disclosure refers to alkyl acrylate or methacrylate Ester, and the ethylene used by the disclosure/(methyl) alkyl acrylate copolymer is comprising vinyl polymerization unit and about 6-40wt% At least one (methyl) alkyl acrylate polymerized unit copolymer.The moieties of (methyl) alkyl acrylate can With containing 1-6 or 1-4 carbon atom, can be selected from methyl, ethyl and branched or nonbranched propyl group, butyl, amyl group and oneself Base.Exemplary (methyl) alkyl acrylate includes, but not limited to acrylic acid methyl ester., ethyl acrylate, Isobutyl 2-propenoate And n-butyl acrylate.The polarity of (methyl) alkyl acrylate comonomer can be present in comonomer by changing The relative quantity and homogeneity of alkyl is controlling.It is likewise possible to using methacrylic acid C1-C6Arrcostab comonomer is used as altogether Polycondensation monomer.These comonomers include methyl methacrylate, ethyl methacrylate, isobutyl methacrylate and methyl-prop Olefin(e) acid N-butyl.
Ethylene used by the disclosure/(methyl) alkyl acrylate copolymer can be that bipolymer or higher level are common The form of polymers, such as terpolymer.When the form for higher level copolymer, ethylene/(methyl) alkyl acrylate Copolymer can also include the polymerized unit of one or more other suitable comonomer.For example, the ethylene used by the disclosure/ (methyl) alkyl acrylate copolymer can be the form of terpolymer, common based on ethylene/(methyl) alkyl acrylate The gross weight of polymers, also including the polymerized unit selected from the 3rd following comonomer of below about 5wt%:Acrylic compounds, methyl Acrylic compounds and its derivant.
In some embodiments, the ethylene used by the disclosure/(methyl) alkyl acrylate copolymer is selected from ethylene/propylene Olefin(e) acid ester copolymer and ethylene/methacrylic acid ester copolymer.In another embodiment, the ethylene used by the disclosure/(first Base) alkyl acrylate copolymer is ethylene/methyl acrylate copolymer.
Ethylene used by the disclosure/(methyl) alkyl acrylate copolymer can be using autoclave or tubular reactor It is obtained by technique known to polymer arts.For example, the copolyreaction can be carried out in autoclave with continuous processing, wherein By ethylene, (methyl) alkyl acrylate and the solvent such as methanol (referring to United States Patent (USP) 5,028,674) being optionally present and initiation Agent is added to together in the agitated autoclave of the type for example disclosed in United States Patent (USP) 2,897,183.In another embodiment, Ethylene/(methyl) alkyl acrylate copolymer can be in tubular reactor, according to article " High Flexibility EMA Made from High Pressure Tubular Process”(Annual Technical Conference-Society Of Plastics Engineers (2002), 60th (Vol.2), 1832-1836) described in the step of be obtained.In another enforcement In mode, ethylene/(methyl) alkyl acrylate copolymer can in addition add in high pressure tubular reactors in intensification lower edge pipe Plus reactant comonomer is obtained.In yet, ethylene/(methyl) alkyl acrylate copolymer can be one It is obtained in row autoclave reactor, the replacement of wherein comonomer is to add reactant comonomer by multizone to realize, Such as United States Patent (USP) 3,350,372;3,756,996;With 5,532,066 in instruct.
Ethylene used by the disclosure/(methyl) alkyl acrylate copolymer can also be commercially available from various businessmans.Example Such as, they can derive from Du Pont, trade nameAC or
Based on the gross weight of copolymer, ethylene/(methyl) acrylic copolymer comprising vinyl polymerization unit and more than or wait In about 10wt%, or about 15-25wt%, or the acrylic acid and/or the polymerized unit of methacrylic acid of about 18-23wt%.
Ethylene used by the disclosure/(methyl) acrylic copolymer can also the polymerization containing other unsaturated comonomers Unit.The instantiation of other unsaturated comonomers include, but not limited to acrylic acid methyl ester., methyl methacrylate, third Olefin(e) acid ethyl ester, ethyl methacrylate, propyl acrylate, propyl methacrylate, isopropyl acrylate, methacrylic acid isopropyl Ester, butyl acrylate, butyl methacrylate, Isobutyl 2-propenoate, isobutyl methacrylate, tert-butyl acrylate, methyl Tert-butyl acrylate, 1-Octyl acrylate, 2-Propenoic acid, 2-methyl-, octyl ester, acrylic acid hendecane ester, methacrylic acid hendecane ester, propylene Sour octadecane ester, methacrylic acid octadecane ester, lauryl ester, lauryl ester, acrylic acid 2- ethyls Own ester, 2-Ethylhexyl Methacrylate, isobornyl acrylate, isobornyl methacrylate, lauryl acrylate, methyl Lauryl acrylate, acrylic acid 2- hydroxy methacrylates, 2-hydroxyethyl methacrylate, glycidyl acrylate, metering system Acid glycidyl ester, PEG acrylate, PEG methacrylate, PEG methyl ether acrylic acid Ester, PEG methyl ether methacrylate, PEG phenyl ether acrylate, PEG phenyl ether methyl It is acrylate, PEG 4- nonylplenyl ether acrylate, PEG 4- nonylplenyl ether methacrylates, poly- (ethylene glycol) phenyl ether acrylate, PEG phenyl ether methacrylate, dimethyl maleate, maleic acid diethyl Ester, dibutyl maleate, dimethyl fumarate, DEF, dibutyl fumarate, fumaric acid di-menthyl ester, acetic acid second Alkene ester, propionate and analog and its mixture.It is preferred that, described other unsaturated comonomers are selected from in the following group:Third E pioic acid methyl ester, methyl methacrylate, butyl acrylate, butyl methacrylate, glycidyl methacrylate, acetic acid second Alkene ester and its mixture.Based on the gross weight of copolymer, the ethylene used by the disclosure/(methyl) acrylic copolymer can be added No more than about 50wt%, or no more than about 30wt%, or other unsaturated comonomers of no more than about 20wt% are total to Poly- unit.
Ethylene used by the disclosure/(methyl) acrylic copolymer can as United States Patent (USP) 3,404,134,5,028,674, Mode disclosed in 6,500,888 or 6,518,365 is polymerized.
Ethylene used by the disclosure/(methyl) acrylic copolymer can also be commercially available from various businessmans.For example, they Du Pont, trade name can be derived from
Ionomer used by the disclosure is obtained by ethylene recited above/(methyl) acrylic copolymer is derivative.Specifically Say, the ionomer is obtained by neutralizing the ethylene/(methyl) acrylic acid mother's acid copolymer with ionic metal moiety or whole 's.It is preferred that, based on the total mole number of the carboxylic acid ester groups in polyarylene block copolymer, the ethylene/(methyl) acrylic copolymer about 10- 100%, or about 10-50%, or about 20-40% is neutralized by metal ion.Metal ion can be monovalence, bivalence, trivalent, many Valency and its mixture.Preferred monovalent metallic ion includes, but not limited to sodium, potassium, lithium, silver, hydrargyrum, copper and analog and its mixes Compound.Preferred bivalent metal ion include, but not limited to beryllium, magnesium, calcium, strontium, barium, copper, cadmium, hydrargyrum, stannum, lead, ferrum, cobalt, nickel, Zinc and analog and its mixture.Preferred trivalent metal ion include, but not limited to aluminum, scandium, ferrum, yttrium and analog and Its mixture.Preferred polyvalent metal ion includes, but not limited to titanium, zirconium, hafnium, vanadium, tantalum, tungsten, chromium, cerium, ferrum and analog And its mixture.It is preferred that when metal ion is multivalence, including complexant, for example stearate radical, Oleic acid root, salicylate and Phenolic acid root, such as United States Patent (USP) 3, disclosed in 404,134.It is further preferred that the metal ion is selected from in the following group:Sodium, lithium, magnesium, Zinc, aluminum and its mixture.Further preferably, metal ion is selected from sodium, zinc and its mixture.Most preferably, metal ion is zinc.
Suitable ionomer used by the disclosure can also be commercially available from various businessmans.For example, suitable ionomer can To derive from Du Pont, trade nameOr derive from Dow Chemical company(Dow Chemical Company), business Entitling is AMPLIFYTM, or derive from Exxon Mobil company(Exxon Mobil Corporation), trade name IotekTM
According to the disclosure, the ethylene copolymer layer be mainly made up of ethylene copolymer and be substantially free of cross-linking agent and Silane.Substantially free refers to specific components containing no more than about 0.1wt% in the composition.
As used herein, term " cross-linking agent " is used to refer to promote or adjust intermolecular between polymer chain Therefore covalent bond simultaneously produces the compound of more rigid structure.According to the disclosure, ethylene copolymer layer is substantially free of arbitrarily crosslinking Agent, the cross-linking agent includes peroxide, silane, epoxide, isocyanate compound, carbamate compounds, metal Oxide, sulfur and difunctional compound (such as diene, diacid, glycol, diamidogen, etc.).
Term " silane " used by the disclosure is used to refer to containing silicon-carbon bond and without the compound of any hydrogen-silicon key.Second Alkene copolymer layer is substantially free of any silane, and the silane includes, trialkoxy silane (for example, vinyl trimethoxy silicon Alkane;VTES;3- glycidoxypropyltrimewasxysilanes;The ethoxy of 3- glycidoxypropyls three Base silane;3- methacryloxypropyl trimethoxy silanes;3- methacryloxypropyls;3- third Alkene acryloxypropylethoxysilane trimethoxy silane;3- ureidopropyltriethoxysilanes;3- r-chloropropyl trimethoxyl silanes;3- Carbimide .s Ester group propyl-triethoxysilicane;3- TSL 8330s;APTES etc.) and dialkoxy Base silane (for example, N-2- (amino-ethyl) -3- amino propyl methyl dimethoxysilanes;3- mercaptopropyi methyl dimethoxy epoxides Silane etc.).
According to the disclosure, the ethylene copolymer is directly extrusion coated on the inner surface of basal layer, forms multilamellar protection Plate.That is, without binding agent or prime coat or primer material between the inner surface and ethylene copolymer layer of basal layer.However, should Understand that the inner surface of basal layer can be through certain surface treatment before extrusion coated process.The surface treatment improves thin film Surface and arbitrary form known in the art can be taken, including flame treatment (United States Patent (USP) 2,632 is see, e.g., 921;2,648,097;2,683,894;Or 2,704,382), corona treatment (see, for example, United States Patent (USP) 4,732, 814), electron beam treatment, oxidation processes, chemical treatment, chromic acid process, hot air treatment, ozone process, treatment with ultraviolet light, spray Sand process, solvent process, sided corona treatment and its combination of two or more.
By making film surface through surface treatment, which improve the surface energy (in terms of dynes/cm) of thin film and therefore change Be apt to it and other materials, such as binding agent, solvent or other polymer thin films, bond strength.
The surface treatment being worth mentioning is that sided corona treatment (see, e.g. United States Patent (USP) 3,030,290;3,676,181;6, 726,979;Or 6,972,068).Sided corona treatment (sometimes referred to as air plasma) is a kind of process for modifying surface, and it makes The change of the surface property (for example, bond propertiess) of target material is given with low temperature corona discharge plasma.Corona plasma Body is to apply high pressure by the electrode end to point, is produced so as to form plasma in the tip end.It is commonly used Linearly aligned electrode produces corona plasma curtain.When target such as plastics, cloth or paper pass through the corona plasma curtain During curtain, the corona plasma is applied on the surface of target through gas gap or medium.Various gas may be used herein Body forms gas gap, and it includes, but not limited to air;Reactive hydrocarbon steam;Or other steam such as ketone (for example, acetone Or methyl vinyl ketone), alcohols (for example, methanol), to chlorostyrene, acrylonitrile, anhydrous ammonia, amine (for example, propane diamine, four The amine of ethylidene five, cyclohexylamine, decyl amine, diethylenetriamines, tert-butylamine, ethylenediamine, trien, triethylamine, or Isopropyl methyl amine), the steam for waiting.In one embodiment, the sided corona treatment is in the gas formed by air or alcohol steam Carry out on body space.In another embodiment, at least one surface of the first film layer on the air gap through corona Process modified.In yet, at least one surface of the first film layer on the air gap with dosage about 20- 1000W·min/m2Or about 25-600Wmin/m2Through sided corona treatment.
And, in order to improve the bond strength between basal layer and ethylene copolymer layer, preferred extrusion temperature is set in 270-330℃。
According to the disclosure, the average total thickness of the multilamellar protection board for so obtaining is for about 8-1000 μm, or about 50-600 μ M, or about 100-400 μm, and the average thickness of the ethylene copolymer layer is for about 10-400 μm or about 40-200 μm.
According to the disclosure, the multilamellar protection board and solar cell layer directly in conjunction with.That is, in gained solaode mould In block, without encapsulating material or other polymeric materials between multilamellar protection board and solar cell layer.
In an embodiment of solar module disclosed herein, multilamellar protection board and solar cell layer The back side directly in conjunction with and be used as integrated backboard.In this embodiment, multilamellar protection board is positioned such that the ethylene copolymer Nitride layer and solar cell layer directly in conjunction with and between the ethylene copolymer layer and solar cell layer without encapsulating material.
In these embodiments, solar module can also include being laminated on the front of solar cell layer Transparent front encapsulated layer, and the front encapsulated layer can include any appropriate polymeric material, for example acid copolymer, ionomer, Ethylene/vinyl acetate, polyvinyl acetal class (including acoustics level polyvinyl acetal class), polyurethaness, polychlorostyrene Change vinyl, polyethylene kind (for example, linear low density polyethylene class), polyolefin block copolymer elastomer, alpha-olefin and α, The copolymer of β-ethylenically-unsaturated carboxylic acid ester's class) (for example, ethylene/methyl acrylate copolymer and ethylene/butyl acrylate are common Polymers), silicone elastomer, epoxy resin and its combination of two or more.
Solar module can also include the transparent front plate being laminated on front encapsulated layer.The transparent front plate can by appoint Anticipate suitable plate or thin film is formed.Suitable plate includes, for example, glass or plastic plate, such as polycarbonate-based, acrylic acid tree Fat, polyacrylate, cyclic polyolefin (for example, ethylene/norbornene polymer), polystyrene type (are preferably having luxuriant gold Obtained polystyrene type in the case of metal catalyst), polyamide-based, polyester, fluoropolymer, or its two or more Combination.Suitable thin film as the header board can include polymer, and (for example, the polymer includes, but not limited to polyester Polyethylene terephthalate and PEN), polycarbonate-based, polyolefin (for example, polypropylene, poly- second Alkene, and cyclic polyolefin), norbornene polymer, polystyrene (for example, syndiotactic polystyrene), cinnamic acrylic ester it is common Polymers, acrylonitritrile-styrene resin, polysulfones (for example, polyether sulfone, polysulfones, etc.), polyamide-based, polyurethaness, acrylic acid Resin, cellulose acetate class (for example, cellulose acetate, cellulose triacetate, etc.), cellophane, polysiloxanes, polychloride vinyl Class (for example, polyvinylidene chloride), fluoropolymer (for example, polyvinyl fluoride, polyvinylidene fluoride, politef, and second Alkene-TFE copolymer) and its combination of two or more.The thin polymer film can be without orientation, or single shaft takes To, or biaxial orientation.
Solar module can also include other function films or flaggy (for example, the dielectric layer being embedded in the module Or barrier layer).These functional layers can include above-mentioned thin polymer film or be coated with those of other functional coatings.For example, It is coated with poly- (ethylene glycol terephthalate) of coating of metal oxides (PET) thin film, such as United States Patent (USP) 6,521,825 Hes 6,818,819 and European patent 1182710 described in, oxygen and moisture barrier layer can be played in laminate.
If desired, non-woven fiberglass (scrim can also be included between solar cell layer and encapsulated layer Scrim) layer is beneficial to degassing and/or the reinforcing as encapsulation agent in lamination process.The use of this scrim layer, for example, It is described in United States Patent (USP) 5,583,057;6,075,202;6,204,443;6,320,115;6,323,416 or European patent 0769818。
And, one or two surface for any composition layer being added in solar module can optionally through appointing The suitable bonding intensive treatment of meaning.The bonding intensive treatment can be arbitrary form known in the art and including flame treatment (see, e.g., United States Patent (USP) 2,632,921;2,648,097;2,683,894;Or 2,704,382), corona treatment (ginseng See for example, United States Patent (USP) 4,732,814), electron beam treatment, oxidation processes, Corona discharge Treatment, chemical treatment, chromic acid process, Hot air treatment, ozone process, treatment with ultraviolet light, blasting treatment, solvent process and its combination of two or more.
There is disclosed herein a kind of preparation method of the multilamellar protection board for solar module, including extrusion is warm Degree is set at 270-330 DEG C or preferably 280-330 DEG C, the direct extrusion coated ethylene copolymer in flexible base layer Material.
Embodiment
Material:
·PVF:The polyvinyl fluoride thin film (37 μ m-thick) of orientation, density 1.4g/cm3, from Du Pont with trade (brand) nameObtain ;
·PET-1:The pet film (188 μ m-thick) that (two-sided) sided corona treatment is crossed, density 1.40g/cm3, obtain from DuPont Teijin Film companies of the U.S.;
·PET-2:The pet film (250 μ m-thick) that (two-sided) sided corona treatment is crossed, density 1.40g/cm3, can obtain from DuPont Teijin Film;
·Al:Aluminium foil (20 μ m-thick), from Chinese Shanghai Hu Xin aluminium foil, company limited obtains;
·EMA-1:Ethylene/methyl acrylate copolymer, the acrylic acid methyl ester. of the copolymerization containing 20wt%, density 0.94g/ cm3(determining according to ASTM D792), melt flow rate (MFR) (MFR) 8.0g/10min (determining according to ASTM D1238), fusing point 92 ℃;
·EMA-2:Ethylene/methyl acrylate copolymer, the polymerized unit of the acrylic acid methyl ester. containing 9wt%, density 0.93g/cm3, MFR is 6.0g/10min, 101 DEG C of fusing point;
·EMA-3:Random ethylene copolymer, can be from Du Pont with trade nameM603 is obtained;
·EMA-4:Ethylene/methyl acrylate copolymer, the polymerized unit of the acrylic acid methyl ester. containing 24wt%;
·EMAA:Ethylene/methacrylic acid, the polymerized unit of the methacrylic acid containing 9wt%, density 0.93g/cm3, MFR is 10g/10min, 100 DEG C of fusing point;
·PE:Linear low density polyethylene, density 0.924g/cm3, MFR is 25g/10min, 124 DEG C of fusing point, from China Han Hua chemistry Ningbo company limited obtains;
·TiO 2 :Titanium dioxide, density 3.9g/cm, 1843 DEG C of fusing point, from Du Pont with Ti-R-105 is obtained;
·UVA:A kind of double (1- methyl isophthalic acids-phenylethyl) phenol of 2- (2H- benzotriazole -2- bases) -4,6-, UV absorbs Agent, from BASF Aktiengesellschaft(BASF) with trade (brand) name234 obtain;
·MS:A kind of resin concentrates, containing 23.25wt%EMA-1;23.25wt%EMA-4;50wt%TiO2;And 3.5wt% UVA;
·Silane -1:3- TSL 8330s, from Shin-Etsu Chemical Co., Ltd.s with trade name KBM 903 is obtained;
·Silane -2:APTES, from Shin-Etsu Chemical Co., Ltd.s with trade name KBE 903 is obtained;
·Silane -3:N-2 (amino-ethyl) 3- amino propyl methyl dimethoxysilanes.From Shin-Etsu Chemical Co., Ltd. is obtained with trade name KBM 602;
·SC-1:5- inch list c-Si solaodes, obtain from Chinese Jing'ao Solar Energy Co., Ltd.;
·SC-2:The a-Si thin film of A4 sizes, with glass front plate;
·EVA:Ethylene/vinyl acetate plate (500 μ m-thick), from Chinese Wenzhou Ruiyang Photovoltaic Material Co., Ltd. Obtain.
Comparative example CE1-CE4 and embodiment E1-E6
6 kinds of ethylene copolymer compositions have been used in these embodiments (ECP-1-ECP-6, its composition is listed in table 1).Its In, 3 kinds of ethylene copolymers (ECP-4-ECP-6) include silane additives.
Table 1
ECP-1 ECP-2 ECP-3 ECP-4 ECP-5 ECP-6
EMA-1(wt%) 27 27 50 85.23 85.23 27
EMA-2(wt%) 42 42 - - - 42
EMA-3(wt%) 3 5 - 9.47 9.47 3
EMAA(wt%) - - 50 - - -
PE(wt%) 21 21 - - - 21
MS - - - 5 5 -
TiO2(wt%) 5 5 - - - 5
UVA(wt%) 2 - - - - 1.7
Silane -1 (wt%) - - - 0.3 - -
Silane -2 (wt%) - - - - 0.3 -
Silane -3 (wt%) - - - - - 0.3
Afterwards, (manufactured by Davis Standard) using double screw extruder on the pet sheet face of different base thin film By the extrusion coated ethylene copolymer composition (ECP-1-ECP-3) without silane additives under different extrusion temperatures, system Obtained 9 kinds of multilamellar protection boards (MPS-1-MPS-9, structure is shown in table 2).Then, using the general determining instruments of Instron 5566 (being manufactured by DatapointLabs (U.S.A.), model 5566) determines ethylene copolymer layer and substrate according to ASTM 1876-08 T- peel strengths between layer.Confirmation can be in ethylene copolymer layer and base only when extrusion temperature is set in 270 DEG C or more Enough bond strengths are obtained between bottom.
Table 2
Same as abovely, on PET-1 layers with 290 DEG C of extrusion temperature by extrusion coated containing silane additives Ethylene copolymer composition (ECP-4-ECP-6), has been obtained 3 kinds of multilamellar protection boards (MPS-10-MPS-12, structure is shown in table 3). In these embodiments, silane is finally added in the dried resin mixture of all other component and conditioned at room temperature At night, then extrude.It was observed that all occurring in that bubble in all 3 kinds of plates (MPS-10-MPS-12).Additionally, the second in MPS-12 Alkene copolymer layer ruptures under extrusion condition.
Table 3
* represent that ethylene copolymer layer ruptures under extrusion condition.
Finally, solar module has been obtained in CE1-CE4 and E1-E4.Used in each solar module Composition stratose in table 4.First, all composition layers are stacked to form pre-laminated component.The group of CE1-CE2 and E1-E2 Part has the conventional structure of " header board/front encapsulated layer/solaode/integrated backboard ", and the component of CE3-CE4 and E3-E4 has The conventional structure of " solaode/integrated backboard ".Then by these pre-laminated components in vacuum laminator (by German Meier Vakuumtechnik GmbH companies manufacture, model ICOLAM 10/08) in 145 DEG C of laminateds 15 minutes, obtain final mould Block.Then (manufactured by Spire Solar companies of the U.S., model Spi-Module QA using Spi-Sun simulatorsTM3500) press The output of the solar module of such acquisition is determined under 25 DEG C~50 DEG C of battery temperature according to IEC60904-1.So It is afterwards that these modules are aging through wet/hot (D/H).Specifically, according to IEC 61215 and IEC 61646, these modules are placed In the D/H rooms of 85 DEG C ± 2 DEG C of design temperature and humidity 85% ± 5%.Then the output of the module of these aging mistakes is determined, And calculate it is relatively aging before the power of output reduce ratio, be summarized in table 4.
These embodiments confirm using multilamellar protection board disclosed herein as solar module in the integrated back of the body Plate, can further improve the weatherability of module in the case of not additional back side encapsulating material.
Table 4
1n/a:It is inapplicable;
2:Aging 2000 hours power afterwards of D/H reduces ratio;
3:Aging 1000 hours power afterwards of D/H reduces ratio.

Claims (7)

1. solar module, including:
A () solar cell layer, the solar cell layer includes the solaode of one or more electrical interconnections, and with front And the back side;With
B () multilamellar protection board, the multilamellar protection board includes that (i) has the flexible substrates and (ii) of inner surface and outer surface in 270- The direct extrusion coated ethylene copolymer layer on the inner surface of the flexible substrates under 330 DEG C of extrusion temperature,
Wherein, the ethylene copolymer layer (iii) is main by selected from being constituted with the ethylene copolymer in the following group:Ethylene/(methyl) Alkyl acrylate copolymer, ethylene/(methyl) acrylic copolymer, ionomer and its combination of two or more, and (iv) without cross-linking agent and silane, and
Wherein, the ethylene copolymer layer of the multilamellar protection board is directly tied with the front or the back side of the solar cell layer Close.
2. solar module as claimed in claim 1, wherein extrusion temperature of the ethylene copolymer layer at 280-330 DEG C On the lower directly extrusion coated inner surface to the flexible substrates of degree.
3. solar module as claimed in claim 1 or 2, wherein the flexible substrates of the multilamellar protection board are by metal foil Film or the polymeric material in the following group are formed:Polyester, fluoropolymer, and combinations thereof.
4. solar module as claimed in claim 1 or 2, wherein the ethylene copolymer is selected from ethylene/(methyl) third Olefin(e) acid alkyl ester copolymer.
5. solar module as claimed in claim 1 or 2, wherein the multilamellar protection board is used as header board, and it is described Ethylene copolymer layer is directly combined with the front of solar cell layer, therebetween without encapsulating material.
6. solar module as claimed in claim 1 or 2, wherein the multilamellar protection board is used as backboard, and it is described Ethylene copolymer layer is directly combined with the back side of solar cell layer, therebetween without encapsulating material.
7. solar module as claimed in claim 1 or 2, wherein the solaode is selected from crystal silicon battery and thin film Solaode.
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CN101728437A (en) * 2008-11-03 2010-06-09 E.I.内穆尔杜邦公司 Backboard with packaging function and solar panel using same
CN102576763A (en) * 2009-10-10 2012-07-11 E.I.内穆尔杜邦公司 Method for manufacturing multilayer films and solar panel backsheets formed thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101728437A (en) * 2008-11-03 2010-06-09 E.I.内穆尔杜邦公司 Backboard with packaging function and solar panel using same
CN102576763A (en) * 2009-10-10 2012-07-11 E.I.内穆尔杜邦公司 Method for manufacturing multilayer films and solar panel backsheets formed thereof

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