CN106409949A - Integrated backboard for photovoltaic assembly - Google Patents

Integrated backboard for photovoltaic assembly Download PDF

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Publication number
CN106409949A
CN106409949A CN201611081024.XA CN201611081024A CN106409949A CN 106409949 A CN106409949 A CN 106409949A CN 201611081024 A CN201611081024 A CN 201611081024A CN 106409949 A CN106409949 A CN 106409949A
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layer
copolymer
photovoltaic cell
ethylene
protection board
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庞倩桃
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a photovoltaic assembly. The photovoltaic assembly comprises (a) a photovoltaic cell layer and (b) a multilayer protection board; the photovoltaic cell layer comprises one photovoltaic cell or multiple photovoltaic cells electrically connected to one another, and the photovoltaic cell layer includes a front side and a back side; and the multilayer protection board includes a flexible substrate including an internal surface and an external surface and an ethene copolymer layer which is extruded and coats the internal surface of the flexible substrate directly. The ethene copolymer layer is mainly composed of ethene copolymer selected from ethane/alkyl (meth) acrylates copolymer, ethane/acrylic (meth) copolymer, an ionomer and a combination of two or more thereof, and does not include a cross-linking agent and silane basically; and the ethene copolymer layer of the multilayer protection board is combined with the front or back side of the photovoltaic cell layer directly.

Description

Integrated backboard for photovoltaic module
Technical field
A kind of the present invention relates to photovoltaic module, and the integrated backboard of more particularly to a kind of photovoltaic module.
Background technology
A kind of solar energy seemingly nexhaustible energy, the correlational study of therefore solar energy causes many attentions.Light Volt battery is the device developed in order to solar energy is directly changed into electric energy.
Generally, solar energy module mechanically supports photovoltaic cell, and protects photovoltaic cell to deteriorate from environmental effect. Solar energy module generally includes a rigid and transparent protection header board (such as glass) and a back plate or backboard.Header board and Photovoltaic cell is encapsulated by backboard, and therefore protects photovoltaic cell to deteriorate from environmental effect.
Prior art discloses a kind of backboard, it includes a weathering layer, an obstruct aqueous vapor layer and an insulating barrier.Existing skill It is using aluminium foil as obstruct aqueous vapor layer in art.However, aluminium foil is conductive material, the insulating properties requirement for backboard will be because of aluminium foil There is a possibility that electric leakage and produce doubt.Furthermore, aluminium foil is simultaneously light tight, and the backboard therefore with aluminium foil cannot be applied In penetration film photovoltaic cell.
In view of this, need a kind of Improvement type backboard that can improve the problems referred to above at present badly.
Content of the invention
The present disclosure provides a kind of photovoltaic module, it includes：A () photovoltaic cell layer, this photovoltaic cell layer includes one The photovoltaic cell of individual or multiple electrical interconnection, and there is front and back；(b) multilamellar protection board, this multilamellar protection board includes tool There are flexible substrates and the direct ethylene copolymer on the extrusion coated inner surface in described flexible substrates of inner surface and outer surface Layer, wherein, described ethylene copolymer layer is by selected from being constituted with the ethylene copolymer in the following group：Ethylene/(methyl) acrylic acid alkyl Ester copolymer, ethylene/(methyl) acrylic copolymer, ionomer and its combination of two or more, and without cross-linking agent and Silane, and it is doped in the silica dioxide granule carrying electric charge in ethylene copolymer layer all the time, and wherein, described multilamellar protection board Described ethylene copolymer layer be directly combined with the front of described photovoltaic cell layer or the back side.
In an embodiment of photovoltaic module, described ethylene copolymer layer is straight under 280-330 DEG C of extrusion temperature Connect on the extrusion coated inner surface to described flexible substrates.
In another embodiment of photovoltaic module, the flexible substrates of described multilamellar protection board by metallic film or are selected from Formed with the polymeric material in the following group：Polyester, fluoropolymer, and combinations thereof.
In a further embodiment of photovoltaic module, described ethylene copolymer is selected from ethylene/(methyl) alkyl acrylate Copolymer.
In a further embodiment of photovoltaic module, described multilamellar protection board is used as header board, and described ethylene copolymer Layer is directly combined with the front of photovoltaic cell layer, does not have encapsulating material therebetween.Or, described multilamellar protection board is used as backboard, and And described ethylene copolymer layer is directly combined with the back side of photovoltaic cell layer, there is no encapsulating material therebetween.
In a further embodiment of photovoltaic module, described photovoltaic cell is selected from crystal silicon battery and film photovoltaic cell.
Open according to the present invention, when a scope is given with two specific endpoints it should be understood that this scope include this two Arbitrary value in individual specific endpoints and the arbitrary value being at or about this two end points any.
Specific embodiment
The invention discloses photovoltaic module, it includes：A () photovoltaic cell layer, this solar cell layer includes one or many The photovoltaic cell of individual electrical interconnection, and there is front and back；(b) multilamellar protection board, in this multilamellar protection board includes having Ethylene copolymer layer on the flexible substrates of surface and outer surface and the directly extrusion coated inner surface in described flexible substrates, its In, described ethylene copolymer layer by selected from being constituted with the ethylene copolymer in the following group：Ethylene/(methyl) alkyl acrylate is common Polymers, ethylene/(methyl) acrylic copolymer, ionomer and its combination of two or more, and do not contain cross-linking agent and silicon Alkane, and it is doped in the silica dioxide granule carrying electric charge in ethylene copolymer layer all the time, and wherein, described multilamellar protection board Described ethylene copolymer layer is directly combined with the front of described photovoltaic cell layer or the back side.
The photovoltaic cell layer being included in photovoltaic module includes one or more photovoltaic cells.Described photovoltaic cell can be Any photoelectric conversion device of electric energy can be transformed solar radiation to.They by opto-electronic conversion body and can be formed at two Electrode on first type surface is constituted.Opto-electronic conversion body can be fixed by any suitable photoelectric conversion material such as crystalline silicon (c-Si), nothing Shape silicon (a-Si), microcrystal silicon (μ c-Si), cadmium telluride (CdTe), copper indium diselenide (CuInSe2Or CIS), two copper indium diselenide/gallium (CuInxGa(1-x)Se2Or CIGS), extinction dyestuff and organic semiconductor to be making.Front electrode can be by by any suitable print Brush method such as silk screen printing or ink jet printing and the electrocondution slurry such as silver paste that is coated on the front surface of opto-electronic conversion body is formed.Leading Plasma-based material can include multiple parallel conductive grid lines and perpendicular to conductive grid line and connected one or more more than Conductive main gate line, and back electrode can be formed by type metal slurry on the whole back surface of opto-electronic conversion body.Formed The suitable metal of back electrode includes but is not limited to aluminum, copper, silver, gold, nickel, cadmium and their alloy.
Photovoltaic cell layer can have front (the also referred to as front, and leading under active usage conditions in the face of sunlight Often in the face of sunlight) and not faced by sunlight the back side (the also referred to as back side, and be generally away from sunlight under active usage conditions). In photovoltaic module, all material in the laminate layers on the front of sunlight being arranged at photovoltaic cell layer should have enough Transparency so that enough sunlight reaches photovoltaic cell.Be arranged at photovoltaic cell layer not in the face of sunlight the back side on Material in laminate layers does not need transparent.
The open flexible substrates used of the present invention can be by metal forming (as aluminium foil) or any appropriate polymeric material The thin film being formed.The open suitable polymeric material being used for being formed substrate of the present invention can include, but not limited to following material Material：Polyester (for example, polyethylene terephthalate and PEN), Merlon, polyolefin are (for example, Polypropylene, polyethylene and cyclic polyolefin), norbornene polymer, polystyrene (for example, syndiotactic polystyrene), styrene- Acrylate copolymer, acrylonitritrile-styrene resin, polysulfones (for example, polyether sulfone, polysulfones, etc.), polyamide-based, poly- ammonia Esters, acrylic resin, cellulose acetate class (for example, cellulose acetate, cellulose triacetate, etc.), cellophane, poly- silica Alkane, polychloride vinyl class) (for example, polyvinylidene chloride), fluoropolymer (for example, polyvinyl fluoride, polyvinylidene fluoride, poly- Tetrafluoroethene and ethylene-tetrafluoroethylene copolymer) and its combination of two or more.In some embodiments, flexible substrates Formed by the material comprising polyester and/or fluoropolymer.In another embodiment, flexible substrates are by the material comprising polyester Or mainly formed by the material that polyester forms.Flexible substrates thin film can be non-oriented, or through uniaxial orientation, or Through biaxial orientation.
The instantiation that can be used as the thin film of flexible substrates in the present disclosure includes, but not limited to mylar (example As poly- (ethylene glycol terephthalate) thin film), fluoro-containing copolymer film, metallic film (for example, aluminium foil).And the present invention Open flexible substrates used can also be the form of plural layers, such as fluoropolymer/polyester/fluoropolymer multi-layer thin Film.
The open term " (methyl) alkyl acrylate " used of the present invention refers to alkyl acrylate or methacrylic acid Arrcostab, and open used ethylene/(methyl) alkyl acrylate copolymer of the present invention be comprise vinyl polymerization unit and The copolymer of the polymerized unit of at least one (methyl) alkyl acrylate of about 6-40wt%.(methyl) alkyl acrylate Moieties can contain 1-6 or 1-4 carbon atom, can selected from methyl, ethyl and branched or nonbranched propyl group, butyl, Amyl group and hexyl.Exemplary (methyl) alkyl acrylate includes, but not limited to acrylic acid methyl ester., ethyl acrylate, propylene Sour isobutyl ester and n-butyl acrylate.The polarity of (methyl) alkyl acrylate comonomer can be present in copolymerization by change The relative quantity of the alkyl in monomer and homogeneity are controlling.It is likewise possible to use methacrylic acid C1-C6Arrcostab copolymerization list Body is as comonomer.These comonomers include methyl methacrylate, ethyl methacrylate, isobutyl methacrylate And n-BMA.
Open ethylene/(methyl) alkyl acrylate copolymer used of the present invention can be bipolymer or more senior The form of other copolymer, such as terpolymer.When the form for higher level copolymer, ethylene/(methyl) alkyl acrylate Base ester copolymer can also comprise the polymerized unit of one or more other suitable comonomer.For example, the open institute of the present invention Ethylene/(methyl) alkyl acrylate copolymer can be the form of terpolymer, based on ethylene/(methyl) acrylic acid The gross weight of alkyl ester copolymer, also includes the below about polymerized unit selected from the 3rd following comonomer of 5wt%：Propylene Acids, methacrylic and its derivant.
In some embodiments, open ethylene/(methyl) alkyl acrylate copolymer used of the present invention is selected from second Alkene/acrylate copolymer and ethylene/methacrylic acid ester copolymer.In another embodiment, the present invention is open used Ethylene/(methyl) alkyl acrylate copolymer is ethylene/methyl acrylate copolymer.
Open ethylene/(methyl) alkyl acrylate copolymer used of the present invention can be anti-using autoclave or tubular type Answer device to pass through technique known to polymer arts to be obtained.For example, this copolyreaction can be carried out with continuous processing in autoclave, Wherein by ethylene, (methyl) alkyl acrylate with the solvent such as methanol that is optionally present is added to stirring high pressure together with initiator In kettle.In yet, ethylene/(methyl) alkyl acrylate copolymer can be in liter in high pressure tubular reactors In addition warm lower edge pipe adds reactant comonomer and obtains.In yet, ethylene/(methyl) alkyl acrylate is common Polymers can be obtained in a series of autoclave reactors, and the replacement of wherein comonomer is to add reactant altogether by multizone Poly- monomer is realized.
Based on the gross weight of copolymer, ethylene/(methyl) acrylic copolymer comprises vinyl polymerization unit and is more than or waits In about 10wt%, or about 15-25wt%, or the acrylic acid of about 18-23wt% and/or the polymerized unit of methacrylic acid.
Open ethylene/(methyl) acrylic copolymer used of the present invention can also contain other unsaturated comonomers Polymerized unit.The instantiation of this other unsaturated comonomer includes, but not limited to acrylic acid methyl ester., methyl methacrylate Ester, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, isopropyl acrylate, metering system The tertiary fourth of isopropyl propionate, butyl acrylate, butyl methacrylate, Isobutyl 2-propenoate, isobutyl methacrylate, acrylic acid Ester, Tert-butyl Methacrylate, 1-Octyl acrylate, 2-Propenoic acid, 2-methyl-, octyl ester, acrylic acid hendecane ester, methacrylic acid hendecane Ester, octadecyl ester, methacrylic acid octadecane ester, lauryl ester, lauryl ester, acrylic acid 2- Octyl Nitrite, 2-Ethylhexyl Methacrylate, isobornyl acrylate, isobornyl methacrylate, lauryl Ester, lauryl methacrylate, acrylic acid 2- hydroxy methacrylate, 2-hydroxyethyl methacrylate, glycidyl acrylate, first Base glycidyl acrylate, PEG acrylate, PEG methacrylate, PEG methyl ether Acrylate, PEG methyl ether methacrylate, PEG phenyl ether acrylate, PEG phenyl Ether metacrylic acid ester, PEG 4- nonylplenyl ether acrylate, PEG 4- nonylplenyl ether metering system Acid esters, PEG phenyl ether acrylate, PEG phenyl ether methacrylate, dimethyl maleate, Malaysia Diethyl phthalate, dibutyl maleate, dimethyl fumarate, DEF, dibutyl fumarate, fumaric acid di-menthyl ester, Vinyl acetate, propionate and analog and its mixture.Preferably, described other unsaturated comonomer is selected from following In group：Acrylic acid methyl ester., methyl methacrylate, butyl acrylate, butyl methacrylate, methyl propenoic acid glycidyl Ester, vinyl acetate and its mixture.Based on the gross weight of copolymer, open ethylene/(methyl) acrylic acid used of the present invention Copolymer can add no more than about 50wt%, or no more than about 30wt%, or no more than about described other of 20wt% The copolymerization units of unsaturated comonomer.
The open ionomer used of the present invention is obtained by ethylene recited above/(methyl) acrylic copolymer is derivative.Tool Say, this ionomer is by with ionic metal moiety or whole this ethylene of neutralization/(methyl) acrylic acid mother's acid copolymer body Obtain.Preferably, the total mole number based on carboxylic acid ester groups in polyarylene block copolymer, this ethylene/(methyl) acrylic copolymer about 10- 100%, or about 10-50%, or about 20-40% is neutralized by metal ion.Metal ion can be monovalence, bivalence, trivalent, Multivalence and its mixture.Preferably monovalent metallic ion include, but not limited to sodium, potassium, lithium, silver, hydrargyrum, copper and analog and its Mixture.Preferably bivalent metal ion include, but not limited to beryllium, magnesium, calcium, strontium, barium, copper, cadmium, hydrargyrum, stannum, lead, ferrum, cobalt, Nickel, zinc and analog and its mixture.Preferably trivalent metal ion includes, but not limited to aluminum, scandium, ferrum, yttrium and analog And its mixture.Preferably polyvalent metal ion include, but not limited to titanium, zirconium, hafnium, vanadium, tantalum, tungsten, chromium, cerium, ferrum with similar Thing and its mixture.Preferably when metal ion is multivalence, including complexant, such as stearate radical, Oleic acid root, salicylate With phenolic acid root, such as United States Patent (USP) 3, disclosed in 404,134.It is further preferred that described metal ion is selected from in the following group：Sodium, lithium, Magnesium, zinc, aluminum and its mixture.Further preferably, metal ion is selected from sodium, zinc and its mixture.Most preferably, metal ion is Zinc.
Open according to the present invention, described ethylene copolymer layer is mainly made up of ethylene copolymer and is substantially free of crosslinking Agent and silane.Substantially free refers to contain no more than about this specific components of 0.1wt% in the composition.
Just as used in the present invention, term " cross-linking agent " is used to refer to promote or adjust the molecule between polymer chain Between covalent bond therefore produce the compound of more rigid structure.Open according to the present invention, ethylene copolymer layer is substantially free of appoints Meaning cross-linking agent, described cross-linking agent includes peroxide, silane, epoxide, isocyanate compound, urethane compound Thing, metal-oxide, sulfur and difunctional compound (such as diene, diacid, glycol, diamidogen, etc.).
The open term " silane " used of the present invention is used to refer to containing silicon-carbon bond and does not have the chemical combination of any hydrogen-silicon key Thing.Ethylene copolymer layer is substantially free of any silane, and described silane includes, trialkoxy silane (for example, vinyl trimethoxy Base silane；VTES；3- glycidoxypropyltrimewasxysilane；3- glycidoxypropyl three Ethoxysilane；3- methacryloxypropyl trimethoxy silane；3- methacryloxypropyl； 3- acryloxypropyl trimethoxy silane；3- ureidopropyltriethoxysilane；3- r-chloropropyl trimethoxyl silane；3- is different Cyanic acid ester group propyl-triethoxysilicane；3- TSL 8330；APTES etc.) and two Alkoxy silane (for example, N-2- (amino-ethyl) -3- amino propyl methyl dimethoxysilane；3- mercaptopropyi methyl dimethoxy TMOS etc.).
Open according to the present invention, described ethylene copolymer directly extrusion coated on the inner surface of basal layer, form multilamellar Protection board.That is, binding agent or prime coat or primer material are not contained between the inner surface of basal layer and ethylene copolymer layer.So And it should be understood that the inner surface of basal layer can be through certain surface treatment before extrusion coated process.This surface treatment changes Kind film surface and arbitrary form known in the art can be taken, at flame treatment, corona treatment, electron beam Reason, oxidation processes, chemical treatment, chromic acid process, hot air treatment, ozone process, treatment with ultraviolet light, blasting treatment, at solvent Reason, sided corona treatment and its combination of two or more.
By making film surface through surface treatment, which improve the surface energy (in terms of dynes/cm) of thin film and therefore change Be apt to it and other materials, such as binding agent, solvent or other polymer thin film, bond strength.
The surface treatment being worth mentioning is sided corona treatment, and sided corona treatment (sometimes referred to as air plasma) is a kind of table Face modification technology, it uses low temperature corona discharge plasma to give the surface property (for example, bond propertiess) of target material Change.Corona plasma is by applying high pressure to sharp electrode end, thus in this tip end formation plasma Produce.Commonly used linearly aligned electrode produces corona plasma curtain.When target such as plastics, cloth or paper pass through to be somebody's turn to do During corona plasma curtain, by this corona plasma on the surface that gas gap or medium are applied to target.Here Gas gap can be formed using various gases, it includes, but not limited to air；Reactive hydrocarbon steam；Or other steam is for example Ketone (for example, acetone or methyl vinyl ketone), alcohols (for example, methanol), to chlorostyrene, acrylonitrile, anhydrous ammonia, amine (for example, propane diamine, tetren, cyclohexylamine, decyl amine, diethylenetriamines, tert-butylamine, ethylenediamine, triethylene four Amine, triethylamine, or isopropyl methyl amine), the steam waiting.In one embodiment, this sided corona treatment is by air Or carry out on the gas gap of alcohol steam formation.In another embodiment, at least one surface of the first film layer is in sky Modified through sided corona treatment on gas gap.In yet, at least one surface of the first film layer is in the air gap On with dosage about 20-1000W min/m2Or about 25-600W min/m2Through sided corona treatment.
And, in order to improve the bond strength between basal layer and ethylene copolymer layer, preferably extrusion temperature is set in 270-330℃.
Open according to the present invention, the average total thickness of the multilamellar protection board so obtaining is about 8-1000 μm, or about 50- 600 μm, or about 100-400 μm, and the average thickness of described ethylene copolymer layer is about 10-400 μm or about 40-200 μm.
Open according to the present invention, described multilamellar protection board and photovoltaic cell layer directly in conjunction with.That is, in gained photovoltaic module Interior, do not contain encapsulating material or other polymeric material between multilamellar protection board and photovoltaic cell layer.
In an embodiment of photovoltaic module disclosed by the invention, multilamellar protection board is straight with the back side of photovoltaic cell layer Access node merges as integrated backboard.In this embodiment, multilamellar protection board be positioned such that described ethylene copolymer layer with Photovoltaic cell layer directly in conjunction with and there is no encapsulating material between this ethylene copolymer layer and photovoltaic cell layer.
In these embodiments, the transparent front envelope on front that photovoltaic module can also include be laminated to photovoltaic cell layer Dress layer, and this front encapsulated layer can include any appropriate polymeric material, such as acid copolymer, ionomer, ethylene/acetic acid Vinyl ester copolymers, polyvinyl acetal class (include acoustics level polyvinyl acetal class), polyurethaness, polychloride vinyl class, Polyethylene kind (for example, linear low density polyethylene class), polyolefin block copolymer elastomer, alpha-olefin and α, β-ethylenic is not The copolymer of saturated carboxylic acid esters) (for example, ethylene/methyl acrylate copolymer and ethylene/butylacrylate copolymer), poly- silicon Oxygen alkane elastomer, epoxy resin and its combination of two or more.
Photovoltaic module can also include the transparent front plate being laminated on front encapsulated layer.This transparent front plate can be by any appropriate Plate or thin film formed.Suitable plate includes, for example, glass or plastic plate, for example polycarbonate-based, acrylic resin, poly- third Olefin(e) acid esters, cyclic polyolefin (for example, ethylene/norbornene polymer), polystyrene type (are preferably having metallocene catalyst In the case of the polystyrene type that is obtained), polyamide-based, polyester, fluoropolymer, or its combination of two or more.With The suitable thin film making described header board can include polymer, and this polymer includes, but not limited to polyester and (for example, gathers to benzene two Formic acid glycol ester and PEN), polycarbonate-based, polyolefin (for example, polypropylene, polyethylene, and ring-type Polyolefin), norbornene polymer, polystyrene (for example, syndiotactic polystyrene), copolymer in cinnamic acrylic ester, propylene Nitrile-styrol copolymer, polysulfones (for example, polyether sulfone, polysulfones, etc.), polyamide-based, polyurethaness, acrylic resin, acetic acid Cellulose family (for example, cellulose acetate, cellulose triacetate, etc.), cellophane, polysiloxanes, polychloride vinyl class are (for example, Polyvinylidene chloride), fluoropolymer (for example, polyvinyl fluoride, polyvinylidene fluoride, politef, and ethylene-tetrafluoro second Alkene copolymer) and its combination of two or more.This thin polymer film can be without orientation, or uniaxial orientation, or twin shaft Orientation.
Photovoltaic module can also include embedding the other function films in this module or flaggy (for example, dielectric layer or barrier Layer).These functional layers can include above-mentioned thin polymer film or be coated with other functional coatings those, can be in laminate In play the effect of oxygen and moisture barrier layer.
If necessary, non-woven fiberglass (scrim can also be included between photovoltaic cell layer and encapsulated layer Scrim) layer is beneficial to and deaerates in lamination process and/or the strengthening as encapsulation agent.And, it is added to appointing in photovoltaic module One or two surface of meaning group stratification can be optionally through any appropriate bonding intensive treatment.This bonding intensive treatment is permissible Arbitrary form known in the art and include flame treatment, corona treatment, electron beam treatment, oxidation processes, corona are put Electric treatment, chemical treatment, chromic acid process, hot air treatment, ozone process, treatment with ultraviolet light, blasting treatment, solvent process and Its combination of two or more.
The invention also discloses a kind of preparation method of the multilamellar protection board for photovoltaic module, set including by extrusion temperature It is scheduled at 270-330 DEG C or preferably 280-330 DEG C, direct extrusion coated described ethylene copolymer material in flexible base layer Material.

Claims (7)

1. photovoltaic module, including：
A () photovoltaic cell layer, this photovoltaic cell layer includes the photovoltaic cell of one or more electrical interconnections, and has front and the back of the body Face；With
B () multilamellar protection board, this multilamellar protection board includes having flexible substrates of inner surface and outer surface and directly extrusion coated Ethylene copolymer layer on the inner surface of described flexible substrates,
Wherein, described ethylene copolymer layer is by selected from being constituted with the ethylene copolymer in the following group：Ethylene/(methyl) acrylic acid alkyl Ester copolymer, ethylene/(methyl) acrylic copolymer, ionomer and its combination of two or more, and without cross-linking agent and Silane, and it is doped in the silica dioxide granule carrying electric charge in ethylene copolymer layer all the time；
Wherein, the described ethylene copolymer layer of described multilamellar protection board directly front or the back side knot with described photovoltaic cell layer Close.
2. photovoltaic module as claimed in claim 1, wherein said ethylene copolymer layer is straight under 280-330 DEG C of extrusion temperature Connect on the extrusion coated inner surface to described flexible substrates.
3. photovoltaic module as claimed in claim 1 or 2, the flexible substrates of wherein said multilamellar protection board are by metallic film or choosing Formed from the polymeric material in the following group：Polyester, fluoropolymer, and combinations thereof.
4. the photovoltaic module as described in any one of claim 1-3, wherein said ethylene copolymer is selected from ethylene/(methyl) propylene Acid alkyl ester copolymer.
5. the photovoltaic module as described in any one of claim 1-4, wherein said multilamellar protection board is used as header board, and described second Alkene copolymer layer is directly combined with the front of photovoltaic cell layer, does not have encapsulating material therebetween.
6. the photovoltaic module as described in any one of claim 1-4, wherein said multilamellar protection board is used as backboard, and described second Alkene copolymer layer is directly combined with the back side of photovoltaic cell layer, does not have encapsulating material therebetween.
7. the photovoltaic module as described in any one of claim 1-6, wherein said photovoltaic cell is selected from crystal silicon battery and film light Volt battery.
CN201611081024.XA 2016-11-30 2016-11-30 Integrated backboard for photovoltaic assembly Pending CN106409949A (en)

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CN102939201A (en) * 2010-06-07 2013-02-20 纳幕尔杜邦公司 Method for preparing multilayer structures containing perfluorinated copolymer resin layer
CN103038060A (en) * 2010-07-30 2013-04-10 纳幕尔杜邦公司 Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer
CN103730528A (en) * 2012-10-12 2014-04-16 杜邦公司 Integrated backboard for solar cell module

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Publication number Priority date Publication date Assignee Title
US20110108094A1 (en) * 2008-06-26 2011-05-12 Du Pont-Mitsui Polychemicals Co., Ltd. Laminated sheet for solar cell and solar cell module using the same
CN102067328A (en) * 2008-06-26 2011-05-18 三井-杜邦聚合化学株式会社 Laminated sheet for solar cell, and solar cell module comprising the same
CN102576763A (en) * 2009-10-10 2012-07-11 E.I.内穆尔杜邦公司 Method for manufacturing multilayer films and solar panel backsheets formed thereof
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Application publication date: 20170215