CN103728999B - Rack - Google Patents
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- Publication number
- CN103728999B CN103728999B CN201210391401.5A CN201210391401A CN103728999B CN 103728999 B CN103728999 B CN 103728999B CN 201210391401 A CN201210391401 A CN 201210391401A CN 103728999 B CN103728999 B CN 103728999B
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- Prior art keywords
- rack
- sealing
- temperature
- casing
- base
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- Expired - Fee Related
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Abstract
The invention provides a kind of rack, it comprises casing, environment temperature inductor, temperature controller and the semiconductor refrigeration system be installed in described casing, the temperature detected when described environment temperature inductor meets or exceeds temperature controller and sets a temperature value, described semiconductor refrigeration system starts, and manufactures cold air in described casing.Semiconductor refrigeration system principle of work is safe and reliable, simple.
Description
Technical field
The present invention relates to a kind of rack, particularly relate to a kind of rack needing to freeze.
Background technology
Along with the development of science and technology, the precise treatment all the more of electronic devices and components, various precision equipment is widely used in our field such as electric power, communication, public security monitoring, as switch, intelligent terminal etc.A lot of precision equipment is again realize its distinctive function by installing corresponding power-supply unit, lightning protection function, signal output apparatus etc. in the containment housing such as rack, battery rack, control box simultaneously.The temperature range of these precision equipment work is certain, too high or the too low performance that all can have influence on it of temperature of temperature, equipment is except self-heating, also be subject to the impact of surrounding environment, the area that typical temperature is comparatively suitable for we fan can be used to regulate in-cabinet temperature, because the range of adjustment of fan is less, and it just realizes hot-fluid and cabinet outer air in cabinet one and exchanges, real refrigeration can not be reached, the area comparatively severe at environment, temperature is higher, the temperature that we can use heat exchanger or cabinet air conditioner to come in regulator cubicle.Though heat exchanger and cabinet air conditioner can reach the effect of refrigeration, but will consume very large energy, and cost is very high, require higher to the installation dimension of rack.
Therefore, be necessary to provide a kind of new rack to solve the problem.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of rack improving refrigeration.
For achieving the above object, can be achieved through the following technical solutions: a kind of rack, it comprises casing, environment temperature inductor, temperature controller and the semiconductor refrigeration system be installed in described casing, the temperature detected when described environment temperature inductor meets or exceeds the initiation value of temperature controller setting, described semiconductor refrigeration system starts, and manufactures cold air in described casing; Described semiconductor refrigeration system comprises the refrigeration module that freezes to described rack and the radiating module to temperature sink in described casing; Described refrigeration module has the internal gas flow entrance being located thereon surface and the cold air flow export being positioned at its side, described radiating module comprises the ambient windstream entrance being positioned at its lower surface and the hot blast being positioned at its side outlet, described internal gas flow entrance is communicated with the outlet of described hot blast, and described cold air flow export is communicated with described ambient windstream entrance; Described rack comprises the sealing installing described refrigeration module and the base installing described radiating module; Described environment temperature inductor is installed on for detecting the temperature of described sealing in described sealing, and described temperature controller is installed in described base.
As a further improvement on the present invention, described sealing is provided with the placed cavity of accommodating described refrigeration module, and described base is provided with the installation cavity of accommodating described radiating module.
As a further improvement on the present invention, described base is positioned at the below of described sealing, and described placed cavity lower surface and the upper surface of described installation cavity are respectively equipped with mutually corresponding through hole.
As a further improvement on the present invention, the outside surface of described sealing and described base wraps up thermal isolation film respectively.
As a further improvement on the present invention, described base is provided with and is communicated to extraneous some window shutters with described installation cavity.
The device of hinge structure, the beneficial effect of rack of the present invention is: semiconductor refrigeration system work is simple and reliable, simple.The open and close of the intelligentized control semiconductor refrigeration system of temperature controller, without the need to manual operation, it is quite convenient to safeguard; Cost reduces greatly, it eliminate the need the manufacturing cost of the refrigeration plant in prior art rack, requires also not high simultaneously, saved very high cost to the installation dimension of rack.
Accompanying drawing explanation
Fig. 1 is the assembling schematic diagram of rack of the present invention;
Fig. 2 is the sections fit schematic diagram of rack of the present invention;
Fig. 3 is the semiconductor refrigeration system schematic diagram of Fig. 1 rack;
Fig. 4 is the side view of the casing of Fig. 1 rack.
Embodiment
Please refer to the drawing 1 to Fig. 3, the present invention is a kind of rack 100, and it comprises casing 1, the environment temperature inductor 2 be installed in casing 1, temperature controller 3 and semiconductor refrigeration system 4.
Casing 1 comprises sealing 11 and is positioned at the base 12 of sealing 11 periphery.Present embodiment, base 12 is positioned at the below of sealing 11, sealing 11 has the placed cavity 111 that some walls enclose formation, one through hole 112 runs through the lower surface of placed cavity 111, base 12 has the upper surface that an installation cavity 121, through hole 122 that some walls enclose formation runs through placed cavity 121.The through hole 112 of sealing 11 and base 12,122 corresponding.Sealing 11 and the surface of base 12 are surrounded by thermal isolation film 13 respectively and stop high temperature to enter sealing 11 with in base 12, also well can play the effect avoiding mutual heat conduction between sealing 11 and base 12 simultaneously.
As Fig. 4, be provided with at the base 12 of casing 1 and be communicated to extraneous some window shutters 120 with installation cavity 121, it is for the circulation of air.
Environment temperature inductor 2 is installed in sealing 11 for detecting the temperature of sealing 11.Temperature controller 3 is installed in base 12.
Semiconductor refrigeration system 4 comprises the refrigeration module 41 being contained in sealing 11 and the radiating module 42 being contained in base 12.Radiating module 42 is positioned at the below of refrigeration module 41.Refrigeration module 41 has the internal gas flow entrance 411 being located thereon surface and the cold air flow export 412 being positioned at its side, and radiating module 42 comprises the ambient windstream entrance 421 being positioned at its lower surface and the hot blast being positioned at its side outlet 422.Internal gas flow entrance 411 is communicated with described hot blast outlet 422, and cold air flow export 412 is communicated with 421 with ambient windstream entrance.
The principle of work of semiconductor refrigeration system 4 for: by environment temperature inductor 2, gathered environment temperature is passed to temperature controller 3, semiconductor refrigeration system 4 is transferred to again through temperature controller 3, and to semiconductor refrigeration system 4 transfer instruction, when the temperature collected arrives or exceed the initiation value of temperature controller 3 setting, (this initiation value can be as required, by artificial regulatory), temperature controller 3 by the command of start up system to semiconductor refrigeration system 4, refrigeration module 41 in semiconductor refrigeration system 4 starts refrigerating function, by the radiating module 42 of semiconductor refrigeration system 4, the thermal current in casing 1 is dispersed into outside casing 1 by window shutter 120 simultaneously, to make in casing 1 temperature within the normal operating limit of equipment.When refrigeration module 41 and radiating module 42 start, the air in sealing 11 enters internal gas flow entrance 411, flows out from the hot blast outlet 422 of radiating module 42; Air outside casing 1 flows into from ambient windstream entrance 421, and air is flowed in sealing 11 from cold air inflow entrance 412 after being freezed by refrigeration module 41.If when temperature is lower than start-up temperature in the casing collected 1, closes semiconductor refrigeration system 4, thus realize its electricity-saving function.
Rack 100 of the present invention specifically has following advantage: semiconductor refrigeration system 4 refrigeration is obvious, and range of choices is extensive, according to the comprehensive condition of the thermal value of casing 1 inside and environment temperature, can select the semiconductor refrigeration system 4 that power is suitable; Semiconductor refrigeration system 4 principle of work is safe and reliable, simple.The open and close of the intelligentized control semiconductor refrigeration system 4 of temperature controller 3, without the need to manual operation, it is quite convenient to safeguard; Cost reduces greatly, it eliminate the need the manufacturing cost of the large-scale refrigeration plants such as prior art air-conditioning or heat exchanger, requires also not high simultaneously, saved very high cost to the installation dimension of rack.
Above-mentioned listed specific implementation is nonrestrictive, and for a person skilled in the art, not departing from the scope of the invention, the various modifications and variations of carrying out, all belong to protection scope of the present invention.
Claims (5)
1. a rack; it is characterized in that: described rack comprises casing, environment temperature inductor, temperature controller and the semiconductor refrigeration system be installed in described casing; the temperature detected when described environment temperature inductor meets or exceeds the initiation value of temperature controller setting; described semiconductor refrigeration system starts, and manufactures cold air in described casing; Described semiconductor refrigeration system comprises the refrigeration module that freezes to described rack and the radiating module to temperature sink in described casing; Described refrigeration module has the internal gas flow entrance being located thereon surface and the cold air flow export being positioned at its side, described radiating module comprises the ambient windstream entrance being positioned at its lower surface and the hot blast being positioned at its side outlet, described internal gas flow entrance is communicated with the outlet of described hot blast, and described cold air flow export is communicated with described ambient windstream entrance; Described rack comprises the sealing installing described refrigeration module and the base installing described radiating module; Described environment temperature inductor is installed on for detecting the temperature of described sealing in described sealing, and described temperature controller is installed in described base.
2. rack as claimed in claim 1, it is characterized in that: described sealing is provided with the placed cavity of accommodating described refrigeration module, described base is provided with the installation cavity of accommodating described radiating module.
3. rack as claimed in claim 2, is characterized in that: described base is positioned at the below of described sealing, and described placed cavity lower surface and the upper surface of described installation cavity are respectively equipped with mutually corresponding through hole.
4. rack as claimed in claim 1, is characterized in that: the outside surface of described sealing and described base wraps up thermal isolation film respectively.
5. rack as claimed in claim 2, is characterized in that: described base is provided with and is communicated to extraneous some window shutters with described installation cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210391401.5A CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210391401.5A CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103728999A CN103728999A (en) | 2014-04-16 |
| CN103728999B true CN103728999B (en) | 2016-04-06 |
Family
ID=50453113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210391401.5A Expired - Fee Related CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103728999B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106708125B (en) * | 2016-12-23 | 2018-07-06 | 武汉网锐实验室（信息产业光通信产品质量监督检验中心） | Heating system and method are automatically controlled for communication system outdoor cabinet |
| CN107456678A (en) * | 2017-08-31 | 2017-12-12 | 合肥康东福双信息科技有限公司 | Temperature management system for high-rise building security rescue capsule |
| CN111609480A (en) * | 2020-04-23 | 2020-09-01 | 海信（山东）空调有限公司 | Air conditioner refrigerating system and air conditioner |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031066A (en) * | 1989-05-25 | 1991-01-07 | Deisuko Haitetsuku:Kk | Cooling system in heat treatment furnace |
| CN2114849U (en) * | 1992-04-08 | 1992-09-02 | 殷金华 | Constant temp instrument box |
| CN1742678A (en) * | 2004-08-31 | 2006-03-08 | 上海雷硕医疗器械有限公司 | Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument |
| CN202205108U (en) * | 2011-08-16 | 2012-04-25 | 吉林市航盛宏宇电子有限公司 | Monitoring thermotank |
| CN202948342U (en) * | 2012-10-16 | 2013-05-22 | 苏州工业园区新宏博通讯科技有限公司 | Cabinet |
-
2012
- 2012-10-16 CN CN201210391401.5A patent/CN103728999B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031066A (en) * | 1989-05-25 | 1991-01-07 | Deisuko Haitetsuku:Kk | Cooling system in heat treatment furnace |
| CN2114849U (en) * | 1992-04-08 | 1992-09-02 | 殷金华 | Constant temp instrument box |
| CN1742678A (en) * | 2004-08-31 | 2006-03-08 | 上海雷硕医疗器械有限公司 | Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument |
| CN202205108U (en) * | 2011-08-16 | 2012-04-25 | 吉林市航盛宏宇电子有限公司 | Monitoring thermotank |
| CN202948342U (en) * | 2012-10-16 | 2013-05-22 | 苏州工业园区新宏博通讯科技有限公司 | Cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103728999A (en) | 2014-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88 Applicant after: SUZHOU NEWHONGBO INTELLIGENT TECHNOLOGY CO., LTD. Address before: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88 Applicant before: Suzhou Industrial Prak New Hongbo Communication Technology Co., Ltd. |
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| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20201016 |