CN103728999A - Equipment cabinet - Google Patents

Equipment cabinet Download PDF

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Publication number
CN103728999A
CN103728999A CN201210391401.5A CN201210391401A CN103728999A CN 103728999 A CN103728999 A CN 103728999A CN 201210391401 A CN201210391401 A CN 201210391401A CN 103728999 A CN103728999 A CN 103728999A
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CN
China
Prior art keywords
rack
refrigeration system
module
semiconductor refrigeration
casing
Prior art date
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Granted
Application number
CN201210391401.5A
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Chinese (zh)
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CN103728999B (en
Inventor
孔祥娟
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Suzhou Industrial Park New Hongbo Communication Technology Co Ltd
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Suzhou Industrial Park New Hongbo Communication Technology Co Ltd
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Priority to CN201210391401.5A priority Critical patent/CN103728999B/en
Publication of CN103728999A publication Critical patent/CN103728999A/en
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Publication of CN103728999B publication Critical patent/CN103728999B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention provides an equipment cabinet. The equipment cabinet comprises a box body, an environment temperature inductor, a temperature controller and a semiconductor refrigeration system, wherein the environment temperature inductor, the temperature controller and the semiconductor refrigeration system are installed in the box body, and when the temperature detected by the environment temperature inductor reaches or exceeds a temperature value set by the temperature controller, the semiconductor refrigeration system starts to generate cold air in the box body. The working principle of the semiconductor refrigeration system is safe, reliable, simple and easy to achieve.

Description

Rack
Technical field
The present invention relates to a kind of rack, relate in particular to a kind of rack that needs refrigeration.
Background technology
Along with scientific and technological development, the precise treatment all the more of electronic devices and components, various precision equipments are widely used in the fields such as our electric power, communication, public security monitoring, as switch, intelligent terminal etc.Simultaneously a lot of precision equipments are again to realize its distinctive function by corresponding power-supply unit, lightning protection function, signal output apparatus etc. being installed in the airtight casing such as rack, battery rack, control box.The temperature range of these precision equipment work is certain, the too low performance that all can have influence on it of excess Temperature or temperature, equipment is except self-heating, also be subject to the impact of surrounding environment, we can regulate the more suitable area of typical temperature in-cabinet temperature with fan, because the range of adjustment of fan is less, and it just realizes an exchange of the interior hot-fluid of cabinet and cabinet outer air, can not reach real refrigeration, in the area that environment is severe, temperature is higher, we can carry out the temperature in regulator cubicle with heat exchanger or cabinet air conditioner.Though heat exchanger and cabinet air conditioner can reach the effect of refrigeration, but will consume very large energy, and cost is very high, and the installation dimension of rack is had relatively high expectations.
Therefore, be necessary to provide a kind of new rack to address the above problem.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of rack that improves refrigeration.
For achieving the above object, can be achieved through the following technical solutions: a kind of rack, it comprises casing, is installed on environment temperature inductor, temperature controller and semiconductor refrigeration system in described casing, the temperature detecting when described environment temperature inductor meets or exceeds the startup value that temperature controller is set, described semiconductor refrigeration system starts, to manufacturing cold air in described casing.
As a further improvement on the present invention, described semiconductor refrigeration system comprises the refrigeration module to described rack refrigeration and the radiating module to temperature heat radiation in described casing.
As a further improvement on the present invention, described refrigeration module has the cold air flow export that is located thereon surperficial internal gas flow entrance and is positioned at its side, described radiating module comprises the hot blast outlet that is positioned at the ambient windstream entrance of its lower surface and is positioned at its side, described internal gas flow entrance is communicated with described hot blast outlet, and described cold air flow export is communicated with described ambient windstream entrance.
As a further improvement on the present invention, described rack comprises the closure that described refrigeration module is installed and the pedestal that described radiating module is installed.
As a further improvement on the present invention, described closure is provided with the placed cavity of accommodating described instruction module, and described pedestal is provided with the installation cavity of accommodating described radiating module.
As a further improvement on the present invention, described pedestal is positioned at the below of described closure, and described placed cavity lower surface is respectively equipped with mutual corresponding through hole with the upper surface of described installation cavity.
As a further improvement on the present invention, the outside surface of described closure and described pedestal wraps up respectively thermal isolation film.
As a further improvement on the present invention, described base is provided with described installation cavity and is communicated to extraneous some window shutters.
The device of prior art relatively, the beneficial effect of rack of the present invention is: semiconductor refrigeration system work is simple and reliable, simple.The open and close of the intelligentized control semiconductor refrigeration system of temperature controller, without manual operation, it is quite convenient to safeguard; Cost reduces greatly, and it has saved the manufacturing cost of the refrigeration plant in prior art rack, the installation dimension of rack is required also not highly simultaneously, has saved very high cost.
Accompanying drawing explanation
Fig. 1 is the assembling schematic diagram of rack of the present invention;
Fig. 2 is the part assembling schematic diagram of rack of the present invention;
Fig. 3 is the semiconductor refrigeration system schematic diagram of Fig. 1 rack;
Fig. 4 is the side view of the casing of Fig. 1 rack.
Embodiment
Please refer to the drawing 1 is to Fig. 3, and the present invention is a kind of rack 100, and it comprises casing 1, is installed on environment temperature inductor 2, temperature controller 3 and semiconductor refrigeration system 4 in casing 1.
Casing 1 comprises airtight portion 11 and is positioned at the base 12 of sealing 11 peripheries.Present embodiment, base 12 is positioned at the below of sealing 11, airtight portion 11 has some walls and encloses a placed cavity 111 of formation, one through hole 112 runs through the lower surface of placed cavity 111, base 12 has the upper surface that an installation cavity 121, one through holes 122 that some walls enclose formation run through placed cavity 121.Sealing 11 is corresponding with the through hole 112,122 of base 12.Sealing 11 is surrounded by respectively thermal isolation film 13 with the surface of base 12 and stops high temperature to enter in sealing 11 and base 12, also can well play the effect of avoiding mutual heat conduction between airtight portion 11 and base 12 simultaneously.
As Fig. 4, at the base 12 of casing 1, be provided with installation cavity 121 and be communicated to extraneous some window shutters 120, it is for the circulation of air.
Environment temperature inductor 2 is installed on the temperature for detection of sealing 12 in sealing 12.Temperature controller 3 is installed in base 12.
Semiconductor refrigeration system 4 comprises the radiating module 42 that is contained in the refrigeration module 41 of sealing 11 and is contained in base interior 12.Radiating module 42 is positioned at the below of refrigeration module 41.Refrigeration module 41 has the cold air flow export 412 that is located thereon surperficial internal gas flow entrance 411 and is positioned at its side, and radiating module 42 comprises the hot blast outlet 422 that is positioned at the ambient windstream entrance 421 of its lower surface and is positioned at its side.Internal gas flow entrance 411 is communicated with described hot blast outlet 422, and cold air flow export 412 is communicated with 421 with ambient windstream entrance.
The principle of work of semiconductor refrigeration system 4 for: by environment temperature inductor 2, gathered environment temperature is passed to temperature controller 3, through temperature controller 3, be transferred to again semiconductor refrigeration system 4, and to semiconductor refrigeration system 4 transfer instructions, when the temperature that collects arrives or exceed the startup value that temperature controller 3 sets, (this startup value can be as required, by artificial regulatory), temperature controller 3 will start the command of system to semiconductor refrigeration system 4, refrigeration module 41 in semiconductor refrigeration system 4 starts refrigerating function, by the radiating module 42 of semiconductor refrigeration system 4, the thermal current in casing 1 is dispersed into outside casing 1 by window shutter 120 simultaneously, make the interior temperature of casing 1 within the normal operating limit of equipment.When refrigeration module 41 starts with radiating module 42, the air in airtight portion 11 enters internal gas flow entrance 411, from the hot blast outlet 422 of radiating module 42, flows out; Air outside casing 1 flows into from ambient windstream entrance 421, and air flows in sealing 11 from cold air inflow entrance 412 after freezing by refrigeration module 41.If the interior temperature of the casing collecting 1 during lower than start-up temperature, is closed semiconductor refrigeration system 4, thereby is realized its electricity-saving function.
Rack 100 of the present invention specifically has following advantage: semiconductor refrigeration system 4 refrigeration are obvious, and optional in extensive range, can, according to the thermal value of casing 1 inside and the comprehensive condition of environment temperature, select the suitable semiconductor refrigeration system 4 of power; Semiconductor refrigeration system 4 principle of work are safe and reliable, simple.The open and close of the intelligentized control semiconductor refrigeration system 4 of temperature controller 3, without manual operation, it is quite convenient to safeguard; Cost reduces greatly, and it has saved the manufacturing cost of the large-scale refrigeration plants such as prior art air-conditioning or heat exchanger, the installation dimension of rack is required also not highly simultaneously, has saved very high cost.
Above-mentioned listed specific implementation is nonrestrictive, and for a person skilled in the art, not departing from the scope of the invention, the various modifications and variations of carrying out, all belong to protection scope of the present invention.

Claims (8)

1. a rack, it is characterized in that: described rack comprises casing, is installed on environment temperature inductor, temperature controller and semiconductor refrigeration system in described casing, the temperature detecting when described environment temperature inductor meets or exceeds the startup value that temperature controller is set, described semiconductor refrigeration system starts, to manufacturing cold air in described casing.
2. rack as claimed in claim 1, is characterized in that: described semiconductor refrigeration system comprises the refrigeration module to described rack refrigeration and the radiating module to temperature heat radiation in described casing.
3. rack as claimed in claim 2, it is characterized in that: described refrigeration module has the cold air flow export that is located thereon surperficial internal gas flow entrance and is positioned at its side, described radiating module comprises the hot blast outlet that is positioned at the ambient windstream entrance of its lower surface and is positioned at its side, described internal gas flow entrance is communicated with described hot blast outlet, and described cold air flow export is communicated with described ambient windstream entrance.
4. rack as claimed in claim 3, is characterized in that: described rack comprises the closure that described refrigeration module is installed and the pedestal that described radiating module is installed.
5. rack as claimed in claim 4, is characterized in that: described closure is provided with the placed cavity of accommodating described instruction module, and described pedestal is provided with the installation cavity of accommodating described radiating module.
6. rack as claimed in claim 5, is characterized in that: described pedestal is positioned at the below of described closure, and described placed cavity lower surface is respectively equipped with mutual corresponding through hole with the upper surface of described installation cavity.
7. rack as claimed in claim 4, is characterized in that: the outside surface of described closure and described pedestal wraps up respectively thermal isolation film.
8. rack as claimed in claim 5, is characterized in that: described base is provided with described installation cavity and is communicated to extraneous some window shutters.
CN201210391401.5A 2012-10-16 2012-10-16 Rack Expired - Fee Related CN103728999B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210391401.5A CN103728999B (en) 2012-10-16 2012-10-16 Rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210391401.5A CN103728999B (en) 2012-10-16 2012-10-16 Rack

Publications (2)

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CN103728999A true CN103728999A (en) 2014-04-16
CN103728999B CN103728999B (en) 2016-04-06

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106708125A (en) * 2016-12-23 2017-05-24 武汉网锐实验室(信息产业光通信产品质量监督检验中心) Automatic control heating system and automatic control heating method used for communication system outdoor rack
CN107456678A (en) * 2017-08-31 2017-12-12 合肥康东福双信息科技有限公司 Temperature management system for high-rise building security rescue capsule
CN111609480A (en) * 2020-04-23 2020-09-01 海信(山东)空调有限公司 Air conditioner refrigerating system and air conditioner

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031066A (en) * 1989-05-25 1991-01-07 Deisuko Haitetsuku:Kk Cooling system in heat treatment furnace
CN2114849U (en) * 1992-04-08 1992-09-02 殷金华 Constant temp instrument box
CN1742678A (en) * 2004-08-31 2006-03-08 上海雷硕医疗器械有限公司 Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument
CN202205108U (en) * 2011-08-16 2012-04-25 吉林市航盛宏宇电子有限公司 Monitoring thermotank
CN202948342U (en) * 2012-10-16 2013-05-22 苏州工业园区新宏博通讯科技有限公司 Cabinet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031066A (en) * 1989-05-25 1991-01-07 Deisuko Haitetsuku:Kk Cooling system in heat treatment furnace
CN2114849U (en) * 1992-04-08 1992-09-02 殷金华 Constant temp instrument box
CN1742678A (en) * 2004-08-31 2006-03-08 上海雷硕医疗器械有限公司 Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument
CN202205108U (en) * 2011-08-16 2012-04-25 吉林市航盛宏宇电子有限公司 Monitoring thermotank
CN202948342U (en) * 2012-10-16 2013-05-22 苏州工业园区新宏博通讯科技有限公司 Cabinet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106708125A (en) * 2016-12-23 2017-05-24 武汉网锐实验室(信息产业光通信产品质量监督检验中心) Automatic control heating system and automatic control heating method used for communication system outdoor rack
CN106708125B (en) * 2016-12-23 2018-07-06 武汉网锐实验室(信息产业光通信产品质量监督检验中心) Heating system and method are automatically controlled for communication system outdoor cabinet
CN107456678A (en) * 2017-08-31 2017-12-12 合肥康东福双信息科技有限公司 Temperature management system for high-rise building security rescue capsule
CN111609480A (en) * 2020-04-23 2020-09-01 海信(山东)空调有限公司 Air conditioner refrigerating system and air conditioner

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Address after: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88

Applicant after: SUZHOU NEWHONGBO INTELLIGENT TECHNOLOGY CO., LTD.

Address before: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88

Applicant before: Suzhou Industrial Prak New Hongbo Communication Technology Co., Ltd.

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Granted publication date: 20160406

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CF01 Termination of patent right due to non-payment of annual fee