CN103728999A - Equipment cabinet - Google Patents
Equipment cabinet Download PDFInfo
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- CN103728999A CN103728999A CN201210391401.5A CN201210391401A CN103728999A CN 103728999 A CN103728999 A CN 103728999A CN 201210391401 A CN201210391401 A CN 201210391401A CN 103728999 A CN103728999 A CN 103728999A
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- Prior art keywords
- rack
- refrigeration system
- module
- semiconductor refrigeration
- casing
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Abstract
The invention provides an equipment cabinet. The equipment cabinet comprises a box body, an environment temperature inductor, a temperature controller and a semiconductor refrigeration system, wherein the environment temperature inductor, the temperature controller and the semiconductor refrigeration system are installed in the box body, and when the temperature detected by the environment temperature inductor reaches or exceeds a temperature value set by the temperature controller, the semiconductor refrigeration system starts to generate cold air in the box body. The working principle of the semiconductor refrigeration system is safe, reliable, simple and easy to achieve.
Description
Technical field
The present invention relates to a kind of rack, relate in particular to a kind of rack that needs refrigeration.
Background technology
Along with scientific and technological development, the precise treatment all the more of electronic devices and components, various precision equipments are widely used in the fields such as our electric power, communication, public security monitoring, as switch, intelligent terminal etc.Simultaneously a lot of precision equipments are again to realize its distinctive function by corresponding power-supply unit, lightning protection function, signal output apparatus etc. being installed in the airtight casing such as rack, battery rack, control box.The temperature range of these precision equipment work is certain, the too low performance that all can have influence on it of excess Temperature or temperature, equipment is except self-heating, also be subject to the impact of surrounding environment, we can regulate the more suitable area of typical temperature in-cabinet temperature with fan, because the range of adjustment of fan is less, and it just realizes an exchange of the interior hot-fluid of cabinet and cabinet outer air, can not reach real refrigeration, in the area that environment is severe, temperature is higher, we can carry out the temperature in regulator cubicle with heat exchanger or cabinet air conditioner.Though heat exchanger and cabinet air conditioner can reach the effect of refrigeration, but will consume very large energy, and cost is very high, and the installation dimension of rack is had relatively high expectations.
Therefore, be necessary to provide a kind of new rack to address the above problem.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of rack that improves refrigeration.
For achieving the above object, can be achieved through the following technical solutions: a kind of rack, it comprises casing, is installed on environment temperature inductor, temperature controller and semiconductor refrigeration system in described casing, the temperature detecting when described environment temperature inductor meets or exceeds the startup value that temperature controller is set, described semiconductor refrigeration system starts, to manufacturing cold air in described casing.
As a further improvement on the present invention, described semiconductor refrigeration system comprises the refrigeration module to described rack refrigeration and the radiating module to temperature heat radiation in described casing.
As a further improvement on the present invention, described refrigeration module has the cold air flow export that is located thereon surperficial internal gas flow entrance and is positioned at its side, described radiating module comprises the hot blast outlet that is positioned at the ambient windstream entrance of its lower surface and is positioned at its side, described internal gas flow entrance is communicated with described hot blast outlet, and described cold air flow export is communicated with described ambient windstream entrance.
As a further improvement on the present invention, described rack comprises the closure that described refrigeration module is installed and the pedestal that described radiating module is installed.
As a further improvement on the present invention, described closure is provided with the placed cavity of accommodating described instruction module, and described pedestal is provided with the installation cavity of accommodating described radiating module.
As a further improvement on the present invention, described pedestal is positioned at the below of described closure, and described placed cavity lower surface is respectively equipped with mutual corresponding through hole with the upper surface of described installation cavity.
As a further improvement on the present invention, the outside surface of described closure and described pedestal wraps up respectively thermal isolation film.
As a further improvement on the present invention, described base is provided with described installation cavity and is communicated to extraneous some window shutters.
The device of prior art relatively, the beneficial effect of rack of the present invention is: semiconductor refrigeration system work is simple and reliable, simple.The open and close of the intelligentized control semiconductor refrigeration system of temperature controller, without manual operation, it is quite convenient to safeguard; Cost reduces greatly, and it has saved the manufacturing cost of the refrigeration plant in prior art rack, the installation dimension of rack is required also not highly simultaneously, has saved very high cost.
Accompanying drawing explanation
Fig. 1 is the assembling schematic diagram of rack of the present invention;
Fig. 2 is the part assembling schematic diagram of rack of the present invention;
Fig. 3 is the semiconductor refrigeration system schematic diagram of Fig. 1 rack;
Fig. 4 is the side view of the casing of Fig. 1 rack.
Embodiment
Please refer to the drawing 1 is to Fig. 3, and the present invention is a kind of rack 100, and it comprises casing 1, is installed on environment temperature inductor 2, temperature controller 3 and semiconductor refrigeration system 4 in casing 1.
As Fig. 4, at the base 12 of casing 1, be provided with installation cavity 121 and be communicated to extraneous some window shutters 120, it is for the circulation of air.
The principle of work of semiconductor refrigeration system 4 for: by environment temperature inductor 2, gathered environment temperature is passed to temperature controller 3, through temperature controller 3, be transferred to again semiconductor refrigeration system 4, and to semiconductor refrigeration system 4 transfer instructions, when the temperature that collects arrives or exceed the startup value that temperature controller 3 sets, (this startup value can be as required, by artificial regulatory), temperature controller 3 will start the command of system to semiconductor refrigeration system 4, refrigeration module 41 in semiconductor refrigeration system 4 starts refrigerating function, by the radiating module 42 of semiconductor refrigeration system 4, the thermal current in casing 1 is dispersed into outside casing 1 by window shutter 120 simultaneously, make the interior temperature of casing 1 within the normal operating limit of equipment.When refrigeration module 41 starts with radiating module 42, the air in airtight portion 11 enters internal gas flow entrance 411, from the hot blast outlet 422 of radiating module 42, flows out; Air outside casing 1 flows into from ambient windstream entrance 421, and air flows in sealing 11 from cold air inflow entrance 412 after freezing by refrigeration module 41.If the interior temperature of the casing collecting 1 during lower than start-up temperature, is closed semiconductor refrigeration system 4, thereby is realized its electricity-saving function.
Above-mentioned listed specific implementation is nonrestrictive, and for a person skilled in the art, not departing from the scope of the invention, the various modifications and variations of carrying out, all belong to protection scope of the present invention.
Claims (8)
1. a rack, it is characterized in that: described rack comprises casing, is installed on environment temperature inductor, temperature controller and semiconductor refrigeration system in described casing, the temperature detecting when described environment temperature inductor meets or exceeds the startup value that temperature controller is set, described semiconductor refrigeration system starts, to manufacturing cold air in described casing.
2. rack as claimed in claim 1, is characterized in that: described semiconductor refrigeration system comprises the refrigeration module to described rack refrigeration and the radiating module to temperature heat radiation in described casing.
3. rack as claimed in claim 2, it is characterized in that: described refrigeration module has the cold air flow export that is located thereon surperficial internal gas flow entrance and is positioned at its side, described radiating module comprises the hot blast outlet that is positioned at the ambient windstream entrance of its lower surface and is positioned at its side, described internal gas flow entrance is communicated with described hot blast outlet, and described cold air flow export is communicated with described ambient windstream entrance.
4. rack as claimed in claim 3, is characterized in that: described rack comprises the closure that described refrigeration module is installed and the pedestal that described radiating module is installed.
5. rack as claimed in claim 4, is characterized in that: described closure is provided with the placed cavity of accommodating described instruction module, and described pedestal is provided with the installation cavity of accommodating described radiating module.
6. rack as claimed in claim 5, is characterized in that: described pedestal is positioned at the below of described closure, and described placed cavity lower surface is respectively equipped with mutual corresponding through hole with the upper surface of described installation cavity.
7. rack as claimed in claim 4, is characterized in that: the outside surface of described closure and described pedestal wraps up respectively thermal isolation film.
8. rack as claimed in claim 5, is characterized in that: described base is provided with described installation cavity and is communicated to extraneous some window shutters.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210391401.5A CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210391401.5A CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103728999A true CN103728999A (en) | 2014-04-16 |
CN103728999B CN103728999B (en) | 2016-04-06 |
Family
ID=50453113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210391401.5A Expired - Fee Related CN103728999B (en) | 2012-10-16 | 2012-10-16 | Rack |
Country Status (1)
Country | Link |
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CN (1) | CN103728999B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106708125A (en) * | 2016-12-23 | 2017-05-24 | 武汉网锐实验室(信息产业光通信产品质量监督检验中心) | Automatic control heating system and automatic control heating method used for communication system outdoor rack |
CN107456678A (en) * | 2017-08-31 | 2017-12-12 | 合肥康东福双信息科技有限公司 | Temperature management system for high-rise building security rescue capsule |
CN111609480A (en) * | 2020-04-23 | 2020-09-01 | 海信(山东)空调有限公司 | Air conditioner refrigerating system and air conditioner |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH031066A (en) * | 1989-05-25 | 1991-01-07 | Deisuko Haitetsuku:Kk | Cooling system in heat treatment furnace |
CN2114849U (en) * | 1992-04-08 | 1992-09-02 | 殷金华 | Constant temp instrument box |
CN1742678A (en) * | 2004-08-31 | 2006-03-08 | 上海雷硕医疗器械有限公司 | Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument |
CN202205108U (en) * | 2011-08-16 | 2012-04-25 | 吉林市航盛宏宇电子有限公司 | Monitoring thermotank |
CN202948342U (en) * | 2012-10-16 | 2013-05-22 | 苏州工业园区新宏博通讯科技有限公司 | Cabinet |
-
2012
- 2012-10-16 CN CN201210391401.5A patent/CN103728999B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH031066A (en) * | 1989-05-25 | 1991-01-07 | Deisuko Haitetsuku:Kk | Cooling system in heat treatment furnace |
CN2114849U (en) * | 1992-04-08 | 1992-09-02 | 殷金华 | Constant temp instrument box |
CN1742678A (en) * | 2004-08-31 | 2006-03-08 | 上海雷硕医疗器械有限公司 | Thermostat for low-light quick-acting spectrum analysing assembly in medical laser medical laser diagnosis instrument |
CN202205108U (en) * | 2011-08-16 | 2012-04-25 | 吉林市航盛宏宇电子有限公司 | Monitoring thermotank |
CN202948342U (en) * | 2012-10-16 | 2013-05-22 | 苏州工业园区新宏博通讯科技有限公司 | Cabinet |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106708125A (en) * | 2016-12-23 | 2017-05-24 | 武汉网锐实验室(信息产业光通信产品质量监督检验中心) | Automatic control heating system and automatic control heating method used for communication system outdoor rack |
CN106708125B (en) * | 2016-12-23 | 2018-07-06 | 武汉网锐实验室(信息产业光通信产品质量监督检验中心) | Heating system and method are automatically controlled for communication system outdoor cabinet |
CN107456678A (en) * | 2017-08-31 | 2017-12-12 | 合肥康东福双信息科技有限公司 | Temperature management system for high-rise building security rescue capsule |
CN111609480A (en) * | 2020-04-23 | 2020-09-01 | 海信(山东)空调有限公司 | Air conditioner refrigerating system and air conditioner |
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Publication number | Publication date |
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CN103728999B (en) | 2016-04-06 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88 Applicant after: SUZHOU NEWHONGBO INTELLIGENT TECHNOLOGY CO., LTD. Address before: 215126 Suzhou City Industrial Park, Suzhou, Su Sheng Tung Road, Hong Kong Street, No. 88 Applicant before: Suzhou Industrial Prak New Hongbo Communication Technology Co., Ltd. |
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COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20201016 |
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CF01 | Termination of patent right due to non-payment of annual fee |