CN103715257A - HEMT device with back surface field plate structure and manufacturing method of HEMT device - Google Patents
HEMT device with back surface field plate structure and manufacturing method of HEMT device Download PDFInfo
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- CN103715257A CN103715257A CN201410008455.8A CN201410008455A CN103715257A CN 103715257 A CN103715257 A CN 103715257A CN 201410008455 A CN201410008455 A CN 201410008455A CN 103715257 A CN103715257 A CN 103715257A
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- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 claims abstract description 65
- 230000005533 two-dimensional electron gas Effects 0.000 claims abstract description 35
- 229910002704 AlGaN Inorganic materials 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 30
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000005684 electric field Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000005516 deep trap Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
Abstract
The invention discloses an HEMT device with a back surface field plate structure and a manufacturing method of the HEMT device. The device can be manufactured through a common semiconductor device machining technology. The device comprises a source electrode, a drain electrode, a heterostructure and a back field plate electrode. The source electrode and the drain electrode electrically connected through two-dimensional electron gas formed in the heterostructure, the source electrode, the drain electrode and the heterostructure form ohmic contact, the heterostructure comprises a first semiconductor layer and a second semiconductor layer which are arranged in sequence in the setting direction, the first semiconductor layer is arranged between the source electrode and the drain electrode, a grid electrode is arranged on the surface of the first semiconductor layer, Schottky contact is formed between the grid electrode and the first semiconductor layer, and the back field plate electrode is arranged on the surface of one side, far away from the first semiconductor layer, of the second semiconductor. The puncture voltage of the device can be effectively improved, and the effect of electric current collapsing can be restrained to the maximum degree.
Description
Technical field
The present invention relates to a kind of HEMT (High Electron Mobility Transistor, High Electron Mobility Transistor) device, particularly a kind of HEMT device with back surface field plate structure and preparation method thereof.
Background technology
III group-III nitride semiconductor HEMT device, because of piezoelectric polarization and spontaneous polarization effect, at heterojunction boundary, as AlGaN/GaN interface, will form the two-dimensional electron gas of high concentration, high mobility.In addition, the HEMT device that III group-III nitride semiconductor is backing material, can obtain very high puncture voltage, and obtains lower conduction resistance simultaneously, because material energy gap is large, so have very high high-temperature working performance and good capability of resistance to radiation.Therefore, it is not only applicable to high frequency power amplifier part, can also be applicable to field of power electronics, for high-power device for power switching.
When existing III group-III nitride semiconductor HEMT device is used as high-frequency element or high voltage switch device, there is " current collapse " phenomenon.Be operated under DC pulse pattern or high frequency mode when device, drain electrode 4 output currents do not catch up with the variation of grid 6 control signals, the situation that there will be drain electrode 4 electric currents instantaneously to reduce, on-delay increases.Having a strong impact on the practicality of device.This phenomenon is a kind of storage effect of electric charge after all.Its principle is, when device is operated in off-state (OFF state), will have electronics to be captured by trap states, the release of these trapped electrons is slow, so when the grid voltage of device is placed in higher than threshold voltage again, the conducting state electric current of device will significantly reduce, and on-delay is larger.For fear of " current collapse " effect of device, often adopt surface passivation, surface treatment or at the positive surface construction field plate structure of device, stop electronics to the injection of trap states in semiconductor.Thereby slow down current collapse effect.But, these problems can only solve device and be operated in " current collapse " under low voltage condition, because under low voltage condition, electronics is only filled to the trap states of semiconductor surface, when device is operated in high voltage situation, electronics is filled the Deep Level Traps state being more prone to being positioned at the semiconductor bulk of bottom, these Deep Level Traps states are difficult to discharge electronics more by the trap states of specific surface, therefore, when device is operated in high voltage situation, technological means in the past solves the effect of " current collapse " effect and will have a greatly reduced quality.
Summary of the invention
Main purpose of the present invention is to provide a kind of HEMT device with back surface field plate structure, to overcome deficiency of the prior art.
For achieving the above object, the present invention has adopted following technical scheme:
A kind of HEMT device with back surface field plate structure, comprise source electrode, drain electrode and heterostructure, described source electrode is electrically connected to by the two-dimensional electron gas being formed in heterostructure with drain electrode, and described source electrode and drain electrode and heterostructure form ohmic contact, described heterostructure comprises the first semiconductor layer and the second semiconductor layer setting gradually along direction initialization, the first semiconductor layer is arranged between source electrode and drain electrode, and the first semiconductor layer surface is also provided with grid, between described grid and the first semiconductor layer, form Schottky contacts, and, this HEMT device also comprises back surface field plate electrode, described back surface field plate electrode is arranged at the side surface away from the first semiconductor layer of the second semiconductor layer.
As one of comparatively preferred embodiment, the distance between described grid and source electrode is less than the distance between described grid and drain electrode.
As one of feasible embodiment, a lateral edges of at least described back surface field plate electrode extends to source electrode or drain directions, and orthographic projection and the grid both sides of the edge of described back surface field plate electrode are all overlapping simultaneously.
Further, described back surface field plate electrode is electrically connected to grid or source electrode and forms back of the body grid field plate or back of the body source field plate.
Further, described source electrode is connected with high potential with the electronegative potential of power supply respectively with drain electrode.
As one of feasible embodiment, extend to source electrode and drain directions respectively the both sides of the edge of described back surface field plate electrode.
Or as one of feasible embodiment, described back surface field plate electrode only has a lateral edges to extend to source electrode or drain directions.
Further, when described HEMT device work, described grid and back surface field plate electrode are controlled by a control signal respectively.
Further, this HEMT device also comprises supporting base, described supporting base comprises supporting substrate, and described supporting substrate is provided with time source electrode, inferior drain electrode and inferior grid, and described time source electrode, inferior drain electrode and inferior grid are electrically connected to described source electrode, drain and gate respectively.
As one of comparatively preferred embodiment, between described the first semiconductor layer and the second semiconductor layer, also can be provided with to improve the insert layer of mobility of the two-dimensional electron gas of heterojunction boundary.
As one of specific embodiment, described the first semiconductor layer comprises AlGaN layer, and described the second semiconductor layer comprises GaN layer.
As one of specific embodiment, described insert layer can comprise AlN layer.
Further, the thickness of described the second semiconductor layer is less than the thickness of corresponding the second semiconductor layer in existing HEMT device.Or from another perspective, the thickness of described the second semiconductor layer should be enough little, make back surface field plate electrode and be formed at enough near of the two-dimensional electron gas at heterojunction boundary place, thereby can effectively regulate and control the surface density of two-dimensional electron gas.
Postscript, " existing HEMT device " described herein, meant and have HEMT device basic device architecture shown in Fig. 2, that can obtain by any known approach before patent application of the present invention day.
Further, described supporting substrate is mainly formed by the material that has easy heat conduction and be difficult for conductive characteristic.
Further, when described drain electrode connects high potential, source electrode connects electronegative potential, and grid connects the current potential lower than threshold voltage, and this HEMT device is when OFF state, and back surface field plate electrode connects negative voltage; And work as described grid, connect the current potential higher than threshold voltage, this HEMT device is when conducting state, and back surface field plate electrode connects high potential.
Another object of the present invention is to provide a kind of method that this has the HEMT device of back surface field plate structure of preparing, it comprises the steps:
(1) on selected substrate, form the heterostructure that mainly formed by the first semiconductor layer and the second semiconductor layer, and heterostructure form source electrode and the drain electrode of ohmic contact, and be formed at the first semiconductor layer surface and form the grid of Schottky contacts with the first semiconductor layer, thereby obtain HEMT basal body structure;
(2) remove described selected substrate, and at the side surface away from the first semiconductor layer of this second semiconductor layer, back surface field plate electrode is set.
As one of preferred embodiment, step (2) also comprises: after removing described selected substrate, this second semiconductor layer is carried out to reduction processing, then on this second semiconductor layer, back surface field plate electrode is set.
As one of preferred embodiment, step (2) also comprises: the side surface away from the first semiconductor layer at this second semiconductor layer forms the first insulating medium layer, then on this first insulating medium layer, back surface field plate electrode is set.
Further, the method also comprises: this HEMT basal body structure is connected with a supporting base being mainly comprised of supporting substrate, and make to be distributed in the inferior source electrode on described supporting substrate, inferior drain electrode and inferior grid and be electrically connected to described source electrode, drain and gate respectively, then remove the operation of described selected substrate.
Further, in order to the method that described supporting base is connected with HEMT basal body structure, comprise face-down bonding or wafer bonding techniques.
Compared with prior art, the present invention at least tool has the following advantages: by existing HEMT device architecture is improved, be included in back surface field plate electrode is set in device architecture, and be used in conjunction with grid, the Effective Regulation of realization to two-dimensional electron gas in raceway groove, and electric field when device is worked is redistributed, even if HEMT is operated under very high voltage, its drain electrode output current can be got caught up in the variation of grid voltage, and farthest inhibition " current collapse effect ", meanwhile, the effect of redistributing and can play raising puncture voltage of electric field.
Accompanying drawing explanation
Fig. 1 is a kind of cross-sectional view with the HEMT device of back surface field plate structure in the present invention;
Fig. 2 is the structural representation of existing HEMT device;
Fig. 3 is one of structural representation of HEMT device in the embodiment of the present invention 1, and wherein back surface field plate respectively has extension to drain electrode 4 and source electrode 5 directions;
Fig. 4 be HEMT device in the embodiment of the present invention 1 structural representation two, wherein back surface field plate only has extension to source electrode 5 directions;
Fig. 5 be HEMT device in the embodiment of the present invention 1 structural representation three, wherein back surface field plate only to drain electrode 4 directions have extension;
Fig. 6 is the structural representation of HEMT device in the embodiment of the present invention 2, and wherein back surface field plate electrode 9 is electrically connected to grid 6;
Fig. 7 is the structural representation of the HEMT device in the embodiment of the present invention 3, and wherein back surface field plate electrode 9 is electrically connected to source electrode 5;
Fig. 8 is a kind of structural representation with the HEMT device of back surface field plate structure in the present invention's one typical embodiments;
Fig. 9 is a kind of preparation technology's flow chart with the HEMT device of back surface field plate structure in the present invention's one typical embodiments.
Embodiment
Consult Fig. 2, existing HEMT device (as AlGaN/GaN device) generation current avalanche phenomenon former because: when the drain electrode 4 of device applies high voltage, when grid 6 applies lower than the voltage of threshold value, device will be in off state, under the effect of electric field, in AlGaN surface 11 and GaN body, 12 High-Field region class alms giver trap states is electronegative by trapped electron, under the effect of electrostatic induction, these negative electrical charges can make again the two-dimensional electron gas equivalent of corresponding AlGaN/GaN interface 13 reduce, when the surface density of these trap states is sufficiently high, even the two-dimensional electron gas in raceway groove can be exhausted completely.The electronics that these are captured in trap, needs the regular hour just can discharge, and the shortest time also will arrive microsecond magnitude, even can arrive second-time.When device transient state is opened, two-dimensional electron gas quantity below grid in raceway groove will significantly improve under the induction of grid voltage, but in the out of contior region of grid 6, two-dimensional electron gas in raceway groove is still controlled by the negative electrical charge that trap is captured, its quantity is still very little, makes the electric conduction resistive of device large, must wait until that trap states discharges electronics completely and just can reach due quantity, this have on-delay and a large phenomenon of electric conduction resistive, is exactly " current collapse ".
For solving the defect of aforementioned common HEMT device, the present invention proposes a kind of HEMT device with back surface field plate structure, its core texture is consulted Fig. 1, and wherein supporting base role is that mechanical support and electrode are drawn, when explanation device principle, this part is omitted.The source electrode 5 of this device, drain electrode 4 are positioned at the first semiconductor layer 3(as AlGaN) simultaneously, and apportion two ends, grid 6 is also positioned at the first semiconductor layer 3 one sides, and between source electrode 5, drain electrode 4, and grid 6 is apart from source electrode 5 close together.Back surface field plate electrode 9 is positioned at the second semiconductor layer 2(as GaN) simultaneously, and because the second semiconductor layer 2 had carried out attenuate, back surface field plate electrode 9 is nearer apart from the two-dimensional electron gas of heterojunction boundary, can effectively regulate and control the surface density of two-dimensional electron gas.When the drain electrode 4 of device connects high voltage, source electrode 5 connects 0 current potential, grid 6 connects the current potential lower than threshold voltage, device is when OFF state, back surface field plate electrode 9 can apply negative voltage, thereby inhibition the first surperficial 10 places of semiconductor layer 3 and the second semiconductor layer body interior 11 captured for electronics, stops the minimizing of heterojunction boundary two-dimensional electron gas.When the grid 6 of device applies the current potential higher than threshold voltage, device is when conducting state, back surface field plate electrode 9 applies high voltage, can additionally generate two-dimensional electron gas 13 at heterojunction boundary place, make up its loss, thereby play inhibition conducting resistance, reduce, reduce the effect of on-delay, thereby solve " current collapse " effect.
Referring to shown in Fig. 8 is a kind of AlGaN/GaN HEMT device in the present invention's one typical embodiments again, it comprises source electrode 5, drain electrode 4 and grid 6, back surface field plate electrode 9, supporting base, insulating medium layer 8 and AlGaN/GaN heterostructure and the two-dimensional electron gas that is positioned at heterojunction boundary, source, drain electrode realize electrical connection by two-dimensional electron gas.Source, drain electrode are positioned at AlGaN one side, and form ohmic contact with AlGaN, and grid 6 is positioned at AlGaN one side, and form Schottky contacts with AlGaN, and back surface field plate electrode 9 is positioned at GaN one side, and with GaN every with insulating medium layer 8.This supporting base has inferior source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' and supporting substrate 7.Back surface field plate electrode 9 has the coverage wider than grid 6.
Aforementioned source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' can be by face-down bonding or wafer bonding techniques philosophy and source electrodes 5, drain 4, grid 6 combinations.
Postscript, it should be noted that, the aforementioned insulating medium layer being arranged between back surface field plate electrode and the second semiconductor layer also can omit.
Refer to Fig. 9, this HEMT device can be prepared by following technique again:
A) on substrate 1 material, complete traditional AlGaN/GaN HEMT device architecture, that is, and HEMT device matrix;
B), on supporting substrate 7, form the supporting base that comprises time source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 '.This supporting substrate material can be any material applicatory;
C) by HEMT device matrix and supporting base combination, form a combination, be characterized in that the substrate of HEMT device matrix is topmost.Source electrode 5, drain electrode 4, grid 6 are electrically connected to inferior source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' respectively;
D) adopt existing semiconducter process, in connection with substrate 1 material of body, remove, only remain AlGaN/GaN epitaxial structure, and now GaN layer topmost.
E) GaN one deck is utilized existing reduction process means be thinned to suitable thickness.
F) on the GaN of attenuate, structure back surface field plate electrode 9;
G) by back surface field plate electrode 9 and source electrode 5 or grid 6 interconnection, or back surface field plate electrode 9 is applied separately to signal of telecommunication use.
Certainly, technical scheme of the present invention also can be applicable to MIS-HEMT, and its structure comprises: source electrode, drain electrode and heterostructure (as AlGaN/GaN) and be positioned at the two-dimensional electron gas of heterojunction boundary, back surface field plate electrode, supporting base.Described source electrode and drain electrode are positioned at AlGaN one side, form ohmic contact with AlGaN, by the two-dimensional electron gas being formed in heterostructure, are electrically connected to.Described grid is positioned at AlGaN one side, forms Schottky contacts with substrate.Described HEMT device has back surface field plate electrode and supporting base, and back surface field plate electrode is positioned at the second semiconductor layer (as GaN) simultaneously.Described supporting base comprises time source electrode, inferior drain electrode, inferior grid, and it is combined with source electrode, drain electrode, grid respectively.
Above technical solution of the present invention is summarized, in order to make the public can better understand technological means of the present invention, and can be implemented according to the content of specification, below technical scheme of the present invention is further described.
embodiment 1consult Fig. 3, this HEMT has AlGaN/GaN.GaN specially adulterates.In AlGaN, can mix N-shaped impurity, also can not adulterate.The thickness of AlGaN is about 15 to 30nm.
This HEMT has drain electrode 4 and source electrode 5.Drain electrode 4 forms ohmic contact with source electrode 5 with AlGaN/GaN, and is connected with two-dimensional electron gas formation good electrical in raceway groove.Drain electrode 4 and source electrode 5 are to be annealed and formed ohmic contact by quick high-temp by multiple layer metal (as Ti/Al/Ti/Au or Ti/Al/Ni/Au etc.).
Further, this HEMT has grid 6, and between source electrode 5 and drain electrode 4, near the close together of source electrode 5, grid 6 is positioned on AlGaN.
Back surface field plate electrode 9 is positioned on GaN, in vertical direction with grid 6 have overlapping, and to source, drain electrode 4 directions respectively have extension (or, only extend to drain electrode 4 or source electrode 5 directions, consult and Figure 4 shows that back surface field plate electrode 9 only extends to source electrode 5 directions).
Wherein, between back surface field plate electrode 9 and GaN, also insulating medium layer 8 can be set.
This dielectric layer 8 can be by Al
2o
3etc. formation, and can be deposited on GaN by the process means such as PECVD, ALD.
The supporting substrate 7 of supporting base can adopt AlN substrate, and thickness is 100 ~ 1000um, and inferior source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' can adopt Ti(50 ~ 100)/Au(50 ~ 1000nm) metal level.
This operation principle of HEMT with back surface field plate is as follows: while adding the current potential higher than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is higher, and device is in opening; While adding the current potential lower than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is depleted, and device is in closed condition; Can be by the current potential on grid 6 is controlled, control grid 6 times two-dimensional electron gas in corresponding raceway groove, thereby the on off state of control device raceway groove.
To back surface field plate electrode 9, can apply independently signal of telecommunication control and (also can apply the current potential identical with grid 6 or source electrode 5, the back surface field plate electrode 9 that is is as shown in Figure 6 electrically connected to grid 6, realize and the equipotential example of grid 6), and can realize the control to two-dimensional electron gas 14 concentration in its corresponding raceway groove by back surface field plate electrode 9 being added to the different signals of telecommunication.
embodiment 2consult Fig. 6, this HEMT has AlGaN/GaN.GaN specially adulterates.In AlGaN, can mix N-shaped impurity, also can not adulterate.The thickness of AlGaN is about 15 to 30nm.
This HEMT has drain electrode 4 and source electrode 5.Drain electrode 4 forms ohmic contact with source electrode 5 with AlGaN/GaN, and is connected with two-dimensional electron gas formation good electrical in raceway groove.Drain electrode 4 and source electrode 5 are to be annealed and formed ohmic contact by quick high-temp by multiple layer metal (as Ti/Al/Ti/Au or Ti/Al/Ni/Au etc.).
Further, this HEMT has grid 6, and between source electrode 5 and drain electrode 4, near the close together of source electrode 5, grid 6 is positioned on AlGaN.
Back surface field plate electrode 9 is positioned on GaN, in vertical direction with grid 6 have overlapping, and to source, drain electrode 4 directions respectively have extension (or, only extend to drain electrode 4 or source electrode 5 directions, consult and Figure 5 shows that back surface field plate electrode 9 only extends to drain electrode 4 directions).
Wherein, between back surface field plate electrode 9 and GaN, also insulating medium layer 8 can be set.
This dielectric layer 8 can be by Al
2o
3etc. formation, and can be deposited on AlGaN by the process means such as PECVD, ALD.
The supporting substrate 7 of supporting base can adopt AlN substrate, and thickness is 100 ~ 1000um, and inferior source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' can adopt Ti(50 ~ 100)/Au(50 ~ 1000nm) metal level.
This operation principle of HEMT with back surface field plate is as follows: while adding the current potential higher than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is higher, and device is in opening; While adding the current potential lower than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is depleted, and device is in closed condition; Can be by the current potential on grid 6 is controlled, control grid 6 times two-dimensional electron gas in corresponding raceway groove, thereby the on off state of control device raceway groove.
Back surface field plate electrode 9 applies and the equipotential control signal of grid 6, realizes the control to two-dimensional electron gas 14 concentration in its corresponding raceway groove.
embodiment 3consult Fig. 7, this HEMT has AlGaN/GaN.GaN specially adulterates.In AlGaN, can mix N-shaped impurity, also can not adulterate.The thickness of AlGaN is about 15 to 30nm.
This HEMT has drain electrode 4 and source electrode 5.Drain electrode 4 forms ohmic contact with source electrode 5 with AlGaN/GaN, and is connected with two-dimensional electron gas formation good electrical in raceway groove.Drain electrode 4 and source electrode 5 are to be annealed and formed ohmic contact by quick high-temp by multiple layer metal (as Ti/Al/Ti/Au or Ti/Al/Ni/Au etc.).
Further, this HEMT has grid 6, and between source electrode 5 and drain electrode 4, near the close together of source electrode 5, grid 6 is positioned on AlGaN.
Back surface field plate electrode 9 is positioned on GaN, in vertical direction with grid 6 have overlapping, and to source electrode 5, drain electrode 4 directions respectively have extension.
Wherein, between back surface field plate electrode 9 and GaN, also insulating medium layer 8 can be set.
This dielectric layer 8 can be by Al
2o
3etc. formation, and can be deposited on AlGaN by the process means such as PECVD, ALD.
The supporting substrate 7 of supporting base can adopt AlN substrate, and thickness is 100 ~ 1000um, and inferior source electrode 5 ', inferior drain electrode 4 ', inferior grid 6 ' can adopt Ti(50 ~ 100)/Au(50 ~ 1000nm) metal level.
This operation principle of HEMT with back surface field plate is as follows: while adding the current potential higher than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is higher, and device is in opening; While adding the current potential lower than threshold voltage on grid 6, in raceway groove, two-dimensional electron gas is depleted, and device is in closed condition; Can be by the current potential on grid 6 is controlled, control grid 6 times two-dimensional electron gas in corresponding raceway groove, thereby the on off state of control device raceway groove.
Back surface field plate electrode 9 applies and the equipotential control signal of source electrode 5, realizes the control to two-dimensional electron gas 14 concentration in its corresponding raceway groove.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned schemes is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of apparatus of the present invention scheme.
Claims (12)
1. a HEMT device with back surface field plate structure, comprise source electrode (5), drain electrode (4) and heterostructure, described source electrode (5) is electrically connected to by the two-dimensional electron gas being formed in heterostructure with drain electrode (4), and described source electrode (5) and drain electrode (4) form ohmic contact with heterostructure, described heterostructure comprises the first semiconductor layer (3) and the second semiconductor layer (2) setting gradually along direction initialization, the first semiconductor layer (3) is arranged between source electrode (5) and drain electrode (4), and the first semiconductor layer (3) surface is also provided with grid (6), described grid (6) forms Schottky contacts with the first semiconductor layer (3), it is characterized in that, it also comprises back surface field plate electrode (9), described back surface field plate electrode (9) is arranged at the side surface away from the first semiconductor layer (3) of the second semiconductor layer (2).
2. the HEMT device according to claim 1 with back surface field plate structure, it is characterized in that, one lateral edges of at least described back surface field plate electrode (9) extends to source electrode (5) or drain electrode (4) direction, and orthographic projection and grid (6) both sides of the edge of described back surface field plate electrode (9) are all overlapping simultaneously.
3. the HEMT device according to claim 1 with back surface field plate structure, is characterized in that, described back surface field plate electrode (9) is electrically connected to grid (6) or source electrode (5) and forms back of the body grid field plate or back of the body source field plate.
4. the HEMT device according to claim 1 with back surface field plate structure, is characterized in that, described source electrode (5) is connected with high potential with the electronegative potential of power supply respectively with drain electrode (4).
5. according to the HEMT device described in claim 1 or 2 with back surface field plate structure, it is characterized in that, extend to source electrode (5) and drain electrode (4) direction respectively the both sides of the edge of described back surface field plate electrode (9), or described back surface field plate electrode (9) only has a lateral edges to extend to source electrode (5) or drain electrode (4) direction.
6. the HEMT device according to claim 1 with back surface field plate structure, is characterized in that, when described HEMT device work, described grid (6) and back surface field plate electrode (9) are controlled by a control signal respectively.
7. the HEMT device according to claim 1 with back surface field plate structure, it is characterized in that, it also comprises supporting base, described supporting base comprises supporting substrate (7), described supporting substrate (7) is provided with time source electrode (5 '), inferior drain electrode (4 ') and time grid (6 '), and described source electrode (5 '), inferior drain electrode (4 ') and time grid (6 ') are electrically connected to described source electrode (5), drain electrode (4) and grid (6) respectively.
8. the HEMT device according to claim 1 with back surface field plate structure, is characterized in that, described the first semiconductor layer (3) layer comprises AlGaN layer, and described the second semiconductor layer (2) comprises GaN layer.
9. according to the HEMT device described in claim 1 or 8 with back surface field plate structure, it is characterized in that, the thickness of described the second semiconductor layer (2) is less than the thickness of corresponding the second semiconductor layer in existing HEMT device.
10. a preparation method with the HEMT device of back surface field plate structure, is characterized in that, comprises the steps:
(1) selecting substrate (1) heterostructure that above formation is mainly comprised of the first semiconductor layer (3) and the second semiconductor layer (2), forming the source electrode (5) of ohmic contact and drain (4) with heterostructure, and be formed at the first semiconductor layer (3) surface and form the grid (6) of Schottky contacts with the first semiconductor layer (3), thereby obtain HEMT basal body structure;
(2) remove described selected substrate (1), and at the side surface away from the first semiconductor layer (3) of this second semiconductor layer (2), back surface field plate electrode (9) is set.
11. have the preparation method of the HEMT device of back surface field plate structure according to claim 10, it is characterized in that, step (2) also comprises: after removing described selected substrate (1), this second semiconductor layer (2) is carried out to reduction processing, then on this second semiconductor layer (2), back surface field plate electrode (9) is set.
12. according to the preparation method described in claim 11 with the HEMT device of back surface field plate structure, it is characterized in that, it also comprises: this HEMT basal body structure is connected with the supporting base being mainly comprised of supporting substrate (7), and the inferior source electrode (5 '), inferior drain electrode (4 ') and time grid (6 ') that make to be distributed on described supporting substrate (7) are electrically connected to described source electrode (5), drain electrode (4) and grid (6) respectively, then remove the operation of described selected substrate (1).
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