CN103700916A - Micro-strip orthogonal plane 3dB electrical bridge - Google Patents
Micro-strip orthogonal plane 3dB electrical bridge Download PDFInfo
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- CN103700916A CN103700916A CN201310746994.7A CN201310746994A CN103700916A CN 103700916 A CN103700916 A CN 103700916A CN 201310746994 A CN201310746994 A CN 201310746994A CN 103700916 A CN103700916 A CN 103700916A
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- coupling minor
- electric bridge
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Abstract
The invention provides a micro-strip orthogonal plane 3dB electrical bridge, comprising a bottom surface microwave substrate, two symmetrical weak coupling branch knots and a strong coupling branch knot, wherein the weak coupling branch knots are printed on the bottom surface microwave substrate, and the strong coupling branch knot is connected between the two symmetrical weak coupling branch knots. The micro-strip orthogonal plane 3dB electrical bridge has the advantages that the traditional multilayer stacking strip line structure is avoided, so that the installation and the debugging are simple; the microwave plane electrical bridge and a commonly-used microwave plane circuit are easily overall distributed, so that the transition between the circuits is reduced; the size is greatly reduced, minimization is realized, and the loss is reduced.
Description
Technical field
The present invention relates to a kind of micro-band orthogonal plane 3dB electric bridge, particularly relate to a kind of a kind of micro-band orthogonal plane 3dB electric bridge being applicable in microwave regime microstrip circuit.
Background technology
The coaxial 3dB electric bridge overwhelming majority of tradition is to adopt the mode with line to realize, Figure 1 shows that band line 3dB electrical bridge principle block diagram, as can be seen from Figure 1, microwave circuit structure with line 3dB electric bridge is symmetrical, when a port is as input, corresponding coupled end, straight-through end and isolation end (ISO) are determined with regard to corresponding.Figure 2 shows that the illustraton of model with line 3dB electric bridge, according to microwave band line circuit design principle, total is divided into upper and lower metallic briquette, three layers of medium and two strip metal band lines and forms, and structure as shown in Figure 3.In order to strengthen electromagnetic coupling ability, the dielectric thickness between two strip metal band lines is generally 0.127mm, and the width of metal tape line is relevant with thickness with the dielectric constant of the medium between it.
As can be seen from Figure 3, traditional band line 3dB electric bridge physical structure is complicated, is not planar structure, is inconvenient to assemble, debugs and and other microwave circuit combination.
Summary of the invention
The technical problem to be solved in the present invention be to provide a kind of convenient for assembly, debugging micro-band orthogonal plane 3dB electric bridge.
The technical solution used in the present invention is as follows: a kind of micro-band orthogonal plane 3dB electric bridge, is characterized in that: comprise bottom surface microwave base plate, weak coupling minor matters and close coupling minor matters; Described weak coupling minor matters are printed on the microwave base plate of bottom surface; Described weak coupling minor matters are two symmetrical weak coupling minor matters; In the middle of described two weak coupling minor matters, be connected with close coupling minor matters.
As preferably, described close coupling minor matters are vertically fixed in the middle of the weak coupling minor matters of both sides.
As preferably, the quarter-wave that the length of described close coupling minor matters is its centre frequency.
As preferably, the quarter-wave that the length of described weak coupling minor matters is its centre frequency.
As preferably, gold-plated processing is done on microwave base plate surface, described bottom surface, and gold plating thickness is 2um.
As preferably, gold-plated processing is done on described close coupling minor matters surface, and gold plating thickness is 2um.
As preferably, described bottom surface microwave base plate adopts the material that dielectric constant is 3.48.
As preferably, described close coupling minor matters adopt the material that dielectric constant is 2.2.
Compared with prior art, the invention has the beneficial effects as follows:
1, avoided the band line structure of traditional multiple-layer stacked, made to install, debugging is simple;
2, this microwave planar electric bridge is easy to and conventional microwave planar circuit comp comprehensive layout, reduces the transition between circuit;
3, this structure has been dwindled widely volume, has realized miniaturization, has been reduced loss.
Accompanying drawing explanation
Fig. 1 is background technology band line 3dB electrical bridge principle block diagram.
Fig. 2 is with line 3dB electric bridge illustraton of model shown in Fig. 1.
Fig. 3 is Stripline hybrid lateral plan shown in Fig. 2.
Fig. 4 is the wherein theory diagram of an embodiment of the present invention.
Fig. 5 is micro-band plane 3dB electric bridge outline drawing embodiment illustrated in fig. 4.
Fig. 6 is the lateral plan of Fig. 5.
Fig. 7 is simulated effect figure embodiment illustrated in fig. 4.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing), unless narration especially all can be replaced by other equivalences or the alternative features with similar object.That is,, unless narration especially, each feature is an example in a series of equivalences or similar characteristics.
In the present invention, according to microwave theory, innovative design goes out a kind of micro-band orthogonal plane 3dB electric bridge based on microwave planar circuit, and through design of Simulation and test, microwave property is excellent, is easy to assembling, convenient debugging, and can and microwave planar circuit directly integrated.
As shown in Figure 4, be principle of the invention block diagram, a kind of mode of innovative design replaces the close coupling method of Stripline hybrid halved belt line, is connected with close coupling minor matters in the middle of two weak coupling minor matters.
The micro-band plane of the 2~6GHz 3dB electric bridge outline drawing of take is below specifically described as example.
As shown in Figure 5 and Figure 6, a kind of micro-band orthogonal plane 3dB electric bridge, comprises bottom surface microwave base plate, weak coupling minor matters and close coupling minor matters; Described weak coupling minor matters are printed on the microwave base plate of bottom surface; Described weak coupling minor matters are two symmetrical weak coupling minor matters; In the middle of described two weak coupling minor matters, be connected with close coupling minor matters.
Described close coupling minor matters are vertically fixed in the middle of the weak coupling minor matters of both sides, can adopt epoxy resin conduction silver to starch the modes such as the mode of sintering, scolding tin welding and fix.Two symmetrical weak coupling minor matters and middle vertical connection of close coupling minor matters, two-way output phase differs 90 degree.
The length of described close coupling minor matters is the quarter-wave of its centre frequency.
The length of described weak coupling minor matters is the quarter-wave of its centre frequency.
Gold-plated processing is done on microwave base plate surface, described bottom surface, and gold plating thickness is 2um.
Gold-plated processing is done on described close coupling minor matters surface, and gold plating thickness is 2um.
Described bottom surface microwave base plate adopts the material that dielectric constant is 3.48, and thickness is 0.508mm.
Described close coupling minor matters adopt the material that dielectric constant is 2.2, and thickness is 0.127mm, high 0.6mm.
As shown in Figure 7, for the micro-band of plane 2~6GHz 3dB electric bridge emulated data, from emulated data, can find out that two-way output amplitude unevenness is very little, port reflecting properties is excellent.
Claims (8)
1. a micro-band orthogonal plane 3dB electric bridge, is characterized in that: comprise bottom surface microwave base plate, weak coupling minor matters and close coupling minor matters; Described weak coupling minor matters are printed on the microwave base plate of bottom surface; Described weak coupling minor matters are two symmetrical weak coupling minor matters; In the middle of described two weak coupling minor matters, be connected with close coupling minor matters.
2. 3dB electric bridge according to claim 1, is characterized in that: described close coupling minor matters are vertically fixed in the middle of the weak coupling minor matters of both sides.
3. 3dB electric bridge according to claim 2, is characterized in that: the quarter-wave that the length of described close coupling minor matters is its centre frequency.
4. 3dB electric bridge according to claim 3, is characterized in that: the quarter-wave that the length of described weak coupling minor matters is its centre frequency.
5. 3dB electric bridge according to claim 2, is characterized in that: gold-plated processing is done on microwave base plate surface, described bottom surface, and gold plating thickness is 2um.
6. 3dB electric bridge according to claim 2, is characterized in that: gold-plated processing is done on described close coupling minor matters surface, and gold plating thickness is 2um.
7. 3dB electric bridge according to claim 2, is characterized in that: described bottom surface microwave base plate adopts the material that dielectric constant is 3.48.
8. 3dB electric bridge according to claim 2, is characterized in that: described close coupling minor matters adopt the material that dielectric constant is 2.2.
Priority Applications (1)
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CN201310746994.7A CN103700916A (en) | 2013-12-31 | 2013-12-31 | Micro-strip orthogonal plane 3dB electrical bridge |
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CN201310746994.7A CN103700916A (en) | 2013-12-31 | 2013-12-31 | Micro-strip orthogonal plane 3dB electrical bridge |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107104260A (en) * | 2017-06-23 | 2017-08-29 | 电子科技大学 | Multi-octave 3dB quadrature bridges |
Citations (7)
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GB1276180A (en) * | 1968-12-30 | 1972-06-01 | Texas Instruments Inc | Interdigitated strip line coupler |
CN201210511Y (en) * | 2008-04-24 | 2009-03-18 | 杭州紫光网络技术有限公司 | Wide frequency 3dB electric bridge |
CN101436703A (en) * | 2007-11-14 | 2009-05-20 | 深圳国人通信有限公司 | Microwave low-waveband ultra-minitype 3dB sawtooth coupling quadrature electric bridge |
CN101950840A (en) * | 2010-09-30 | 2011-01-19 | 浙江纺织服装职业技术学院 | Air strip line bridge |
CN202888377U (en) * | 2012-10-31 | 2013-04-17 | 合肥扬帆通信元器件有限公司 | Five-stage microstrip line bridge |
CN202997026U (en) * | 2012-12-21 | 2013-06-12 | 上海联影医疗科技有限公司 | 3db bridge power divider |
CN103326099A (en) * | 2013-06-18 | 2013-09-25 | 三维通信股份有限公司 | Compact broadband high-balance-degree allocator |
-
2013
- 2013-12-31 CN CN201310746994.7A patent/CN103700916A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1276180A (en) * | 1968-12-30 | 1972-06-01 | Texas Instruments Inc | Interdigitated strip line coupler |
CN101436703A (en) * | 2007-11-14 | 2009-05-20 | 深圳国人通信有限公司 | Microwave low-waveband ultra-minitype 3dB sawtooth coupling quadrature electric bridge |
CN201210511Y (en) * | 2008-04-24 | 2009-03-18 | 杭州紫光网络技术有限公司 | Wide frequency 3dB electric bridge |
CN101950840A (en) * | 2010-09-30 | 2011-01-19 | 浙江纺织服装职业技术学院 | Air strip line bridge |
CN202888377U (en) * | 2012-10-31 | 2013-04-17 | 合肥扬帆通信元器件有限公司 | Five-stage microstrip line bridge |
CN202997026U (en) * | 2012-12-21 | 2013-06-12 | 上海联影医疗科技有限公司 | 3db bridge power divider |
CN103326099A (en) * | 2013-06-18 | 2013-09-25 | 三维通信股份有限公司 | Compact broadband high-balance-degree allocator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107104260A (en) * | 2017-06-23 | 2017-08-29 | 电子科技大学 | Multi-octave 3dB quadrature bridges |
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Application publication date: 20140402 |