CN103700653B - LED (Light-Emitting Diode) light source packaging structure - Google Patents
LED (Light-Emitting Diode) light source packaging structure Download PDFInfo
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- CN103700653B CN103700653B CN201310684275.7A CN201310684275A CN103700653B CN 103700653 B CN103700653 B CN 103700653B CN 201310684275 A CN201310684275 A CN 201310684275A CN 103700653 B CN103700653 B CN 103700653B
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- base plate
- cover plate
- led chip
- light source
- led
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Abstract
The invention relates to an LED (Light-Emitting Diode) light source packaging structure, which comprises an LED chip, a bottom plate and a cover plate. The LED chip is fixedly arranged on the bottom plate. The cover plate covers the bottom plate. A holding tank is formed after the cover plate and the bottom plate are closed and is used for holding the LED chip. Transparent colloids are arranged in the holding tank to cover the LED chip. The LED chip is in hot connection with the bottom plate. The bottom plate is integrally made of a transparent or semi-transparent heat conducting material by mixing with fluorescent powder. The cover plate is made of a transparent or semi-transparent material and fluorescent powder is arranged on the cover plate at a position corresponding to the LED chip. The LED light source packaging structure not only can realize large-angle light emission, but also has the advantage of high heat dissipating efficiency.
Description
Technical field
The present invention relates to LED light source field, particularly to a kind of LED light source encapsulating structure.
Background technology
LED light source is the new light sources of environmental protection, has been widely used in lighting field at present, currently, existing led on market
Encapsulating structure has multiple, and the packing forms of current 4 π LED light sources mainly have: one be chip is arranged on transparency carrier carry out straight
Connect encapsulation；Two is that chip is installed on transparency carrier, is then encapsulated in the transparent unit scribble phosphor powder layer.Existing 4 π
LED light source has individually transparent substrate, deposits led chip package on substrate and in the form of coating phosphor powder layer simultaneously
The hidden danger coming off in fluorescent material, poor reliability.Also there are the packing forms mixing using fluorescent material with transparent resin, for example at present
Authorized announcement date is on November 27th, 2013, and Authorization Notice No. is that the Chinese utility model patent of cn203309561u discloses one
Plant the LED light source module of specular removal, including transparency carrier 1, led chip array is fixed with transparency carrier 1, led chip battle array
One layer of potting resin 3 of overall parcel outside row and transparency carrier, the LED light source module packaging technical that so encapsulation is formed is complicated, and deposits
The big heat-sinking capability of thermal resistance low, resin is aging the problems such as, thus largely effecting on and shorten the performance and used life of led chip.
Content of the invention
In view of this it is necessary to provide that a kind of structure is simple, the LED light source encapsulating structure of good reliability.
A kind of LED light source encapsulating structure, including led chip, base plate and cover plate, described led chip is fixing on which floor plate, this lid
Plate covers on which floor plate, and this cover plate and this base plate form accepting groove to house described led chip after covering, and are provided with this accepting groove
Transparent colloid coats this led chip, and this led chip is thermally coupled with this base plate, and this base plate is mixed by transparent or semitransparent Heat Conduction Material
Close fluorescent material to be made into integration, this cover plate is made up of transparent or semitransparent material and is corresponded to described led chip thereon and is provided with fluorescent material.
Compared with prior art, these led chips located at this cover plate and this base plate cover after in the accepting groove that formed and by transparent colloid
Cladding, the light that these led chips send can be simultaneously to this cover plate and the transmitting of this base plate, and this cover plate and this base plate are by transparent or half
Transparent material is made, and light excites the fluorescent material of both to dissipate to surrounding simultaneously and realize 360 full angles and light.So, due to
This led chip is directly thermally coupled to be arranged on this base plate, and this base plate is provided with fluorescent material and is joined directly together with the external world so that this led
Illuminating source packaging structure not only enables wide-angle and lights, and has the advantages that radiating efficiency is high.
Brief description
Fig. 1 is the generalized section of LED light source encapsulating structure first embodiment of the present invention.
Fig. 2 is the sectional view in the a-a line direction along along Fig. 1.
Fig. 3 is the partial enlarged drawing of b part in Fig. 2.
Description of reference numerals:
10 led chip, 20 base plate 30 cover plate
40 accepting groove, 50 transparent colloid 60 gold thread
70 conducting end, 21 trapezoidal groove 31 light output groove
Specific embodiment
With specific embodiment, the present invention is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of LED light source encapsulating structure first embodiment of the present invention.Refer to Fig. 1, this LED light source seals
Assembling structure includes led chip 10, base plate 20 and cover plate 30, and these led chips 10 are fixed on this base plate 20, these led
Chip 10 is thermally coupled with this base plate 20.
Refer to Fig. 1 to Fig. 3, this base plate 20 be made into integration by transparent or semitransparent Heat Conduction Material mixed fluorescent powder it is preferred that
This base plate 20 has good chemical compatibility by fluorescent material and with fluorescent material and infiltrating transparent high heat conduction inorganic material is made.Should
It is as shown in Figure 3 that base plate 20 is provided with trapezoidal groove 21(), these led chips 10 are fixed on the bottom of this trapezoidal groove 21, should
The two side of trapezoidal groove 21 goes out the curved wall structure of light for ease of these led chips 10.Including multiple led chips 10,
A plurality of gold thread 60 and two conducting end 70, these led chips 10 are connected in series by gold thread 60, and these conducting end 70 are passed through
Gold thread 60 is respectively electrically connected to the both sides of this led chip 10, and these conducting end 70 are located at the two ends of this base plate 20 respectively.Should
Base plate 20 and this cover plate 30 are semicylinder structure, and this base plate 20 forms column structure after covering with cover plate 30.
Refer to Fig. 1 to Fig. 3, this cover plate 30 covers on this base plate 20, pass through between this cover plate 30 and this base plate 20 to lead
Hot glue is thermally coupled.This cover plate 30 material therefor is identical with this base plate 20, and this cover plate 30 is made up and it of transparent or semitransparent material
The described led chip 10 of upper correspondence is provided with fluorescent material.This cover plate 30 forms accepting groove 40 to house this after covering with this base plate 20
A little led chips 10, are provided with transparent colloid 50 and coat this led chip 10, this transparent colloid 50 is led by height in this accepting groove 40
Hot material is made, and this transparent colloid 50 is thermally coupled with this cover plate 30.This cover plate 30 is provided with light output groove 31, this light output groove 31
Cooperatively form this accepting groove 40 with this trapezoidal groove 21, the shape of this light output groove 31 goes out light for ease of described led chip 10
Deep-slotted chip breaker.
In sum, these led chips 10 located at this cover plate 30 and this base plate 20 cover after in the accepting groove 40 that formed and quilt
Transparent colloid 50 coats, and the light that these led chips 10 send can be simultaneously to this cover plate and the transmitting of this base plate, this cover plate 30
It is made up of transparent or semitransparent material with this base plate 20, light excites the fluorescent material of both to dissipate to surrounding and realize 360 full-shapes
Degree is luminous.So, it is arranged on this base plate 20 because these led chips 10 are directly thermally coupled, this base plate 20 is provided with fluorescence
Powder and being joined directly together with the external world, the heat on led chip 10 directly can diffuse to the external world by this base plate 20, and this allows for this
LED light source encapsulating structure not only enables wide-angle and lights, and has the advantages that radiating efficiency is high.Additionally, this base plate 20 sets
Have the trapezoidal groove 21 of curved wall and this cover plate 30 to be provided with the light output groove 31 of arc, cooperatively form this accepting groove 40 so that this
The light that a little led chips 10 send is respectively evenly.Additionally, these led chips 10 produce a heat part directly by with
This base plate 20 of its hot linked high heat conduction distributes, and another part is delivered to this cover plate by this transparent colloid 50 of high heat conduction
Distribute on 30, due to achieving comprehensive radiating using this transparent colloid 50 so that this LED light source encapsulating structure
Radiating is more preferably.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, any those skilled in the art are not taking off
In this programme technical scope, make the Equivalent embodiments for equal change of few modifications using the technology contents of above-mentioned exposure.But
All disengaging technical solution of the present invention content, according to the technology of the present invention essence to any modification made for any of the above embodiments, equivalent,
Improve etc., should be included within the scope of protection of the invention.
Claims (8)
1. a kind of LED light source encapsulating structure, including led chip, base plate and cover plate, described led chip is fixed on this base plate
Upper it is characterised in that: this cover plate covers on which floor plate, and this cover plate and this base plate form accepting groove to house described led after covering
Chip, is provided with transparent colloid and coats this led chip, this led chip is thermally coupled with this base plate in this accepting groove, this base plate by
Transparent or semitransparent Heat Conduction Material mixed fluorescent powder is made into integration, and this cover plate is made up of transparent or semitransparent material and is corresponded to thereon
Described led chip is provided with fluorescent material.
2. LED light source encapsulating structure according to claim 1 it is characterised in that: this base plate is by fluorescent material and and fluorescent material
There is good chemical compatibility and infiltrating transparent heat conduction inorganic material is made.
3. LED light source encapsulating structure according to claim 1 it is characterised in that: this transparent colloid is made from a material that be thermally conductive,
This transparent colloid is thermally coupled with this cover plate.
4. LED light source encapsulating structure according to claim 1 it is characterised in that: this base plate is provided with trapezoidal groove, described
Led chip is fixed on the bottom of this trapezoidal groove, and the two side of this trapezoidal groove is for ease of the curved side of described led chip light-emitting
Wall construction.
5. LED light source encapsulating structure according to claim 4 it is characterised in that: this cover plate is provided with light output groove, and this goes out
Light groove and this trapezoidal groove cooperatively form this accepting groove, and the shape of this light output groove is for ease of the deep-slotted chip breaker of described led chip light-emitting.
6. the LED light source encapsulating structure according to any one of claim 1-5 it is characterised in that: this cover plate material therefor
Identical with this base plate, pass through heat-conducting glue between this cover plate and this base plate thermally coupled.
7. LED light source encapsulating structure according to claim 6 it is characterised in that: this base plate and this cover plate are semicolumn
Body structure, this base plate and cover plate form column structure after covering.
8. LED light source encapsulating structure according to claim 1 it is characterised in that: include multiple led chips, a plurality of
Gold thread and two conducting end, described led chip is connected in series by gold thread, and described conducting end is respectively electrically connected to this by gold thread
The both sides of led chip, described conducting end is located at the two ends of this base plate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684275.7A CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684275.7A CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103700653A CN103700653A (en) | 2014-04-02 |
| CN103700653B true CN103700653B (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310684275.7A Active CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895788A (en) * | 2014-05-08 | 2016-08-24 | 罗冠杰 | Sheet type white light emitting diode, method for preparing sheet type white light emitting diode and packaging adhesive material |
| EP2942825B1 (en) * | 2014-05-08 | 2020-04-15 | Guan-Jie Luo | White light emitting diode, manufacturing method |
| CN104300073A (en) * | 2014-11-04 | 2015-01-21 | 常州晶玺照明有限公司 | 360-degree complete cycle type LED lamp filament based on purple light chips |
| WO2016109941A1 (en) * | 2015-01-06 | 2016-07-14 | 厦门星际电器有限公司 | Improved all-plastic led lamp |
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| KR100769191B1 (en) * | 2004-03-22 | 2007-10-23 | 엘지.필립스 엘시디 주식회사 | flat fluorescent lamp and method for manufacturing the same |
| CN103035823A (en) * | 2012-12-18 | 2013-04-10 | 浙江中宙光电股份有限公司 | Fluorescent powder body capable of exciting light-emitting diode (LED) white light |
| CN103441205B (en) * | 2013-08-22 | 2016-12-28 | 厦门多彩光电子科技有限公司 | A kind of 360 ° of luminous LED component |
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| CN201126826Y (en) * | 2007-09-05 | 2008-10-01 | 昌鑫光电（东莞）有限公司 | Light emitting diode capable of bidirectional luminescence and heat radiation |
| CN202338805U (en) * | 2011-11-29 | 2012-07-18 | 苏州晶能科技有限公司 | LED (light-emitting diode) transparent light-emitting device capable of enhancing heat dissipation |
| CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
| CN103367622A (en) * | 2013-07-05 | 2013-10-23 | 江苏华英光宝科技股份有限公司 | Full-angle luminous LED (light emitting diode) support frame as well as LED lamp post comprising support frame and preparation method of LED lamp post |
| CN103398316A (en) * | 2013-08-27 | 2013-11-20 | 江苏华英光宝科技股份有限公司 | High-transparency ultrathin quartz crystal heat-radiation panel LED (Light Emitting Diode) light source |
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
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| CN103700653A (en) | 2014-04-02 |
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Effective date of registration: 20170119 Address after: Xingtai Industrial Park Economic Development Zone, Changtai County, Fujian city of Zhangzhou province 363999 Patentee after: ZHANGZHOU LIDAXIN PHOTOELECTRON TECHNOLOGY CO., LTD. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |