CN103698981A - PCB (Printed Circuit Board) exposure energy test jig as well as preparation method and application thereof - Google Patents
PCB (Printed Circuit Board) exposure energy test jig as well as preparation method and application thereof Download PDFInfo
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- CN103698981A CN103698981A CN201310641731.XA CN201310641731A CN103698981A CN 103698981 A CN103698981 A CN 103698981A CN 201310641731 A CN201310641731 A CN 201310641731A CN 103698981 A CN103698981 A CN 103698981A
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Abstract
The invention relates to a PCB (Printed Circuit Board) exposure energy test jig as well as a preparation method and application of the PCB exposure energy test jig. The structure of the PCB exposure energy test jig comprises a black negative film and an exposure guide rule, wherein the exposure guide rule is embedded at the center of the black negative film; the both ends of the exposure guide rule along the length direction are fixedly arranged on the black negative film by using a shading adhesive tape. According to the PCB exposure energy test jig provided by the invention, the exposure guide rule is fixedly arranged on the black negative film, so that the position of the exposure guide rule on the PCB is changed when the next exposure is performed; an exposure guide rule does not need to be repeatedly adhered; white shading paper does not need to be used for covering. Therefore, the labor and the material are saved; the production efficiency is improved.
Description
Technical field
The present invention relates to semiconductor applications, relate in particular to a kind of PCB exposure energy measurement jig and preparation method thereof and application.
Background technology
In wiring board industry now, each exposure all needs to test energy lattice number before producing, the light intensity that exposes to the sun, the energy that need to set while judging according to this corresponding product exposure.At present, common way is as shown in Fig. 1 a～1d, and the first step, is to be attached at respectively pcb board 1 by exposure guide rule 3 with for the blank sheet of paper 2 of shading, as shown in Figure 1a; Second step, exposes for the first time, and as shown in Figure 1 b, the below of exposure guide rule 3 produces exposure energy lattice number 4 for the first time to the result of exposure for the first time, and the below of shading blank sheet of paper 2 is photosensitive region 5 not; The 3rd step, as shown in Fig. 1 c, with blank sheet of paper 2 exposure energy lattice number 4 coverings for the first time, prevents sensitization again, and exposure guide rule 3 is positioned over to not photosensitive region 5 places; The 4th step, adjusting exposure parameter exposes for the second time, the result of exposure as shown in Figure 1 d for the second time, be on described pcb board, to present exposure energy lattice number 4 and for the second time exposure energy lattice number 6 for the first time, according to the result of above-mentioned double exposure, the energy that need to set while judging corresponding product exposure, certainly, also can prepare multiple blank sheet of paper 2 to complete multiexposure, multiple exposure.
In aforesaid way, each exposure all needs the position of blank sheet of paper 2 and exposure guide rule 3 to adjust, and wastes time and energy, and work efficiency is lower.
Summary of the invention
The invention provides a kind of PCB exposure energy measurement jig and preparation method thereof and application, the problem wasting time and energy to solve existing PCB exposure energy test process.
For solving the problems of the technologies described above, the invention provides a kind of PCB exposure energy measurement jig, comprise: black egative film and exposure guide rule, described exposure guide rule is embedded in the central authorities of described black egative film, and described exposure guide rule two ends are along its length fixed on described black egative film with shading rubber belt.
Preferably, the length dimension of described black egative film is 12.5～30cm, and width dimensions is 25～27cm.
The present invention also provides the method for making of above-mentioned PCB exposure energy measurement jig, and it comprises the following steps:
S11: get black egative film;
S12: make the strip opening that a size with described exposure guide rule matches in the central authorities of described black egative film;
S13: described exposure guide rule is embedded in described strip opening, and exposure guide rule two ends are along its length fixed on described black egative film with shading rubber belt.
The present invention also provides the application of above-mentioned PCB exposure energy measurement jig, and it comprises the following steps:
S21: described PCB exposure energy measurement jig is positioned on pcb board, exposes for the first time;
S22: the Width along described exposure guide rule moves described PCB exposure energy measurement jig, exposes next time;
S23: repeating step S22, until exposure has been tested.
PCB exposure energy measurement jig provided by the invention and preparation method thereof and application, its structure comprises: black egative film and exposure guide rule, described exposure guide rule is embedded in the central authorities of described black egative film, and described exposure guide rule two ends are along its length fixed on described black egative film with shading rubber belt.The present invention is by being fixed on described exposure guide rule on described black egative film, when the position of change exposure guide rule on pcb board carries out exposing next time, without repeating to paste exposure guide rule, and without using shading blank sheet of paper to hide, thereby use manpower and material resources sparingly, enhance productivity.
Accompanying drawing explanation
Fig. 1 a to 1d is the flow chart of steps of existing PCB exposure energy test;
Fig. 2 is the cut-open view of the PCB exposure energy measurement jig of the embodiment of the invention;
Fig. 3 is the method for making process flow diagram of the PCB exposure energy measurement jig of the embodiment of the invention;
The manufacturing process figure of the PCB exposure energy measurement jig that Fig. 4 a to 4c is the embodiment of the invention;
Flow chart of steps when the PCB exposure energy measurement jig that Fig. 5 a to 5b is the embodiment of the invention is applied to exposure test.
In Fig. 1 a to 1d: 1-PCB plate, 2-blank sheet of paper, 3-exposure guide rule, 4-be exposure energy lattice number, 5-photosensitive region, 6-exposure energy lattice number for the second time not for the first time;
In Fig. 2 to 5b: 10-PCB plate, 20-PCB exposure energy measurement jig, 21-black egative film, 22-strip opening, 23-exposure guide rule, 24-shading rubber belt.
Embodiment
For the technical scheme of more detailed statement foregoing invention, below list specific embodiment and carry out Proof Technology effect; It is emphasized that these embodiment are not limited to limit the scope of the invention for the present invention is described.
Please emphasis with reference to figure 2, and in conjunction with Fig. 3 to 5b, PCB exposure energy measurement jig 20 provided by the invention, comprise: black egative film 21 and exposure guide rule 23, described exposure guide rule 23 is embedded in the central authorities of described black egative film 21, and the described exposure guide rule 23 along its length two ends of (being the Y-direction in Fig. 4 c) is fixed on described black egative film 21 with shading rubber belt 24.The present invention is by being fixed on described exposure guide rule 23 on described black egative film 21, when the position of change exposure guide rule 23 on pcb board 10 carries out exposing next time, without repeating to paste exposure guide rule 23, and without using shading blank sheet of paper to hide, thereby use manpower and material resources sparingly, enhance productivity.
Preferably, the length dimension of described black egative film 21 is 12.5～30cm, and width dimensions is 25～27cm.
Please emphasis with reference to figure 3 and Fig. 4 a to 4c, the present invention also provides the method for making of PCB exposure energy measurement jig 20 as above, it comprises the following steps:
S11: get black egative film 21, compared to shading blank sheet of paper of the prior art, described black egative film 21 has better shaded effect, and black egative film 21 can select waste and old black egative film, can not produce unnecessary cost, and play the effect of salvaging;
S12: make the strip opening 22 that a size with described exposure guide rule 23 matches in the central authorities of described black egative film 21, in the present embodiment, the length and width of described strip opening 22 are respectively 24cm*2.8cm(± 0.1cm), to adapt to the size of described exposure guide rule 23;
S13: described exposure guide rule 23 is embedded in described strip opening 22, and exposure guide rule 23 two ends are along its length fixed on described black egative film 21 with shading rubber belt 24.
Said method is simple to operate, can repeatedly use, and do not have extra cost to produce after completing.
Please emphasis with reference to figure 5a to 5b, the present invention also provides the application of PCB exposure energy measurement jig 20 as above, it comprises the following steps:
S21: described PCB exposure energy measurement jig 20 is positioned on pcb board 10, exposes for the first time;
S22: the mobile described PCB exposure energy measurement jig 20 of Width (being the directions X in Fig. 5 b) along described exposure guide rule 23 exposes next time;
S23: repeating step S22, until exposure has been tested.
Apply in the process that described PCB exposure energy measurement jig 20 completes exposure test, only the position of PCB exposure energy measurement jig 20 integral body need be finely tuned, as shown in the dotted portion in Fig. 5 b, can complete exposure test repeatedly, particularly, different according to the length of the black egative film 21 of making, can complete 2～5 exposures, particularly, when the length dimension of black egative film 21 is 12.5cm, can carry out 5 exposures; When the length dimension of black egative film 21 is 30cm, can carry out 2 exposures, said method is simple to operate, saves time, and then can enhance productivity.
In sum, PCB exposure energy measurement jig 20 provided by the invention and preparation method thereof and application, its structure comprises: black egative film 21 and exposure guide rule 23, described exposure guide rule 23 is embedded in the central authorities of described black egative film 21, and described exposure guide rule 23 two ends are along its length fixed on described black egative film 21 with shading rubber belt 24.The present invention is by being fixed on described exposure guide rule 23 on described black egative film 21, when the position of change exposure guide rule 23 on pcb board 10 carries out exposing next time, without repeating to paste exposure guide rule 23, and without using shading blank sheet of paper to hide, thereby use manpower and material resources sparingly, enhance productivity.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these change and modification.
Claims (4)
1. a PCB exposure energy measurement jig, is characterized in that, comprising: black egative film and exposure guide rule, and described exposure guide rule is embedded in the central authorities of described black egative film, and described exposure guide rule two ends are along its length fixed on described black egative film with shading rubber belt.
2. PCB exposure energy measurement jig as claimed in claim 1, is characterized in that, the length dimension of described black egative film is 12.5～30cm, and width dimensions is 25～27cm.
3. the method for making of PCB exposure energy measurement jig as claimed in claim 1 or 2, is characterized in that, it comprises the following steps:
S11: get black egative film;
S12: make the strip opening that a size with described exposure guide rule matches in the central authorities of described black egative film;
S13: described exposure guide rule is embedded in described strip opening, and exposure guide rule two ends are along its length fixed on described black egative film with shading rubber belt.
4. the application of PCB exposure energy measurement jig as claimed in claim 1 or 2, is characterized in that, it comprises the following steps:
S21: described PCB exposure energy measurement jig is positioned on pcb board, exposes for the first time;
S22: the Width along described exposure guide rule moves described PCB exposure energy measurement jig, exposes next time;
S23: repeating step S22, until exposure has been tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310641731.XA CN103698981A (en) | 2013-12-03 | 2013-12-03 | PCB (Printed Circuit Board) exposure energy test jig as well as preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310641731.XA CN103698981A (en) | 2013-12-03 | 2013-12-03 | PCB (Printed Circuit Board) exposure energy test jig as well as preparation method and application thereof |
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| CN103698981A true CN103698981A (en) | 2014-04-02 |
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| CN201310641731.XA Pending CN103698981A (en) | 2013-12-03 | 2013-12-03 | PCB (Printed Circuit Board) exposure energy test jig as well as preparation method and application thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003262956A (en) * | 2002-03-12 | 2003-09-19 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using the same, method for manufacturing resist pattern and method for manufacturing printed wiring board |
| WO2005050318A1 (en) * | 2003-11-19 | 2005-06-02 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| CN201749292U (en) * | 2010-07-14 | 2011-02-16 | 深圳市深联电路有限公司 | Exposing energy uniformity testing device |
| CN202008575U (en) * | 2011-04-12 | 2011-10-12 | 徐瑜繁 | Printed circuit board developing and exposing negative film |
| CN103019044A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Method for detecting exposure energy of circuit board |
-
2013
- 2013-12-03 CN CN201310641731.XA patent/CN103698981A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003262956A (en) * | 2002-03-12 | 2003-09-19 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using the same, method for manufacturing resist pattern and method for manufacturing printed wiring board |
| WO2005050318A1 (en) * | 2003-11-19 | 2005-06-02 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| CN201749292U (en) * | 2010-07-14 | 2011-02-16 | 深圳市深联电路有限公司 | Exposing energy uniformity testing device |
| CN202008575U (en) * | 2011-04-12 | 2011-10-12 | 徐瑜繁 | Printed circuit board developing and exposing negative film |
| CN103019044A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Method for detecting exposure energy of circuit board |
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Application publication date: 20140402 |