CN103684386B - High-pressure solid switch - Google Patents
High-pressure solid switch Download PDFInfo
- Publication number
- CN103684386B CN103684386B CN201310653366.4A CN201310653366A CN103684386B CN 103684386 B CN103684386 B CN 103684386B CN 201310653366 A CN201310653366 A CN 201310653366A CN 103684386 B CN103684386 B CN 103684386B
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- Prior art keywords
- single layer
- layer board
- insulating cylinder
- solid switch
- power electronic
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- 239000007787 solid Substances 0.000 title claims abstract description 42
- 239000002356 single layer Substances 0.000 claims abstract description 66
- 238000009413 insulation Methods 0.000 claims abstract description 27
- 230000005684 electric field Effects 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 8
- 238000012216 screening Methods 0.000 claims description 8
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- 244000273618 Sphenoclea zeylanica Species 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000013461 design Methods 0.000 description 9
- 239000013307 optical fiber Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
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- 230000005669 field effect Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 230000009194 climbing Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- 230000008439 repair process Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Gas-Insulated Switchgears (AREA)
Abstract
The invention discloses a high-pressure solid switch which comprises an insulation cylinder, a plurality of single-layer circuit boards and electrodes. The single-layer circuit boards are arranged in the insulation cylinder in an overlapping mode. Each single-layer circuit board is used for placing of a power electronic device and an auxiliary circuit of the power electronic device. The electrodes are used for being connected with the single-layer circuit boards and a uniform electric field. According to the high-pressure solid switch, the problem existing in the arrangement structure of power electronic devices in the prior art is solved, and the effect that the power electronic devices are compact in arrangement structure, small in size, high in voltage-withstanding level, low in partial-discharge level, easy to expand and great in performance is achieved.
Description
Technical field
The present invention relates to field of electrical equipment, in particular to a kind of high-pressure solid switch.
Background technology
Flourishing with power electronic devices and correlation technique, increasing high-tension apparatus can be electric by electric power
Sub- device and Power Electronic Technique are realized controlling and transformation of electrical energy.But the resistance to voltage levels of single power electronic devices are extremely limited,
Be applied to voltage levels occasion when, high voltage need to be born by way of multiple series connection.Typical application such as high straightening
Flow the converter valve in field of power transmission, the high-pressure solid switch in Pulse Power Techniques etc., be required for a lot of level power electronic devices
Series connection and used in parallel.Taking high-pressure solid switch as a example it is briefly described below.High-pressure solid switch generally adopts multistage
Power metal-oxide layer semiconductcor field effect transistor (metal oxide semiconductor field-effect
Transistor, abbreviation mosfet) or insulated gate bipolar transistor (insulated gate bipolar transisto,
Abbreviation igbt) or the power electronic devices string connection in series-parallel such as IGCT (silicon controlled rectifier, abbreviation scr)
Form, its difficult point includes driving the design of insulation and quiet dynamic voltage balancing between the synchronous triggering of energy supply, driving, level.Therefore design good
Good drive circuit electric energy supplies, drive circuit synchronously triggering, the mutually insulated of tandem drive circuit at different levels and series power
Quiet dynamic voltage balancing between electronic device is to ensure that high-pressure solid switch stablizes the premise of trouble free service.
Existing high-pressure solid switch firing control mainly includes electromagnetism triggering and controls and two kinds of optical fiber triggering control.Electricity
Magnetic triggering mode core devices are pulse transformers, are based on electromagnetic coupled principle, by the trigger of electronegative potential through extra pulse
It is sent to high-potential thyristor gate leve after transformer isolation, realize Multi-path synchronous triggering；Optical fiber triggering core devices be optical fiber cable,
Photocurrent generator and receiver, are based on photoelectric conversion and fiber optic communication principle, trigger is sent to high-pressure side by optical fiber,
Drive the gate pole of each power electronic devices after treatment, realize Multi-path synchronous triggering.Described triggering control is required for solving
Low-voltage control signal is designed and location problem with the electric insulation under high-voltage electromagnetic environment.Conventional way is mainly along high pressure
The direction that side potential reduces is disposed vertically downward power electronic devices at different levels and its auxiliary circuit.Either electromagnetism triggering controlling party
Formula, or optical fiber firing control all can exist, and wiring is complicated, expensive, design is loaded down with trivial details, equipment volume is big, degraded performance
Etc. obvious shortcoming, these shortcomings seriously govern using and promoting and the aspect such as integrated of high-tension apparatus.Specifically:
(1) wiring is complicated, it is loaded down with trivial details to design.The control module of single-stage power electronic devices need with external connection control line with
And energy hole line, because general series is more, wiring becomes complicated, and global design seems loaded down with trivial details.
(2) expensive, bulky.Due to needing the problems for consideration insulation at different levels, often exist when being arranged vertically
The problem turning over so that the insulation at low voltage designs repeatedly, whole equipment bulky, insulation costs etc. are big
Width rises.
(3) degraded performance.It is that the power electronic devices needing plural serial stage is synchronously led to during high-tension electricity electronic device works
Disconnected, and bulky, spacing layout designs farther out are unfavorable for realizing synchronous, lead to whole hydraulic performance decline.
The problems of layout structure for power electronic devices in correlation technique, not yet proposes effectively to solve at present
Certainly scheme.
Content of the invention
Present invention is primarily targeted at providing a kind of high-pressure solid switch, this high-pressure solid switch is also referred to as switchgear,
To solve the problems of layout structure of power electronic devices in prior art.
To achieve these goals, according to an aspect of the invention, it is provided a kind of high-pressure solid switch, comprising: absolutely
Edge cylinder；Single layer board, the quantity of single layer board is multiple, and multiple single layer board are stacked to be arranged in insulating cylinder, often
Individual single circuit is used to arrange the auxiliary circuit of power electronic devices and power electronic devices；And electrode, many for connecting
Individual single layer board and uniform electric field.
Further, high-pressure solid switch also includes: base, is connected with insulating cylinder；And grading ring, it is set in insulation
On cylinder.
Further, single layer board is circular circuit board, and single layer board includes: center cable hole, is arranged on individual layer
The circle centre position of circuit board；First installing hole, the quantity of the first installing hole is multiple, and multiple first installing holes are uniformly arranged individual layer electricity
On the plate of road, for installing power electronic devices；And second installing hole, the quantity of the second installing hole is multiple, multiple second peaces
Dress hole is uniformly arranged in single layer board, and for installing the auxiliary circuit of power electronic devices, insulating cylinder has and center cabling
The axis hollow stem matching in hole.
Further, electrode includes: goes out line electrode；And screening electrodes, screening electrodes are annular, and single layer board is also wrapped
Include: electrode connecting hole, for installing out line electrode；And insulative air gap, wherein, the carrying voltage of insulative air gap first side is more than
Or be equal to single layer board any voltage, insulative air gap second side carry voltage be less than or equal to single layer board arbitrary
Voltage, and the voltage that carries of insulative air gap is more than the first difference carrying voltage and the second carrying voltage, the first side and second
Side is the opposite sides of insulative air gap, and the first carrying voltage is the carrying voltage of the first side, and the second carrying voltage is the second side
Carry voltage.
Further, axis hollow stem and the outer wall of insulating cylinder are structure as a whole.
Further, power electronic devices and power electronic devices auxiliary circuit constitute multi-level pmultistage circuit, wherein, first away from
From the pitch-row more than or equal to power electronic devices, the first distance is any two in multiple second installing holes of adjacent level circuit
The distance between adjacent installing hole.
Further, high-pressure solid switch also includes: drive control line, drive control line by center cable hole connect to
Auxiliary circuit.
Further, high-pressure solid switch also includes: insulation filling medium, is filled in insulating cylinder, is used for fixing individual layer
Circuit board, single layer board also includes: steam vent.
Further, the material of insulation filling medium is epoxy resin, and the relative dielectric constant of insulation filling medium
More than or equal to 2.5.
Further, the quantity of insulating cylinder is multiple, all lays multiple single layer board, wherein in each insulating cylinder: with
Equipotential points on adjacent monolayer circuit board in one insulating cylinder adopt guide rod to connect, and the equipotential points of adjacent insulating cylinder adopt ripple
Pipe or guide rod connect.
The present invention adopts the high-pressure solid switch of following layout structure: insulating cylinder；Single layer board, the number of single layer board
Measure as multiple, multiple single layer board are stacked to be arranged in insulating cylinder, each single circuit is used to arrange power electronics device
Part and the auxiliary circuit of power electronic devices；And electrode, for connecting multiple single layer board and uniform electric field.By in list
Layer circuit board arranges the auxiliary circuit of power electronic devices and power electronic devices, and by multiple single layer board with overlapped way
It is arranged in it is achieved that designing the high-pressure solid switch of a kind of compact conformation, small volume and permissible in insulating cylinder in insulating cylinder
Place several single layer board, the power electronic devices series connection of a lot of levels can lift overall resistance to voltage levels, meanwhile, individual layer
All can easily connect between circuit board and insulating cylinder and extend, compact layout is advantageously implemented multistage Synchronization Control, whole
The synchronism of body is more excellent and cut-offs speed faster, solves asking existing for the layout structure of power electronic devices in prior art
Topic, and then reached and ensure that the compact layout and structure of power electronic devices, small volume, resistance to voltage levels are high, office's zoom level is low, be easy to
Extension, the effect of superior performance.
Brief description
The accompanying drawing constituting the part of the application is used for providing a further understanding of the present invention, the schematic reality of the present invention
Apply example and its illustrate, for explaining the present invention, not constituting inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the schematic diagram of high-pressure solid switch according to embodiments of the present invention；And
Fig. 2 is the end view of Fig. 1 mesohigh solid switch.
Specific embodiment
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can phases
Mutually combine.To describe the present invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
Embodiments provide a kind of high-pressure solid switch, this high-pressure solid switch is also referred to as switchgear, right below
The high-pressure solid switch that the embodiment of the present invention is provided is specifically introduced:
Fig. 1 is the schematic diagram of high-pressure solid switch according to embodiments of the present invention, and Fig. 2 is Fig. 1 mesohigh solid switch
End view, as depicted in figs. 1 and 2, high-pressure solid switch includes insulating cylinder 10, single layer board 20 and electrode, electrode bag
Include line electrode 31 and screening electrodes (not shown), single layer board 20 is the pcb circuit board of individual layer, wherein:
The quantity of single layer board 20 is multiple, and multiple single layer board 20 are stacked to be arranged in insulating cylinder 10, each
Single circuit is used to arrange the auxiliary circuit of power electronic devices and power electronic devices, auxiliary circuit includes power electronics device
The driving protection location of part and homogenous cell etc..Electrode is used for connecting multiple single layer board 20 and uniform electric field.
The high-pressure solid switch that the embodiment of the present invention is provided, by single layer board 20 arrange power electronic devices and
The auxiliary circuit of power electronic devices, and multiple single layer board 20 are arranged in insulating cylinder 10 with overlapped way it is achieved that
Design the high-pressure solid switch of a kind of compact conformation, small volume, and several single circuits can be placed in insulating cylinder 10
Plate 20, the power electronic devices series connection of a lot of levels can lift overall resistance to voltage levels, meanwhile, single layer board 20 and insulating cylinder
All can easily connect between 10 and extend, compact layout is advantageously implemented multistage Synchronization Control, and overall synchronism is more
Excellent and cut-off speed faster, solve the problems of layout structure of power electronic devices in prior art, and then reach
Ensure the compact layout and structure of power electronic devices, small volume, resistance to voltage levels are high, office's zoom level is low, be easy to extension, performance is excellent
Effect more.
Specifically, high-pressure solid switch also includes base 40 and grading ring 50, and wherein, base 40 is connected with insulating cylinder 10
Connect, can be integral type be fixedly connected or by paste etc. mode connect, grading ring 50 is set in insulating cylinder 10
On.
Single layer board 20 is circular circuit board, and circular single layer board 20 includes center cable hole 21, first and installs
Hole and the second installing hole, wherein, center cable hole 21 is arranged on the circle centre position of single layer board 20, and center cable hole 21 is used for cloth
Put the control line of driving side introducing, enter this hole in the optical fiber cable of low-voltage driving side or line set, and connect to electric power at different levels
At the auxiliary circuit of electronic device, electromagnetism firing control or optical fiber firing control can be accepted.That is, the present invention is real
The high-pressure solid switch that applying example is provided also includes drive control line, and this drive control line is connected to auxiliary by center cable hole
Circuit, and, drive control line can be the optical fiber cable of low-voltage driving side or the wire of low-voltage driving side.
Wherein, for when insulating cylinder 10 quantity is multiple, multiple individual layers can all be laid in each insulating cylinder 10
Circuit board 20, the equipotential points on adjacent monolayer circuit board 20 in same insulating cylinder 10 adopt the hard connecting mode that guide rod connects,
The equipotential points of adjacent insulating cylinder 10 both can the mode that is flexible coupling to be connected using bellows, it would however also be possible to employ it is hard that guide rod connects
Connected mode.
The quantity of the first installing hole and the second installing hole is multiple, and multiple first installing holes are uniformly arranged single layer board
On 20, for installing power electronic devices, multiple second installing holes are equally uniformly arranged in single layer board 20, for installing electricity
The concrete mounting means of the auxiliary circuit of power electronic device, power electronic devices and auxiliary circuit can be plug-in type welding,
It can be SMD welding.
Wherein, the auxiliary circuit of power electronic devices and power electronic devices constitutes the multi-level pmultistage circuit in single layer board,
Assume that in multiple second installing holes of adjacent level circuit, the distance between adjacent installing hole of any two is the first distance, carrying out
During power electronic devices layout designs, the first distance is designed as the pitch-row more than or equal to power electronic devices, i.e. individual layer electricity
The minimum rectilineal interval of adjacent auxiliary circuit installing hole on road plate 20, is not less than power electronic devices (drain electrode and source electrode) itself
Pitch-row.
Accordingly, insulating cylinder 10 has the axis hollow stem 11 matching with center cable hole 21, in the embodiment of the present invention
In, insulating cylinder 10 is circle, and material is nylon material or polytetrafluoro material or epoxide resin material etc., axis hollow stem 11
Integrated processing mode can be adopted with the outer wall of insulating cylinder 10, become one structure.
Further, electrode includes line electrode 31 and screening electrodes, and wherein, screening electrodes are annular, connect to insulation
Maximum potential point in cylinder 10, go out line electrode 31 connect for circuit and fixed insulation cylinder 10 in externally the drawing of single layer board 20
Being flexible coupling between the Hard link between single layer board 20 and insulating cylinder 10 in outlet, cylinder.
Accordingly, single layer board 20 also includes electrode connecting hole 24 and insulative air gap 25, and this electrode connecting hole 24 is used for
Line electrode 31 is installed out, goes out line electrode 31 and include high-voltage terminal electrode and low-pressure line-outgoing electrode, corresponding electrode connecting hole 24 wraps
Include the high-field electrode connecting hole for installing high-voltage terminal electrode, and connect for installing the low-field electrode of low-pressure line-outgoing electrode
Hole.The insulation voltage value that insulative air gap 25 first side can bear is more than or equal to any voltage of single layer board 20, insulation
The insulation voltage value that air gap 25 second side can bear is less than or equal to any voltage of single layer board 20, and insulative air gap
The voltage that carries be more than the first difference carrying voltage and the second carrying voltage, the first side and the second side are the phase of insulative air gap 25
To both sides, the first carrying voltage is the carrying voltage of the first side, and the second carrying voltage is the carrying voltage of the second side, i.e. insulation
The side of air gap 25 is the high pressure in single layer board 20, and opposite side is then the low pressure in single layer board 20, insulative air gap
Carry the pressure difference that voltage is more than high pressure and low pressure, by arranging insulative air gap 25 between high pressure and low pressure, reach raising
Insulation ability to bear between high-low pressure, avoid climbing the effect of electricity along face.
Further, high-pressure solid switch also includes insulation filling medium, and insulation filling Filled Dielectrics are in insulating cylinder 10
Interior, it is used for fixing single layer board 20, the single layer board 20 of multiple electrical connections is arranged vertically on the insulation in insulating cylinder 10
In filled media, wherein, insulation filling medium can also play the effect reducing electric-field intensity at each tie point.Accordingly, single
Layer circuit board 20 also includes steam vent 26, for excluding the bubble producing in dielectric potting process.In the embodiment of the present invention
In, the material of insulation filling medium is epoxy resin, and the relative dielectric constant of insulation filling medium is more than or equal to 2.5.
Wherein, in the embodiment of the present invention, high-low pressure electrode connecting hole 24, steam vent 26, center cable hole 21, first are installed
Hole and the second installing hole are all circular, and, steam vent 26, the first installing hole, the second installing hole are evenly arranged in and are walked with center
String holes 21 is the center of circle, with the orthodrome between high-low pressure electrode connecting hole 24, and auxiliary circuit installing hole is near the center of circle, with
Farthest ensure that the compact layout and structure of power electronic devices, small volume, resistance to voltage levels are high, office's zoom level is low, be easy to expand
Exhibition, superior performance.
As can be seen from the above description, present invention achieves following technique effect:
(1) compact conformation, small volume.Dispersion annular layout is proposed on single layer board, multiple single layer board are vertical
Arrangement, adopts epoxy sealing in insulating cylinder, center through wires hole centralized arrangement drives wire or optical fiber to control drives line, overall knot
Structure is compact, rationally distributed, and wiring is succinct, and under identical voltage, the volume of scheme used is obviously reduced compared with existing scheme.
(2) resistance to voltage levels height, office's zoom level are low.Single layer board can place multistage igbt, permissible in single insulating cylinder
Place several individual layers pcb circuit board, the power electronic devices series connection of a lot of levels can lift overall resistance to voltage levels；Epoxy fills
Envelope and go out line electrode and screening electrodes all can the starting voltage level put of the office of effectively improving reduce an innings zoom level.
(3) it is easy to extension, superior performance.All can easily connect between single layer board and insulating cylinder and extend, compact
Layout be advantageously implemented multistage Synchronization Control, overall synchronism is more excellent and cut-offs speed faster.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (8)
1. a kind of high-pressure solid switch is it is characterised in that include:
Insulating cylinder；
Single layer board, the quantity of described single layer board is multiple, multiple described single layer board are stacked be arranged in described
In insulating cylinder, each described single layer board is used to arrange the auxiliary electricity of power electronic devices and described power electronic devices
Road；And
Electrode, for connecting multiple described single layer board and being used for uniform electric field,
Wherein, described single layer board is circular circuit board, and described single layer board includes:
Center cable hole, is arranged on the circle centre position of described single layer board；
First installing hole, the quantity of described first installing hole is multiple, and multiple described first installing holes are uniformly arranged on described list
On layer circuit board, for installing described power electronic devices；And
Second installing hole, the quantity of described second installing hole is multiple, and multiple described second installing holes are uniformly arranged on described list
On layer circuit board, for installing the auxiliary circuit of described power electronic devices,
Described insulating cylinder has the axis hollow stem matching with described center cable hole,
The auxiliary circuit of described power electronic devices and described power electronic devices constitutes multi-level pmultistage circuit, and wherein, the first distance is big
In or be equal to described power electronic devices pitch-row, described first distance is in multiple described second installing hole of adjacent level circuit
The distance between adjacent installing hole of any two.
2. high-pressure solid switch according to claim 1 is it is characterised in that described high-pressure solid switch also includes:
Base, is connected with described insulating cylinder；And
Grading ring, is set on described insulating cylinder.
3. high-pressure solid switch according to claim 1 it is characterised in that:
Described electrode includes:
Go out line electrode；And
Screening electrodes, described screening electrodes are annular,
Described single layer board also includes:
Electrode connecting hole, for going out line electrode described in installing；And
Insulative air gap, wherein, the voltage that carries of described insulative air gap first side is more than or equal to the arbitrary of described single layer board
Voltage, the carrying voltage of described insulative air gap second side is less than or equal to any voltage of described single layer board, and described
The voltage that carries of insulative air gap is more than the first difference, described first side and described second side carrying voltage and the second carrying voltage
For the opposite sides of described insulative air gap, described first carrying voltage is the carrying voltage of described first side, described second carrying
Voltage is the carrying voltage of described second side.
4. high-pressure solid switch according to claim 1 is it is characterised in that described axis hollow stem and described insulating cylinder
Outer wall is structure as a whole.
5. high-pressure solid switch according to claim 1 is it is characterised in that described high-pressure solid switch also includes:
Drive control line, described drive control line is connected to described auxiliary circuit by described center cable hole.
6. high-pressure solid switch according to claim 1 it is characterised in that:
Described high-pressure solid switch also includes: insulation filling medium, is filled in described insulating cylinder, is used for fixing described individual layer electricity
Road plate,
Described single layer board also includes: steam vent.
7. high-pressure solid switch according to claim 6 is it is characterised in that the material of described insulation filling medium is epoxy
Resin, and the relative dielectric constant of described insulation filling medium is more than or equal to 2.5.
8. high-pressure solid switch according to claim 1 it is characterised in that described insulating cylinder quantity be multiple, each
Multiple described single layer board are all laid in described insulating cylinder, wherein:
Equipotential points in adjacent described single layer board in same described insulating cylinder adopt guide rod to connect,
The equipotential points of adjacent described insulating cylinder adopt bellows or guide rod to connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310653366.4A CN103684386B (en) | 2013-12-05 | 2013-12-05 | High-pressure solid switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310653366.4A CN103684386B (en) | 2013-12-05 | 2013-12-05 | High-pressure solid switch |
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| Publication Number | Publication Date |
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| CN103684386A CN103684386A (en) | 2014-03-26 |
| CN103684386B true CN103684386B (en) | 2017-01-18 |
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| CN201310653366.4A Expired - Fee Related CN103684386B (en) | 2013-12-05 | 2013-12-05 | High-pressure solid switch |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449219A (en) * | 2016-11-18 | 2017-02-22 | 广州供电局有限公司 | High-voltage solid-state switch structure |
| CN112713557B (en) * | 2020-11-20 | 2022-06-21 | 华北电力大学 | Shielding and fixing integrated high-voltage end metal insert of gas insulation wall bushing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3211860A1 (en) * | 1982-03-31 | 1983-10-06 | Calor Emag Elektrizitaets Ag | Isolating switch arrangement |
| CN103391064A (en) * | 2012-05-09 | 2013-11-13 | 株式会社村田制作所 | Switch module |
-
2013
- 2013-12-05 CN CN201310653366.4A patent/CN103684386B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3211860A1 (en) * | 1982-03-31 | 1983-10-06 | Calor Emag Elektrizitaets Ag | Isolating switch arrangement |
| CN103391064A (en) * | 2012-05-09 | 2013-11-13 | 株式会社村田制作所 | Switch module |
Non-Patent Citations (1)
| Title |
|---|
| 一种级联型结构的固体开关式高压脉冲电源的研制;戚栋;《电子器件》;20061231;第29卷(第4期);第1081-1084页 * |
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| CN103684386A (en) | 2014-03-26 |
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