CN103672457A - High-intensity LED light source and heat dissipation method thereof - Google Patents

High-intensity LED light source and heat dissipation method thereof Download PDF

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Publication number
CN103672457A
CN103672457A CN201210335063.3A CN201210335063A CN103672457A CN 103672457 A CN103672457 A CN 103672457A CN 201210335063 A CN201210335063 A CN 201210335063A CN 103672457 A CN103672457 A CN 103672457A
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China
Prior art keywords
substrate
light source
liquid carrier
led light
heat
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Pending
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CN201210335063.3A
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Chinese (zh)
Inventor
姚晓乌
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Individual
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Individual
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Priority to CN201210335063.3A priority Critical patent/CN103672457A/en
Publication of CN103672457A publication Critical patent/CN103672457A/en
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Abstract

The invention discloses a high-intensity LED light source which comprises a circuit board provided with LED particles, a substrate, a pump, a heat dissipation device and a guide pipe. The circuit board provided with the LED particles is installed on the substrate, a built-in pipeline is arranged in the substrate, the guide pipe is in series connection with the pump and the heat dissipation device and is communicated with the built-in pipeline to form a circulating pipeline, and fluid carriers are filled into the circulating pipeline. According to the high-intensity LED light source, circulating fluid is used as a heat-carrying agent, huge heat generated by the high-intensity LED light source can be removed from the substrate in time, the heat cannot gather at the position nearby an LED, and the normal operation of the LED light source is guaranteed.

Description

High strength LED light source and heat dissipating method thereof
Technical field
The present invention relates to a kind of LED light source, particularly a kind of high strength LED light source and heat dissipating method thereof.
Background technology
The radiating and cooling operation principle of existing LED light source is: the wiring board with LED particle is directly or indirectly arranged on metal substrate, metal substrate is directly connected on the radiator that surface area is very large, first the heat producing during LED work conducts to metal substrate, then by metal substrate heat-carrying, heat is conducted to radiator, and radiator dispels the heat by heat radiation and with the heat exchange of surrounding air.Metal substrate is heat carrier, and the cross-sectional area of metal substrate is one of decisive factor of heat-conducting effect.
The high-intensity light source of small size can not adopt existing LED light source technology.The power of high strength small size meaning LED is large, LED concentration degree is high, the heat producing during light source works is huge, and small size has limited the cross-sectional area of substrate, and then limited heat-conducting effect, and heat can not conduct to radiator in time by substrate, and heat can be gathered near LED, temperature is more and more higher, thereby causes the hydraulic performance decline of LED until burn out.
Summary of the invention
The object of this invention is to provide a kind of high strength LED light source and heat dissipating method thereof.
According to an aspect of the present invention, a kind of high strength LED light source is provided, comprise wiring board, substrate with LED particle, take out pump, heat abstractor and conduit, wiring board with LED particle is arranged on substrate, in substrate, be provided with built-in pipe, conduit series connection is taken out pump and heat abstractor and is communicated with built-in pipe and forms circulating line, is filled with liquid carrier in circulating line.Thus, the high-intensity LED light source of a kind of small size that can normally work is disclosed.
In some embodiments, liquid carrier is gas or liquid.
In some embodiments, taking out pump is air pump or hydraulic pump.
In some embodiments, heat abstractor comprises radiator or cooler.
The heat dissipating method of described high strength LED light source comprises the following steps:
S1, at substrate place, liquid carrier and substrate carry out heat exchange in built-in pipe, liquid carrier heat absorption and heating up, substrate heat release and lowering the temperature;
The liquid carrier that in S2, built-in pipe, temperature is higher flows to radiator or cooler by circulating line under the effect of taking out pump;
S3, at radiator or cooler place, liquid carrier and radiator or cooler carry out heat exchange, liquid carrier cooling down;
Liquid carrier after S4, cooling enters the built-in pipe in substrate along circulating line.
Liquid carrier completes a circulation like this.The heat that liquid carrier produces base onboard led is transported to radiator or cooler, reaches the object that makes substrate cooling.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high strength LED light source of a kind of embodiment of LED light fixture of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
Fig. 1 has schematically shown according to the present invention the LED light source structure of a kind of embodiment of high strength LED light source.
As shown in Figure 1, a kind of high strength LED light source, comprise wiring board, substrate 2 with LED particle 1, take out pump 3, heat abstractor 4 and conduit 5, wiring board 1 with LED particle 1 is arranged on substrate 2, in substrate 2, be provided with built-in pipe 6, conduit 5 series connection are taken out pump 3 and heat abstractor 4 and are communicated with built-in pipe 6 and form circulating line, are filled with liquid carrier in circulating line.Thus, the high-intensity LED light source of a kind of small size that can normally work is disclosed.
Substrate 2 can be metal substrate; Liquid carrier is gas or liquid; Heat abstractor 4 is radiator or cooler.
Liquid carrier can be for inorganic liquid be as water, can also be organic liquid as oils, can also be hydrogen, helium or hydrogen mist, or for containing helium mix gas.
When liquid carrier is gas, take out pump 3 for air pump; When liquid carrier is liquid, take out pump 3 for hydraulic pump.
The heat dissipating method of described high strength LED light source comprises the following steps:
S1, at substrate 2 places, the interior liquid carrier of built-in pipe 6 and substrate 2 carry out heat exchange: liquid carrier heat absorption and heating up, substrate 2 heat releases and lowering the temperature;
The liquid carrier that in S2, built-in pipe, temperature is higher flows to radiator or cooler by circulating line under the effect of taking out pump 3;
S3, at radiator or cooler 4 places, liquid carrier and radiator or cooler 4 carry out heat exchange, liquid carrier cooling down;
Liquid carrier after S4, cooling enters the built-in pipe 6 in substrate 2 along circulating line.
According to above step cycle operation, all or part of radiator or the cooler of being transported to of heat that liquid carrier produces 1 work of LED particle on substrate 2, therefore substrate 2 has reduced temperature, as long as guarantee the heat exchange quality of liquid carrier and substrate 2 and liquid carrier and heat abstractor 4, the temperature of substrate 2 just can be controlled in ideal range, and the high-intensity LED lamp of small size just can normally be worked.
The invention discloses and a kind ofly can realize LED light source and the heat dissipating method thereof that can normally work in the high-intensity situation of small size.Solve the difficult problem that in small size high strength situation, LED light source can not work long hours.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.

Claims (5)

1. high strength LED light source, it is characterized in that, comprise wiring board, substrate with LED particle, take out pump, heat abstractor and conduit, the described wiring board with LED particle is arranged on substrate, in described substrate, be provided with built-in pipe, described conduit series connection is taken out pump and heat abstractor and is communicated with built-in pipe and forms circulating line, is filled with liquid carrier in described circulating line.
2. high strength LED light source according to claim 1, is characterized in that, described liquid carrier is gas or liquid.
3. high strength LED light source according to claim 2, is characterized in that, the described pump of taking out is air pump or hydraulic pump.
4. high strength LED light source according to claim 3, is characterized in that, described heat abstractor comprises radiator or cooler.
5. the heat dissipating method of high strength LED light source according to claim 1, is characterized in that, comprises the following steps:
S1, at substrate place, liquid carrier and substrate carry out heat exchange in built-in pipe, liquid carrier heat absorption and heating up, substrate heat release and lowering the temperature;
The liquid carrier that in S2, built-in pipe, temperature is higher flows to radiator or cooler by circulating line under the effect of taking out pump;
S3, at radiator or cooler place, liquid carrier and radiator or cooler carry out heat exchange, liquid carrier cooling down;
Liquid carrier after S4, cooling enters the built-in pipe in substrate along circulating line.
CN201210335063.3A 2012-09-11 2012-09-11 High-intensity LED light source and heat dissipation method thereof Pending CN103672457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210335063.3A CN103672457A (en) 2012-09-11 2012-09-11 High-intensity LED light source and heat dissipation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210335063.3A CN103672457A (en) 2012-09-11 2012-09-11 High-intensity LED light source and heat dissipation method thereof

Publications (1)

Publication Number Publication Date
CN103672457A true CN103672457A (en) 2014-03-26

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Application Number Title Priority Date Filing Date
CN201210335063.3A Pending CN103672457A (en) 2012-09-11 2012-09-11 High-intensity LED light source and heat dissipation method thereof

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CN (1) CN103672457A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108930942A (en) * 2018-05-30 2018-12-04 俞权东 LED underground lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1967821A (en) * 2005-11-16 2007-05-23 比亚迪股份有限公司 Radiating system of light-emitting diode
CN101101948A (en) * 2007-06-04 2008-01-09 朱建钦 A high-power LED luminescent part
CN102454970A (en) * 2010-10-20 2012-05-16 湖南明和灯光设备有限公司 Heat pipe heat radiator of high-power LED street lamp
CN202403243U (en) * 2011-12-23 2012-08-29 浙江海振电子科技有限公司 Liquid cooling device for LED (light-emitting diode) lamp
CN202419401U (en) * 2011-11-17 2012-09-05 飞利浦(中国)投资有限公司 Illuminating equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1967821A (en) * 2005-11-16 2007-05-23 比亚迪股份有限公司 Radiating system of light-emitting diode
CN101101948A (en) * 2007-06-04 2008-01-09 朱建钦 A high-power LED luminescent part
CN102454970A (en) * 2010-10-20 2012-05-16 湖南明和灯光设备有限公司 Heat pipe heat radiator of high-power LED street lamp
CN202419401U (en) * 2011-11-17 2012-09-05 飞利浦(中国)投资有限公司 Illuminating equipment
CN202403243U (en) * 2011-12-23 2012-08-29 浙江海振电子科技有限公司 Liquid cooling device for LED (light-emitting diode) lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108930942A (en) * 2018-05-30 2018-12-04 俞权东 LED underground lamp
CN108930942B (en) * 2018-05-30 2020-10-20 广东宏泰照明科技有限公司 LED underground lamp

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Application publication date: 20140326