CN103668373B - Rotating electroplating machine and automatic discharge unit thereof - Google Patents
Rotating electroplating machine and automatic discharge unit thereof Download PDFInfo
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- CN103668373B CN103668373B CN201410002339.5A CN201410002339A CN103668373B CN 103668373 B CN103668373 B CN 103668373B CN 201410002339 A CN201410002339 A CN 201410002339A CN 103668373 B CN103668373 B CN 103668373B
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Abstract
The invention discloses a kind of rotating electroplating machine and automatic discharge unit thereof, rotating electroplating machine is used for plating and the discharging of chip components and parts, including cathode loop, cathode loop rotating mechanism and automatic discharge unit, cathode loop rotating mechanism controls cathode loop and rotates, automatic discharge unit includes chassis and automatic-separation mechanism, and automatic-separation mechanism controls to be mutually closed and be separated from each other between chassis and cathode loop. The present invention is controlled Guan Bi between chassis and cathode loop by automatic-separation mechanism and is separated, it is possible to make rotating electroplating machine complete plating and the discharging of chip components and parts; When plating, it is mutually closed between cathode loop and chassis, and when needs discharging, to be separated from each other between cathode loop and chassis and form space, allowing chip components and parts when rotated along with current are thrown out of from space, thus completing automatic discharging step, and discharging is clean.
Description
Technical field
The present invention relates to a kind of rotating electroplating machine, particularly relate to rotating electroplating machine and the automatic discharge unit thereof of a kind of chip components and parts.
Background technology
The commonly used rotating electroplating electromechanics plating of the plating mode of existing chip components and parts, and the plating mode such as common rack plating, barrel plating, the quality better effects if of the plating chip components and parts of rotating electroplating machine. Due at present in industry the automatic discharging function of rotating electroplating machine be usually present that automatic discharging is clean, get stuck, the problem such as material leakage, most rotating electroplating machine does not simply set automatic discharging function, plastic material back cover is directly used in the lower surface of cathode loop, after plating, manual operation is needed to dismantle lower cathode loop from equipment, individually tablet is poured out, again then need to install on equipment again cathode loop during plating, waste time and energy.
Summary of the invention
For solving the problems referred to above, it is an object of the invention to provide a kind of rotating electroplating machine and automatic discharge unit thereof, this rotating electroplating machine can realize automatic discharging, and discharging is clean, quick, time saving and energy saving.
For reaching above-mentioned purpose, the present invention by the following technical solutions:
The invention discloses a kind of rotating electroplating machine, plating and discharging for chip components and parts, including cathode loop, cathode loop rotating mechanism and automatic discharge unit, described cathode loop rotating mechanism controls described cathode loop and rotates, described automatic discharge unit includes chassis and automatic-separation mechanism, and described automatic-separation mechanism controls to be mutually closed and be separated from each other between described chassis and described cathode loop.
Preferably, described cathode loop rotating mechanism includes rotary drive mechanism, lower rotary table, support bar, guide pillar and top rotary table, described rotary drive mechanism is of coupled connections described lower rotary table, described support bar connects described lower rotary table and described cathode loop, described guide pillar is axially movably through described lower rotary table and connect described top rotary table, and described chassis includes described top rotary table and is close in conjunction with the sealing member between described top rotary table upper surface and described cathode loop lower surface.
Preferably, described cathode loop rotating mechanism includes packing ring and inner cover, wherein said packing ring is provided with multiple groove at circumferencial direction, the inner ring end face of the through described packing ring of described groove and cycle surface, and the depth and width of described groove are respectively less than or equal to the minimum dimension of described chip components and parts;Described inner cover be shaped as circular bosses shape.
Preferably, described automatic-separation mechanism includes lift drive mechanism, lifting basal disc, pulling plate, described lower rotary table and described guide pillar, described lift drive mechanism is of coupled connections described lifting basal disc, and described lifting basal disc is of coupled connections described pulling plate, and described guide pillar lower end connects described pulling plate.
Preferably, described pulling plate includes actively pulling plate and driven pulling plate, and described driven pulling plate is enclosed within described active pulling plate, and described lifting basal disc is of coupled connections described active pulling plate, and described guide pillar lower end connects described driven pulling plate; Described automatic-separation mechanism also includes the intersection ball axle collar, and the described intersection ball axle collar is arranged between the connecting portion of described driven pulling plate and described active pulling plate, and described active pulling plate pulls described driven pulling plate by the described intersection ball axle collar.
Preferably, described automatic-separation mechanism also includes the flexible member that is arranged between described top rotary table and described lower rotary table.
Preferably, described automatic discharge unit also includes discharge mechanism, and described discharge mechanism includes Draining basin and outer housing, and described outer housing covers on described cathode loop and the periphery on described chassis, and described Draining basin is connected to the lower end of described outer housing.
Preferably, described outer housing includes internal layer and outer layer, the lower surface of wherein said outer layer and the laminating of described Draining basin, and the lower surface of described internal layer is lower than the lower surface of described outer layer.
Preferably, described discharge mechanism also includes vibrator and discharge gate, and described Draining basin is obliquely installed, and described vibrator is arranged on the extreme higher position bottom described Draining basin, and described discharge gate is arranged on the extreme lower position bottom described Draining basin.
The invention also discloses the automatic discharge unit of a kind of rotating electroplating machine, discharging for chip components and parts, described rotating electroplating machine includes cathode loop and cathode loop rotating mechanism, described cathode loop rotating mechanism controls described cathode loop and rotates, described automatic discharge unit includes chassis and automatic-separation mechanism, and described automatic-separation mechanism controls to be mutually closed and be separated from each other between described chassis and described cathode loop.
Heretofore described top rotary table had both belonged to described cathode loop rotating mechanism, belong to again described chassis, the effect being because described top rotary table is in that the drive by guide pillar is rotated together on the one hand, further aspect is that and by pulling of guide pillar, lengthwise movement can occur when discharging so that described chassis and described cathode loop are separated from each other. Described chassis preferably also includes being close to the sealing member in conjunction with between described top rotary table upper surface and described cathode loop lower surface, in section Example of the present invention, this sealing member can adopt rubber disc, and state the annular table terrace of top rotary table by arranging cannelure outsourcing residence at rubber disc lower surface circumferencial direction, the upper surface of rotating disk is close to live in the lower surface making rubber disc, so that the rotary motion of top rotary table and downward pulling force can pass to rubber disc.
It addition, heretofore described guide pillar and described lower rotary table are all both belonged to described cathode loop rotating mechanism, belong to again described automatic-separation mechanism. Wherein, the upper end of described guide pillar connects top rotary table, centre and axially connects driven pulling plate movably through lower rotary table, lower end, drive driven pulling plate to rotate together with top rotary table on the one hand, be when discharging on the other hand, for pulling top rotary table to play the effect of pulling force conduction; Described lower rotary table is on the one hand by being of coupled connections rotary drive mechanism, and transmission rotary motion is to guide pillar and cathode loop, on the other hand for arranging flexible member thereon between end face and the lower surface of top rotary table.
The invention has the beneficial effects as follows:
The automatic discharge unit of the rotating electroplating machine of the present invention adopts automatic-separation mechanism to control to be mutually closed and be separated from each other between cathode loop and the chassis of rotating electroplating machine, when plating, it is mutually closed between cathode loop and chassis, and when needs discharging, to be separated from each other between cathode loop and chassis and form space, allowing chip components and parts when rotated along with current are thrown out of from space, thus completing automatic discharging step, and discharging is clean.
Further, the automatic discharge unit of this rotating electroplating machine is additionally provided with discharge mechanism, and the outer housing of discharge mechanism can block the chip components and parts being thrown out of, and makes chip components and parts drop into Draining basin; And by being obliquely installed Draining basin, and in the extreme higher position of Draining basin, vibrator is set, extreme lower position arranges discharge gate, so that chip components and parts are rapidly and cleanly discharged in magazine.
Accompanying drawing explanation
Fig. 1 be the rotating electroplating machine of the preferred embodiment of the present invention always assemble schematic diagram;
Fig. 2 is the schematic diagram that outer housing opened by the rotating electroplating machine in Fig. 1;
Fig. 3 is the structural representation of the cathode loop rotating mechanism in the rotating electroplating machine in Fig. 1;
Fig. 4 is the exploded perspective view of cathode loop rotating mechanism in Fig. 3;
Schematic diagram when Fig. 5 is that in Fig. 4, the lower rotary table in cathode loop rotating mechanism assembles with slave spindle;
Fig. 6 is the part schematic diagram of the chassis in cathode loop rotating mechanism and top rotary table in Fig. 4;
Fig. 7 is the part schematic diagram of the packing ring in cathode loop rotating mechanism and inner cover in cathode loop and Fig. 4;
Fig. 8 is the structural representation of the automatic-separation mechanism in the rotating electroplating machine in Fig. 1;
Fig. 9 is the exploded perspective view of the automatic-separation mechanism in Fig. 8;
Figure 10 is the some part schematic diagrams in the automatic-separation mechanism in Fig. 8;
Figure 11 is the structural representation of the discharge mechanism in the rotating electroplating machine in Fig. 1;
Figure 12 is the structural representation of the Draining basin in the discharge mechanism in Figure 11 and outer housing.
Description of reference numerals:
1 cathode loop rotating mechanism, 101 motors, 102 driving pulleys, 103 Timing Belts, 104 driven pulleys, 105 first fixing plates, 106 steps, 107 connecting rods, 108 second fixing plate, 109 top chocks, 110 slave spindles, 111 lower rotary tables, 112 support bars, 113 guide pillars, 114 top rotary tables, 115 packing rings, 116 inner covers;
2 automatic-separation mechanisms, 201 cylinder blocks, 202 cylinders, 203 lifting basal discs, 204 active pulling plates, 205 driven pulling plates, the 206 intersection ball axle collars, 207 fixing Spring screws, 208 springs;
3 discharge mechanisms, 301 Draining basins, 302 ball vibrators, 303 outer housings, 304 magazines, 3031 outer layers, 3032 internal layers;
400 cathode loops, 500 rubber disc, 600 frames.
Detailed description of the invention
Below against accompanying drawing and combine preferred embodiment the invention will be further described.
As depicted in figs. 1 and 2, the invention discloses a kind of rotating electroplating machine, for plating and the discharging of chip components and parts. as shown in Fig. 1, Fig. 3, Fig. 8 and Figure 11, the rotating electroplating machine of the preferred embodiments of the present invention includes cathode loop rotating mechanism 1, automatic-separation mechanism 2, discharge mechanism 3, cathode loop 400, rubber disc 500, frame 600, anode titanium cylinder (not shown) and commutator (not shown). rotating electroplating machine is when plating produces, anode titanium cylinder (not shown) drops in cathode loop 400, it is continuously replenished plating solution in cathode loop 400, cathode loop rotating mechanism 1 intermittently drives cathode loop 400 rotating at high speed, commutator (not shown) provides the DC current required by electroplating technology, during rotating forward, chip components and parts are attached on the inwall of cathode loop 400, complete to plate on coating, during reversion, the product short time departs from, the carrying out so gone round and begun again, and electroplating technology required time has just plated uniform coating in chip components and parts termination after arriving. after chip components and parts complete plating, carry out washing automatization's discharging, cathode loop rotating mechanism 1 drives cathode loop 400 intermittently with relatively low speed rotating, automatic-separation mechanism 2 pulls open rubber disc 500 automatically simultaneously, the upper end of rubber disc 500 is made to separate with the lower end of cathode loop 400, such chip components and parts just throw away with the space between the current being continuously replenished in cathode loop 400 upper end and the lower end of cathode loop 400 from rubber disc 500, blocked by the outer housing 303 in discharge mechanism 3, fall in the Draining basin 301 in discharge mechanism 1, magazine 304 is drained into again from Draining basin 301.
It is illustrated in figure 3 the structural representation of cathode loop rotating mechanism 1, being illustrated in figure 4 the exploded perspective view of cathode loop rotating mechanism 1, cathode loop rotating mechanism 1 includes motor 101, driving pulley 102, synchronous pulley 103, the fixing plate 105 of driven pulley 104, first, step 106, the fixing plate 108 of connecting rod 107, second, top chock 109, slave spindle 110, lower rotary table 111, support bar 112, guide pillar 113 and top rotary table 114, packing ring 115 and inner cover 116. Wherein motor 101, driving pulley 102, synchronous pulley 103, the fixing plate 105 of driven pulley 104, first, step 106, the fixing plate 108 of connecting rod 107, second, top chock 109 and rotary drive mechanism that slave spindle 110 is cathode loop rotating mechanism 1.
The annexation of cathode loop rotating mechanism 1 is as follows: as shown in Figure 3 and Figure 4, the main shaft of motor 101 connects and drives driving pulley 102, driven pulley 104 is driven by Timing Belt 103, slave spindle 110 lower end is enclosed within driven pulley 104, the radial direction of slave spindle 110 is positioned by step 106 and top chock 109, and the method such as the shaft shoulder, screens location (but being not limited) then can be passed through in axial location; The first fixing plate 105 and second that step 106 and top chock 109 are then separately mounted to be connected by connecting rod 107 is fixed on plate 108, and uses screw locking. As it is shown in figure 5, lower rotary table 111 is assemblied in the upper end of slave spindle 110, adopts key to connect, and with 3 screws from 3 hole traverses at lower rotary table center, be locked on slave spindle 110, so just on radial and axial, secure lower rotary table 111. As shown in Figure 4, support bar 112 has 6, the equal auger shell pit in upper and lower end face of each support bar 112, the screwed hole of each support bar 112 lower end is attached to 6 annular concentric counter sinks of lower rotary table 111 upper surface outermost respectively, is locked on lower rotary table 111 with hexagon socket head cap screw by each support bar 112; The screwed hole of each support bar 112 upper end is attached on the counter sink that cathode loop 400 lower surface is corresponding respectively, and with short thumb screw locking, axial restraint lives cathode loop 400. Guide pillar 113 has 4, annular is uniformly distributed, the upper end of each guide pillar 113 has screwed hole, upper end is connected with Flat-head internal hexagonal with top rotary table 114, each guide pillar 113 is axially movably through lower rotary table 111 from the bottom up, such lower rotary table 111 is when rotating, and torque drives each guide pillar 113 to rotate, and top rotary table just can be driven to rotate together by each guide pillar 113. As shown in Figure 6, the lower surface circumferencial direction of rubber disc 500 is provided with cannelure outsourcing and lives in the annular table terrace of rotating disk 114, makes the lower surface of rubber disc 500 be close to live in the upper surface of rotating disk 114. The hole as it is shown in fig. 7, screw in the relevant position of packing ring 115, inner cover 116 and cathode loop 400, utilizes multiple screw packing ring 115 and inner cover 116 to be locked on cathode loop 400.
The operation principle of cathode loop rotating mechanism 1 is: the driving shaft of motor 101 drives slave spindle 110 to rotate by Timing Belt 103 and driving pulley 102 and driven pulley 104, and slave spindle 110 drives lower rotary table 111 to rotate. Lower rotary table 111 drives cathode loop 400 to rotate by support bar 112, and drives the packing ring 115 and inner cover 116 that are locked on cathode loop 400; Meanwhile, lower rotary table 111 drives top rotary table 114 and the rubber disc 500 that is nested on top rotary table 114 to rotate by guide pillar 113.
In cathode loop rotating mechanism 1 it should be understood that one, driving pulley 102, Timing Belt 103 and driven pulley 104 be provided with can high-speed drive, stable drive, can the characteristic of transmission high pulling torque, should be noted that when part type selecting.Two, step 106 and top chock 109 type selecting are preferably with the single bearing seat of clasp, convenient installation, adopt pair of bearings, be also effectively prevented the circular runout of slave spindle 110 in the embodiment of the present invention. Three, rubber disc 500 is as sealing member, material require to have good resistance to acid liquid corrosion, high temperature resistant 60��70 DEG C, pliability is good, makes and adopts mould processing, upper and lower end face require smooth, must not have sags and crests, it is prevented that block chip components and parts; In the present embodiment, sealing member adopts quality of rubber materials, but is not limited thereto. Four, cathode loop 400 adds and must assure that inner wall smooth man-hour, must not there is sags and crests, it is prevented that the coating blocking chip components and parts and inwall generation is coarse, and facilitates the stripping of subsequent plating layer, the lower surface of cathode loop 400 requires that planarization is good, with the fitting tightly of rubber disc 500 when being conducive to electroplating. Five, the upper surface of packing ring 115 is provided with multiple groove at circumferencial direction, the inner ring end face of the through packing ring of these grooves and cycle surface, the depth and width of groove must not exceed the minimum dimension of chip components and parts, after the reason of fluting is in that plating completes, need to be thrown away the plating solution in cathode loop 400 by the mode rotated, and plating solution is because the effect of centrifugal force cannot all throw away from the upper port of inner cover 116, the effect of these grooves just can allow plating solution throw away totally; The additionally material selection high-quality PVC of packing ring 115. Six, inner cover 116 material is preferably glass, and it is preferably shaped to circular bosses shape, reason is in that if being designed to straight tube shape, chip components and parts are too little and weight is too light, when switching when cathode loop 400 rotating when plating, chip components and parts, probably due to lose suddenly centrifugal force, fall down from cathode loop 400, and the plating solution gone out along with overflow along smooth glass inner wall is gushed out; And it is designed as circular bosses shape, and just can avoid this problem, the round platform inclined-plane of glass can block chip components and parts floating upwards during switching direction of rotation, thus chip components and parts will not be gushed out from the upper port of inner cover 116.
It is illustrated in figure 8 the structural representation of automatic-separation mechanism 2, being illustrated in figure 9 the exploded perspective view of automatic-separation mechanism 2, automatic-separation mechanism 2 includes the first fixing plate 105, cylinder block 201, cylinder 202, lifting basal disc 203, actively pulling plate 204, driven pulling plate 205, the intersection ball axle collar 206, fixing Spring screws 207, spring 208, lower rotary table 111, guide pillar 113 and top rotary table 114. Wherein the first fixing plate 105, cylinder block 201, cylinder 202 are the lift drive mechanism of automatic-separation mechanism 2.
The annexation of automatic-separation mechanism 2 is as follows: as shown in Figure 8 and Figure 9, cylinder 202 and cylinder block 201 are equipped with 4, each cylinder 202 is fixed on each cylinder block 201, and cylinder block 201 is fixed on the first fixing plate 105, and lifting basal disc 203 is connected with the contiguous block of the guide pillar termination of 4 cylinders 202. as shown in Figure 9 and Figure 10, actively pulling plate 204 is fixed on lifting basal disc 203 by Flat-head internal hexagonal screw, the ball axle collar 206 that intersects is urgent with the outer cylinder surface that driven pulling plate 205 hollow axle coordinates place, the inner ring end face of the intersection ball axle collar 206 touch the shaft shoulder of driven pulling plate 205, intersect the ball axle collar 206 and driven pulling plate 205 again together be enclosed within actively in pulling plate 204, make the outer ring of the lower surface contact intersection ball axle collar 206 of actively pulling plate 204, actively the inwall of the thin round buss of pulling plate 204 with intersect the ball axle collar 206 external cylindrical surface between have less matched in clearance.As shown in Figure 10, the lower end of 4 guide pillars 113 also all has screwed hole, locks with common hexagon socket head cap screw between lower end and the driven pulling plate 205 of each guide pillar 113. As it is shown in figure 9, uniform 12 screwed holes of lower rotary table 111 annular concentric, pin from top to bottom with 12 fixing Spring screwses 207, only stay nut herein above, in each fixing Spring screws 207, entangle spring 208, radially surely live the lower end of spring 208; Uniform 12 blind holes of lower surface annular concentric of top rotary table, for entangling outward spring 208, the upper end of radially fixed firmly spring 208.
The operation principle of automatic-separation mechanism 2 is: during discharging, cathode loop 400 is intermittently with relatively low speed rotating, now cylinder 202 is left behind and is lifted basal disc 203, the active pulling plate 204 being fixed on lifting basal disc 203 just and then moves downward, pulling force is delivered to the intersection ball axle collar 206 being tightly placed in driven pulling plate 205, pulling force is passed to driven pulling plate 205 by the ball axle collar 206 that intersects again, makes driven pulling plate 205 pull down; The guide pillar 113 connected in driven pulling plate 205 axially couples together with top rotary table 114 movably through after lower rotary table 111, the moving downward of so driven pulling plate 205 hauls again top rotary table 114 with guide pillar 113 and moves downward, and makes the spring 208 between top rotary table 114 and lower rotary table 111 be compressed; And rubber disc 500 is tightly placed on top rotary table 114, then rubber disc 500 is just also by past drop-down, thus just producing space between rubber disc 500 and cathode loop 400; Chip components and parts in cathode loop 400 with current constantly intermittently rotating, will be thrown out of in cathode loop 400 in the gap between rubber disc 500 and cathode loop 400, thus completing discharging operation.
In automatic-separation mechanism 2 it should be understood that one, cylinder 202 preferably select duplex cylinder, 4 cylinder 202 squares are uniformly distributed, and so when discharging, it is ensured that the tension uniform of circumferencial direction, space that chassis is opened is impartial. Two, the ball axle collar 206 that intersects is arranged between the connecting portion of driven pulling plate 205 and active pulling plate 204, when discharging, need in the rotary motion of device, pull open rubber disc 500, without intersecting the ball axle collar 206, allow the actively driven pulling plate 205 of pulling plate 204 direct pull, and driven pulling plate 205 is in rotary motion when discharging, driven pulling plate 205 will make with the consequence actively directly contacted between pulling plate 204 to produce dryness contact between the two, both can be made impaired, original rotary motion also can be made to be obstructed. And intersect the effect of the ball axle collar 206 and be just in that to be converted to this direct dryness friction and intersect the rolling friction of the ball within the ball axle collar 206, it is ensured that even if driven pulling plate 205 can also unobstructed be pulled down into while high-speed motion. Three, automatic-separation mechanism 2 is provided with spring 208 between lower rotary table 111 and top rotary table 114, when discharging, top rotary table 114 is pulled down into, and lower rotary table 111 is being axially fixed, such spring 208 is in compressive state, after discharging completes, cylinder 202 moves upward, and lifting basal disc 203 is promptly risen with actively pulling plate 204, pulling force disappears, the compression stress of spring 208 is released, and spring 208 is upspring rubber disc 500 jack-up, so as to fit tightly with cathode loop 400.
For cathode loop rotating mechanism 1 and automatic-separation mechanism 2 it is to be noted that cathode loop rotating mechanism 1 and automatic-separation mechanism 2 are integrated in rotating electroplating machine, and the central shaft of this Liang Ge mechanism is also consistent, but the present embodiment is for ease of illustrating cathode loop rotating mechanism 1 and automatic-separation mechanism 2 respectively, the part of the two mechanism is split, respectively as shown in figures 3 and 8.And the annexation of cathode loop rotating mechanism 1 and automatic-separation mechanism 2 is as common supporting member by the first fixing plate 105, and it is attached as common central shaft by slave spindle 110. Wherein the first fixing plate 105 be for while fixed negative pole ring rotating mechanism 1 in step 106 and cylinder block 201 in automatic-separation mechanism 2.
Such as the structural representation that Figure 11 is discharge mechanism 3, discharge mechanism 3 includes Draining basin 301, ball vibrator 302, outer housing 303, magazine 304.
The annexation of discharge mechanism 3 is as follows: as shown in figure 12, outer housing 303 includes outer layer 3031 and internal layer 3032, aliging one by one in 4 holes of 4 holes of outer wall ring annular spread of outer layer 3031 and the outer wall annular spread of internal layer 3032, with screw rod through hole, and fixes with nut. It addition, the lower surface of internal layer 3032 is lower than the lower surface of outer layer 3031, the lower surface of outer layer 3031 is connected with Draining basin 301, can adopt threaded or automatic mechanism, be not limited. As is illustrated by figs. 11 and 12, the bottom surface of Draining basin 301 is set to and horizontal plane, and cannelure is formed in the bottom of Draining basin 301, ball vibrator 302 is arranged on the extreme higher position of Draining basin 301 bottom annular recess, and discharge gate is arranged on the extreme lower position of cannelure, arrange magazine 304 in the outside of discharge gate, the bottom of magazine 304 is provided with gauze.
The operation principle of discharge mechanism 3 is: when chip components and parts are thrown out of from the gap that cathode loop 400 and rubber disc 500 are opened with current, blocked by internal layer 3032, drop in the cannelure of Draining basin 301, start ball vibrator 302, chip components and parts are made quickly to fall into discharge gate along with current, and fall into magazine 304 by discharge gate, and chip components and parts are stayed in magazine 304, and liquid is flowed out by the gauze of magazine 304.
In discharge mechanism 3 it should be understood that one, outer housing 303 be divided into outer layer 3031 and internal layer 3032 two-layer, internal layer 3032 acts primarily as backgauge effect, the lower surface of internal layer 3032 when mounted will lower than the plane of outer layer 3031 with Draining basin 301 laminating, it is to avoid chip components and parts are likely to the gap place got rid of at outer layer 3031 with Draining basin 301 binding face. Keep the distance of about 20mm between outer layer 3031 and internal layer 3032, and be interconnected and fixed. Two, ball vibrator 302 can adopt pneumatic mode, when rinsing chip components and parts, supplies and Draining basin 301 is produced vibration, and the chip components and parts in such Draining basin 301 just will not be piled up motionless, it is simple to the flushing of current. Three, the bottom of Draining basin 301 is preferably designed to and the horizontal plane inclination angle into about 5 ��, and on inclined-plane molding cannelure, least significant end at cannelure arranges discharge gate, other mechanisms that can make on the one hand Draining basin 301 and device are absent from interfering, and the bottom surface of tilting is easy to pure water and is flowed to discharge gate on the other hand. Draining basin 301 can also be designed to turnably as required, discharge gate so can be allowed to move, it is directed at different drain location, realize the switching of electroplating technology, as tin plating after the nickel plating of chip components and parts elder generation, for preventing plating solution cross-contamination, it is possible to allow the discharge gate of Draining basin 301 move, if and only with a kind of plating solution plating, then Draining basin 301 can be fixed in frame 600. Four, the gauze mesh that the bottom of magazine 304 is provided with is less than the minimum dimension of chip components and parts. Five, Draining basin 301, outer layer 3031 and internal layer 3032 preferably select lucite.
Parts in all the above rotating electroplating machine, on material selects, all need to consider the adverse circumstances of plating, it is preferable that the material of the acid-alkali-corrosive-resisting of high-quality, and meet the requirement in intensity. The rotating electroplating machine of the preferred embodiment of the present invention, by practice examining, when plating will not material leakage, electroplate rear automatic discharging, and discharging quickly, clean, time saving and energy saving, structure is ingenious, meets production, greatly improves production efficiency.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, it is impossible to assert that specific embodiment of the invention is confined to these explanations. For those skilled in the art, without departing from the inventive concept of the premise, it is also possible to make some equivalent replacements or obvious modification, and performance or purposes are identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a rotating electroplating machine, plating and discharging for chip components and parts, including cathode loop and cathode loop rotating mechanism, described cathode loop rotating mechanism controls described cathode loop and rotates, it is characterized in that, also including automatic discharge unit, described automatic discharge unit includes chassis and automatic-separation mechanism, and described automatic-separation mechanism controls to be mutually closed and be separated from each other between described chassis and described cathode loop.
2. rotating electroplating machine as claimed in claim 1, it is characterized in that, described cathode loop rotating mechanism includes rotary drive mechanism, lower rotary table, support bar, guide pillar and top rotary table, described rotary drive mechanism is of coupled connections described lower rotary table, described support bar connects described lower rotary table and described cathode loop, described guide pillar is axially movably through described lower rotary table and connect described top rotary table, and described chassis includes described top rotary table and is close in conjunction with the sealing member between described top rotary table upper surface and described cathode loop lower surface.
3. rotating electroplating machine as claimed in claim 1, it is characterized in that, described cathode loop rotating mechanism includes packing ring and inner cover, wherein said packing ring is provided with multiple groove at circumferencial direction, the inner ring end face of the through described packing ring of described groove and cycle surface, and the depth and width of described groove are respectively less than or are equal to the minimum dimension of described chip components and parts; Described inner cover be shaped as circular bosses shape.
4. rotating electroplating machine as claimed in claim 2, it is characterized in that, described automatic-separation mechanism includes lift drive mechanism, lifting basal disc, pulling plate, described lower rotary table and described guide pillar, described lift drive mechanism is of coupled connections described lifting basal disc, described lifting basal disc is of coupled connections described pulling plate, and described guide pillar lower end connects described pulling plate.
5. rotating electroplating machine as claimed in claim 4, it is characterized in that, described pulling plate includes actively pulling plate and driven pulling plate, and described driven pulling plate is enclosed within described active pulling plate, described lifting basal disc is of coupled connections described active pulling plate, and described guide pillar lower end connects described driven pulling plate; Described automatic-separation mechanism also includes the intersection ball axle collar, and the described intersection ball axle collar is arranged between the connecting portion of described driven pulling plate and described active pulling plate, and described active pulling plate pulls described driven pulling plate by the described intersection ball axle collar.
6. rotating electroplating machine as claimed in claim 4, it is characterised in that described automatic-separation mechanism also includes the flexible member being arranged between described top rotary table and described lower rotary table.
7. the rotating electroplating machine as described in any one of claim 1 to 6, it is characterized in that, described automatic discharge unit also includes discharge mechanism, described discharge mechanism includes Draining basin and outer housing, described outer housing covers on described cathode loop and the periphery on described chassis, and described Draining basin is connected to the lower end of described outer housing.
8. rotating electroplating machine as claimed in claim 7, it is characterised in that described outer housing includes internal layer and outer layer, the lower surface of wherein said outer layer and the laminating of described Draining basin, and the lower surface of described internal layer is lower than the lower surface of described outer layer.
9. rotating electroplating machine as claimed in claim 7, it is characterized in that, described discharge mechanism also includes vibrator and discharge gate, and described Draining basin is obliquely installed, described vibrator is arranged on the extreme higher position bottom described Draining basin, and described discharge gate is arranged on the extreme lower position bottom described Draining basin.
10. the automatic discharge unit of a rotating electroplating machine, discharging for chip components and parts, described rotating electroplating machine includes cathode loop and cathode loop rotating mechanism, described cathode loop rotating mechanism controls described cathode loop and rotates, it is characterized in that, described automatic discharge unit includes chassis and automatic-separation mechanism, and described automatic-separation mechanism controls to be mutually closed and be separated from each other between described chassis and described cathode loop.
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| CN201410002339.5A CN103668373B (en) | 2014-01-03 | 2014-01-03 | Rotating electroplating machine and automatic discharge unit thereof |
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| CN201410002339.5A CN103668373B (en) | 2014-01-03 | 2014-01-03 | Rotating electroplating machine and automatic discharge unit thereof |
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| CN103668373B true CN103668373B (en) | 2016-06-08 |
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| CN112011815B (en) * | 2020-07-22 | 2021-07-02 | 福建奋安铝业有限公司 | Electrophoresis painting device for aluminum profile machining |
| CN114032603B (en) * | 2021-11-26 | 2023-11-17 | 合肥恒力装备有限公司 | Centrifugal rotary electroplating machine and electroplating process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508296A (en) * | 2002-12-19 | 2004-06-30 | 大日本网目版制造株式会社 | Electroplating device and method thereof |
| CN1576400A (en) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | Electroplating apparatus and method for electronic parts,and the same electronic parts |
| CN101016645A (en) * | 2003-01-21 | 2007-08-15 | 大日本网目版制造株式会社 | Plating apparatus, plating cup and cathode ring |
| CN101425471A (en) * | 2007-11-02 | 2009-05-06 | 株式会社瑞萨科技 | Manufacturing method of semiconductor integrated device |
| KR101141479B1 (en) * | 2010-07-13 | 2012-05-04 | 삼성전기주식회사 | Electroplating cell apparatus |
| CN203034129U (en) * | 2012-12-17 | 2013-07-03 | 深圳市宇阳科技发展有限公司 | Chip component electroplating vibrating screen |
-
2014
- 2014-01-03 CN CN201410002339.5A patent/CN103668373B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508296A (en) * | 2002-12-19 | 2004-06-30 | 大日本网目版制造株式会社 | Electroplating device and method thereof |
| CN101016645A (en) * | 2003-01-21 | 2007-08-15 | 大日本网目版制造株式会社 | Plating apparatus, plating cup and cathode ring |
| CN1576400A (en) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | Electroplating apparatus and method for electronic parts,and the same electronic parts |
| CN101425471A (en) * | 2007-11-02 | 2009-05-06 | 株式会社瑞萨科技 | Manufacturing method of semiconductor integrated device |
| KR101141479B1 (en) * | 2010-07-13 | 2012-05-04 | 삼성전기주식회사 | Electroplating cell apparatus |
| CN203034129U (en) * | 2012-12-17 | 2013-07-03 | 深圳市宇阳科技发展有限公司 | Chip component electroplating vibrating screen |
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