CN103666355A - Conductive silver adhesive - Google Patents
Conductive silver adhesive Download PDFInfo
- Publication number
- CN103666355A CN103666355A CN201310605784.6A CN201310605784A CN103666355A CN 103666355 A CN103666355 A CN 103666355A CN 201310605784 A CN201310605784 A CN 201310605784A CN 103666355 A CN103666355 A CN 103666355A
- Authority
- CN
- China
- Prior art keywords
- conductive silver
- conductive
- solidifying agent
- silver glue
- total mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
A conductive silver adhesive comprises base resin, a curing agent, a curing accelerating agent and a conductive material, and is characterized in that the base resin is ethoxyline resin; the curing agent is an anhydride curing agent, the curing accelerating agent adopts an isobutanol modified imidazole compound, and the conductive material adopts silver powder. The conductive silver adhesive can effectively lower the curing time.
Description
technical field
The present invention relates to a kind of conductive silver glue, belong to field of electronic materials.
technical background
Conductive silver glue is widely used in industries such as electronics, information, plating, is mainly used in the conductive adhesive between object.In prior art the set time of conductive resin long, the quick-setting occasion that is on the one hand difficult to satisfy the demand, on the other hand, it is long that set time, length can cause the production cycle, is unfavorable for saving production cost.
Summary of the invention
The object of this invention is to provide a kind of can quick-setting thermoset conductive silver glue.
For realizing above object, a kind of conductive silver glue of the present invention, comprise base resin, solidifying agent, curing catalyst and electro-conductive material, it is characterized in that: described base resin is epoxy resin, described solidifying agent is sour glycoside solidifying agent, described curing catalyst is isopropylcarbinol modified imidazole compounds, and described electro-conductive material is silver powder.
Described silver powder is 3-5 μ m flake silver powder, the 60%-70% that loading level is total mass.
Described sour glycoside solidifying agent is one or more in trimellitic anhydride, MALEIC ANHYDRIDE, trimellitic anhydride ethylene glycol, sulfobenzide tetracarboxylic dianhydride, the 10%-20% that consumption is total mass.
The 0.5%-1% that the consumption of described isopropylcarbinol modified imidazole class curing catalyst is total mass.
The beneficial effect that the present invention produces is that the present invention adopts sour glycoside solidifying agent, and is used in conjunction with the glyoxaline compound of acetic acid modification, can effectively reduce set time, and its cured article has good electric property and mechanical property.
Embodiment
Embodiment 1:
A conductive silver glue, its component and weight part are: 20 parts of epoxy resin, 10 parts of trimellitic anhydride, 5 parts of MALEIC ANHYDRIDE, 0.5 part of isopropylcarbinol modified imidazole compounds, 3 60 parts of μ m flake silver powders.Be 4.5min the conductive silver glue set time obtaining, and volume resistance is 3.4 * 10
-4ohmcm, cohesive strength is 11MPa.
Embodiment 2:
A conductive silver glue, its component and weight part are: 20 parts of epoxy resin, MALEIC ANHYDRIDE, 7 parts, 6 parts of trimellitic anhydride ethylene glycol, 1 part of isopropylcarbinol modified imidazole compounds, 4 65 parts of μ m flake silver powders.Be 4.5min the conductive silver glue set time obtaining, and volume resistance is 3.3 * 10
-4ohmcm, cohesive strength is 12MPa.
Embodiment 3:
A conductive silver glue, its component and weight part are: 20 parts of epoxy resin, 6 parts of trimellitic anhydride ethylene glycol, 10 parts of sulfobenzide tetracarboxylic dianhydrides, 1 part of isopropylcarbinol modified imidazole compounds, 5 60 parts of μ m flake silver powders.Be 4.8min the conductive silver glue set time obtaining, and volume resistance is 2.9 * 10
-4ohmcm, cohesive strength is 11MPa.
Claims (6)
1. a conductive silver glue, comprise base resin, solidifying agent, curing catalyst and electro-conductive material, it is characterized in that: described base resin is epoxy resin, described solidifying agent is sour glycoside solidifying agent, described curing catalyst is isopropylcarbinol modified imidazole compounds, and described electro-conductive material is silver powder.
2. a kind of conductive silver glue as claimed in claim 1, is characterized in that: described silver powder is 3-5 μ m flake silver powder.
3. a kind of conductive silver glue as claimed in claim 1, is characterized in that: the 60%-70% that described silver powder loading level is total mass.
4. a kind of conductive silver glue as claimed in claim 1, is characterized in that: described sour glycoside solidifying agent is one or more in trimellitic anhydride, MALEIC ANHYDRIDE, trimellitic anhydride ethylene glycol, sulfobenzide tetracarboxylic dianhydride.
5. a kind of conductive silver glue as claimed in claim 1, is characterized in that: the 10%-20% that the consumption of described sour glycoside solidifying agent is total mass.
6. a kind of conductive silver glue as claimed in claim 1, is characterized in that: the 0.5%-1% that the consumption of described isopropylcarbinol modified imidazole class curing catalyst is total mass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310605784.6A CN103666355B (en) | 2013-11-26 | 2013-11-26 | A kind of conductive silver glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310605784.6A CN103666355B (en) | 2013-11-26 | 2013-11-26 | A kind of conductive silver glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103666355A true CN103666355A (en) | 2014-03-26 |
| CN103666355B CN103666355B (en) | 2015-12-09 |
Family
ID=50305147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310605784.6A Active CN103666355B (en) | 2013-11-26 | 2013-11-26 | A kind of conductive silver glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103666355B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109096867A (en) * | 2018-06-25 | 2018-12-28 | 西安交通大学 | A kind of anti-static coatings and preparation method for high-voltage isulation dielectric surface |
| CN110894411A (en) * | 2019-12-16 | 2020-03-20 | 苏州瑞力博新材科技有限公司 | Epoxy conductive adhesive for laminated solar module and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309768A (en) * | 1999-03-10 | 2000-11-07 | Korea Advanced Inst Of Sci Technol | Production of anisotropic conductive adhesive for flip- chip bonding of plastic substrate |
| CN102093833A (en) * | 2010-12-06 | 2011-06-15 | 常州合润新材料科技有限公司 | Method for preparing silver conductive adhesive by in situ synthesis |
| CN102649899A (en) * | 2011-06-01 | 2012-08-29 | 京东方科技集团股份有限公司 | Conductive elargol and production method thereof |
-
2013
- 2013-11-26 CN CN201310605784.6A patent/CN103666355B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309768A (en) * | 1999-03-10 | 2000-11-07 | Korea Advanced Inst Of Sci Technol | Production of anisotropic conductive adhesive for flip- chip bonding of plastic substrate |
| CN102093833A (en) * | 2010-12-06 | 2011-06-15 | 常州合润新材料科技有限公司 | Method for preparing silver conductive adhesive by in situ synthesis |
| CN102649899A (en) * | 2011-06-01 | 2012-08-29 | 京东方科技集团股份有限公司 | Conductive elargol and production method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 刘全文等: "《咪唑类环氧树脂固化剂研究进展》", 《国外建材科技》, vol. 27, no. 3, 31 March 2006 (2006-03-31), pages 4 - 7 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109096867A (en) * | 2018-06-25 | 2018-12-28 | 西安交通大学 | A kind of anti-static coatings and preparation method for high-voltage isulation dielectric surface |
| CN110894411A (en) * | 2019-12-16 | 2020-03-20 | 苏州瑞力博新材科技有限公司 | Epoxy conductive adhesive for laminated solar module and preparation method thereof |
| CN110894411B (en) * | 2019-12-16 | 2021-09-21 | 苏州瑞力博新材科技有限公司 | Epoxy conductive adhesive for laminated solar module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103666355B (en) | 2015-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101781540B (en) | High-performance conducting resin and preparation method thereof | |
| MY169978A (en) | Low dielectric loss thermoset resin system at high frequency for use in electrical components | |
| WO2013095908A3 (en) | Process for preparing cured epoxy composites | |
| GB2473982A (en) | Circuit materials, circuits laminates and method of manufacture thereof | |
| MX351929B (en) | Acid-hardening epoxy thermoset resins and composites that can be hot-processed and recycled. | |
| JP2013510429A5 (en) | ||
| JP2015059170A5 (en) | ||
| JP2009070677A5 (en) | ||
| CN103666355B (en) | A kind of conductive silver glue | |
| JP2009019081A5 (en) | ||
| EA201690947A1 (en) | COMPOSITIONS ON THE BASIS OF THERMAL-RESISTANT RESINS WITH SUPER-LOW DIELECTRIC LOSSES AND HIGH-QUALITY LAYERED MATERIALS PRODUCED FROM THEM | |
| CN106415743A (en) | Soft magnetic resin composition and soft magnetic film | |
| SG10201406428QA (en) | Semiconductor device | |
| CN103666356B (en) | A kind of thermoset conductive silver glue | |
| CN103642420A (en) | Fast curing thermosetting conductive silver adhesive | |
| WO2016042415A2 (en) | Curable resin composition, curable resin molded article, cured product, laminate, complex, and multi-layer printed circuit board | |
| CN202917205U (en) | Flexible flat cable with property of anti-electromagnetic interference | |
| CN204367512U (en) | Metallic steel reinforcement conductive adhesive film in a kind of printed substrate | |
| CN103666322A (en) | Thermoplastic conductive silver sol | |
| WO2009028170A1 (en) | Thermosetting resin composition and cured product thereof | |
| CN105623585A (en) | Modified epoxy resin conductive adhesive used for LED chip packaging | |
| TW200712123A (en) | The nitrogen-containing curing agent and used thereof in the epoxy resin composition | |
| 이선호 et al. | Highly Insulating PCB Materials Based on Polybenzoxazine | |
| CN106883801A (en) | A kind of High-Voltage Electrical Appliances special isolation adhesive | |
| JP2006199835A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Cao Chahua Inventor before: Su Jianli |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170406 Address after: 519125 Guangdong Province, Zhuhai city Doumen District Baijiao town two new road No. 26 (building a floor area B) Patentee after: Zhuhai City Electronics Co. Ltd. die Address before: 266061 Shandong, Laoshan, Hongkong East Road, No. Pioneering Park, biological park, room 248, No. 239 Patentee before: Qingdao Wenchuang Science & Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |