CN103666322A - Thermoplastic conductive silver sol - Google Patents
Thermoplastic conductive silver sol Download PDFInfo
- Publication number
- CN103666322A CN103666322A CN201310661595.0A CN201310661595A CN103666322A CN 103666322 A CN103666322 A CN 103666322A CN 201310661595 A CN201310661595 A CN 201310661595A CN 103666322 A CN103666322 A CN 103666322A
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- China
- Prior art keywords
- thermoplastic conductive
- thermoplastic
- solvent
- conductive
- elargol
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A thermoplastic conductive silver sol comprises polymer resins, a solvent, and a conductive material, wherein the polymer resins are ethyl cellulose and polydicyclopentadiene, the solvent is terpineol, and the conductive material is silver powder. The thermoplastic conductive silver sol is especially suitable for the flexible substrate printing.
Description
technical field
The present invention relates to a kind of thermoplastic conductive elargol, belong to field of electronic materials.
technical background
Conductive silver glue is widely used in industries such as electronics, information, plating, is mainly used in the conductive adhesive between object.When conductive silver glue is used in flexible substrates in prior art, because the mobility of conductive silver glue is poor, be difficult for seeing through mesh, thereby cause biting, increase fraction defective.
Summary of the invention
The object of this invention is to provide a kind of thermoplastic conductive elargol that is specially adapted to flexible substrates printing.
For realizing above object, a kind of thermoplastic conductive elargol of the present invention, comprises macromolecule resin, solvent and electro-conductive material, and described macromolecule resin is ethyl cellulose and polydicyclopentadiene, and described solvent is Terpineol 350, and described electro-conductive material is silver powder.
Wherein, the mass ratio of ethyl cellulose and polydicyclopentadiene is 5:1-10:1; The mass ratio of macromolecule resin and solvent is 3:1-4:1; Described silver powder is 3-5 μ m flake silver powder, the 60%-70% that loading level is total mass.
The beneficial effect that the present invention produces is that conductive silver glue of the present invention has good mobility, is specially adapted to flexible substrates.While printing, show easy dispersion in flexible substrates, be convenient to grind, easily by mesh, become the premium properties of the smooth homogeneous of line.
Embodiment
Embodiment 1:
A thermoplastic conductive elargol, its component and weight part are: 30 parts of ethyl cellulose, 6 parts of polydicyclopentadiene epoxy resin, 12 parts of Terpineol 350s, 3 65 parts of μ m flake silver powders.
Embodiment 2:
A thermoplastic conductive elargol, its component and weight part are: 30 parts of ethyl cellulose, 4 parts of polydicyclopentadiene epoxy resin, 10 parts of Terpineol 350s, 4 70 parts of μ m flake silver powders.
Embodiment 3:
A thermoplastic conductive elargol, its component and weight part are: 30 parts of ethyl cellulose, 3 parts of polydicyclopentadiene epoxy resin, 9 parts of Terpineol 350s, 5 70 parts of μ m flake silver powders.
Claims (5)
1. a thermoplastic conductive elargol, comprises macromolecule resin, solvent and electro-conductive material, it is characterized in that: described macromolecule resin is ethyl cellulose and polydicyclopentadiene, and described solvent is Terpineol 350, and described electro-conductive material is silver powder.
2. a kind of thermoplastic conductive elargol as claimed in claim 1, is characterized in that: the mass ratio of described ethyl cellulose and polydicyclopentadiene is 5:1-10:1.
3. a kind of thermoplastic conductive elargol as claimed in claim 1, is characterized in that: the mass ratio of described macromolecule resin and solvent is 3:1-4:1.
4. a kind of thermoplastic conductive elargol as claimed in claim 1, is characterized in that: described silver powder is 3-5 μ m flake silver powder.
5. a kind of thermoplastic conductive elargol as claimed in claim 1, is characterized in that: the 60%-70% that described silver powder loading level is total mass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310661595.0A CN103666322A (en) | 2013-12-10 | 2013-12-10 | Thermoplastic conductive silver sol |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310661595.0A CN103666322A (en) | 2013-12-10 | 2013-12-10 | Thermoplastic conductive silver sol |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103666322A true CN103666322A (en) | 2014-03-26 |
Family
ID=50305115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310661595.0A Pending CN103666322A (en) | 2013-12-10 | 2013-12-10 | Thermoplastic conductive silver sol |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103666322A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107868283A (en) * | 2017-11-30 | 2018-04-03 | 安徽坤大化学锚固有限公司 | A kind of high low-temperature resistance type resin anchoring agent and its preparation technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400610A (en) * | 2002-09-02 | 2003-03-05 | 广东风华高新科技集团有限公司 | Conducting slurry material |
| CN101271929A (en) * | 2008-05-04 | 2008-09-24 | 常州亿晶光电科技有限公司 | Leadless solar battery silver paste and method for producing the same |
| CN101710497A (en) * | 2009-12-08 | 2010-05-19 | 华中科技大学 | Nano-silver conductive slurry |
| CN103165223A (en) * | 2011-12-15 | 2013-06-19 | 上海宝银电子材料有限公司 | High temperature sintering conductive silver paste for positive temperature coefficient (PTC) thermistor and preparation method thereof |
-
2013
- 2013-12-10 CN CN201310661595.0A patent/CN103666322A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400610A (en) * | 2002-09-02 | 2003-03-05 | 广东风华高新科技集团有限公司 | Conducting slurry material |
| CN101271929A (en) * | 2008-05-04 | 2008-09-24 | 常州亿晶光电科技有限公司 | Leadless solar battery silver paste and method for producing the same |
| CN101710497A (en) * | 2009-12-08 | 2010-05-19 | 华中科技大学 | Nano-silver conductive slurry |
| CN103165223A (en) * | 2011-12-15 | 2013-06-19 | 上海宝银电子材料有限公司 | High temperature sintering conductive silver paste for positive temperature coefficient (PTC) thermistor and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 王萍: "导电银胶的研究与制备", 《中国优秀硕士学位论文全文数据库 工程科技I辑》 * |
| 迟积山: "新的结构用树脂PDCPD", 《化工新型材料》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107868283A (en) * | 2017-11-30 | 2018-04-03 | 安徽坤大化学锚固有限公司 | A kind of high low-temperature resistance type resin anchoring agent and its preparation technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140326 |
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| RJ01 | Rejection of invention patent application after publication |