CN103663363A - Disordered alloy micro-spring, and preparation method and lighthouse thereof - Google Patents
Disordered alloy micro-spring, and preparation method and lighthouse thereof Download PDFInfo
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- CN103663363A CN103663363A CN201310644730.0A CN201310644730A CN103663363A CN 103663363 A CN103663363 A CN 103663363A CN 201310644730 A CN201310644730 A CN 201310644730A CN 103663363 A CN103663363 A CN 103663363A
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Abstract
The invention discloses a disordered alloy micro-spring, and a preparation method and a lighthouse thereof. A spring structure is in a screw shape, and integral dimension is in a level from hundred micrometer magnitude to millimeter magnitude; the material is a Ni-Nb-based disordered alloy material, young modulus is larger than 180 GPa, and elastic limit is larger than 2%. A preparation method comprises: (1) preparing a PMMA photoresist cylinder; (2) clamping the photoresist cylinder on the lighthouse for X-ray exposure; (3) carrying out development, and preparing a PMMA mould of the spring after development; (4) melting nickel and niobium metals under vacuum and argon protection to form a target material; (5) preparing a disordered alloy thin film layer by magnetron sputtering; and (6) releasing to obtain the disordered alloy micro-spring. An X-ray photoetching process and a magnetron sputtering technology are combined, which breaks a dimension bottleneck of a submillimeter spiral minisize spring prepared by a traditional mechanical technology, fills a vacancy of the disordered alloy spiral micro spring in an MEMS device, develops processing thinking of a 3D metal micro-device, and makes the micro spring have a flat and smooth surface and an ideal shape.
Description
Technical field
The invention belongs to nanometer technique field, relate to a kind of disordered alloy Microspring and preparation method thereof and exposure desk.
Background technology
Spring is as a kind of basic machine components, and the field that almost can touch people all has a wide range of applications and indispensable status.Yet along with nanometer technique fast development in recent decades, utilizing MEMS(Micro-Electro-Mechanical Systems) micro element such as microsensor of preparing of technology, Micromechanical Optics device, microactrator, micro parts obtains the achievement attracting people's attention in every field, the trend of device microminiaturization is day by day remarkable, each field is day by day urgent for the demand of Microspring, how traditional mechanical spring is miniaturizated to an important problem.
Traditional spring has obtained sufficient research for hundreds of years, the preparation technology who has comparatively perfect, preparation technology is generally divided into cold working and hot-working, conventionally there are the steps such as cold coiling shaping, hot rolling shaping, quenching, temper, destressing overdo, yet these ripe mechanical preparation methods are only applicable to the spring of general size and the moulding of material be there are certain requirements, cannot prepare other high coefficient of stiffiness Microspring of submillimeter level.The application model of Microspring in MEMS also do not have systematic summary and conclusion at present, the Microspring of having reported is generally prepared by MEMS technique, such as LIGA or UV-LIGA technology, Micro-machining based on silicon and surperficial sacrificial layer technology etc., said method can only be prepared planar structure spring conventionally, and the selection of material is limited, cannot prepare the spiral Microspring with very good mechanical properties.
Along with dwindling of spring size, its resistance to compression, energy storage capacity also can decline thereupon, select the high and non-friable material of a kind of strength ratio metal to prepare the mechanical property that spring can effectively improve spring.Ni-Nb base disordered alloy intensity is high, and hardness is high, corrosion-resistant, rub resistance, and the advantage of its existing metal and glass, has overcome again their disadvantages separately.The intensity of disordered alloy is higher than steel, and hardness surpasses high hard tool steel, has reasonable toughness and rigidity, is the ideal material of preparing Microspring, but utilize it to prepare Microspring, need to overcome the technical barrier that traditional handicraft cannot be processed micro-dimension spring.
Summary of the invention
The object of the invention is to fill up the vacancy of prior art, disordered alloy Microspring and preparation method thereof and exposure desk are provided.
The disordered alloy Microspring with the high coefficient of stiffiness and elastic limit, structure is screw type, and overall dimensions is in hundred micron dimensions to millimeter rank, and spring wire diameter is more than or equal to 10 um; Material is Ni-Nb base disordered alloy material, and Young's modulus is greater than 180GPa, and elastic limit is greater than 2%.
The described disordered alloy Microspring preparation method with the high coefficient of stiffiness and elastic limit, step is as follows:
1) utilize machining or injection moulding process, prepare a PMMA(polymethyl methacrylate) photoresist cylinder;
2) photoresist cylinder is clamped on exposure desk and carries out X-ray exposure, control exposure parameter and regulate the pitch of Microspring and the diameter of spring wire;
3) the photoresist cylinder exposing is developed, the PMMA mould of preparing spring after being developed;
4) by purity, surpass respectively 99.9% nickel and niobium metal higher than 3*10
-3the target that under the vacuum of Pa, argon shield melting forms;
5) the preparation of target materials disordered alloy thin layer that utilizes magnetron sputtering apparatus and make, controls sputtering time and controls sputter thickness, makes PMMA mould evenly around self axle rotation during sputter, guarantees the thickness evenness of disordered alloy thin layer;
6) first with methyl methacrylate solution, the mould with disordered alloy thin layer is soaked 24 hours, then soak 12 hours with acetone, finally by soaked in absolute ethyl alcohol, clean, discharge and obtain small one and large one two disordered alloy Microsprings of diameter.
Step 2) in, described exposure desk comprises electric rotating machine, mask plate, stepper motor, mask plate clamping fixture seat, the fixture of photoresist cylinder, carry sample folder, photoresist cylinder is clamped on the electric rotating machine of carry sample folder, can uniformly rotate, mask plate utilizes fixture to be fixed on mask plate clamping fixture seat, stepper motor rigid attachment mask plate clamping fixture seat, can drive mask plate rectilinear motion, and mask plate center printing opacity aperture and photoresist cylindrical center place are contour.
Described X-ray exposure method, is clamped to photoresist cylinder on the electric rotating machine of carry sample folder and carries out X-ray exposure, and X-ray sees through mask plate central small hole and is mapped on photoresist cylinder, electric rotating machine with
angular speed uniform rotation, stepper motor with
speed drive mask plate at the uniform velocity to move, exposure dose size has determined the degree of depth of exposure, the diameter of the diameter of moulding rear spring silk and center printing opacity aperture is suitable.
Exposure desk for the preparation of disordered alloy Microspring, the electric rotating machine, mask plate, stepper motor, mask plate clamping fixture seat, the fixture that comprise photoresist cylinder, carry sample folder, photoresist cylinder is clamped on the electric rotating machine of carry sample folder, can uniformly rotate, mask plate utilizes fixture to be fixed on mask plate clamping fixture seat, stepper motor rigid attachment mask plate clamping fixture seat, can drive mask plate rectilinear motion, and mask plate center printing opacity aperture and photoresist cylindrical center place are contour.
Beneficial effect of the present invention: synchrotron radiation light source X-ray photoetching process is combined with magnetron sputtering technique, break through traditional mechanical technology and prepared the size bottleneck of spiral microsprings, filled up the vacancy of disordered alloy spiral Microspring in MEMS device, the new approaches of preparing complex three-dimensional structure by improving the traditional micro-processing technology of existing maturation have been expanded, the Microspring surfacing of preparing is smooth, and geometry is desirable.Adopt Ni-Nb base disordered alloy material to there is excellent mechanical performance as the Microspring of material, intensity is high, hardness is high, corrosion resistance is common 304 stainless 10,000 times, the coefficient of stiffiness and elastic limit reach respectively the more than 2 times and 4 times of general crystalline metallic material Microspring, are expected to obtain extensive use in high-tech sectors such as micromechanics, accurate assembling, optics, Aero-Space, MEMS.
Accompanying drawing explanation
Fig. 1 is a kind of disordered alloy Microspring preparation method flow chart with the high coefficient of stiffiness and elastic limit;
Fig. 2 a is mask plate and drive unit schematic diagram;
Fig. 2 b is photoresist cylinder and whirligig schematic diagram;
Fig. 2 c is a kind of exposure process schematic diagram of preparing for disordered alloy Microspring;
Fig. 3 is the preparation process schematic diagram of disordered alloy Microspring;
In figure: electric rotating machine 2, mask plate 3, stepper motor 4, mask plate clamping fixture seat 5, the fixture 6 of photoresist cylinder 1, carry sample folder.
The specific embodiment
The present invention is in conjunction with synchrotron radiation light source X-ray photoetching process and magnetron sputtering technique, propose a kind of disordered alloy Microspring and preparation method with the high coefficient of stiffiness and elastic limit, in the numerous areas such as optical engineering, precision instrument, auto industry, biomedicine, military affairs, had very wide application prospect.
Below in conjunction with accompanying drawing, the present invention is described further.
The disordered alloy Microspring with the high coefficient of stiffiness and elastic limit, structure is screw type, and overall dimensions is in hundred micron dimensions to millimeter rank, and spring wire diameter can be little of 10 um left and right; Material is Ni-Nb base disordered alloy material, and Young's modulus is greater than 180GPa, and elastic limit is greater than 2%; Microspring has excellent mechanical performance, and intensity is high, and hardness is high, and corrosion resistance is common 304 stainless 10,000 times, and the coefficient of stiffiness and elastic limit reach respectively the more than 2 times and 4 times of general crystalline metallic material Microspring.
As shown in Figure 1, its key step comprises the above-mentioned disordered alloy Microspring preparation method flow process with the high coefficient of stiffiness and elastic limit: (1) prepares a PMMA(polymethyl methacrylate) photoresist cylinder; (2) photoresist cylinder is carried out to synchrotron radiation X-ray exposure; (3) develop and obtain Microspring mould; (4) prepare Ni-Nb base disordered alloy target, by purity, surpass 99.9% nickel and niobium metal according to a certain percentage higher than 3*10
-3under the vacuum of Pa, argon shield melting obtains; (5) magnetron sputtering is prepared disordered alloy thin layer; (6) dissolve photoresist release and obtain Microspring.
As shown in Fig. 2 a, 2b, 2c, exposure desk for the preparation of disordered alloy Microspring, the electric rotating machine 2, mask plate 3, stepper motor 4, mask plate clamping fixture seat 5, the fixture 6 that comprise photoresist cylinder 1, carry sample folder, photoresist cylinder 1 is clamped on the electric rotating machine 2 of carry sample folder, can uniformly rotate, mask plate 3 utilizes fixture 6 to be fixed on mask plate clamping fixture seat 5, stepper motor 4 rigid attachment mask plate clamping fixture seats 5, can drive mask plate 3 rectilinear motions, mask plate 3 center printing opacity apertures and photoresist cylinder 1 center are contour.
X-ray exposure method: photoresist cylinder is clamped on the electric rotating machine of carry sample folder, X-ray sees through mask plate central small hole and is mapped on photoresist cylinder near end points place a bit, electric rotating machine with
angular speed uniform rotation, stepper motor with
speed drive mask plate at the uniform velocity to move, angular speed
and translational speed
meet following relation:
The pitch that wherein p is spring.In the situation that light intensity is certain, speed
and
selection has determined that photoresist is exposed the X-ray dosage receiving on position, and hot spot is mobile slower on photoresist, and exposure dose is larger.Exposure dose size has determined the degree of depth of exposure, and the diameter of moulding rear spring silk is roughly suitable with the diameter of center printing opacity aperture.
As shown in Figure 3, its step is as follows for a kind of preparation process principle of above-mentioned disordered alloy Microspring:
1) utilize machining or injection moulding process, prepare a PMMA(polymethyl methacrylate) photoresist cylinder;
2) photoresist cylinder is clamped on exposure desk and carries out x-ray exposure, control exposure parameter and regulate the pitch of Microspring and the diameter of spring wire.
3) the photoresist cylinder exposing is developed, the PMMA mould of preparing spring after being developed.
4) by purity, surpass 99.9% nickel and niobium metal according to a certain percentage higher than 3*10
-3the target that under the vacuum of Pa, argon shield melting forms, by magnetron sputtering apparatus, controls sputtering time and controls sputter thickness.During sputter, make PMMA mould uniform speed slow around self axle rotation, guarantee thickness evenness.
5) first with methyl methacrylate solution, soak 24 hours, then soak 12 hours with acetone, finally by soaked in absolute ethyl alcohol, clean, obtain small one and large one 2 disordered alloy Microsprings of diameter.
Embodiment
A kind of disordered alloy Microspring, its design parameter is as follows: spring wire diameter 20 um, spring pitch 40 um, spring outer diameter 300 um, total coil number of spring 10, number of active coils 8, spring free length 400 um, spring material is Ni-Nb base disordered alloy material, and Young's modulus is greater than 180GPa, and elastic limit is greater than 2%.
As shown in Figure 3, this disordered alloy Microspring preparation method:
S01) utilize machining or injection moulding process, prepare a PMMA(polymethyl methacrylate) photoresist cylinder, its diameter 300 um, length 1mm;
S02) photoresist cylinder is clamped on exposure desk and carries out X-ray exposure, control exposure parameter and regulate the pitch of Microspring and the diameter of spring wire.Synchrotron radiation light source energy 2.2 GeV, flow strong 100 mA, characteristic energy 2.2 KeV, photoresist unit are absorption power density 877 W/m
2, the needed exposure dose density of PMMA is 3.5J/mm
3, mask plate central small hole diameter 20 um, electric rotating machine rotating speed
be 0.016 rad/s, stepper motor translational speed
0.1 um/s.
S03) the photoresist cylinder exposing is developed, the PMMA mould of preparing spring after being developed.
S04) by purity, surpass 99.9% nickel and niobium metal according to a certain percentage higher than 3*10
-3the target that under the vacuum of Pa, argon shield melting forms, by magnetron sputtering apparatus, controls sputtering time and makes sputter thickness reach 18 ~ 20 um.During sputter, make PMMA mould uniform speed slow around self axle rotation, guarantee thickness evenness.
S05) first with methyl methacrylate solution, soak 24 hours, then soak 12 hours with acetone, finally by soaked in absolute ethyl alcohol, clean, obtain small one and large one 2 disordered alloy Microsprings of diameter.
Parameter in disordered alloy Microspring material, dimensional parameters and preparation process in the present invention is controlled and is not limited to the design parameter that the present embodiment limits, and distortion on this basis or replacement etc. are all in protection scope of the present invention.
Claims (5)
1. a disordered alloy Microspring with the high coefficient of stiffiness and elastic limit, is characterized in that, structure is screw type, and overall dimensions is in hundred micron dimensions to millimeter rank, and spring wire diameter is more than or equal to 10 um; Material is Ni-Nb base disordered alloy material, and Young's modulus is greater than 180GPa, and elastic limit is greater than 2%.
2. a disordered alloy Microspring preparation method as claimed in claim 1 with the high coefficient of stiffiness and elastic limit, is characterized in that, step is as follows:
1) utilize machining or injection moulding process, prepare a PMMA photoresist cylinder;
2) photoresist cylinder is clamped on exposure desk and carries out X-ray exposure, control exposure parameter and regulate the pitch of Microspring and the diameter of spring wire;
3) the photoresist cylinder exposing is developed, the PMMA mould of preparing spring after being developed;
4) by purity, surpass respectively 99.9% nickel and niobium metal higher than 3*10
-3the target that under the vacuum of Pa, argon shield melting forms;
5) utilize magnetron sputtering apparatus and target sputter disordered alloy thin layer on PMMA mould, control sputtering time and control sputter thickness, during sputter, make PMMA mould evenly around self axle rotation, guarantee disordered alloy thin layer even thickness;
6) first with methyl methacrylate solution, the mould with disordered alloy thin layer is soaked 24 hours, then soak 12 hours with acetone, finally by soaked in absolute ethyl alcohol, clean, discharge and obtain small one and large one two disordered alloy Microsprings of diameter.
3. preparation method according to claim 2, it is characterized in that, step 2) in, described exposure desk comprises photoresist cylinder (1), the electric rotating machine (2) of carry sample folder, mask plate (3), stepper motor (4), mask plate clamping fixture seat (5), fixture (6), photoresist cylinder (1) is clamped on the electric rotating machine (2) of carry sample folder, can uniformly rotate, mask plate (3) utilizes fixture (6) to be fixed on mask plate clamping fixture seat (5), stepper motor (4) rigid attachment mask plate clamping fixture seat (5), can drive mask plate (3) rectilinear motion, mask plate (3) center printing opacity aperture and photoresist cylinder (1) center are contour.
4. preparation method according to claim 3, it is characterized in that, step 2) in, described X-ray exposure method, photoresist cylinder (1) is clamped on the electric rotating machine (2) of carry sample folder and carries out X-ray exposure, X-ray sees through mask plate (3) central small hole, and to be mapped to photoresist cylinder (1) upper, electric rotating machine (2) with
angular speed uniform rotation, stepper motor (4) with
speed drive mask plate (3) at the uniform velocity to move, exposure dose size has determined the degree of depth of exposure, the diameter of the diameter of moulding rear spring silk and center printing opacity aperture is suitable.
5. the exposure desk for the preparation of disordered alloy Microspring, it is characterized in that, comprise photoresist cylinder (1), the electric rotating machine (2) of carry sample folder, mask plate (3), stepper motor (4), mask plate clamping fixture seat (5), fixture (6), photoresist cylinder (1) is clamped on the electric rotating machine (2) of carry sample folder, can uniformly rotate, mask plate (3) utilizes fixture (6) to be fixed on mask plate clamping fixture seat (5), stepper motor (4) rigid attachment mask plate clamping fixture seat (5), can drive mask plate (3) rectilinear motion, mask plate (3) center printing opacity aperture and photoresist cylinder (1) center are contour.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111679555A (en) * | 2020-07-08 | 2020-09-18 | 江西沃格光电股份有限公司 | Preparation method of metal roller-shaped die |
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Application publication date: 20140326 |