CN103645762B - A kind of temperature/humidity control method and system - Google Patents
A kind of temperature/humidity control method and system Download PDFInfo
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- CN103645762B CN103645762B CN201310601755.2A CN201310601755A CN103645762B CN 103645762 B CN103645762 B CN 103645762B CN 201310601755 A CN201310601755 A CN 201310601755A CN 103645762 B CN103645762 B CN 103645762B
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Abstract
The invention provides a kind of temperature/humidity control method and system, the method comprises: ultrasound wave water-feed is injected into deionized pure water, starts Temperature and Humidity Control by the liquid level warning instruction temperature and humidity control system on temperature and humidity controller; Target temperature and the target humidity of controlled environment are set; When controlled environment temperature or humidity are higher than the target temperature set or target humidity, temperature and humidity control system starts semi-conductor condensation unit, utilize the moisture in semiconductor refrigerating separation air, and the water vapor that liquefies, the water of post liquefaction can be stored at inside in condensed water container and liquid level sensor is housed, when the liquid level of condensed water container exceedes the level threshold of setting, alarm will be initiated; When environment temperature is higher than target temperature, temperature and humidity control system closes electric heating unit, increases the voltage of semiconductor chilling plate simultaneously, improves the rotating speed of axial flow blower, accelerates air by PN junction cold junction thermal dissipating path, thus reduces environment degree.Effectively improve the printing quality of soldering paste.
Description
Technical field
The invention belongs to electronic applications, particularly a kind of temperature/humidity control method and system.
Background technology
Along with people have higher requirement to miniaturize electronic circuitry and input/output port (input/output, I/O) pin count.Although surface installation technique (SurfaceMountedTechnology, SMT) Circuit assembly is made to have light, thin, short and little feature, for have high pin count fine pitch device lead spacing and lead-in wire flatness it is also proposed more strict requirement, but owing to being subject to processing the restriction of precision, productibility, cost and packaging technology, it is generally acknowledged QFP type (QuadFlatPack, QFP) limit of device pitch is 0.3mm, which limits the development of High Density Packaging.In order to improve the number of pins of chip further and reduce chip volume, ball grid array structure (BallGridArray, the BGA) encapsulation technology more superior than QFP encapsulation technology has been born.
The appearance of BGA technology is integrated circuit (IntegratedCircuit, IC) much progress that encapsulates from four limit lead packages to array solder points of device, it achieve that device is less, lead-in wire is more, and excellent electrical property, also have some to exceed the performance advantage of conventional sectional technology in addition.These performance advantages comprise highdensity I/O interface, good heat dissipation performance, and Miniature component can be made to have higher clock frequency.Modern high performance circuit board adopts BGA element to become a kind of trend already in a large number, but BGA element also exists pad easily occurs rosin joint and solder skip problem.Also quite difficulty, testing cost are high for the test of BGA element, are not easy to ensure its q&r.Therefore will play the advantage of BGA technology, must solve rosin joint solder skip problem, solving rosin joint solder skip problem primary link is exactly the printing quality improving soldering paste.
Summary of the invention
Based on the above-mentioned technical matters existed in prior art.The present invention proposes a kind of temperature/humidity control method and system, solve the technical matters that the printing quality of effective soldering paste is not high.
The invention provides a kind of temperature and humidity control system, comprise: ultrasonic atomization unit, delivery conduit, electric heating unit, semi-conductor condensation unit, axial flow blower, humiture transducer and temperature and humidity controller, wherein, described ultrasonic atomization unit is linked together by conduit and controlled environment; Described axial flow blower, semiconductor refrigerating unit, electric heating unit connect and compose gas Inner eycle loop in turn by pipeline, described ultrasonic atomization unit is for improving the humidity of controlled environment, described electric heating unit is for improving controlled environment temperature, and described use semi-conductor condensation unit combined axis flow fan comes for reducing the gentle humidity of controlled environment; Described humiture transducer and controlled environment link together, and for monitoring the temperature and humidity of controlled environment, described temperature and humidity controller, for monitoring the liquid level change of ultrasonic atomization unit, when the liquid level of ultrasonic atomization unit is higher than alarm water level, gives the alarm.
Based on said temperature control system, above-mentioned semi-conductor condensation unit comprises semiconductor chilling plate, nominal pressure PN junction cold junction thermal dissipating path, condensed water container, PN junction hot junction active heat sink and controllable electric power.
Based on said temperature control system, above-mentioned ultrasonic atomization unit comprises water-feed and ultrasonic generator, and described water-feed is for storing deionized pure water.
Present invention also offers a kind of temperature/humidity control method, comprising: ultrasound wave water-feed is injected into deionized pure water, start Temperature and Humidity Control by the liquid level warning instruction temperature and humidity control system on temperature and humidity controller; Target temperature and the target humidity of controlled environment are set; When controlled environment temperature or humidity are higher than the target temperature set or target humidity, temperature and humidity control system starts semi-conductor condensation unit, utilize the moisture in semiconductor refrigerating separation air, and the water vapor that liquefies, the water of post liquefaction can be stored at inside in condensed water container and liquid level sensor is housed, when the liquid level of condensed water container exceedes the level threshold of setting, alarm will be initiated; When environment temperature is higher than target temperature, temperature and humidity control system closes electric heating unit, increases the voltage of semiconductor chilling plate simultaneously, improves the rotating speed of axial flow blower, accelerates air by PN junction cold junction thermal dissipating path, thus reduces environment degree.
Based on above-mentioned temperature/humidity control method, it is characterized in that, between the scope of the water temperature of above-mentioned pure water is 20 to 23 degrees Celsius.
Based on above-mentioned temperature/humidity control method, it is characterized in that, the scope of above-mentioned target humidity is the scope 22-28 degree Celsius of 30-60%, target temperature.
The invention has the beneficial effects as follows: the printing quality effectively improving soldering paste, further increase the yields of BGA element welding.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of temperature and humidity control system of the present invention.
In figure, 1, ultrasonic atomization unit, 2, delivery conduit, 3, electric heating unit, 4, semi-conductor condensation unit, 5, axial flow blower, 6, humiture transducer and 7, temperature and humidity controller.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, is to be noted that described embodiment is only intended to be convenient to the understanding of the present invention, and do not play any restriction effect to it.
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
As shown in Figure 1, the invention provides a kind of temperature and humidity control system, include: ultrasonic atomization unit 1, delivery conduit 2, electric heating unit 3, semi-conductor condensation unit 4, axial flow blower 5, humiture transducer 6 and temperature and humidity controller 7.Wherein, ultrasonic atomization unit comprises water-feed and ultrasonic generator.Semi-conductor condensation unit includes semiconductor chilling plate, nominal pressure (Definitionofnominalpressure, PN) ties cold junction thermal dissipating path, condensed water container, PN junction hot junction active heat sink and controllable electric power.Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.Its advantage does not have slide unit, and be applied in some spaces and be restricted, reliability requirement is high, without the occasion that cold-producing medium pollutes.Ultrasonic atomization unit is linked together by conduit and controlled environment.Axial flow blower, semiconductor refrigerating unit, electric heating unit connect and compose gas Inner eycle loop in turn by pipeline.Ultrasonic atomization unit and electric heating unit is utilized to improve ambient humidity and environment temperature, semi-conductor condensation unit combined axis flow fan is used to reduce ambient temperature and humidity, utilize humiture transducer and temperature and humidity controller to carry out temperature and humidity monitor, constitute the regulator control system that a humiture is reversible.
Present invention also offers a kind of wet temp control method, its process comprises:
First, ultrasound wave water-feed is injected into deionized pure water, and the water temperature of pure water can between 20 ~ 23 degrees Celsius.When the yellow liquid level warning pilot lamp on temperature and humidity controller extinguishes and green lights, just illustrate temperature and humidity control system ready, controlling of humidity and temperature can be started.The effect of liquid level warning is protection ultrasonic generator; if the long-time anhydrous work of ultrasonic generator can cause damage; such ultrasonic generator is once anhydrous, and yellow liquid level warning pilot lamp lights reminds staff to inject pure water toward ultrasonic humidifying unit.
Secondly, arrange target temperature and the humidity of environment, usual humidity can be 30-60%, and temperature is 22-28 degree Celsius.Temperature control or humid control adopt the PID control technology of technology maturation, and wherein, pid parameter automatically can be tested by temperature and humidity control system and draw, eliminates complicated pid parameter debug process.
Finally, if when environment temperature or humidity are higher than the target temperature set or humidity, temperature and humidity control system starts semi-conductor condensation unit, utilize the moisture in semiconductor refrigerating separation air, the water of post liquefaction can be stored in condensed water container, and condensed water container uses PC material to make, liquid level sensor is equipped with in inside, to alarm be initiated, reminding user when liquid level exceedes the level threshold of setting, overflow to prevent condensate water.Semi-conductor condensation unit has refrigerating function simultaneously, when environment temperature is higher than target temperature, and system closing electric heating unit, increase the voltage of semiconductor chilling plate simultaneously, improve the rotating speed of axial flow blower, accelerate air by PN junction cold junction thermal dissipating path, thus reduce environment degree.
System adopts inner loop mode, by conduit, axial flow blower, semi-conductor condensation unit, electric heating unit is connected to controlled environment, external environment can be avoided like this to the interference of controlled environment, reduces entering of dust, improves the stability of control system.
Describing above is only a specific embodiment of the present invention, and obviously anyone amendment done of this area or locally replacement under technical scheme of the present invention instructs, all belongs to the scope that claims of the present invention limits.
Claims (4)
1. the control method of a temperature and humidity control system, it is characterized in that, comprise: ultrasonic atomization unit, delivery conduit, electric heating unit, semi-conductor condensation unit, axial flow blower, humiture transducer and temperature and humidity controller, wherein, described ultrasonic atomization unit is linked together by conduit and controlled environment; Axial flow blower, semi-conductor condensation unit, electric heating unit connect and compose gas Inner eycle loop in turn by pipeline, ultrasonic atomization unit is for improving the humidity of controlled environment, described electric heating unit, for improving controlled environment temperature, uses semi-conductor condensation unit combined axis flow fan to come for reducing controlled environment temperature and humidity; Described humiture transducer and controlled environment link together, and for monitoring the temperature and humidity of controlled environment, described temperature and humidity controller, for monitoring the liquid level change of ultrasonic atomization unit, when the liquid level of ultrasonic atomization unit is higher than alarm water level, gives the alarm; Described semi-conductor condensation unit comprises semiconductor chilling plate, nominal pressure PN junction cold junction thermal dissipating path, condensed water container, PN junction hot junction active heat sink and controllable electric power; Ultrasound wave water-feed is injected into deionized pure water, starts Temperature and Humidity Control by the liquid level warning instruction temperature and humidity control system on temperature and humidity controller; Target temperature and the target humidity of controlled environment are set; When controlled environment temperature or humidity are higher than the target temperature set or target humidity, temperature and humidity control system starts semi-conductor condensation unit, utilize the moisture in semiconductor refrigerating separation air, and the water vapor that liquefies, the water of post liquefaction can be stored in condensed water container, liquid level sensor is equipped with in condensed water container inside, when the liquid level of condensed water container exceedes the level threshold of setting, will initiate alarm; When environment temperature is higher than target temperature, temperature and humidity control system closes electric heating unit, increases the voltage of semiconductor chilling plate simultaneously, improves the rotating speed of axial flow blower, accelerates air by PN junction cold junction thermal dissipating path, thus reduces environment temperature.
2. the control method of described temperature and humidity control system as claimed in claim 1, is characterized in that, described ultrasonic atomization unit comprises ultrasound wave water-feed and ultrasonic generator, and described ultrasound wave water-feed is for storing deionized pure water.
3. the control method of described temperature and humidity control system as claimed in claim 1, is characterized in that, between the scope of the water temperature of described pure water is 20 to 23 degrees Celsius.
4. the control method of described temperature and humidity control system as claimed in claim 1, is characterized in that, the scope of described target humidity is the scope 22-28 degree Celsius of 30-60%, target temperature.
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| CN201310601755.2A CN103645762B (en) | 2013-11-22 | 2013-11-22 | A kind of temperature/humidity control method and system |
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| CN201310601755.2A CN103645762B (en) | 2013-11-22 | 2013-11-22 | A kind of temperature/humidity control method and system |
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| CN103645762B true CN103645762B (en) | 2015-11-18 |
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| CN105202621B (en) * | 2015-09-17 | 2017-12-29 | 国网天津节能服务有限公司 | A kind of method for identifying the bad user of heating cable heating |
| CN105955375A (en) * | 2016-07-01 | 2016-09-21 | 苏州克林络姆空调系统工程有限公司 | Energy-saving temperature and humidity detection and control equipment of clean animal room |
| CN108036440B (en) * | 2017-11-30 | 2020-12-18 | 西安理工大学 | Ultrasonic water mist air purification and humidification system and purification and humidification method |
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| US6168085B1 (en) * | 1999-12-14 | 2001-01-02 | Semifab Incorporated | System and method for cascade control of temperature and humidity for semi-conductor manufacturing environments |
| CN2611785Y (en) * | 2003-03-28 | 2004-04-14 | 陈定弟 | Supersonic air conditioning fan set with semiconductor refrigerator |
| CN101898658A (en) * | 2009-05-30 | 2010-12-01 | 邢刚 | High-precision and constant temperature and humidity cabinet |
| CN202328545U (en) * | 2011-11-17 | 2012-07-11 | 漳州万利达生活电器有限公司 | Humidity control equipment having humidifying function and dehumidifying function |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5913660B2 (en) * | 1978-02-13 | 1984-03-31 | 株式会社東芝 | Temperature and humidity control device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6168085B1 (en) * | 1999-12-14 | 2001-01-02 | Semifab Incorporated | System and method for cascade control of temperature and humidity for semi-conductor manufacturing environments |
| CN2611785Y (en) * | 2003-03-28 | 2004-04-14 | 陈定弟 | Supersonic air conditioning fan set with semiconductor refrigerator |
| CN101898658A (en) * | 2009-05-30 | 2010-12-01 | 邢刚 | High-precision and constant temperature and humidity cabinet |
| CN202328545U (en) * | 2011-11-17 | 2012-07-11 | 漳州万利达生活电器有限公司 | Humidity control equipment having humidifying function and dehumidifying function |
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