CN103643284A - Intelligent sensing method and system for electroplating line current abnormity - Google Patents
Intelligent sensing method and system for electroplating line current abnormity Download PDFInfo
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- CN103643284A CN103643284A CN201310564301.2A CN201310564301A CN103643284A CN 103643284 A CN103643284 A CN 103643284A CN 201310564301 A CN201310564301 A CN 201310564301A CN 103643284 A CN103643284 A CN 103643284A
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Abstract
The invention relates to the electroplating production field, and particularly relates to an intelligent sensing method and system for electroplating line current abnormity. The method comprises the following steps: obtaining a current value required for electroplating according to inputted electroplating current density, and electroplating parameters of a production panel; carrying out electroplating work according to the current value; detecting an electroplating voltage signal during the electroplating; calculating a theoretical voltage corresponding to the inputted electroplating current density according to the linear relation between the voltage and the electroplating current density; sampling and comparing the detected electroplating voltage signal with the theoretical voltage signal, and determining electroplating deviation when the detected electroplating voltage signal is larger than a certain set threshold of the theoretical voltage. According to the invention, by using the linear relation between the electroplating voltage and the current density, the electroplating voltage of an electroplating line is monitored during electroplating in a manner of electroplating current controlling; whether electroplating abnormity occurs is determined by comparing the real voltage with the set current density; and thus intelligent detection of electroplating current abnormity is realized.
Description
Technical field
The present invention relates to Electroplating Production field, more specifically, relate to a kind of plating line current anomaly intelligent-induction method and system.
Background technology
When PCB electro-coppering is carried out in PCB industry inherence, because electroplating voltage is very little, electric current is very large, for guaranteeing to electroplate control accuracy, what generally take is the mode that constant current is electroplated, be that operator input electroplating current density, produce the plating area of plate and produce the electroplating parameters such as plate quantity to master control computer, master control computer calculates the theoretical electric current needing automatically.
Master control computer calculates after the current value needing, the current values signal of needs is sent to corresponding rectifier, rectifier carries out electric current induction and adjustment by built-in current sensor, the current signal result feedback of measurement is returned to master control computer simultaneously, after master control computer verification size of current meets, plating work continues to carry out.
Needed electric current when although this scheme can calculate PCB plating, but some shortcomings that it still exists: when operator input electroplating parameter by mistake as figure number, quantity, area, or current sensor occurs extremely causing current deviation serious, or one in several electroplated leads ruptures because the machinery in electroplating process waves, and master control system cannot all be found above-mentioned abnormal conditions in time.
For example the modal mishandle of plating line is that item number is inputed by mistake:
For example A item number is positioned at and flies to cling to A, and the current density needing is 18ASF, and electroplating area is 3.0inch2/ piece, 10 of quantity, and plating line is controlled 10=540A of electric current=18ASF*3.0inch2/ piece *.
The current density that B item number needs is 15ASF, and electroplating area is 1.5inch2/ piece, 10 of quantity, and plating line is controlled 10=225A of electric current=15ASF*1.5inch2/ piece *.
During plating, because operator neglect, A bar should be inputted A item number, wrong defeated one-tenths B item number, and A bar electric current should be 540A, actually presses 225A plating.
Current density when actual A item number is electroplated becomes: 225A/10 piece/3.0 inch2/ piece=7.5ASF.Actual current density is well below 18ASF requirement originally, and plating line is produced by the wrong item number of operator's input, does not have any error feedback.Therefore finally can cause the serious copper facing of A item number not enough.
And PCB copper facing Inspection of Thickness generally need to carry out destructiveness section, therefore cannot entirely examine, if do not have to find the PCB of copper facing deficiency in time, flow into rear operation, will cause extremely serious quality event.
Visible, no matter how electroplating parameter arranges mistake, or occurs current deviation, and finally impact is all actual current density.For what normally move continuously, the fixing PCB of electroplating time electroplates, and the size of actual current density is almost the unique parameter that determines electroplating thickness.
Summary of the invention
The present invention is at least one defect (deficiency) overcoming described in above-mentioned prior art, and a kind of plating line current anomaly intelligent-induction method that the abnormal intellectuality of electroplating current detects that realizes is provided.
The present invention also provides a kind of plating line current anomaly intelligent-induction system that the abnormal intellectuality of electroplating current detects that realizes.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
A plating line current anomaly intelligent-induction method, comprising:
Electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value;
According to current value, carry out plating work;
In electroplating process, detect electroplating voltage signal;
According to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input;
By the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and is occurred deviation.The present invention is through research discovery, and when electroplating, current density and electroplating voltage are linear, and current density is higher, and electroplating voltage is also higher.Therefore utilize the linear relationship of electroplating voltage and current density, when the mode that adopts control electroplating current size is electroplated, monitor the electroplating voltage of plating line, whether the current density of comparison virtual voltage and setting meets this linear relationship to a certain extent, thereby judge whether to occur electroplating extremely, realize the abnormal intellectuality of electroplating current and detect.
In a kind of preferred version, when detecting after deviation appears in plating, send plating abnormal prompt.By electroplating the appearance of abnormal prompt operation alert plating in time unusual phenomenon.
In a kind of preferred version, when detecting after deviation appears in plating, automatically proceed to electroplating current protected mode and send alarm prompt.When plating deviation is larger, can directly have influence on electroplating quality, therefore can come to producing plate, to protect in time by electroplating current protected mode, and utilize alarm prompt to inform operator simultaneously.
In a kind of preferred version, described according to the electroplating parameter of the electroplating current density of input, production plate, obtain the required current value of plating and comprise:
According to the electroplating parameter of the electroplating current density of input, production plate, calculate the theoretical current that plating needs;
To theoretical current adjust and verification after obtain electroplating required current value.
A plating line current anomaly intelligent-induction system, comprising:
Primary controller, the electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value;
Electroplating worktable, is connected with primary controller, and the required electric current of plating obtaining according to primary controller carries out plating work;
Voltage sensor, is connected with electroplating worktable, detects the electroplating voltage signal in electroplating process;
Voltage sensor is also connected with primary controller, primary controller is according to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input, and by the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and is occurred deviation.The present invention increases voltage sensor the voltage of electroplating process is detected, primary controller according to voltage sensor senses to electroplating voltage judge whether electroplating process occurs extremely, realize the abnormal intellectuality of electroplating current and detect, significantly improve plating reliability.
In a kind of preferred version, also comprise the abnormal prompt device being connected with primary controller, when detecting after deviation appears in plating, primary controller sends plating abnormal prompt by abnormal prompt device.
In a kind of preferred version, also comprise the warning being connected with primary controller, after primary controller detects plating to occur deviation, electroplating worktable automatically proceeds to electroplating current protected mode and sends alarm prompt by warning.
In a kind of preferred version, also comprise the rectifier being connected with primary controller, rectifier is built-in with current sensor, primary controller calculates and electroplates in the theoretical current input rectifier needing according to the electroplating parameter of the electroplating current density of input, production plate, current sensor in rectifier carries out electric current induction and adjustment, then the current signal measuring is fed back to primary controller, primary controller verification size of current obtains electroplating required current value.
In a kind of preferred version, described voltage sensor is built in rectifier.The rectifier of modern electroplating device, for guaranteeing versatility, generally has current sense and voltage sensor function concurrently simultaneously, but current sensor is generally only used in modern PCB plating, and voltage sensor is idle.This scheme makes full use of idle voltage sensor in rectifier, can effectively improve plating reliability, only needs carry out certain modification and arrange electroplating software system.
Compared with prior art, the beneficial effect of technical solution of the present invention is:
(1) the present invention finds through research, and when electroplating, current density and electroplating voltage are linear, and current density is higher, and electroplating voltage is also higher.Therefore utilize the linear relationship of electroplating voltage and current density, when the mode that adopts control electroplating current size is electroplated, monitor the electroplating voltage of plating line, whether the current density of comparison virtual voltage and setting meets this linear relationship to a certain extent, thereby judge whether to occur electroplating extremely, realize the abnormal intellectuality of electroplating current and detect.
(2) the present invention carries out verification to two parameters of current density of electroplating voltage and setting, be independent of the current control system of existing plating line, even if other parameters are if the electroplating parameter of producing plate is as input errors such as production quantity, areas, or the current control system of plating line own breaks down, also can automatically note abnormalities, significantly improve plating reliability.
(3) the present invention increases voltage sensor voltage in electroplating process is detected, and feed back in time primary controller and electroplate abnormal judgement, be independent of the current control system of existing plating line, even if other parameters are if the electroplating parameter of producing plate is as input errors such as production quantity, areas, or the current control system of plating line own breaks down, also can automatically note abnormalities, realize the abnormal intellectuality of electroplating current and detect, significantly improve plating reliability.
Accompanying drawing explanation
Fig. 1 is the schema of a kind of plating line current anomaly of the present invention intelligent-induction method specific embodiment.
Fig. 2 is the frame diagram of a kind of plating line current anomaly of the present invention intelligent-induction system specific embodiment.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
For better explanation the present embodiment, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing some known configurations and explanation thereof may to omit be understandable.
In description of the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " connection " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, can be also indirectly to connect by intermediary, can say the connection of two element internals.For the ordinary skill in the art, can particular case understand above-mentioned term at concrete meaning of the present invention.
Below in conjunction with drawings and Examples, technical scheme of the present invention is described further.
Embodiment 1
As shown in Figure 1, be the schema of a kind of plating line current anomaly of the present invention intelligent-induction method specific embodiment.Participate in Fig. 1, a kind of plating line current anomaly of this specific embodiment intelligent-induction method specifically comprises:
S01: the electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value; It specifically comprises:
S011: calculate the theoretical current that plating needs according to the electroplating parameter of the electroplating current density of input, production plate; Wherein, the electroplating parameter of production plate comprises that the area of producing plate is, the quantity of production plate etc.
S012: to theoretical current adjust and verification after obtain electroplating required current value.Concrete adjustment can realize by rectifier and the current sensor being built in rectifier, theoretical current signal is sent to corresponding rectifier, rectifier carries out electric current induction and adjustment by built-in current sensor, the current signal result feedback of measurement is returned simultaneously, verification size of current meets after plating work, then starts plating work.
S02: carry out plating work according to current value;
S03: detect electroplating voltage signal in electroplating process; The detection of electroplating voltage signal can realize by voltage sensor.The rectifier of modern electroplating device, for guaranteeing versatility, generally has current sense and voltage sensor function concurrently simultaneously, but current sensor is generally only used in modern PCB plating, and voltage sensor is idle.This scheme makes full use of idle voltage sensor in rectifier, can effectively improve plating reliability, only needs carry out certain modification and arrange electroplating software system.
S04: according to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input; Wherein the linear relationship of voltage and electroplating current density presets according to priori, this step can be carried out the front and back in above-mentioned steps S02, S03 the calculating of theoretical voltage, after electroplating current density input, this step just can be carried out in advance, precomputes corresponding theoretical voltage.
S05: by the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and occurred deviation.Wherein setting threshold can be set according to priori.
The present invention is through research discovery, and when electroplating, current density and electroplating voltage are linear, and current density is higher, and electroplating voltage is also higher.Therefore utilize the linear relationship of electroplating voltage and current density, when the mode that adopts control electroplating current size is electroplated, monitor the electroplating voltage of plating line, whether the current density of comparison virtual voltage and setting meets this linear relationship to a certain extent, thereby judge whether to occur electroplating extremely, realize the abnormal intellectuality of electroplating current and detect.
In specific implementation process, for can be to electroplating the timely alarm of unusual phenomenon, the method for this specific embodiment can also comprise:
S06: send plating abnormal prompt when detecting after deviation appears in plating.Electroplate abnormal prompt and can be the electroplating voltage signal that detects than carrying out in the bigger situation of theoretical voltage, by electroplating abnormal prompt, can remind in time operator to check the whole process of electroplating, correct a mistake promptly.
In another embodiment, when detecting after deviation appears in plating, automatically proceed to electroplating current protected mode and send alarm prompt.When plating deviation is larger, can directly have influence on electroplating quality, therefore can to producing plate, protect in time by electroplating current protected mode, and utilize alarm prompt operator to check simultaneously, correct a mistake promptly.
Based on a kind of above-mentioned plating line current anomaly intelligent-induction method, the present invention also provides a kind of plating line current anomaly intelligent-induction system.As shown in Figure 2, be the frame diagram of a kind of plating line current anomaly of the present invention intelligent-induction system specific embodiment.
Referring to Fig. 2, a kind of plating line current anomaly intelligent-induction system of this specific embodiment, comprising:
Primary controller 1, the electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value;
Electroplating worktable 2, is connected with primary controller 1, and the required electric current of plating obtaining according to primary controller 1 carries out plating work;
Voltage sensor 3, is connected with electroplating worktable 2, detects the electroplating voltage signal in electroplating process;
Voltage sensor 3 is also connected with primary controller 1, primary controller 1 is according to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input, and by the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and is occurred deviation.The voltage that the present invention increases by 3 pairs of electroplating processs of voltage sensor detects, and the electroplating voltage that primary controller 1 detects according to voltage sensor 3 judges whether electroplating process occurs extremely, realizes the abnormal intellectuality of electroplating current and detects, and significantly improves plating reliability.
In specific implementation process, for can be to electroplating the timely alarm of unusual phenomenon, the system of this specific embodiment also comprises:
The abnormal prompt device 4 being connected with primary controller 1, sends plating abnormal prompt when primary controller 1 detects after deviation appears in plating by abnormal prompt device 4.Electroplate abnormal prompt device 4 and can be the electroplating voltage signal that detects than pointing out in the bigger situation of theoretical voltage, by electroplating abnormal prompt, can remind in time operator to check the whole process of electroplating, correct a mistake promptly.
In another embodiment, also comprise the warning 5 being connected with primary controller 1, after primary controller 1 detects plating to occur deviation, electroplating worktable 2 automatically proceeds to electroplating current protected mode and sends alarm prompt by warning 5.
In specific implementation process, also comprise the rectifier being connected with primary controller 1, rectifier is built-in with current sensor, primary controller 1 calculates and electroplates in the theoretical current input rectifier needing according to the electroplating parameter of the electroplating current density of input, production plate, current sensor in rectifier carries out electric current induction and adjustment, then the current signal measuring is fed back to primary controller 1, primary controller 1 verification size of current obtains electroplating required current value.A kind of preferred embodiment in, voltage sensor 3 is built in rectifier.The rectifier of modern electroplating device, for guaranteeing versatility, generally has current sense and voltage sensor function concurrently simultaneously, but current sensor is generally only used in modern PCB plating, and voltage sensor is idle.This scheme makes full use of idle voltage sensor in rectifier, can effectively improve plating reliability, only needs carry out certain modification and arrange electroplating software system.
The corresponding same or analogous parts of same or analogous label;
In accompanying drawing, describe position relationship for only for exemplary illustration, can not be interpreted as the restriction to this patent;
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all embodiments.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in the protection domain of the claims in the present invention.
Claims (9)
1. a plating line current anomaly intelligent-induction method, is characterized in that, comprising:
Electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value;
According to current value, carry out plating work;
In electroplating process, detect electroplating voltage signal;
According to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input;
By the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and is occurred deviation.
2. plating line current anomaly intelligent-induction method according to claim 1, is characterized in that, when detecting after deviation appears in plating, sends plating abnormal prompt.
3. plating line current anomaly intelligent-induction method according to claim 1, is characterized in that, when detecting after deviation appears in plating, automatically proceeds to electroplating current protected mode and sends alarm prompt.
4. according to the plating line current anomaly intelligent-induction method described in claims 1 to 3 any one, it is characterized in that, described according to the electroplating parameter of the electroplating current density of input, production plate, obtain the required current value of plating and comprise:
According to the electroplating parameter of the electroplating current density of input, production plate, calculate the theoretical current that plating needs;
To theoretical current adjust and verification after obtain electroplating required current value.
5. a plating line current anomaly intelligent-induction system, is characterized in that, comprising:
Primary controller, the electroplating parameter according to the electroplating current density of input, production plate, obtains and electroplates required current value;
Electroplating worktable, is connected with primary controller, and the required electric current of plating obtaining according to primary controller carries out plating work;
Voltage sensor, is connected with electroplating worktable, detects the electroplating voltage signal in electroplating process;
Voltage sensor is also connected with primary controller, primary controller is according to the linear relationship of voltage and electroplating current density, calculate the corresponding theoretical voltage of electroplating current density of input, and by the comparison of sampling of the electroplating voltage signal detecting and theoretical voltage signal, when the electroplating voltage signal detecting is greater than some setting thresholds of theoretical voltage, judgement is electroplated and is occurred deviation.
6. plating line current anomaly intelligent-induction system according to claim 5, is characterized in that, also comprises the abnormal prompt device being connected with primary controller, when primary controller detects after deviation appears in plating, by abnormal prompt device, sends plating abnormal prompt.
7. plating line current anomaly intelligent-induction system according to claim 5; it is characterized in that; also comprise the warning being connected with primary controller, after primary controller detects plating to occur deviation, electroplating worktable automatically proceeds to electroplating current protected mode and sends alarm prompt by warning.
8. plating line current anomaly intelligent-induction system according to claim 5, it is characterized in that, also comprise the rectifier being connected with primary controller, rectifier is built-in with current sensor, primary controller calculates and electroplates in the theoretical current input rectifier needing according to the electroplating parameter of the electroplating current density of input, production plate, current sensor in rectifier carries out electric current induction and adjustment, then the current signal measuring is fed back to primary controller, primary controller verification size of current obtains electroplating required current value.
9. plating line current anomaly intelligent-induction system according to claim 8, is characterized in that, described voltage sensor is built in rectifier.
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| CN201310564301.2A CN103643284A (en) | 2013-11-14 | 2013-11-14 | Intelligent sensing method and system for electroplating line current abnormity |
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| CN104862768A (en) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | Electroplating method and device of circuit boards |
| CN104988566A (en) * | 2015-06-26 | 2015-10-21 | 昆山博通机械设备有限公司 | Intelligent self-driven transferring hanging rack with rectification function |
| CN105040087A (en) * | 2015-07-08 | 2015-11-11 | 东北石油大学 | Method and device used for optimizing electroplating parameters in laboratory |
| CN105274613A (en) * | 2015-05-07 | 2016-01-27 | 苏州胜科设备技术有限公司 | Plating line early warning system |
| CN105297118A (en) * | 2014-06-09 | 2016-02-03 | 株式会社荏原制作所 | Plating apparatus and plating method |
| KR20160122076A (en) * | 2015-04-13 | 2016-10-21 | 램 리써치 코포레이션 | Monitoring electrolytes during electroplating |
| CN109031117A (en) * | 2018-06-29 | 2018-12-18 | 昆山沪利微电有限公司 | A kind of electroplating device vibrating motor running state monitoring system and monitoring method |
| CN109072476A (en) * | 2016-05-24 | 2018-12-21 | 应用材料公司 | Electroplating power supply with remaining control and ETHERCAT interface |
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| CN110528039A (en) * | 2019-07-31 | 2019-12-03 | 浙江大学 | Micro-nano structure local electric deposition device based on the detection monitoring of faint ionic current |
| CN110737217A (en) * | 2018-07-20 | 2020-01-31 | 浩兴电子有限公司 | Real-time current detection system for hanger of electroplating equipment |
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| CN105297118A (en) * | 2014-06-09 | 2016-02-03 | 株式会社荏原制作所 | Plating apparatus and plating method |
| US20190010626A1 (en) * | 2015-04-13 | 2019-01-10 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| US10774438B2 (en) * | 2015-04-13 | 2020-09-15 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| KR102550311B1 (en) | 2015-04-13 | 2023-06-30 | 램 리써치 코포레이션 | Monitoring electrolytes during electroplating |
| KR20160122076A (en) * | 2015-04-13 | 2016-10-21 | 램 리써치 코포레이션 | Monitoring electrolytes during electroplating |
| CN105274613A (en) * | 2015-05-07 | 2016-01-27 | 苏州胜科设备技术有限公司 | Plating line early warning system |
| CN104862768B (en) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | The electro-plating method and device of a kind of circuit board |
| CN104862768A (en) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | Electroplating method and device of circuit boards |
| CN104988566B (en) * | 2015-06-26 | 2018-03-16 | 昆山博通机械设备有限公司 | Has the self-driven transfer hanger of intelligence of rectification function |
| CN104988566A (en) * | 2015-06-26 | 2015-10-21 | 昆山博通机械设备有限公司 | Intelligent self-driven transferring hanging rack with rectification function |
| CN105040087A (en) * | 2015-07-08 | 2015-11-11 | 东北石油大学 | Method and device used for optimizing electroplating parameters in laboratory |
| CN109072476A (en) * | 2016-05-24 | 2018-12-21 | 应用材料公司 | Electroplating power supply with remaining control and ETHERCAT interface |
| CN109072476B (en) * | 2016-05-24 | 2020-07-21 | 应用材料公司 | Electroplating power supply with redundancy control and ETHERCAT interface |
| CN109031117A (en) * | 2018-06-29 | 2018-12-18 | 昆山沪利微电有限公司 | A kind of electroplating device vibrating motor running state monitoring system and monitoring method |
| CN110737217A (en) * | 2018-07-20 | 2020-01-31 | 浩兴电子有限公司 | Real-time current detection system for hanger of electroplating equipment |
| CN109491935A (en) * | 2018-10-29 | 2019-03-19 | 厦门科华恒盛股份有限公司 | A kind of physical address determines method, system and modularized equipment and storage medium |
| CN110528039A (en) * | 2019-07-31 | 2019-12-03 | 浙江大学 | Micro-nano structure local electric deposition device based on the detection monitoring of faint ionic current |
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Application publication date: 20140319 |
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